Heat dissipation structure of table double-head electromagnetic cooker

Abstract

This utility model discloses a heat dissipation structure for a tabletop dual-burner induction cooker, relating to the field of kitchen appliance technology. The heat dissipation structure includes a shell, a heating mechanism, a printed circuit board assembly, and a heat dissipation mechanism. The shell has a receiving cavity and an air inlet and an air outlet respectively communicating with the receiving cavity. The heating mechanism includes a first coil and a second coil. The heat dissipation mechanism and the shell enclose a guide air duct communicating with the air inlet. The heat dissipation mechanism includes an axial fan disposed within the guide air duct. The guide air duct has multiple air vents, including a first air vent, a second air vent, and a third air vent. This utility model's technical solution, by employing a single axial fan and multiple air vents, optimizes the overall layout, ensuring efficient heat dissipation while reducing the number of parts and complex assembly steps such as related fasteners and wiring. This significantly simplifies the assembly process and reduces manufacturing costs and process difficulty.

Description

Technical Field

[0001] This utility model relates to the field of kitchen appliance technology, and in particular to a heat dissipation structure for a tabletop double-burner induction cooker. Background Technology

[0002] With the widespread use of induction cooktops in modern kitchens, effectively designing a heat dissipation structure to dissipate the heat generated inside the device has become a key design challenge. Currently, countertop dual-burner induction cooktops on the market mainly employ two heat dissipation methods: using two axial fans to cool each burner individually, or using a single centrifugal fan to provide cooling for the entire device. While these methods can meet heat dissipation requirements to some extent, they still have significant shortcomings in terms of assembly complexity and overall layout rationality. Utility Model Content

[0003] The main purpose of this invention is to propose a heat dissipation structure for a tabletop dual-burner induction cooker, aiming to solve the problems of simplifying the assembly process and optimizing the overall layout.

[0004] To achieve the above objectives, this utility model proposes a heat dissipation structure for a tabletop dual-burner induction cooker, the heat dissipation structure of which includes:

[0005] The housing has a receiving cavity and an air inlet and an air outlet respectively communicating with the receiving cavity. The receiving cavity is divided into a first installation space, a second installation space and a third installation space along a first direction. The second installation space is divided into a first installation area and a second installation area along a second direction. The first direction and the second direction are perpendicular to each other.

[0006] A heating mechanism, comprising a first coil and a second coil, wherein the first coil is disposed in the first mounting space and the second coil is disposed in the third mounting space;

[0007] A printed circuit board assembly disposed in the first mounting area;

[0008] A heat dissipation mechanism is disposed in the second mounting area. The heat dissipation mechanism and the housing enclose a guide air duct that communicates with the air inlet. The heat dissipation mechanism includes an axial fan disposed within the guide air duct. The guide air duct has multiple air guide ports, including a first air guide port, a second air guide port, and a third air guide port. The first air guide port is used to guide the airflow generated by the axial fan to the first coil for heat dissipation. The second air guide port is used to guide the airflow generated by the axial fan to the second coil for heat dissipation. The third air guide port is used to guide the airflow generated by the axial fan to the printed circuit board assembly for heat dissipation.

[0009] In one embodiment, the first installation area and the second installation area are arranged sequentially along a direction away from the air outlet, and the first coil, the axial fan, and the second coil are not arranged collinearly; a straight line passing through the central axis of the axial fan along the second direction is defined as L, the distance between the central axis of the first coil and L is L1, and the distance between the central axis of the second coil and L is L2, then: L1 = L2.

[0010] In one embodiment, the first coil and the second coil are collinear. The angle between the line connecting the central axis of the first coil and the central axis of the axial fan and the line connecting the central axis of the second coil and the central axis of the axial fan is defined as A. Then, 100°≤A≤140°.

[0011] In one embodiment, the heat dissipation structure of the tabletop dual-burner induction cooker further includes a heat dissipation component, which is connected to the printed circuit board assembly.

[0012] In one embodiment, the heat sink includes a heat sink fin.

[0013] In one embodiment, the heat dissipation mechanism further includes a first baffle and a guide plate. The housing includes a base and a mounting bracket connected to each other. The first baffle is disposed on the side of the axial fan away from the printed circuit board assembly. The first baffle is connected to the base. The guide plate and the axial fan are both connected to the mounting bracket. The base and the guide plate are disposed opposite to each other on both sides of the axial fan along a third direction. The guide plate abuts against the end of the first baffle away from the base, so that the first baffle, the guide plate, and the housing enclose the guiding air duct. The base is provided with the receiving cavity, the air inlet, and the air outlet. The first direction, the second direction, and the third direction are perpendicular to each other.

[0014] In one embodiment, the housing further includes a second baffle, a third baffle, and a fourth baffle respectively connected to the base. The second baffle is arranged around the outer periphery of the first coil so that the second baffle and the base enclose a first air outlet duct, the first air outlet duct having a first inlet and a first outlet, the first inlet communicating with the first air guide port. The third baffle is arranged around the outer periphery of the second coil so that the third baffle and the base enclose a second air outlet duct, the second air outlet duct having a second inlet and a second outlet, the second inlet communicating with the second air guide port. The fourth baffle is arranged around the outer periphery of the printed circuit board assembly so that the fourth baffle and the base enclose a third air outlet duct, the third air outlet duct having a third inlet and a third outlet, the third inlet communicating with the third air guide port. Furthermore, the first outlet, the second outlet, and the third outlet are all communicating with the receiving cavity.

[0015] In one embodiment, the number of air outlets is multiple, and the multiple air outlets are divided into a first air outlet, a second air outlet, and a third air outlet; the base includes a base plate, a first side plate, a second side plate, a third side plate, and a fourth side plate. The first side plate and the second side plate are spaced apart on the base plate along a first direction, and the third side plate and the fourth side plate are spaced apart on the base plate along a second direction. The first side plate, the second side plate, the third side plate, the fourth side plate, and the base plate enclose the receiving cavity. The system is provided with a first air outlet, a second air outlet on the second side plate, a third air outlet on the third side plate, and an air inlet on the bottom plate. The first baffle, the guide plate, and the bottom plate together form the guide air duct. The first baffle, the second baffle, the third baffle, and the fourth baffle are all connected to the bottom plate. The second baffle and the bottom plate together form the first air outlet duct, the third baffle and the bottom plate together form the second air outlet duct, and the fourth baffle and the bottom plate together form the third air outlet duct.

[0016] In one embodiment, the first outlet is disposed toward the first air outlet, the second outlet is disposed toward the second air outlet, and the third outlet is disposed toward the third air outlet.

[0017] In one embodiment, the first coil, the second coil, and the axial fan are all electrically connected to the printed circuit board assembly.

[0018] In this embodiment of the invention, the housing, as the basic component of the overall structure, provides installation space for each functional module. It forms a complete airflow channel by connecting to the receiving cavity through both the air inlet and outlet. The receiving cavity is divided into multiple installation spaces and areas according to the first and second directions, forming a modular layout. This not only improves the space utilization efficiency inside the housing but also provides a foundation for the rational distribution and assembly of subsequent functional modules. The heating mechanism is used to achieve electromagnetic induction heating of the cookware, providing the user with the heat energy required for cooking. The first coil is located in the first installation space, and the second coil is located in the third installation space. This facilitates balanced heat load in the heating area, avoiding localized overheating and ensuring good thermal balance between the two heating units during power output. This improves the stability of the entire machine and the user's comfort. The printed circuit board assembly, as the core of the heat dissipation structure control system of the tabletop double-head induction cooker, is responsible for signal processing and component control, and is also one of the heating elements. The heat dissipation mechanism provides cooling airflow to the first coil, the second coil, and the printed circuit board assembly, preventing localized overheating and ensuring that each component operates in a more suitable working environment. This extends the lifespan of each component, reduces malfunctions or system crashes caused by overheating, and guarantees the stability and safety of the induction cooker under high-power operation. The heat dissipation mechanism is located in the second installation area within the second installation space, forming a guide air duct connected to the air inlet with the housing. The guide air duct has multiple air vents, which are used to guide the airflow generated by the axial fan to the first coil, the second coil, and the printed circuit board assembly for directional cooling. By optimizing the overall layout and making reasonable use of the multiple air vents in the guide air duct, a good heat dissipation effect is achieved. This not only improves the operational stability and safety of the induction cooker under high-power output conditions but also extends the overall lifespan of the machine and enhances the product's market competitiveness. This utility model embodiment optimizes the overall layout by adopting a structure with one axial fan and multiple air vents, replacing the traditional dual axial fan and single centrifugal fan solutions. While ensuring efficient heat dissipation, it reduces the number of parts and complex assembly steps such as related fasteners and wiring, significantly simplifying the assembly process. This improves assembly convenience while reducing manufacturing costs and process difficulty. The structure, through centralized air supply and multi-point heat dissipation, makes the overall heat dissipation layout more reasonable, achieving precise air delivery and efficient cooling. At the same time, the design of the air duct optimizes the airflow path, preventing airflow short-circuiting or turbulence, further enhancing cooling efficiency. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of a embodiment of the heat dissipation structure of the tabletop double-headed induction cooker of this utility model;

[0021] Figure 2 This is a schematic diagram of another perspective of one embodiment of the heat dissipation structure of the tabletop double-headed induction cooker of this utility model.

[0022] Figure 3 This is a partial structural diagram of an embodiment of the heat dissipation structure of the tabletop double-burner induction cooker of this utility model.

[0023] Explanation of icon numbers:

[0024] 100. Heat dissipation structure of a tabletop double-burner induction cooker; 1. Shell; 11. Base; 111. Receiving cavity; 1111. First installation space; 1112. Second installation space; 11121. First installation area; 11122. Second installation area; 1113. Third installation space; 112. Base plate; 1121. Air inlet; 113. First side plate; 1131. First air outlet; 114. Second side plate; 1141. Second air outlet; 115. Third side plate; 1151. Third air outlet; 116. Fourth side plate; 12. Mounting bracket; 13. Second baffle; 14. Third baffle 15. Fourth baffle; 16. First air outlet; 161. First inlet; 162. First outlet; 17. Second air outlet; 171. Second inlet; 172. Second outlet; 18. Third air outlet; 181. Third inlet; 182. Third outlet; 2. Heating mechanism; 21. First coil; 22. Second coil; 3. Printed circuit board assembly; 4. Heat dissipation mechanism; 41. Guide air duct; 411. First air guide; 412. Second air guide; 413. Third air guide; 42. Axial fan; 43. First baffle; 44. Air guide plate; 5. Heat dissipation component; 51. Heat sink.

[0025] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0027] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, and back), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0028] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0029] With the widespread use of induction cooktops in modern kitchens, effectively designing a heat dissipation structure to dissipate the heat generated inside the device has become a key design challenge. Currently, countertop dual-burner induction cooktops on the market mainly employ two heat dissipation methods: using two axial fans to cool each burner individually, or using a single centrifugal fan to provide cooling for the entire device. While these methods can meet heat dissipation requirements to some extent, they still have significant shortcomings in terms of assembly complexity and overall layout rationality.

[0030] After careful study, the applicant discovered that in the dual-axial-flow fan solution, each burner head is equipped with an axial-flow fan. The airflow generated by the fan rotation is directly directed to the corresponding coil area to remove heat. This solution ensures sufficient cooling for each burner head and is suitable for high-power output applications. However, the need to install two independent fan systems not only increases manufacturing costs but also adds assembly steps and complexity, making assembly errors more likely. Furthermore, each fan requires installation space, resulting in a less compact overall layout, lower space utilization, and impacting the equipment's appearance and portability.

[0031] In contrast, the single centrifugal fan design utilizes the high-pressure airflow generated by a single centrifugal fan, which distributes cool air to various heat-generating components via a guide device. While this reduces the number of fans and simplifies the structural design compared to a dual-axial fan design, the smaller exhaust area of ​​the single centrifugal fan means it primarily focuses on cooling the PCBA (Printed Circuit Board Assembly), making it difficult to effectively cover the coil areas on both sides. This results in insufficient coil cooling capacity, especially under high-power operation, which can easily lead to excessive coil temperature rise and uneven heat dissipation, thus limiting its application in high-power induction cooktops. Furthermore, centrifugal fans themselves are relatively expensive to manufacture, and their operating characteristics typically require a large installation space. To achieve effective airflow distribution, a complex guide system is often necessary, which not only increases design complexity but may also further increase manufacturing costs.

[0032] The main purpose of this utility model is to propose a heat dissipation structure for a tabletop double-head induction cooker to solve the problems of simplifying the assembly process and optimizing the overall layout.

[0033] Please see Figure 1 and Figure 3In one embodiment of this utility model, the heat dissipation structure 100 of the tabletop double-burner induction cooker includes a shell 1, a heating mechanism 2, a printed circuit board assembly 3, and a heat dissipation mechanism 4. The shell 1 is provided with a receiving cavity 111 and an air inlet 1121 and an air outlet respectively communicating with the receiving cavity 111. The receiving cavity 111 is sequentially divided into a first installation space 1111, a second installation space 1112, and a third installation space 1113 along a first direction. The second installation space 1112 is sequentially divided into a first installation area 11121 and a second installation area 11122 along a second direction. The first direction and the second direction are perpendicular to each other. The heating mechanism 2 includes a first coil 21 and a second coil 22. The first coil 21 is disposed in the first installation space 1111, and the second coil 22 is disposed in the third installation space 1112. 113; Printed circuit board assembly 3 is disposed in the first mounting area 11121; heat dissipation mechanism 4 is disposed in the second mounting area 11122. The heat dissipation mechanism 4 and the housing 1 enclose a guide air duct 41 that communicates with the air inlet 1121. The heat dissipation mechanism 4 includes an axial fan 42 disposed in the guide air duct 41. The guide air duct 41 has multiple air guides, including a first air guide 411, a second air guide 412, and a third air guide 413. The first air guide 411 is used to guide the airflow generated by the axial fan 42 to the first coil 21 for heat dissipation. The second air guide 412 is used to guide the airflow generated by the axial fan 42 to the second coil 22 for heat dissipation. The third air guide 413 is used to guide the airflow generated by the axial fan 42 to the printed circuit board assembly 3 for heat dissipation.

[0034] In the embodiments of this utility model, such as Figure 1As shown, the first direction is left-right, and the second direction is front-back. The housing 1, as the basic component of the overall structure, provides installation space for various functional modules. It connects to the receiving cavity 111 via the air inlet 1121 and air outlet, forming a complete airflow channel. The receiving cavity 111 is divided into multiple installation spaces and areas according to the first and second directions, forming a modular layout. This not only improves the space utilization efficiency inside the housing 1 but also provides basic support for the rational distribution and assembly of subsequent functional modules. The heating mechanism 2 is used to achieve electromagnetic induction heating of the cookware, providing the user with the heat energy required for cooking. The first coil 21 is set in the first installation space 1111, and the second coil 22 is set in the third installation space 1113. This helps to achieve a balanced heat load in the heating area, avoiding local overheating and ensuring good thermal balance between the two heating units during power output, thus improving the stability of the entire machine and the user's comfort. The printed circuit board assembly 3, as the core of the heat dissipation structure 100 control system of the tabletop double-head induction cooker, is responsible for signal processing and component control, and is also one of the heating elements. The heat dissipation mechanism 4 provides cooling airflow to the first coil 21, the second coil 22, and the printed circuit board assembly 3, preventing local overheating and allowing each component to operate in a more suitable working environment. This extends the service life of each component, reduces malfunctions or system crashes caused by excessive temperature, and ensures the stability and safety of the induction cooker under high-power operation. The heat dissipation mechanism 4 is located in the second installation area 11122 of the second installation space 1112, forming a guide air duct 41 connected to the air inlet 1121 with the housing 1. The guide air duct 41 has multiple air vents, which are used to guide the airflow generated by the axial fan 42 to the first coil 21, the second coil 22, and the printed circuit board assembly 3 for directional cooling. By optimizing the overall layout and making reasonable use of the multiple air vents of the guide air duct 41, a good heat dissipation effect is achieved. This not only improves the operational stability and safety of the induction cooker under high-power output, but also extends the service life of the entire machine and enhances the product's market competitiveness.

[0035] The technical solution of this utility model optimizes the overall layout by adopting a structure with one axial fan 42 and multiple air vents, replacing the traditional dual axial fan and single centrifugal fan solutions. While ensuring efficient heat dissipation, it reduces the number of parts and complex assembly steps such as related fasteners and wiring, significantly simplifying the assembly process. This improves assembly convenience while reducing manufacturing costs and process difficulty. The structure makes the overall heat dissipation layout more reasonable through centralized air supply and multi-point heat dissipation, achieving precise air delivery and efficient cooling. At the same time, the design of the air duct 41 optimizes the airflow path, preventing airflow short-circuiting or turbulence, further enhancing cooling efficiency.

[0036] Please see Figure 1 and Figure 3In one embodiment, the first mounting area 11121 and the second mounting area 11122 are arranged sequentially in a direction away from the air outlet, and the first coil 21, the axial fan 42, and the second coil 22 are not arranged collinearly. A straight line passing through the central axis of the axial fan 42 along the second direction is defined as L, the distance between the central axis of the first coil 21 and L is L1, and the distance between the central axis of the second coil 21 and L is L2. Therefore, L1 = L2. Specifically, in one embodiment, the first mounting area 11121 and the second mounting area 11122 are arranged sequentially in a direction away from the air outlet, so that the printed circuit board assembly 3 is closer to the air outlet on the housing 1. This facilitates the formation of a stable air duct system with unidirectional flow from the air inlet 1121 to the air outlet, thereby improving the overall heat dissipation efficiency. Based on the characteristics of the axial fan 42, its main airflow concentration area, namely the area on both sides near the central axis of the axial fan 42, is fully utilized. Therefore, the first coil 21, the axial fan 42, and the second coil 22 are not collinear, allowing the fan to be in a more reasonable geometric position, increasing the air outlet area of ​​the axial fan 42, ensuring that the airflow at the air guide is strong enough, and further enhancing the cooling efficiency. At the same time, the distance L1 between the central axis of the first coil 21 and L is the same as the distance L2 between the central axis of the second coil 21 and L. This not only achieves a balance in the heat load distribution of the left and right heating units, but also ensures that the airflow output by the fan can be evenly distributed between the two heating zones, preventing local overcooling or overheating. This significantly improves the efficiency and stability of the heat dissipation mechanism 4, making it suitable for high-performance, high-power-density tabletop double-burner induction cooktops.

[0037] Please see Figure 3 In one embodiment, the first coil 21 and the second coil 22 are collinear. The angle A formed between the line connecting the central axis of the first coil 21 and the central axis of the axial fan 42 and the line connecting the central axis of the second coil 22 and the central axis of the axial fan 42 is defined as: 100°≤A≤140°. Specifically, the range of this angle A is selected based on the airflow distribution characteristics of the axial fan 42. That is, the main airflow of the axial fan 42 is concentrated in the two sides near the central axis. When the angle A is too small or too large, the two coils will be in the area where the airflow of the axial fan 42 is weak, resulting in a decrease in cooling capacity. Therefore, by limiting the angle A within the above range, it can be ensured that the axial fan 42 is in an optimal geometric position that can effectively cover the two heating units on the left and right sides and make full use of its main airflow area, thereby achieving optimal utilization of the airflow of the axial fan 42 and improving the overall heat dissipation efficiency and stability. In addition, this angle range also improves the guiding efficiency of the guide duct 41 and reduces wind resistance loss, providing a guarantee for the stability and safety of the induction cooker under high power operation.

[0038] Please see Figures 1 to 3In one embodiment, the heat dissipation structure 100 of the countertop dual-burner induction cooker further includes a heat sink 5, which is connected to the printed circuit board assembly 3. Specifically, by setting the heat sink 5 on the printed circuit board assembly 3, a good heat conduction path is formed, and the heat generated during the operation of the printed circuit board assembly 3 is quickly dissipated through the heat sink 5, thereby effectively reducing the local temperature of the printed circuit board assembly 3 and avoiding performance degradation or functional abnormalities caused by overheating. Combined with the active air-cooling system formed by the axial fan 42 and the guide air duct 41, the addition of the heat sink 5 realizes a composite heat dissipation mode of passive heat conduction and active heat dissipation, significantly improving the overall heat dissipation efficiency within a limited space. This not only improves the operational stability and safety of the induction cooker under high load conditions but also reduces the failure rate caused by overheating of the printed circuit board assembly 3, extends the service life of the entire machine, and enhances the user experience and market competitiveness of the product.

[0039] Please see Figures 1 to 3 In one embodiment, the heat sink 5 includes a heat sink 51. Specifically, the heat sink 51 significantly enhances the heat exchange efficiency with the surrounding air due to its large surface area, enabling it to quickly conduct and dissipate the heat generated during the operation of the printed circuit board assembly 3 into the environment, thereby effectively reducing the local temperature and preventing performance degradation or functional abnormalities caused by overheating. The heat sink 51 can be made of aluminum through extrusion molding or stamping, and has the advantages of simple structure and high standardization. It can also be flexibly installed on the printed circuit board assembly 3 by means of clips, screws, or thermally conductive adhesive, facilitating diverse layouts according to the internal space of the housing 1.

[0040] According to one embodiment of the present invention, the heat sink 5 can be a heat pipe or a vapor chamber, thereby reducing the temperature of the printed circuit board assembly 3.

[0041] Please see Figure 1 In one embodiment, the heat dissipation mechanism 4 further includes a first baffle 43 and a guide plate 44. The housing 1 includes a base 11 and a mounting bracket 12 connected to each other. The first baffle 43 is disposed on the side of the axial fan 42 away from the printed circuit board assembly 3. The first baffle 43 is connected to the base 11. The guide plate 44 and the axial fan 42 are both connected to the mounting bracket 12. The base 11 and the guide plate 44 are disposed opposite to each other on both sides of the axial fan 42 along a third direction. The guide plate 44 abuts against the end of the first baffle 43 away from the base 11, so that the first baffle 43, the guide plate 44 and the housing 1 enclose a guide air duct 41. The base 11 is provided with a receiving cavity 111, an air inlet 1121 and an air outlet. The first direction, the second direction and the third direction are perpendicular to each other. Specifically, as shown in the figure... Figure 1As shown, the third direction is up and down. The first baffle 43, the air guide plate 44 and the housing 1 enclose and form a guide air duct 41 that communicates with the air inlet 1121. The base 11 is also provided with a receiving cavity 111 and an air outlet, thus constructing a complete air circulation path. This structure prevents the airflow from flowing upward through the air guide plate 44 and prevents the airflow from flowing forward through the first baffle 43. At the same time, the air guide plate 44 abuts against the first baffle 43, so that the airflow can flow along the guide air duct 41, which enhances the stability of the airflow direction of the axial fan 42, improves the airflow guidance and utilization rate, and can achieve precise air supply to the first coil 21, the second coil 22 and the printed circuit board assembly 3, significantly improving the overall heat dissipation efficiency. It is suitable for high-performance, high-power-density tabletop double-head induction cooker products. In this embodiment, the air guide plate 44 can be made of mica sheet. Mica sheet has good high temperature resistance and electrical insulation properties, which can maintain structural stability in high temperature environment, while avoiding safety hazards caused by leakage or short circuit, thus meeting the usage requirements. Moreover, the mica sheet can be cut or stamped into the required shape according to actual needs, and fixed to the mounting frame 12 by means of buckles, adhesives or screws. This embodiment does not limit this.

[0042] Please see Figure 1 and Figure 3In one embodiment, the housing 1 further includes a second baffle 13, a third baffle 14, and a fourth baffle 15 respectively connected to the base 11. The second baffle 13 is arranged around the outer periphery of the first coil 21 so that the second baffle 13 and the base 11 enclose to form a first air outlet 16. The first air outlet 16 has a first inlet 161 and a first outlet 162, and the first inlet 161 communicates with the first air guide 411. The third baffle 14 is arranged around the outer periphery of the second coil 22 so that the third baffle 14 and the base 11 enclose to form a second air outlet 17. The second air outlet 17 has a second inlet 171 and a second outlet 172, and the second inlet 171 communicates with the second air guide 412. The fourth baffle 15 is arranged around the outer periphery of the printed circuit board assembly 3 so that the fourth baffle 15 and the base 11 enclose to form a third air outlet 18, and the third air outlet 18 has a third inlet 181 and a third outlet 182. The third inlet 181 is connected to the third air vent 413; and the first outlet 162, the second outlet 172, and the third outlet 182 are all connected to the receiving cavity 111. Specifically, this structure, through the independent air outlet ducts formed by the baffles and the base 11, optimizes the overall layout and makes reasonable use of the air outlet principle of the axial fan 42 and each air outlet duct to dissipate heat from the various heat-generating devices distributed in the mounting cavity. This achieves precise air supply and directional cooling for the first coil 21, the second coil 22, and the printed circuit board assembly 3, resulting in good heat dissipation and significantly improving heat dissipation efficiency. The inlets of each air outlet duct correspond one-to-one with the air vents in the guide air duct 41, ensuring that the cooling airflow can be accurately delivered to the target area, avoiding airflow mixing or short circuits. The outlets of each air outlet duct are all connected to the receiving cavity 111, allowing the cooled hot air to be finally discharged from the air outlet, forming a complete air circulation system. At the same time, the modular design of the baffle structure also improves the assembly flexibility and the convenience of later maintenance, which helps to achieve standardized production.

[0043] Please see Figure 2 and Figure 3In one embodiment, there are multiple air outlets, which are divided into a first air outlet 1131, a second air outlet 1141, and a third air outlet 1151. The base 11 includes a base plate 112, a first side plate 113, a second side plate 114, a third side plate 115, and a fourth side plate 116. The first side plate 113 and the second side plate 114 are spaced apart on the base plate 112 along a first direction, and the third side plate 115 and the fourth side plate 116 are spaced apart on the base plate 112 along a second direction. The first side plate 113, the second side plate 114, the third side plate 115, the fourth side plate 116, and the base plate 112 enclose a receiving cavity 111. The first side plate 113 is provided with a first air outlet 1131, and the second side plate 114 is provided with a second air outlet 1151. 41. A third air outlet 1151 is provided on the third side plate 115, and an air inlet 1121 is provided on the bottom plate 112. The first baffle 43, the air guide plate 44, and the bottom plate 112 enclose each other to form a guide air duct 41. The first baffle 43, the second baffle 13, the third baffle 14, and the fourth baffle 15 are all connected to the bottom plate 112. The second baffle 13 and the bottom plate 112 enclose each other to form a first air outlet 16, the third baffle 14 and the bottom plate 112 enclose each other to form a second air outlet 17, and the fourth baffle 15 and the bottom plate 112 enclose each other to form a third air outlet 18. Specifically, this structure, by providing multiple air outlets on the side plates in different directions, allows the cooling airflow to flow in multiple directions within the housing 1, thereby significantly improving the overall airflow speed and air circulation efficiency. The axial fan 42 draws in cool air through the air inlet 1121, and after being delivered to various functional areas through multiple air vents on the guide duct 41, hot air can be smoothly discharged through the air outlets distributed on different side panels, preventing heat accumulation inside the housing 1. This design effectively enhances the ventilation capacity of the entire unit, improves the utilization rate of cooling airflow, and thus improves the overall heat dissipation efficiency. In addition, the multi-directional air outlet layout helps optimize the airflow path inside the housing 1, reduces the generation of local eddies or dead zones, further improves the thermal management capability of the induction cooker under high-power operation, extends the service life of key components, and improves the stability and safety of product operation. In this embodiment, the specific number of the first air outlet 1131, the second air outlet 1141, and the third air outlet 1151 can be selected according to actual needs, and this embodiment does not limit this.

[0044] Please see Figure 3In one embodiment, the first outlet 162 is positioned facing the first air outlet 1131, the second outlet 172 is positioned facing the second air outlet 1141, and the third outlet 182 is positioned facing the third air outlet 1151. Specifically, this design improves the exhaust efficiency of the cooling airflow after completing its heat dissipation task by aligning the outlets of each air duct with their corresponding air outlets, effectively reducing airflow resistance and preventing localized heat accumulation. The first outlet 162, facing the first air outlet 1131, facilitates the rapid exhaust of hot air from the area of ​​the first coil 21; the second outlet 172, facing the second air outlet 1141, improves the heat exchange efficiency of the area of ​​the second coil 22; and the third outlet 182, facing the third air outlet 1151, enhances the ventilation capacity of the area of ​​the printed circuit board assembly 3. This structure achieves a closed-loop heat dissipation mode of precise air supply and corresponding exhaust, enabling the cooling airflow guided by the guide duct 41 to efficiently exhaust from the corresponding air outlet after completing the directional cooling of multiple heat-generating components, forming a complete air circulation system. Furthermore, the first air outlet 1131, the second air outlet 1141, and the third air outlet 1151 not only achieve directional heat dissipation for each heating component, but also, through the rational design of the airflow path within the housing 1, enable the cooling airflow to form a synergistic heat dissipation effect between different areas. That is, while the heating element in a certain area dissipates heat through its dedicated air outlet, it can also achieve auxiliary cooling with the help of airflow guided by other air outlets. This directional and synergistic composite heat dissipation mode significantly improves the thermal management capability of the induction cooker under high-power operation, enhancing the stability and reliability of the entire machine. In addition, this structure also facilitates compact design, improves space utilization, and supports product appearance optimization and portability enhancement, making it suitable for various high-performance, high-power-density countertop dual-burner induction cooker products.

[0045] Please see Figures 1 to 3 In one embodiment, the first coil 21, the second coil 22, and the axial fan 42 are all electrically connected to the printed circuit board assembly 3. Specifically, the printed circuit board assembly 3, as the core of the overall machine control, can uniformly manage the heating and heat dissipation functional modules, realizing centralized power supply and intelligent control of multiple key components. Through electrical signal connection, the printed circuit board assembly 3 can not only adjust the heating power of the first coil 21 and the second coil 22, but also dynamically control the start, stop, and speed of the axial fan 42 according to the system temperature, thereby realizing a coordinated control mode of on-demand power supply and on-demand heat dissipation, improving the safety and reliability of the entire machine. It should be noted that the first coil 21 and the second coil 22 can be existing coils, and the axial fan 42 can also be a directly existing axial fan 42. The first coil 21, the second coil 22, and the axial fan 42 can all be electrically connected to the printed circuit board assembly 3 through existing connection methods to realize control functions.

[0046] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A heat dissipation structure for a tabletop double-burner induction cooker, characterized in that, The heat dissipation structure of the tabletop double-burner induction cooker includes: The housing has a receiving cavity and an air inlet and an air outlet respectively communicating with the receiving cavity. The receiving cavity is divided into a first installation space, a second installation space and a third installation space along a first direction. The second installation space is divided into a first installation area and a second installation area along a second direction. The first direction and the second direction are perpendicular to each other. A heating mechanism, comprising a first coil and a second coil, wherein the first coil is disposed in the first mounting space and the second coil is disposed in the third mounting space; A printed circuit board assembly disposed in the first mounting area; A heat dissipation mechanism is disposed in the second mounting area. The heat dissipation mechanism and the housing enclose a guide air duct that communicates with the air inlet. The heat dissipation mechanism includes an axial fan disposed within the guide air duct. The guide air duct has multiple air guide ports, including a first air guide port, a second air guide port, and a third air guide port. The first air guide port is used to guide the airflow generated by the axial fan to the first coil for heat dissipation. The second air guide port is used to guide the airflow generated by the axial fan to the second coil for heat dissipation. The third air guide port is used to guide the airflow generated by the axial fan to the printed circuit board assembly for heat dissipation.

2. The heat dissipation structure of the tabletop double-burner induction cooker as described in claim 1, characterized in that, The first installation area and the second installation area are arranged sequentially in a direction away from the air outlet. The first coil, the axial fan, and the second coil are not arranged collinearly. The straight line passing through the central axis of the axial fan along the second direction is defined as L. The distance between the central axis of the first coil and L is L1, and the distance between the central axis of the second coil and L is L2. Then, L1 = L2.

3. The heat dissipation structure of the tabletop double-burner induction cooker as described in claim 2, characterized in that, The first coil and the second coil are collinear. Let A be the angle formed between the line connecting the central axis of the first coil and the central axis of the axial fan and the line connecting the central axis of the second coil and the central axis of the axial fan. Then, 100°≤A≤140°.

4. The heat dissipation structure of the tabletop double-burner induction cooker as described in claim 1, characterized in that, The heat dissipation structure of the tabletop dual-burner induction cooker also includes a heat dissipation component, which is connected to the printed circuit board assembly.

5. The heat dissipation structure of the tabletop double-burner induction cooker as described in claim 4, characterized in that, The heat dissipation component includes heat sinks.

6. The heat dissipation structure of the tabletop double-burner induction cooker as described in claim 1, characterized in that, The heat dissipation mechanism further includes a first baffle and a guide plate. The housing includes a base and a mounting bracket connected to each other. The first baffle is disposed on the side of the axial fan away from the printed circuit board assembly. The first baffle is connected to the base. The guide plate and the axial fan are both connected to the mounting bracket. The base and the guide plate are disposed opposite to each other on both sides of the axial fan along a third direction. The guide plate abuts against the end of the first baffle away from the base, so that the first baffle, the guide plate and the housing enclose the guiding air duct. The base is provided with the receiving cavity, the air inlet and the air outlet. The first direction, the second direction and the third direction are perpendicular to each other.

7. The heat dissipation structure of the tabletop double-burner induction cooker as described in claim 6, characterized in that, The housing further includes a second baffle, a third baffle, and a fourth baffle respectively connected to the base. The second baffle is wrapped around the outer periphery of the first coil so that the second baffle and the base enclose a first air outlet duct. The first air outlet duct has a first inlet and a first outlet, and the first inlet communicates with the first air guide. The third baffle is wrapped around the outer periphery of the second coil so that the third baffle and the base enclose a second air outlet duct. The second air outlet duct has a second inlet and a second outlet, and the second inlet communicates with the second air guide. The fourth baffle is wrapped around the outer periphery of the printed circuit board assembly so that the fourth baffle and the base enclose a third air outlet duct. The third air outlet duct has a third inlet and a third outlet, and the third inlet communicates with the third air guide. The first outlet, the second outlet, and the third outlet are all connected to the receiving cavity.

8. The heat dissipation structure of the tabletop double-burner induction cooker as described in claim 7, characterized in that, The number of air outlets is multiple, and the multiple air outlets are divided into a first air outlet, a second air outlet, and a third air outlet. The base includes a base plate, a first side plate, a second side plate, a third side plate, and a fourth side plate. The first side plate and the second side plate are spaced apart on the base plate along the first direction, and the third side plate and the fourth side plate are spaced apart on the base plate along the second direction. The first side plate, the second side plate, the third side plate, the fourth side plate, and the base plate enclose the receiving cavity. The first side plate is provided with the first air outlet, the second side plate is provided with the second air outlet, and the third side plate is provided with the third air outlet. The base plate is provided with an air inlet. The first baffle, the guide plate, and the base plate enclose the guiding air duct. The first baffle, the second baffle, the third baffle, and the fourth baffle are all connected to the base plate. The second baffle and the base plate enclose the first air outlet duct, the third baffle and the base plate enclose the second air outlet duct, and the fourth baffle and the base plate enclose the third air outlet duct.

9. The heat dissipation structure of the tabletop double-burner induction cooker as described in claim 8, characterized in that, The first outlet is oriented toward the first air outlet, the second outlet is oriented toward the second air outlet, and the third outlet is oriented toward the third air outlet.

10. The heat dissipation structure of the tabletop double-burner induction cooker as described in any one of claims 1 to 9, characterized in that, The first coil, the second coil, and the axial fan are all electrically connected to the printed circuit board assembly.

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