MOS module convenient for heat dissipation

Abstract

This utility model relates to the field of MOS module technology, and in particular to a MOS module with convenient heat dissipation. It includes a module housing, a heat sink on one side of the housing, and a positioning component on the other side for positioning the housing and the heat sink. The positioning component and the heat sink are fixed together by a fixing component. Guide components are provided on both sides of the positioning component and the heat sink. This utility model uses the guide components to limit the thermal pad, preventing it from shifting during use. Simultaneously, the fixing components press and fix the heat sink and the positioning component together, thereby providing stable heat dissipation for the module housing. During maintenance, the module can be quickly disassembled simply by removing the fixing components, significantly improving maintenance efficiency.

Description

Technical Field

[0001] This utility model relates to the field of MOS module technology, and in particular to a MOS module that facilitates heat dissipation. Background Technology

[0002] If the heat generated by the MOS module during use cannot be dissipated in time, the heat will accumulate, causing the junction temperature to rise continuously, which will lead to a series of problems. In order to prevent the MOS module from being damaged by overheating and to ensure its long-term reliable and efficient operation, heat dissipation is a crucial and indispensable part.

[0003] Most existing MOS modules use bolts or other structures to fix the casing and heat sink during heat dissipation, which makes maintenance and replacement inconvenient, resulting in longer maintenance time and lower efficiency. Utility Model Content

[0004] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing a MOS module that facilitates heat dissipation.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] Design a heat dissipation-friendly MOS module, including a module housing, a heat sink on one side of the module housing, and a positioning component on the other side of the module housing for positioning the module housing and the heat sink. The positioning component and the heat sink are fixed by a fixing component, and guide components are provided on both sides of the positioning component and the heat sink.

[0007] Furthermore, grooves are provided on both sides of the upper end of the module shell;

[0008] The positioning element is a plate, and several protruding blocks adapted to the groove are formed on the end face of the plate. The groove and the protruding blocks are engaged.

[0009] Furthermore, the heat sink is a fin, and a thermally conductive pad is provided between the fin and the module housing. Both sides of the thermally conductive pad are provided with clearance grooves.

[0010] Furthermore, the guide assembly includes sleeves fixedly connected to both sides of the fins and insert rods fixedly connected to both sides of the plate, the insert rods being inserted into the sleeves.

[0011] Furthermore, the fixing component includes a column fixedly connected to the fin, a connecting plate fixedly connected to the top of the column, a circular groove being formed on the end face of the plate, and the connecting plate passing through the circular groove.

[0012] Furthermore, the fixing assembly also includes a fixing plate rotatably connected to the circular groove. The fixing plate has a slot adapted to the connecting plate. The fixing plate is rotatably connected around the column. An abutting protrusion is provided on the end face of the fixing plate. The abutting protrusion abuts against the connecting plate. A positioning block is formed in the circular groove. A positioning groove is provided on the lower end face of the fixing plate. The positioning block engages with the positioning groove.

[0013] The present invention proposes a MOS module that facilitates heat dissipation. The advantages are as follows: the present invention uses a guide component to limit the thermal pad and prevent it from shifting during use. At the same time, a fixing component is used to press and fix the heat sink and the positioning component, thereby providing stable heat dissipation for the module shell. During maintenance, the module can be quickly disassembled simply by removing the fixing component, which greatly improves maintenance efficiency. Attached Figure Description

[0014] Figure 1 This is a perspective view of the present utility model;

[0015] Figure 2 This is a structural breakdown diagram of the present invention;

[0016] Figure 3 This is a cross-sectional view of the fixing component structure of this utility model;

[0017] Figure 4 For the present utility model Figure 1 Enlarged schematic diagram of region A;

[0018] Figure 5 For the present utility model Figure 3 Enlarged schematic diagram of region B.

[0019] In the diagram: 1. Module shell; 11. Groove; 2. Heat sink; 21. Fin; 22. Thermal pad; 23. Clearance groove; 3. Positioning component; 31. Plate; 32. Protrusion; 4. Fixing component; 41. Column; 42. Connecting plate; 43. Circular groove; 44. Fixing plate; 45. Slot; 46. Abutting protrusion; 47. Positioning block; 48. Positioning groove; 5. Guide component; 51. Sleeve; 52. Insert rod. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Reference Figure 1-5A heat dissipation-friendly MOS module includes a module housing 1. A heat sink 2 is provided on one side of the module housing 1, and a positioning component 3 is provided on the other side of the module housing 1 for positioning the module housing 1 and the heat sink 2. The positioning component 3 and the heat sink 2 are fixed together by a fixing component 4. Guide components 5 are provided on both sides of the positioning component 3 and the heat sink 2.

[0022] It should be noted that grooves 11 are provided on both sides of the upper end of the module housing 1;

[0023] The positioning component 3 is a plate 31. Several protruding blocks 32 adapted to the groove 11 are formed on the end face of the plate 31. The groove 11 and the protruding blocks 32 are engaged. The engagement of the protruding blocks 32 with the groove 11 prevents the module shell 1 from falling off during use.

[0024] Furthermore, the heat sink 2 is a fin 21, and a thermally conductive pad 22 is provided between the fin 21 and the module housing 1. Both sides of the thermally conductive pad 22 are provided with clearance grooves 23, wherein the clearance grooves 23 are adapted to the sleeves 51. During use, the thermally conductive pad 22 can be locked between the two sleeves 51 through the clearance grooves 23. The middle of the thermally conductive pad 22 is also provided with clearance holes for avoiding the connecting plate 42 and the column 41.

[0025] In this embodiment, the guide assembly 5 includes a sleeve 51 fixedly connected to both sides of the fin 21 and a plug 52 fixedly connected to both sides of the plate 31. The plug 52 is inserted into the sleeve 51. Through the insertion of the sleeve 51 and the plug 52, the positioning member 3 and the heat dissipation member 2 are positioned to prevent the positioning member 3 from tilting.

[0026] The fixing component 4 includes a column 41 that is fixedly connected to the fin 21. A connecting plate 42 is fixedly connected to the top of the column 41. A circular groove 43 is provided on the end face of the plate 31, and the connecting plate 42 passes through the circular groove 43.

[0027] Based on the above embodiments, the fixing component 4 further includes a fixing plate 44 rotatably connected to the circular groove 43. The fixing plate 44 has a slot 45 adapted to the connecting plate 42. The fixing plate 44 is rotatably connected around the column 41. An abutting protrusion 46 is provided on the end face of the fixing plate 44. The abutting protrusion 46 abuts against the connecting plate 42. A positioning block 47 is formed in the circular groove 43. A positioning groove 48 is provided on the lower end face of the fixing plate 44. The positioning block 47 is engaged with the positioning groove 48. In use, the connecting plate 42 passes through the fixing plate 44, and then the fixing plate 44 is rotated to make the positioning block 47 and the positioning groove 48 engage, thereby positioning the fixing plate 44. At the same time, the connecting plate 42 abuts against the abutting protrusion 46, thereby fixing the heat sink 2 and the positioning component 3. This structure is similar to the buckle structure of a four-wheel drive vehicle, wherein the abutting protrusion 46 is an arc-shaped structure.

[0028] Working method: During operation, the module shell 1 is positioned with the plate 31 through the groove 11 and the protrusion 32, and the heat-conducting pad 22 is positioned through the sleeves 51 on both sides. Then the sleeves 51 and the plug rod 52 are connected. After that, the heat sink 2, the module shell 1 and the positioning component 3 are connected and fixed through the fixing component 4.

[0029] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A heat-dissipating MOS module, comprising a module housing (1), characterized in that: A heat sink (2) is provided on one side of the module housing (1), and a positioning component (3) is provided on the other side of the module housing (1) for positioning the module housing (1) and the heat sink (2). The positioning component (3) is fixed to the heat sink (2) by a fixing component (4). Guide components (5) are provided on both sides of the positioning component (3) and the heat sink (2).

2. The MOS module with easy heat dissipation according to claim 1, characterized in that: The upper two sides of the module shell (1) are provided with grooves (11); The positioning element (3) is a plate (31), and a plurality of protrusions (32) adapted to the groove (11) are formed on the end face of the plate (31). The groove (11) and the protrusions (32) are engaged.

3. A heat-dissipating MOS module according to claim 2, characterized in that: The heat sink (2) is a fin (21), and a thermal pad (22) is provided between the fin (21) and the module shell (1). Both sides of the thermal pad (22) are provided with clearance grooves (23).

4. A heat-dissipating MOS module according to claim 3, characterized in that: The guide assembly (5) includes a sleeve (51) fixedly connected to both sides of the fin (21) and a plug (52) fixedly connected to both sides of the plate (31), wherein the plug (52) is inserted into the sleeve (51).

5. A heat-dissipating MOS module according to claim 3, characterized in that: The fixing component (4) includes a column (41) fixedly connected to the fin (21), a connecting plate (42) fixedly connected to the top of the column (41), a circular groove (43) is provided on the end face of the plate (31), and the connecting plate (42) passes through the circular groove (43).

6. A heat-dissipating MOS module according to claim 5, characterized in that: The fixing component (4) further includes a fixing plate (44) rotatably connected to the circular groove (43). The fixing plate (44) has a slot (45) adapted to the connecting plate (42). The fixing plate (44) is rotatably connected around the column (41). The end face of the fixing plate (44) is provided with an abutting protrusion (46). The abutting protrusion (46) abuts against the connecting plate (42). A positioning block (47) is formed in the circular groove (43). A positioning groove (48) is provided on the lower end face of the fixing plate (44). The positioning block (47) is engaged with the positioning groove (48).

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