Embedded systems and charging stations based on LoRa communication and multi-voltage domain power supply

Abstract

This invention relates to the field of charging equipment technology, and in particular to an embedded system and charging pile based on LoRa communication and multi-voltage domain power supply. By integrating a power supply module, a control module, an interface communication module, and a LoRa wireless communication module, the system provides a multi-voltage domain power supply range through functional modules, enabling the control module, interface communication module, and LoRa wireless communication module to operate and supply power. This avoids high-voltage damage to various components caused by the high voltage domain of the external power supply to the charging pile, and meets the power supply requirements of different components in multiple voltage domains. At the same time, by integrating the interface communication module and the LoRa wireless communication module, multiple communication methods with external devices are realized, improving the communication efficiency and interactivity when the charging pile charges various devices, and avoiding the technical problem of the narrow power supply voltage range of charging piles to various devices in the prior art.

Description

Technical Field

[0001] This invention relates to the field of charging equipment technology, and in particular to embedded systems and charging piles based on LoRa communication and multi-voltage domain power supply. Background Technology

[0002] With the development of the new energy industry and intelligentization, the supporting charging piles also need to meet diverse functions and communication requirements. The power supply voltage range of each device in the traditional integrated PCB system of charging piles is narrow, making it difficult to adapt to the complex and ever-changing power environment of industrial sites. In actual application, additional power conversion equipment is required, which increases the cost and complexity of actual application. Moreover, the communication method of the integrated PCB system is singular and cannot meet the needs of remote communication.

[0003] The above content is only used to help understand the technical solution of the present invention and does not represent an admission that the above content is prior art. Summary of the Invention

[0004] The main objective of this invention is to provide an embedded system and charging pile based on LoRa communication and multi-voltage domain power supply, aiming to solve the technical problem of narrow power supply voltage range of various devices in the charging pile in the prior art.

[0005] To achieve the above objectives, the present invention provides an embedded system based on LoRa communication and multi-voltage domain power supply, comprising: a power supply module, a communication module, and a control module, wherein the control module is connected to the power supply module and the communication module respectively, and the communication module includes at least an interface communication module and a LoRa wireless communication module; The power supply module is used to step down the voltage of a preset voltage domain to obtain power supply voltages of multiple voltage domains, and to provide power input to the control module, the interface communication module and the LORA wireless communication module. The control module is used to generate control signals; The interface communication module is used to convert the control signal into a communication signal for the corresponding interface, so as to realize the communication control function with external devices. The LORA wireless communication module is used to convert the control signal into a LORA wireless communication module signal to realize remote communication and control functions with external devices.

[0006] The control module includes an STM32F407 control chip, a crystal oscillator circuit, a reset circuit, a programming circuit, and a memory circuit. The STM32F407 control chip is connected to the crystal oscillator circuit, the reset circuit, the programming circuit, and the memory circuit, respectively. The crystal oscillator circuit includes at least a resonator, a fourteenth capacitor, a fifteenth capacitor, and an eleventh resistor. The reset circuit includes at least a sixteenth capacitor and a twelfth resistor. The memory circuit includes at least an AT24C04C chip. Specifically, the PH0 pin of the STM32F407 control chip is connected to the second terminal of the fourteenth capacitor, the third port of the resonator, and the first terminal of the eleventh resistor. The first terminal of the fourteenth capacitor is grounded. The first port of the resonator, the second terminal of the eleventh resistor, and the second terminal of the fifteenth capacitor are connected. The fourth port of the resonator is grounded to the first terminal of the fifteenth capacitor. The VCC pin of the AT24C04C chip is connected to the voltage output terminal of the three-stage buck circuit. The SCL pin of the AT24C04C chip is connected to the PB10 pin of the STM32F407 control chip. The SDA pin of the AT24C04C chip is connected to the PB11 pin of the STM32F407 control chip.

[0007] Optionally, the LORA wireless communication module includes at least a WH-L102-L module, a seventeenth capacitor, and an eighteenth capacitor. The MO pin of the WH-L102-L module is connected to the PD7 pin of the STM32F407 control chip, the M1 pin of the WH-L102-L module is connected to the PD6 pin of the STM32F407 control chip, and the RXD pin of the WH-L102-L module is connected to the PD5 pin of the STM32F407 control chip. The TXD pin of the 102-L module is connected to the PA0 pin of the STM32F407 control chip, the AUX pin of the WH-L102-L module is connected to the PA1 pin of the STM32F407 control chip, the VCC pin of the WH-L102-L module is connected to the voltage output terminal of the three-stage buck circuit, the first terminal of the seventeenth capacitor, and the first terminal of the eighteenth capacitor, and the second terminal of the seventeenth capacitor, the second terminal of the eighteenth capacitor, and the GND pin of the WH-L102-L module are grounded.

[0008] Optionally, the power supply module includes at least: a first-stage step-down circuit, a second-stage step-down circuit, and a third-stage step-down circuit, wherein the first-stage step-down circuit, the second-stage step-down circuit, and the third-stage step-down circuit are connected in sequence; The first-stage step-down circuit is used to step down the voltage of a preset voltage range to obtain a first-stage voltage. The preset voltage range is a voltage range of 20 to 60V, and the first-stage voltage is 24V. The secondary step-down circuit is used to step down the primary voltage to obtain a secondary voltage, which is lower than the primary voltage and is 12V or 5V. The three-stage step-down circuit is used to step down the secondary voltage in three stages to obtain a third-stage voltage, which is lower than the secondary voltage and is 3.3V or 4V.

[0009] Optionally, the first-stage step-down circuit includes: an LM5118 control chip, a first resistor to an eighth resistor, a first capacitor to a sixth capacitor, a first diode, a second diode, a first MOSFET, and a second MOSFET; The LM5118 control chip's VIN pin is connected to an external power supply providing a preset voltage domain, and this external power supply is also grounded through a first resistor and a second resistor. The LM5118 control chip's UVLO pins are connected to the first resistor and the second resistor, respectively. The LM5118 control chip's RT pin is grounded through a third resistor. The LM5118 control chip's EN pin is connected to the VIN pin through a fourth resistor. The LM5118 control chip's RAMP pin is grounded through a first capacitor. The LM5118 control chip's AGND pin is grounded through a second capacitor. The LM5118 control chip's SS pin forms a first loop with the COMP pin through a third capacitor, and a second loop with the COMP pin through a fourth capacitor and a sixth resistor. The first and second loops are connected in parallel. The SS pin is also grounded through a fifth resistor. The LM5118 control chip's VOUT pin is grounded through a seventh resistor and a fifth resistor in sequence. The LM5118 control chip's EP pin is grounded. The LM5118 control chip's CS pin is grounded. The LM5118 control chip's CSG pin is grounded through an eighth resistor. The LM5118 control chip's PGND pin is grounded and connected to the anode of the first diode. The LO pin of the LM5118 control chip is connected to the gate of the second MOSFET. The VCC pin of the LM5118 control chip is connected to both the PGND and EP pins via a fifth capacitor. The VCCX pin of the LM5118 control chip is connected to a fixed 12V voltage. The HB and HS pins of the LM5118 control chip are connected via a sixth capacitor. The HO pin of the LM5118 control chip is connected to the gate terminal of the first MOS transistor. The HS pin of the LM5118 control chip is also connected to the first terminal of the first inductor, the source terminal of the first MOS transistor, and the cathode terminal of the first diode. The drain of the first MOS transistor is connected to the external power supply. The source terminal of the second MOS transistor is grounded. The drain of the second MOS transistor is connected to the second terminal of the first inductor and the anode terminal of the second diode. The cathode of the second diode is connected to the VOUT pin of the LM5118 control chip, and a 24V primary voltage is output through the VOUT pin.

[0010] Optionally, the secondary step-down circuit includes at least: an XL1509 chip, a third diode, a second inductor, a seventh capacitor, an eighth capacitor, and a ninth capacitor; The VIN pin of the XL1509 chip is connected to the second terminal of the seventh capacitor, the second terminal of the eighth capacitor, and the voltage output terminal of the first-stage buck circuit. The OUTPUT pin of the XL1509 chip is connected to the cathode of the third diode and the first terminal of the second inductor. The anode of the third diode and the first terminal of the ninth capacitor are grounded. The FB pin of the XL1509 chip is connected to the second terminal of the second inductor, the second terminal of the ninth capacitor, and the voltage output terminal of the second-stage buck circuit. The voltage output terminal of the second-stage buck circuit outputs a second-stage voltage of 12V or 5V.

[0011] Optionally, the three-stage buck circuit includes at least: a buck chip, tenth to thirteenth capacitors, a ninth resistor, and a tenth resistor; The VIN pin of the buck converter chip is connected to the voltage output terminal of the second-stage buck circuit, the first terminal of the tenth capacitor, and the first terminal of the eleventh capacitor, respectively. The second terminals of the tenth and eleventh capacitors are grounded. The VOUT pin of the buck converter chip is connected to the voltage output terminal of the third-stage buck circuit, the first terminal of the ninth resistor, the first terminal of the twelfth capacitor, and the first terminal of the thirteenth capacitor. The second terminal of the ninth resistor is connected to the first terminal of the tenth resistor and the ADJ pin of the buck converter chip. The second terminal of the tenth resistor is grounded. The second terminals of the twelfth and thirteenth capacitors are grounded.

[0012] Optionally, the interface module includes at least one of the following: a digital interface module, an analog interface module, a CAN interface module, and a 485 interface module.

[0013] In addition, to achieve the above objectives, the present invention also proposes a charging pile, which includes an embedded system based on LoRa communication and multi-voltage domain power supply as described above.

[0014] This invention integrates a power supply module, a control module, an interface communication module, and the LORA wireless communication module. By providing a multi-voltage power supply range through functional modules, it enables the control module, interface communication module, and LORA wireless communication module to operate and supply power. This avoids high-voltage damage to components caused by the high voltage range of the external power supply to the charging pile, and meets the power supply requirements of different components across multiple voltage domains. Simultaneously, by integrating the interface communication module and the LORA wireless communication module, it enables various communication methods with external devices, improving communication when the charging pile charges various devices, enhancing interactivity, and avoiding the narrow power supply voltage range problem of existing technologies where charging piles supply power to various devices. Attached Figure Description

[0015] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the main structural framework of the embedded system based on LoRa communication and multi-voltage domain power supply in this embodiment; Figure 2 This is a schematic diagram of the first-stage step-down circuit in this embodiment; the circuit operates at a voltage of 20-60V, with a wide input voltage range of 20-60V and an output voltage of 24V and 2A; the output power is 48W. Figure 3 This is a schematic diagram of the two-stage step-down circuit in this embodiment; the circuit has a 24V input and a 12V or 5V output. Figure 4 This is a schematic diagram of the three-stage buck circuit in this embodiment; the circuit has a 5V input and a 4V or 3.3V output. Figure 5 This is a schematic diagram of the control module in this embodiment; Figure 6 This is a schematic diagram of the circuit structure of the LORA wireless communication module in this embodiment; Figure 7 This is a schematic diagram of the circuit structure of the 24V digital input circuit in this embodiment; the circuit provides a 24V digital input. Figure 8 This is a schematic diagram of the 24V digital output circuit in this embodiment; the circuit provides a 24V digital output. Figure 9 This is a schematic diagram of the analog input section in the analog interface module of this embodiment; the circuit has a 0-10V analog input. Figure 10 This is a schematic diagram of the analog output section in the analog interface module of this embodiment; the circuit provides a 0-10V analog output. Figure 11 This is a schematic diagram of the CAN interface module in this embodiment; the structure includes CAN bus transmission and reception. Figure 12 This is a schematic diagram of the 485 interface module in this embodiment; the structure uses the 485 bus for transmission and reception.

[0018] Figure label:

[0019] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.

[0021] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0022] Based on this, embodiments of the present invention provide an embedded system based on LoRa communication and multi-voltage domain power supply, including: a power supply module, a communication module and a control module, wherein the control module is connected to the power supply module and the communication module respectively, and the communication module includes at least an interface communication module and a LoRa wireless communication module; The power supply module is used to step down the voltage of a preset voltage domain to obtain power supply voltages of multiple voltage domains, and to provide power input to the control module, interface communication module and LORA wireless communication module. The control module is used to generate control signals; The interface communication module is used to convert control signals into communication signals for the corresponding interface in order to realize communication and control functions with external devices. The LORA wireless communication module is used to convert control signals into LORA wireless communication module signals to enable remote communication and control functions with external devices.

[0023] It should be noted that the reference Figure 1 , Figure 1 This diagram illustrates the main structural framework of the embedded system based on LoRa communication and multi-voltage domain power supply in this embodiment. The control module mainly consists of an STM32F407 main control chip and some peripheral circuits, used to realize communication and data processing requests with external devices. The peripheral circuits include at least a clock circuit, a reset circuit, a debug interface circuit, and a memory circuit. The clock circuit provides a stable clock signal for the chip; the reset circuit is used to restore the chip to its initial state when the system malfunctions; and the debug interface circuit facilitates system debugging and program burning for developers.

[0024] In this embodiment, the communication module is divided into a wired communication interface communication module and a wireless communication LoRa wireless communication module. The interface communication module includes at least one of the following: a digital interface module, an analog interface module, a CAN interface module, and a 485 interface module. The digital interface module supports the input and output of 24V digital signals and can be directly connected to external sensors, actuators, and devices to achieve direct control of external devices. The analog interface module can convert external analog signals into digital signals for processing by the main control chip, and can also convert the digital signals output by the main control chip into analog signals for controlling external analog devices, such as motor speed control and voltage regulation. In this embodiment, the analog interface has a total of 4 ADC channels and 2 DAC channels.

[0025] A 485 interface module refers to a device that uses the RS-485 communication standard, supporting half-duplex or full-duplex communication modes. The 485 interface uses differential signal transmission, which has advantages such as strong anti-interference capability and long transmission distance. Each 485 interface is connected to the UART interface of the main control chip through a 485 transceiver chip. The main control chip can communicate with the 485 device via the UART protocol.

[0026] The CAN interface module is equipped with two CAN interfaces, suitable for high-speed and reliable communication in fields such as automotive electronics and industrial automation. The CAN interfaces connect to the CAN controller of the main control chip via CAN transceiver chips, allowing the main control chip to interact with other CAN nodes through the CAN protocol.

[0027] Furthermore, the power supply module includes at least: a first-stage step-down circuit, a second-stage step-down circuit, and a third-stage step-down circuit, which are connected in sequence. The first-stage step-down circuit is used to step down the voltage of a preset voltage range to obtain a first-stage voltage. The preset voltage range is a voltage range of 20 to 60V, and the first-stage voltage is 24V. The secondary step-down circuit is used to step down the primary voltage to obtain a secondary voltage, which is lower than the primary voltage and is 12V or 5V. The three-stage step-down circuit is used to step down the secondary voltage in three stages to obtain a third-stage voltage, which is lower than the secondary voltage and is 3.3V or 4V.

[0028] In the specific implementation process, the power supply module in this embodiment adopts a combination of switching power supply chip and linear voltage regulator chip. The switching power supply chip converts the 20-60V input voltage into an intermediate voltage of 24V, and then converts the intermediate voltage of 24V into 12V and 5V. The linear voltage regulator chip further converts the 5V voltage into 3.3V and 4V to power different modules or circuits and provide a stable operating environment.

[0029] It is understandable that, since the operating voltages of the electronic components in each control chip and sub-circuit are different, in order to avoid some components being overloaded and damaged, or some components failing to operate normally, this embodiment sets up a multi-stage step-down circuit to step down the external power supply step by step and provide it to circuits or components with different voltage requirements, thereby improving the stability of each circuit operation.

[0030] Furthermore, the first-stage step-down circuit includes: an LM5118 control chip U2, first resistors R1 to eighth resistors R8, first capacitors C1 to sixth capacitors C6, first diode D1, second diode D2, first MOSFET Q1, and second MOSFET Q2; In this configuration, the VIN pin of the LM5118 control chip U2 is connected to an external power supply providing a preset voltage domain, and this external power supply is also grounded through a first resistor R1 and a second resistor R2. The UVLO pins of the LM5118 control chip U2 are connected to the first resistor R1 and the second resistor R2, respectively. The RT pin of the LM5118 control chip U2 is grounded through a third resistor R3. The EN pin of the LM5118 control chip U2 is connected to the VIN pin through a fourth resistor R4. The RAMP pin of the LM5118 control chip U2 is grounded through a first capacitor C1. The AGND pin of the LM5118 control chip U2... The SS pin of the LM5118 control chip U2 is grounded through the second capacitor C2. The SS pin of the LM5118 control chip U2 forms a first circuit with the COMP pin through the third capacitor C3, and a second circuit with the COMP pin through the fourth capacitor C4 and the sixth resistor R6. The first and second circuits are connected in parallel. The SS pin is also grounded through the fifth resistor R5. The VOUT pin of the LM5118 control chip U2 is grounded through the seventh resistor R7 and the fifth resistor R5 in sequence. The EP pin of the LM5118 control chip U2 is grounded. The CS pin of the LM5118 control chip U2 is grounded. The CSG pin of the LM5118 control chip U2 is grounded through the second capacitor C2. The eight resistors R8 are grounded and connected to the anode of the first diode D1. The PGND pin of the LM5118 control chip U2 is grounded. The LO pin of the LM5118 control chip U2 is connected to the gate of the second MOSFET Q2. The VCC pin of the LM5118 control chip U2 is connected to both the PGND and EP pins of the LM5118 control chip U2 via the fifth capacitor C5. The VCCX pin of the LM5118 control chip U2 is connected to a fixed voltage of -12V. The HB and HS pins of the LM5118 control chip U2 are connected via the sixth capacitor C6. The HO pin of the LM5118 control chip U2 is connected to the gate terminal of the first MOSFET. The HS pin of the LM5118 control chip U2 is also connected to the first terminal of the first inductor, the source terminal of the first MOSFET Q1, and the cathode terminal of the first diode D1. The drain of the first MOSFET Q1 is connected to the external power supply. The source terminal of the second MOSFET Q2 is grounded. The drain of the second MOSFET Q2 is connected to the second terminal of the first inductor and the anode terminal of the second diode D2. The cathode of the second diode D2 is connected to the VOUT pin of the LM5118 control chip U2, and a 24V primary voltage is output through the VOUT pin.

[0031] The secondary step-down circuit includes at least: XL1509 chip U3, third diode D3, second inductor, seventh capacitor C7, eighth capacitor C8, and ninth capacitor C9; Specifically, the VIN pin of the XL1509 chip U3 is connected to the second terminal of the seventh capacitor C7, the second terminal of the eighth capacitor C8, and the voltage output terminal of the first-stage buck circuit. The OUTPUT pin of the XL1509 chip U3 is connected to the cathode of the third diode D3 and the first terminal of the second inductor. The anode of the third diode D3 and the first terminal of the ninth capacitor C9 are grounded. The FB pin of the XL1509 chip U3 is connected to the second terminal of the second inductor, the second terminal of the ninth capacitor C9, and the voltage output terminal of the second-stage buck circuit. The voltage output terminal of the second-stage buck circuit outputs a second-stage voltage of 12V or 5V.

[0032] The three-stage buck circuit includes at least: a buck chip, tenth capacitor C10 to thirteenth capacitor C13, ninth resistor R9 and tenth resistor R10; The VIN pin of the buck converter chip is connected to the voltage output terminal of the second-stage buck circuit, the first terminal of the tenth capacitor C10, and the first terminal of the eleventh capacitor C11. The second terminals of the tenth capacitor C10 and the eleventh capacitor C11 are grounded. The VOUT pin of the buck converter chip is connected to the voltage output terminal of the third-stage buck circuit, the first terminal of the ninth resistor R9, the first terminal of the twelfth capacitor C12, and the first terminal of the thirteenth capacitor C13. The second terminal of the ninth resistor R9 is connected to the first terminal of the tenth resistor R10 and the ADJ pin of the buck converter chip. The second terminal of the tenth resistor R10 is grounded, and the second terminals of the twelfth capacitor C12 and the thirteenth capacitor C13 are grounded.

[0033] refer to Figure 2 , Figure 2 This is a schematic diagram of the first-stage step-down circuit in this embodiment. Since the digital interface module operates at 24V, a first-stage step-down circuit supplies power to the digital signal module in the interface communication module in order to enable the charging pile to input and output 24V digital signals. (Refer to...) Figure 3 , Figure 3 This is a schematic diagram of the two-stage buck circuit in this embodiment. The two-stage buck circuit is used to provide a 12V or 5V secondary voltage. Since the digital output section in the digital interface module needs to be connected to a 12V voltage, and the operating voltage of the analog interface module is 12V, while the operating voltage of the chip in the CAN interface module is 5V, the two-stage buck circuit supplies power to the analog signal module in the interface communication module; Reference Figure 4 , Figure 4This is a schematic diagram of the three-stage step-down circuit in this embodiment. Since the operating voltage of the 485 interface module, other crystal oscillator circuits, or reset circuits is relatively small and their sensitivity is relatively high, the three-stage step-down module is generally used to power these sub-circuits or chips to provide a stable operating voltage environment.

[0034] Furthermore, the control module includes an STM32F407 control chip, a crystal oscillator circuit, a reset circuit, a programming circuit, and a memory circuit. The STM32F407 control chip is connected to the crystal oscillator circuit, the reset circuit, the programming circuit, and the memory circuit, respectively. The crystal oscillator circuit includes at least a resonator, a fourteenth capacitor C14, a fifteenth capacitor C15, and an eleventh resistor R11. The reset circuit includes at least a sixteenth capacitor C16 and a twelfth resistor R12. The memory circuit includes at least an AT24C04C chip. Among them, reference Figure 5 , Figure 5 This is a schematic diagram of the control module in this embodiment. The PH0 pin of the STM32F407 control chip is connected to the second terminal of the fourteenth capacitor C14, the third port of the resonator, and the first terminal of the eleventh resistor R11. The first terminal of the fourteenth capacitor C14 is grounded. The first port of the resonator, the second terminal of the eleventh resistor R11, and the second terminal of the fifteenth capacitor C15 are connected. The fourth port of the resonator is grounded to the first terminal of the fifteenth capacitor C15. The VCC pin of the AT24C04C chip is connected to the voltage output terminal of the three-stage buck circuit. The SCL pin of the AT24C04C chip is connected to the PB10 pin of the STM32F407 control chip. The SDA pin of the AT24C04C chip is connected to the PB11 pin of the STM32F407 control chip.

[0035] It should be understood that the control module is mainly used to realize communication and data processing requests with external devices. The peripheral circuits include at least clock circuits, reset circuits, debug interface circuits, and memory circuits. The clock circuit provides a stable clock signal for the chip; the reset circuit is used to restore the chip to its initial state when the system malfunctions; and the debug interface circuit facilitates the development of developers to debug the system and burn programs.

[0036] The LORA wireless communication module includes at least a WH-L102-L module U5, a seventeenth capacitor C17, and an eighteenth capacitor C18. The MO pin of the WH-L102-L module U5 is connected to the PD7 pin of the STM32F407 control chip, the M1 pin of the WH-L102-L module U5 is connected to the PD6 pin of the STM32F407 control chip, and the RXD pin of the WH-L102-L module U5 is connected to the PD5 pin of the STM32F407 control chip. The TXD pin of module U5 is connected to the PA0 pin of the STM32F407 control chip. The AUX pin of module U5 is connected to the PA1 pin of the STM32F407 control chip. The VCC pin of module U5 is connected to the voltage output terminal of the three-stage buck circuit, the first terminal of the seventeenth capacitor C17, and the first terminal of the eighteenth capacitor C18. The second terminal of the seventeenth capacitor C17, the second terminal of the eighteenth capacitor C18, and the GND pin of module U5 are grounded.

[0037] refer to Figure 6 , Figure 6 This is a schematic diagram of the circuit structure of the LoRa wireless communication module in this embodiment. In addition to wired communication, considering the development of intelligent devices, this embodiment also adds configuration and data transmission and reception control using low-power, long-distance LoRa communication technology to achieve low-power data communication and real-time acquisition of the charging status of charging devices (such as vehicles). Unlike traditional wireless communication methods, in this embodiment, LoRa uses the sub-gigahertz (Sub-GHz) band and enhances the signal's anti-interference capability through spread spectrum technology, maintaining stable communication quality even in complex electromagnetic environments. Furthermore, LoRa employs special spread spectrum modulation technology and forward error correction mechanism, which can significantly reduce power consumption while ensuring transmission distance. This characteristic is particularly important for battery-powered devices, as it can greatly extend the device's operating life. This embodiment is applied to charging piles, which are electrical devices subject to electromagnetic interference and frequent use, and the communication effect is better than traditional wireless communication.

[0038] Furthermore, the interface module includes at least one of the following: a digital interface module, an analog interface module, a CAN interface module, and a 485 interface module.

[0039] In its implementation, the digital interface module includes a 24V digital input circuit and a 24V digital output circuit, wherein... Figure 7 This is a schematic diagram of the circuit structure of the 24V digital input circuit in this embodiment. Figure 8This is a schematic diagram of the 24V digital output circuit in this embodiment. The digital input circuit includes at least a first transistor, a thirteenth resistor R13, and a fourteenth resistor R14. The first end of the thirteenth resistor R13 is connected to the voltage output terminal of the first step-down resistor, and the second end of the thirteenth resistor R13 is connected to the first port of the first transistor. The first end of the fourteenth resistor R14 is connected to the voltage output terminal of the three-stage step-down circuit, and the second end of the fourteenth resistor R14 is connected to any one of the PE7-PE12 pins of the STM32F407 control chip and the fourth port of the first transistor. The third port of the first transistor is grounded, and the second port of the first transistor is connected to the digital signal input interface of an external device. The 24V digital output circuit includes at least a second transistor, fifteenth resistors R15 to seventeenth resistors R17, and a fourth diode. D4 and the third MOSFET Q3, wherein the second terminal of the fifteenth resistor R15 and the cathode of the fourth diode D4 are grounded, the first terminal of the fifteenth resistor R15 and the anode of the fourth diode D4 are connected to the digital signal output terminal and the source terminal of the third MOSFET Q3, the gate of the third MOSFET Q3 is connected to the third port of the second transistor, the drain of the third MOSFET Q3 is grounded, the fourth port of the second transistor is connected to the first terminal of the sixteenth resistor R16, the second terminal of the sixteenth resistor R16 is connected to the voltage output terminal of the headphone buck circuit, the second port of the second transistor is connected to any pin of PE7-PE12 in the STM32F407 control chip, the first port of the second transistor is connected to the first terminal of the seventeenth resistor R17, and the second terminal of the seventeenth resistor R17 is connected to the voltage output terminal of the three-stage buck circuit.

[0040] Figure 9 This is a schematic diagram of the analog input section in the analog interface module of this embodiment. Figure 10 This is a schematic diagram of the analog output section of the analog interface module in this embodiment. The analog input section of the analog interface module includes at least the eighteenth resistor R18 to the twenty-second resistor R22 and a first operational amplifier. The first end of the eighteenth resistor R18 is an external input terminal, and the second end of the eighteenth resistor R18 is connected to the non-inverting input terminal of the first operational amplifier. The first end of the nineteenth resistor R19 is grounded, and the second end is connected to the inverting input terminal of the first operational amplifier. The first end of the twenty-second resistor R22 is connected to the non-inverting input terminal of the first operational amplifier and the second end of the eighteenth resistor R18. The second end of the twenty-second resistor R22 is grounded.

[0041] The analog output section of the analog interface module includes at least resistors 21 to 23 and a second operational amplifier. The first end of resistor 21 is connected to the output of the second operational amplifier and the output of the analog interface module, and the second end of resistor 21 is connected to the inverting input of the second operational amplifier. The first end of resistor 22 is connected to the non-inverting input of the second operational amplifier, and the second end is connected to pin PA4 or PA5 of the STM32F407 control chip. The first end of resistor 23 is connected to the inverting input of the second operational amplifier, and the second end is grounded.

[0042] Figure 11 The diagram below shows the structure of the CAN interface module in this embodiment. The CAN interface module includes at least a CA-IS3062W control chip U6, an RS0102YH8 chip U7, and capacitors C19 to C22. The RXD pin of the CA-IS3062W control chip U6 is connected to the B1 pin of the RS0102YH8 chip U7, and the TXD pin of the CA-IS3062W control chip U6 is connected to the B2 pin of the RS0102YH8 chip U7.

[0043] Figure 12 This is a schematic diagram of the 485 interface module in this embodiment. The 485 interface module includes at least an SP3485 chip and a 25th capacitor.

[0044] This embodiment integrates a power supply module, a control module, an interface communication module, and a LoRa wireless communication module. By providing a multi-voltage power supply range through functional modules, it enables the control module, interface communication module, and LoRa wireless communication module to operate and supply power. This avoids high-voltage damage to components caused by the high voltage range of the external power supply to the charging pile, and meets the power supply requirements of different components across multiple voltage domains. Furthermore, by integrating the interface communication module and the LoRa wireless communication module, it enables various communication methods with external devices, improving communication when the charging pile charges various devices and enhancing interactivity. This avoids the problem of narrow power supply voltage ranges for various devices in existing technologies.

[0045] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0046] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0047] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. An embedded system based on LORA communication and multi-voltage domain power supply, characterized in that, include: The system includes a power supply module, a communication module, and a control module. The control module is connected to both the power supply module and the communication module. The communication module includes at least an interface communication module and a LoRa wireless communication module. The power supply module is used to step down the voltage of a preset voltage domain to obtain power supply voltages of multiple voltage domains, and to provide power input to the control module, the interface communication module and the LORA wireless communication module. The control module is used to generate control signals; The interface communication module is used to convert the control signal into a communication signal for the corresponding interface, so as to realize the communication control function with external devices. The LORA wireless communication module is used to convert the control signal into a LORA wireless communication module signal to realize wireless communication control function with external devices; The control module includes an STM32F407 control chip, a crystal oscillator circuit, a reset circuit, a programming circuit, and a memory circuit. The STM32F407 control chip is connected to the crystal oscillator circuit, the reset circuit, the programming circuit, and the memory circuit, respectively. The crystal oscillator circuit includes at least a resonator, a fourteenth capacitor, a fifteenth capacitor, and an eleventh resistor. The reset circuit includes at least a sixteenth capacitor and a twelfth resistor. The memory circuit includes at least an AT24C04C chip. Specifically, the PH0 pin of the STM32F407 control chip is connected to the second terminal of the fourteenth capacitor, the third port of the resonator, and the first terminal of the eleventh resistor. The first terminal of the fourteenth capacitor is grounded. The first port of the resonator, the second terminal of the eleventh resistor, and the second terminal of the fifteenth capacitor are connected. The fourth port of the resonator is grounded to the first terminal of the fifteenth capacitor. The VCC pin of the AT24C04C chip is connected to the voltage output terminal of the three-stage buck circuit. The SCL pin of the AT24C04C chip is connected to the PB10 pin of the STM32F407 control chip. The SDA pin of the AT24C04C chip is connected to the PB11 pin of the STM32F407 control chip.

2. The LORA communication and multi-voltage domain power supply based embedded system as claimed in claim 1 wherein, The LORA wireless communication module includes at least a WH-L102-L module, a seventeenth capacitor, and an eighteenth capacitor. The MO pin of the WH-L102-L module is connected to the PD7 pin of the STM32F407 control chip, the M1 pin of the WH-L102-L module is connected to the PD6 pin of the STM32F407 control chip, and the RXD pin of the WH-L102-L module is connected to the PD5 pin of the STM32F407 control chip. The TXD pin of the WH-L102-L module is connected to the PA0 pin of the STM32F407 control chip. The AUX pin of the WH-L102-L module is connected to the PA1 pin of the STM32F407 control chip. The VCC pin of the WH-L102-L module is connected to the voltage output terminal of the three-stage buck circuit, the first terminal of the seventeenth capacitor, and the first terminal of the eighteenth capacitor. The second terminal of the seventeenth capacitor, the second terminal of the eighteenth capacitor, and the GND pin of the WH-L102-L module are grounded.

3. The LORA communication and multi-voltage domain power supply based embedded system as claimed in claim 1 wherein, The power supply module includes at least: a first-stage step-down circuit, a second-stage step-down circuit, and a third-stage step-down circuit, which are connected in sequence. The first-stage step-down circuit is used to step down the voltage of a preset voltage range to obtain a first-stage voltage. The preset voltage range is a voltage range of 20 to 60V, and the first-stage voltage is 24V. The secondary step-down circuit is used to step down the primary voltage to obtain a secondary voltage, which is lower than the primary voltage and is 12V or 5V. The three-stage step-down circuit is used to step down the secondary voltage in three stages to obtain a third-stage voltage, which is lower than the secondary voltage and is 3.3V or 4V.

4. The LORA communication and multi-voltage domain power supply based embedded system as claimed in claim 3, wherein, The first-stage step-down circuit includes: an LM5118 control chip, first to eighth resistors, first to sixth capacitors, a first diode, a second diode, a first MOSFET, and a second MOSFET. The LM5118 control chip's VIN pin is connected to an external power supply providing a preset voltage domain, and this external power supply is also grounded through a first resistor and a second resistor. The LM5118 control chip's UVLO pins are connected to the first resistor and the second resistor, respectively. The LM5118 control chip's RT pin is grounded through a third resistor. The LM5118 control chip's EN pin is connected to the VIN pin through a fourth resistor. The LM5118 control chip's RAMP pin is grounded through a first capacitor. The LM5118 control chip's AGND pin is grounded through a second capacitor. The LM5118 control chip's SS pin forms a first loop with the COMP pin through a third capacitor, and a second loop with the COMP pin through a fourth capacitor and a sixth resistor. The first and second loops are connected in parallel. The SS pin is also grounded through a fifth resistor. The LM5118 control chip's VOUT pin is grounded through a seventh resistor and a fifth resistor in sequence. The LM5118 control chip's EP pin is grounded. The LM5118 control chip's CS pin is grounded. The LM5118 control chip's CSG pin is grounded through an eighth resistor. The LM5118 control chip's PGND pin is grounded and connected to the anode of the first diode. The LO pin of the LM5118 control chip is connected to the gate of the second MOSFET. The VCC pin of the LM5118 control chip is connected to both the PGND and EP pins via a fifth capacitor. The VCCX pin of the LM5118 control chip is connected to a fixed 12V voltage. The HB and HS pins of the LM5118 control chip are connected via a sixth capacitor. The HO pin of the LM5118 control chip is connected to the gate terminal of the first MOS transistor. The HS pin of the LM5118 control chip is also connected to the first terminal of the first inductor, the source terminal of the first MOS transistor, and the cathode terminal of the first diode. The drain of the first MOS transistor is connected to the external power supply. The source terminal of the second MOS transistor is grounded. The drain of the second MOS transistor is connected to the second terminal of the first inductor and the anode terminal of the second diode. The cathode of the second diode is connected to the VOUT pin of the LM5118 control chip, and a 24V primary voltage is output through the VOUT pin.

5. The LORA communication and multi-voltage domain power supply based embedded system as claimed in claim 3, wherein, The secondary step-down circuit includes at least: an XL1509 chip, a third diode, a second inductor, a seventh capacitor, an eighth capacitor, and a ninth capacitor; The VIN pin of the XL1509 chip is connected to the second terminal of the seventh capacitor, the second terminal of the eighth capacitor, and the voltage output terminal of the first-stage buck circuit. The OUTPUT pin of the XL1509 chip is connected to the cathode of the third diode and the first terminal of the second inductor. The anode of the third diode and the first terminal of the ninth capacitor are grounded. The FB pin of the XL1509 chip is connected to the second terminal of the second inductor, the second terminal of the ninth capacitor, and the voltage output terminal of the second-stage buck circuit. The voltage output terminal of the second-stage buck circuit outputs a second-stage voltage of 12V or 5V.

6. The LORA communication and multi-voltage domain power supply based embedded system as claimed in claim 3, wherein, The three-stage buck circuit includes at least: a buck chip, tenth to thirteenth capacitors, a ninth resistor, and a tenth resistor; The VIN pin of the buck converter chip is connected to the voltage output terminal of the second-stage buck circuit, the first terminal of the tenth capacitor, and the first terminal of the eleventh capacitor, respectively. The second terminals of the tenth and eleventh capacitors are grounded. The VOUT pin of the buck converter chip is connected to the voltage output terminal of the third-stage buck circuit, the first terminal of the ninth resistor, the first terminal of the twelfth capacitor, and the first terminal of the thirteenth capacitor. The second terminal of the ninth resistor is connected to the first terminal of the tenth resistor and the ADJ pin of the buck converter chip. The second terminal of the tenth resistor is grounded. The second terminals of the twelfth and thirteenth capacitors are grounded.

7. The LORA communication and multi-voltage domain power supply based embedded system as claimed in claim 1 wherein, The interface communication module includes at least one of the following: a digital interface module, an analog interface module, a CAN interface module, and a 485 interface module.

8. A charging post, characterized in that The charging pile includes an embedded system based on LORA communication and multi-voltage domain power supply as described in any one of claims 1 to 7.

Images