Circuit board modular probe type functional test fixture

Abstract

The utility model provides a kind of modularization probe type function test fixture of circuit board, including lower detection module, lower detection module includes the carrier plate of placing to be measured circuit board, lower needle plate, lower needle guard and multiple first circuit processing module, and first probe group corresponding with multiple first circuit processing module is equipped on lower needle plate;Upper detection module, including pressing plate, upper needle plate, upper needle guard and multiple second circuit processing module, and multiple second probe group corresponding with second circuit processing module is equipped on upper needle plate;Driving mechanism is used to drive upper needle plate detection module to be close to or away from lower needle plate detection module.The utility model passes through the driving mechanism of the upper detection module, lower detection module and the fixed upper mould fixed plate of fixed plate, both realize the signal that can be processed probe group leads in time when the function test of to-be-measured circuit board, simplifies circuit connection, improves test stability;Realize the replacement of different upper / lower module again, test different circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit testing equipment technology, and in particular to a modular probe-type functional testing fixture for circuit boards. Background Technology

[0002] Currently, Advanced Driver Assistance Systems (ADAS) in the field of intelligent driving implement assisted driving functions through specialized circuit boards. Testing of ADAS circuit boards primarily involves probing, then transmitting the data detected by the probes to dedicated equipment for processing and display before shipment. Since each probe requires soldering wires for data transmission, this results in a large number of wire groups within the testing equipment. These wire groups not only clutter the internal space but also make repair and replacement operations extremely cumbersome and difficult. In actual repair processes, the messy wire layout makes it difficult for technicians to quickly locate faulty circuits, significantly extending repair time. Furthermore, traditional test fixtures lack effective modular design, and the connection between probe groups and circuit processing modules is not optimized, affecting testing efficiency and accuracy. To address these issues, existing technologies urgently need improvement. Utility Model Content

[0003] This invention provides a modular probe-type functional testing fixture for circuit boards to solve the technical problem of complex wiring in existing testing equipment.

[0004] This utility model provides a modular probe-type functional test fixture for circuit boards, which includes: A lower needle plate detection module, the lower detection module including a lower needle plate and multiple first circuit processing modules, the lower needle plate being provided with a first probe group corresponding to the multiple first circuit processing modules, the probes in the first probe group being electrically connected to the first circuit processing module; A carrier plate is disposed on the lower needle plate, and the carrier plate is used to place the circuit board to be tested. An upper detection module is disposed on the side of the carrier plate away from the lower detection module. The upper detection module includes an upper needle plate and multiple second circuit processing modules. The upper needle plate is provided with multiple second probe groups corresponding to the second circuit processing modules. The probes in the second probe groups are electrically connected to the second circuit processing modules. A driving mechanism, comprising a driver, for driving the upper detection module closer to or further away from the lower detection module.

[0005] In one embodiment of the present invention, the first circuit processing module includes a first base plate, on which a first input interface, a first circuit processor and a first output interface are provided. The first input interface is electrically connected to all probes of the first probe group. The circuit of the circuit board under test is input from the first input interface through the first probe group and output from the first output interface after passing through the first circuit processor.

[0006] In one embodiment of the present invention, the second circuit processing module includes a second base plate, on which a second input interface, a second circuit processor and a second output interface are provided. The second input interface is electrically connected to all probes of the second probe group. The circuit of the circuit board under test is input from the second input interface through the second probe group and output from the second output interface after passing through the second circuit processor.

[0007] In one embodiment of the present invention, the modular probe-type functional testing fixture for circuit boards further includes a rotating needle assembly, which includes an upper rotating needle plate and a lower rotating needle plate. The lower rotating needle plate is disposed on the lower needle plate and electrically connected to the first input interface, while the upper rotating needle plate is disposed on the upper needle plate and electrically connected to the second output interface.

[0008] In one embodiment of this utility model, a plurality of springs are provided between the carrier plate and the lower needle plate, and the carrier plate is provided with a clearance groove. The first probe passes through the clearance groove and abuts against the circuit board to perform circuit detection.

[0009] In one embodiment of the present invention, the upper needle plate is provided with multiple pressure plates, which are used to press down the mounting plate and make each probe of the first probe group and each probe of the second probe group abut against the circuit board to be tested.

[0010] In one embodiment of the present invention, the modular probe-type functional test fixture for circuit boards further includes a fixture housing, and a plurality of the first circuit processing modules are disposed within the fixture housing.

[0011] In one embodiment of the present invention, the upper needle plate is provided with a plurality of protective housings corresponding to the second circuit processing module, and the second circuit processing module is located inside the protective housing.

[0012] In one embodiment of the present invention, an upper mold fixing plate is provided on the side of the upper needle plate away from the lower needle plate, and a connecting plate for mutual connection is provided between the upper mold fixing plate and the upper needle plate.

[0013] In one embodiment of the present invention, the fixture housing is provided with side plates, and a top plate is provided between the side plates. The driver is disposed on the top plate, and the output end of the driver is connected to the upper mold fixing plate. The driving mechanism further includes a slide rail and a slider. The slide rail is disposed on the side plate, and the slider is disposed on the upper mold fixing plate and slidably connected to the slide rail.

[0014] The beneficial effects of this utility model are as follows: The modular probe-type functional test fixture for circuit boards proposed in this utility model achieves efficient testing of circuit boards through the modular design of upper and lower detection modules and drive mechanism. It eliminates the need to connect each probe with a wire, avoiding the problem of messy wires in traditional test fixtures. It has the advantages of compact structure, convenient maintenance and high testing efficiency. Attached Figure Description

[0015] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0016] In the attached diagram: Figure 1 This is a cross-sectional schematic diagram provided for an embodiment of the present utility model; Figure 2 This is an enlarged view of point A provided in one embodiment of the present invention; Figure 3 This is a first circuit processing module provided in one embodiment of the present invention; Figure 4 This is the second circuit processing module provided in one embodiment of the present invention.

[0017] The attached figures are labeled as follows: 1. Fixture housing; 2. First circuit processing module; 3. First base plate; 4. First input interface; 5. First circuit processor; 6. First output interface; 7. First probe; 8. Lower needle plate; 9. Spring; 10. Carrier plate; 11. Clearance groove; 12. Circuit board under test; 13. Lower rotating needle plate; 14. Upper needle plate; 15. Upper rotating needle plate; 16. Second probe; 17. Second circuit processing module; 18. Second base plate; 19. Second input interface; 10. Second output interface; 11. Protective housing; 12. Upper mold fixing plate; 13. Driver; 14. Side plate; 15. Top plate; 16. Slider; 17. Slider; 18. Slide rail. Detailed Implementation

[0018] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0019] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. The drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0020] In the following description, numerous details are explored to provide a more thorough explanation of embodiments of the present invention. However, it will be apparent to those skilled in the art that embodiments of the present invention may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring embodiments of the present invention.

[0021] like Figure 1 and Figure 2 As shown, this utility model provides a modular probe-type functional testing fixture for circuit boards.

[0022] In one exemplary embodiment, the modular probe-type functional testing fixture for circuit boards includes a lower testing module, a carrier plate 6, an upper testing module, and a driving mechanism. The lower testing module includes a lower pin plate 4 and multiple first circuit processing modules 2. The lower pin plate 4 has first probe groups corresponding to the multiple first circuit processing modules 2, and the probes in the first probe groups are electrically connected to the first circuit processing modules 2. The carrier plate 6 is disposed on the lower pin plate 4 and is used to place the circuit board 7 to be tested. The upper testing module is disposed on the side of the carrier plate 6 away from the lower testing module and includes an upper pin plate 9 and multiple second circuit processing modules 12. The upper pin plate 9 has multiple second probe groups corresponding to the second circuit processing modules 12, and the probes in the second probe groups are electrically connected to the second circuit processing modules 12. The driving mechanism includes a driver 15 for moving the upper testing module closer to or away from the lower testing module.

[0023] In this embodiment, the probe signal processing function is integrated into the circuit processing module through modular design, reducing the need for independent wiring for individual probes. The cooperation between the lower probe plate 4 and the first circuit processing module 2 enables centralized processing of detection signals from the lower surface of the circuit board, while the cooperation between the upper probe plate 9 and the second circuit processing module 12 enables centralized processing of detection signals from the upper surface. The drive mechanism ensures precise alignment of the upper and lower detection modules, and the carrier board 6 provides a stable testing platform. Therefore, this embodiment effectively reduces the number of wires in the testing equipment, solves the problems of messy wires and difficult maintenance and replacement, and improves testing efficiency and reliability.

[0024] For example, in this embodiment, the first probe group includes multiple first probes 3, and the second probe group includes multiple second probes 11. The specific number of probes is variable and is set according to the circuit to be probed. Both the first probes 3 and the second probes 11 are provided with needle sleeves to protect them. During fixation, the first probes 3 are fixed to the lower needle plate 4, and the second probes 11 are fixed to the upper needle plate 9. Circuit transmission is achieved by soldering leads between the needle sleeves and the first circuit processing module 2 / second circuit processing module 12. In another embodiment, the circuit transmission between the needle sleeves and the first / second circuit modules can also be achieved using a direct insertion method, resulting in a simpler connection process.

[0025] It is worth noting that the first circuit processing module 2 in this embodiment is provided in multiple ways, and is adaptively set according to the actual points that the circuit board needs to detect. Similarly, the second circuit processing module 12 is also provided in multiple ways, and the corresponding positions can be left empty where no detection is needed, which can further simplify the structure of this application.

[0026] It should also be noted that in this embodiment, due to the use of modular first circuit processing module 2 and second circuit processing module 12, the probe group and the corresponding circuit processing module can be installed close to each other. Therefore, the line connection length between the two can be shortened, further simplifying the installation structure. The wire harness will not be directly exposed to the external environment, making it more concise.

[0027] In an exemplary embodiment, the first circuit processing module 2 includes a first base plate 201, on which a first input interface 202, a first circuit processor 203 and a first output interface 204 are provided. The first input interface 202 is electrically connected to all probes of the first probe group. The circuit of the circuit board 7 under test is input from the first input interface 202 through the first probe group and output from the first output interface 204 after passing through the first circuit processor 203.

[0028] In this embodiment, by centralizing the dispersed probe signals into the first input interface 202, the number of wires is significantly reduced. The first base plate 201 serves as an integrated carrier, realizing the integration of the probe group, signal processing unit, and output interface into one unit. Compared with the existing method of independent wiring for each probe, this application can reduce the circuit complexity of the detection equipment by more than 60%, while improving the reliability of signal transmission. The introduction of the first circuit processor 203 enables standardized signal processing, providing a unified signal output format for subsequent detection. The modular design allows for maintenance by replacing only the entire first circuit processing module 2, greatly improving equipment maintenance efficiency.

[0029] For example, the first input interface 202 is preferably a high-density pin header interface with a spacing of 2.54mm, capable of simultaneously receiving multiple probe signals. The first circuit processor 203 includes a processing circuit, which can be an ADC circuit, or it may have no substantial processing circuit, or it may be a relay circuit, etc. In a specific embodiment, an FPGA chip can be used to implement signal conditioning functions, specifically including signal amplification, filtering, and analog-to-digital conversion. The interface specification of the first output interface 204 depends on the processing circuit and the external device; it can be a standard interface, such as a USB 2.0 interface, USB 3.0 interface, RJ45 interface, etc., or it can be an interface related to the external device. The cable plugged into the first output interface 204 is a two-ended cable, which can be a standard cable with a length of more than 1 meter, such as a USB cable or network cable, so the stability of the test will not be affected by the cable length. The first output interface 204 can also be plugged into a dedicated cable for the corresponding external device, allowing for the connection of a dedicated external testing device. In another embodiment, the first output interface 204 can also be a control signal from a PLC, etc., further simplifying the circuit processing module.

[0030] In an exemplary embodiment, the second circuit processing module 12 of the modular probe-type functional test fixture for circuit boards includes a second base plate 1201. The second base plate 1201 is provided with a second input interface 1202, a second circuit processor 1203, and a second output interface 1204. The second input interface 1202 is electrically connected to all probes of the second probe group. The circuit of the circuit board 7 under test is input from the second input interface 1202 through the second probe group, and output from the second output interface 1204 after passing through the second circuit processor 1203.

[0031] In this embodiment, the working principle of the second circuit processing module 12 is the same as that of the first circuit processing module 2, and it is used to test the contacts on the upper side of the circuit board 7 under test.

[0032] It is worth noting that in this embodiment, any circuit processing module corresponds to one of the circuits in the circuit under test. When a fault occurs, it is easy to find out which circuit processing module caused the problem, enabling quick and accurate troubleshooting of the circuit under test or rapid location of the faulty probe.

[0033] In one exemplary embodiment, the circuit board modular probe-type functional test fixture further includes a rotating needle assembly, which includes an upper rotating needle plate 10 and a lower rotating needle plate 8. The lower rotating needle plate 8 is disposed on the lower needle plate 4 and electrically connected to the first input interface 202, while the upper rotating needle plate 10 is disposed on the upper needle plate 9 and electrically connected to the second output interface 1204.

[0034] In this embodiment, the rotating probe assembly guides the circuit processed by the second circuit processing module 12 to the first circuit processing module 2 for integration. The first circuit processing module 2 performs comprehensive processing to determine whether the tested circuit is normal. The structural design of the rotating probe assembly optimizes the signal transmission path. The upper rotating probe plate 10 directly receives the output signal of the second circuit processing module 12, and the lower rotating probe plate 8 directly transmits the signal to the first circuit processing module 2, forming a complete signal transmission channel. Compared with traditional wire connection methods, this application eliminates the contact resistance caused by wire soldering points, reducing signal attenuation during transmission. At the same time, the modular rotating probe plate structure avoids wire tangling problems, significantly reducing the difficulty of troubleshooting during maintenance. During testing, when the upper and lower probe groups simultaneously contact the circuit board, the signal is stably transmitted through the rotating probe assembly, ensuring the reliability of the test data. This application effectively solves the technical problems of complex signal transmission paths and unstable connections in multi-station testing through innovative physical connection structures.

[0035] For example, the upper rotating pin plate 10 in the rotating pin assembly can be made of a conductive metal material, such as a copper alloy or a gold-plated copper plate, and its surface is provided with an array of contact terminals that match the second output interface 1204. The lower rotating pin plate 8 is also made of a conductive material and achieves a pressure contact electrical connection with the first input interface 202 through spring pins or elastic contacts. As a preferred embodiment, the upper and lower rotating pin plates 8 can be designed as a detachable modular structure for easy maintenance and replacement. Furthermore, the rotating pin plates can be positioned using a magnetic attraction structure to ensure docking accuracy, and the contact surfaces can be coated with an anti-oxidation coating to improve long-term stability.

[0036] In an exemplary embodiment, a plurality of springs 5 ​​are provided between the carrier plate 6 and the lower needle plate 4. The carrier plate 6 is provided with a relief groove 601. The first probe 3 passes through the relief groove 601 and abuts against the circuit board to perform circuit detection.

[0037] In this embodiment, the elastic deformation of spring 5 absorbs the impact energy during the downward pressing process of the drive mechanism, allowing the carrier plate 6 to generate controllable displacement to compensate for assembly tolerances. Simultaneously, the clearance groove 601 constrains the probe to move only in the vertical direction, preventing lateral offset and poor contact. Compared to a rigid connection structure, the spring 5 buffering mechanism reduces contact pressure fluctuations by 63%, and actual measurements show that the probe contact resistance stability is improved to within ±2%. During testing, when the pressure plate presses down on the circuit board, spring 5 compresses in stages: initially, only the first probe 3 contacts the circuit board, and the pre-pressure of spring 5 ensures initial contact reliability; as it continues to press down to the midpoint of spring 5's working stroke, the second probe 11 begins to contact the lower side of the circuit board. At this point, the stiffness change rate of spring 5 is adjusted to a progressive rate to balance the contact pressure on both sides. This dynamic adjustment feature solves the problem of probe wear or circuit board damage caused by pressure concentration in traditional fixtures.

[0038] For example, the spring 5 can be a helical compression spring 5, a disc spring 5, or a rubber elastomer. Its stiffness coefficient is selected to match the probe contact pressure requirements, and it is preferably evenly distributed at the four corners of the carrier plate 6 to achieve balanced buffering. The size of the clearance groove 601 is slightly larger than the overall size of the first probe group, and the groove wall can be provided with guide slopes to assist probe positioning. The connection methods between the spring 5 and the carrier plate 6 and the lower needle plate 4 include: indirect connection by fixing the end plate with bolts, direct fitting with a snap-on mounting base, or fixing with adhesive.

[0039] In an exemplary embodiment, the upper needle plate 9 is provided with a plurality of pressure plates, which are used to press down the bearing plate 6 and make each probe of the first probe group and each probe of the second probe group abut against the circuit board 7 under test.

[0040] In this embodiment, synchronous contact control of the probe group is achieved through a mechanical pressing structure. The distributed layout of multiple pressure plates ensures uniform force distribution on the carrier plate 6, avoiding poor probe contact caused by local deformation. Compared with the traditional method of manually adjusting probes point by point, this application uses the driver 15 to drive the upper probe plate 9 to press down as a whole, and the pressure plates transmit the force to the carrier plate 6, thereby completing the stable contact between all probes and the circuit board in one go. The introduction of a pressure sensor further optimizes contact reliability, and the test process can be automatically stopped when an abnormal pressure is detected in a certain area. This application significantly improves the efficiency and consistency of multi-probe group testing, and is especially suitable for high-density testing scenarios such as ADAS circuit boards.

[0041] For example, in this embodiment, the pressure plate can be made of metal or engineering plastic, and its number is set to 4-8 according to the size of the carrier plate 6 and the probe distribution density, avoiding the weak stress areas of the carrier plate 6. The pressure plate and the upper needle plate 9 can be fixedly connected by threaded fasteners or snap-fit ​​structures, and a rubber buffer layer can be provided on its lower pressing surface to avoid damage to the carrier plate 6. As a preferred embodiment, a pressure sensor is provided at the bottom of the pressure plate to monitor the downward pressure in real time and feed it back to the drive mechanism to adjust the pressure value.

[0042] In one exemplary embodiment, the circuit board modular probe-type functional test fixture further includes a fixture housing 1, and a plurality of first circuit processing modules 2 are disposed within the fixture housing 1.

[0043] In this embodiment, the addition of a fixture housing 1, a structural improvement, achieves unified installation, positioning, and physical protection for multiple first circuit processing modules 2. Specifically, the housing structure provides a stable installation reference for the circuit processing modules, avoiding positioning deviations caused by scattered installations; simultaneously, the enclosed design effectively blocks external environmental factors such as dust and moisture from corroding the circuits. This solves the maintenance difficulties caused by messy wiring in the prior art and significantly improves the reliability of the test fixture under complex working conditions. Therefore, the fixture housing 1, which integrates the first circuit processing modules 2, simplifies the equipment assembly process and extends the service life of core circuit components.

[0044] For example, the fixture housing 1 can be made of metal or engineering plastic, with aluminum alloy being preferred for the metal housing to balance strength and weight. A modular mounting slot or guide rail structure can be provided inside the housing for fixing the first circuit processing module 2. In a specific embodiment, heat dissipation holes or a cooling fan can be provided on the sidewall of the housing to solve the heat dissipation problem of the circuit processing module. A sealing strip or dust cover can be provided at the opening of the housing to prevent dust from entering and affecting the circuit operation. The housing and the lower pin plate 4 can be connected by bolts or clips for easy disassembly and maintenance.

[0045] In an exemplary embodiment, the upper needle plate 9 is provided with a plurality of protective housings 13 corresponding to the second circuit processing module 12, and the second circuit processing module 12 is located inside the protective housing 13.

[0046] In this embodiment, a modular protection unit is constructed by setting independent protective housings 13, each corresponding to a second circuit processing module 12, on the upper needle plate 9. The protective housing 13 forms a fully enclosed physical barrier, effectively blocking mechanical impacts from the probe mechanism, dust pollution from the production environment, and electrostatic interference from operators during testing. Because the protective housing 13 maintains a precise correspondence with the circuit processing module, it ensures targeted protection while preserving the original electrical connection reliability between the probe group and the circuit processing module. Compared to the exposed circuit processing module in the prior art, this application reduces the failure rate of precision electronic components by approximately 60% without affecting the testing function, significantly improving the continuous operation stability of the testing fixture.

[0047] For example, the protective housing 13 can be made of metal stamping or injection molded engineering plastic, with a wall thickness of 1.5-3mm to meet mechanical protection requirements. In a specific embodiment, the protective housing 13 has a removable cover plate on top for easy module maintenance, and an array of heat dissipation holes on the side walls to balance protection and heat dissipation requirements. Specifically, the protective housing 13 and the upper needle plate 9 can be fixedly connected by bolts, and a buffer foam layer is provided inside the housing to absorb mechanical impact. Furthermore, the bottom of the protective housing 13 can be provided with a guide groove structure to form a plug-in fit with the edge of the circuit board of the second circuit processing module 12, thereby achieving rapid positioning and installation.

[0048] In an exemplary embodiment, an upper mold fixing plate 14 is provided on the upper surface of the upper needle plate 9, and a connecting plate for mutual connection is provided between the upper mold fixing plate 14 and the upper needle plate 9.

[0049] In this embodiment, the upper mold fixing plate 14 serves as a force transmission intermediary structure, converting the linear motion of the driver 15 into the precise vertical displacement of the upper needle plate 9. The rigid connection characteristics of the connecting plate effectively suppress the lateral displacement of the upper needle plate 9 during high-speed reciprocating motion. Compared with directly driving the upper needle plate 9, indirectly driving the upper needle plate 9 using the upper mold fixing plate 14 solves the problem of poor probe contact caused by high-frequency lifting motion in ADAS circuit board testing scenarios, effectively improving the test yield.

[0050] For example, in this embodiment, the upper mold fixing plate 14 can be made of aluminum alloy or steel with a thickness ranging from 5-15mm. It is rigidly connected to the output end of the driver 15 by bolts or clips. The connection plate can be implemented in ways including but not limited to: using an L-shaped metal plate to fix the upper mold fixing plate 14 and the upper needle plate 9 simultaneously with four corner bolts; or using an integrally formed bridging structure with mounting holes at both ends that match the upper mold fixing plate 14 and the upper needle plate 9; or using a composite connection plate with a buffer pad and a rubber shock-absorbing layer on the metal substrate. The connection position between the connection plate and the upper needle plate 9 can be set at the four corners or the midpoint of the long side of the upper needle plate 9. The number of connection plates is preferably 2-4 and symmetrically distributed.

[0051] In an exemplary embodiment, the fixture housing 1 is provided with side plates 16, and a top plate 17 is provided between the side plates 16. A driver 15 is provided on the top plate 17, and the output end of the driver 15 is connected to the upper mold fixing plate 14. The driving mechanism also includes a slide rail 19 and a slider 18. The slide rail 19 is provided on the side plates 16, and the slider 18 is provided on the upper mold fixing plate 14 and is slidably connected to the slide rail 19.

[0052] In this embodiment, a rigid frame formed by the side plate 16 and the top plate 17 provides stable support for the actuator 15, avoiding positioning deviations caused by vibration. The direct connection between the output end of the actuator 15 and the upper mold fixing plate 14 ensures efficient power transmission. The precise fit between the slide rail 19 and the slider 18 enables the upper detection module to move linearly in the vertical direction, with the trajectory deviation controlled within ±0.05mm. This embodiment significantly improves the positional consistency of the upper detection module during repetitive motion, solves the problem of unstable probe contact pressure, and the rigid structure can withstand high pressure without deformation.

[0053] For example, side plates 16 are symmetrically arranged on the fixture housing 1. The side plates 16 can be made of metal sheets and fixed to both sides of the fixture housing 1 by welding or bolting to form a symmetrical support structure. The top plate 17 is preferably a steel plate with a thickness of 5-10mm and is rigidly connected to the side plates 16 by angle brackets. The driver 15 is a servo motor or cylinder and is installed at the center of the top plate 17 by a flange. The slide rail 19 can be a linear guide or a ball guide and is installed parallel to the two side plates 16; correspondingly, the slider 18 is a sliding module that matches the slide rail 19 and is fixed to the back of the upper mold fixing plate 14 by screws. As a preferred embodiment, the surface of the slide rail 19 can be provided with a lubrication groove, and the slider 18 is embedded with a self-lubricating bearing to reduce motion friction.

[0054] It is worth noting that in this embodiment, different upper / lower test modules can be replaced to test different circuit boards.

[0055] In summary, this utility model achieves efficient circuit board inspection through modular design of upper and lower detection modules and drive mechanism, eliminating the need for wiring connections for each probe and avoiding the messy wiring problem in traditional test fixtures.

[0056] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A modular probe-type functional test fixture for circuit boards, characterized in that, include: The lower detection module includes a lower needle plate, a carrier plate, a lower needle guard plate, and multiple first circuit processing modules. The lower needle plate is provided with a first probe group corresponding to the multiple first circuit processing modules, and the probes in the first probe group are electrically connected to the first circuit processing module. A carrier plate is disposed on the lower needle plate, and the carrier plate is used to place the circuit board to be tested. An upper detection module is disposed on the side of the carrier plate away from the lower detection module. The upper detection module includes an upper needle plate, a pressure plate, an upper needle guard plate, and multiple second circuit processing modules. The upper needle plate is provided with multiple second probe groups corresponding to the second circuit processing modules. The probes in the second probe groups are electrically connected to the second circuit processing modules. The driving mechanism includes a driver and an upper mold fixing plate. The driver is used to drive the upper detection module to move closer to or further away from the lower detection module.

2. The modular probe-type functional test fixture for circuit boards according to claim 1, characterized in that: The first circuit processing module includes a first base plate, on which a first input interface, a first circuit processor and a first output interface are provided. The first input interface is electrically connected to all probes of the first probe group. The circuit of the circuit board under test is input from the first input interface through the first probe group and output from the first output interface after passing through the first circuit processor.

3. The modular probe-type functional test fixture for circuit boards according to claim 2, characterized in that: The second circuit processing module includes a second base plate, on which a second input interface, a second circuit processor, and a second output interface are provided. The second input interface is electrically connected to all probes of the second probe group. The circuit of the circuit board under test is input from the second input interface through the second probe group and output from the second output interface after passing through the second circuit processor.

4. The modular probe-type functional test fixture for circuit boards according to claim 3, characterized in that: The modular probe-type functional test fixture for circuit boards also includes a rotating needle assembly, which includes an upper rotating needle plate and a lower rotating needle plate. The lower rotating needle plate is disposed on the lower needle plate and is electrically connected to the first input interface. The upper rotating needle plate is disposed on the upper needle plate and is electrically connected to the second output interface.

5. The modular probe-type functional test fixture for circuit boards according to claim 1, characterized in that: Multiple springs are provided between the carrier plate and the lower needle plate. The carrier plate is provided with a clearance groove. The first probe passes through the clearance groove and abuts against the circuit board to perform circuit detection.

6. The modular probe-type functional test fixture for circuit boards according to claim 1, characterized in that: The upper needle plate is provided with multiple pressure plates, which are used to press down the load plate and make each probe of the first probe group and each probe of the second probe group abut against the circuit board under test.

7. The modular probe-type functional test fixture for circuit boards according to claim 1, characterized in that: The modular probe-type functional test fixture for the circuit board also includes a fixture housing, and multiple first circuit processing modules are disposed within the fixture housing.

8. The modular probe-type functional test fixture for circuit boards according to claim 7, characterized in that: The upper needle plate is provided with multiple protective shells corresponding to the second circuit processing module, and the second circuit processing module is located inside the protective shell.

9. The modular probe-type functional test fixture for circuit boards according to claim 8, characterized in that: An upper die fixing plate is provided on the side of the upper needle plate away from the lower needle plate, and a connecting plate for mutual connection is provided between the upper die fixing plate and the upper needle plate.

10. The modular probe-type functional test fixture for circuit boards according to claim 9, characterized in that: The fixture housing is provided with side plates, and a top plate is provided between the side plates. The driver is disposed on the top plate, and the output end of the driver is connected to the upper mold fixing plate. The driving mechanism also includes a slide rail and a slider. The slide rail is disposed on the side plate, and the slider is disposed on the upper mold fixing plate and is slidably connected to the slide rail.

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