An igbt secondary printing and reflow soldering carrier

Abstract

The utility model relates to a kind of IGBT secondary printing and reflow soldering carrier, belong to power electronics technical field, including carrier body, cover plate, wherein;The carrier body is equipped with recess, the recess is used to place bottom plate;The cover plate is equipped with substrate through-hole, the periphery of substrate through-hole is equipped with limiting portion;The carrier body with the cover plate is detachably connected, the recess with the substrate through-hole position corresponds, the limiting portion can prevent the bottom plate in the recess from falling off.The above structure, by being equipped with recess on carrier body, only need to place bottom plate into recess to carry out secondary printing;After secondary printing, cover plate is arranged on carrier body, bottom plate in recess is prevented from falling off by limiting portion, by corresponding substrate through-hole with recess, DBC substrate is welded on bottom plate, and reflow soldering process step is completed;Make in secondary printing and reflow soldering process without replacing carrier, simple operation and reduce workload.

Description

Technical Field

[0001] This utility model belongs to the field of power electronics technology, and specifically relates to an IGBT secondary printing and reflow soldering carrier. Background Technology

[0002] IGBT DCB substrates possess excellent thermal cycling performance, shape stability, high rigidity, high thermal conductivity, and high reliability. Various patterns can be etched onto the copper-clad surface. Furthermore, it is a pollution-free and environmentally friendly product. Traditional manufacturing processes require changing substrates during the secondary printing and reflow soldering of IGBT substrates, resulting in a significant workload and inconvenience.

[0003] Therefore, in order to address the problem that the existing technology requires changing the carrier during the secondary printing and reflow soldering process of IGBT substrates, which is labor-intensive and inconvenient, there is a need to provide an IGBT secondary printing and reflow soldering carrier. Utility Model Content

[0004] This invention provides an IGBT secondary printing and reflow soldering carrier to solve the problem that in the prior art, the carrier needs to be changed during the secondary printing and reflow soldering process of IGBT substrates, which is labor-intensive and inconvenient.

[0005] This utility model is achieved through the following technical solution: an IGBT secondary printing and reflow soldering carrier, comprising a carrier body and a cover plate, wherein;

[0006] The vehicle body is provided with a groove for placing a base plate;

[0007] The cover plate is provided with a substrate through hole, and a limiting part is provided around the substrate through hole;

[0008] The carrier body is detachably connected to the cover plate, the groove corresponds to the through hole of the base plate, and the limiting part cooperates with the carrier body to clamp and fix the bottom plate located in the groove.

[0009] To better realize this utility model, further optimizations are made to the above structure. The limiting part is located at the end corner of the through hole. When the carrier body and the cover plate are connected in place, the limiting part covers the end corner of the groove.

[0010] To better realize this utility model, the above structure is further optimized. Four cylinders are vertically arranged in the groove. When the base plate is located in the groove, the cylinders are inserted into the base plate.

[0011] To better realize this utility model, the above structure is further optimized, the groove is rectangular, and the number of grooves is multiple.

[0012] To better realize this utility model, the above structure is further optimized by providing pick-up and put-out openings on both sides of the groove, and the pick-up and put-out openings are connected to the square groove.

[0013] To better realize this utility model, the above structure is further optimized by providing a plurality of cleaning through holes in the groove, which penetrate the bottom wall of the square groove.

[0014] To better realize this utility model, further optimization is made to the above structure. The substrate through hole is provided with a dividing part on both sides of the middle part, and the dividing part divides the substrate through hole into upper and lower half regions.

[0015] To better realize this utility model, further optimization is made to the above structure. Ventilation grooves are provided around the through holes of the substrate, and the ventilation grooves are connected to the through holes of the substrate.

[0016] To better realize this utility model, the above structure is further optimized, and the carrier body and the cover plate are detachably connected by screws.

[0017] Compared with the prior art, this utility model has the following advantages:

[0018] This utility model provides an IGBT secondary printing and reflow soldering carrier, including a carrier body and a cover plate, wherein: the carrier body is provided with a groove for placing a base plate; the cover plate is provided with a substrate through hole, and a limiting part is provided around the substrate through hole; the carrier body and the cover plate are detachably connected, the groove corresponds to the position of the substrate through hole, and the limiting part can prevent the base plate in the groove from falling off.

[0019] The above structure, by setting a groove on the carrier body, only requires placing the base plate into the groove for secondary printing; after secondary printing, the cover plate is placed on the carrier body, and the limiting part prevents the base plate in the groove from falling off. The DBC substrate is welded on the base plate through the substrate through hole corresponding to the groove to complete the reflow soldering process; this eliminates the need to change the carrier during secondary printing and reflow soldering, simplifying the operation and reducing the workload. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the carrier body of the IGBT secondary printing and reflow soldering carrier in this utility model;

[0022] Figure 2 This is a schematic diagram of the cover plate of the IGBT secondary printing and reflow soldering carrier in this utility model.

[0023] In the picture:

[0024] 1-Carrier body; 2-Groove; 3-Cover plate; 4-Base plate through hole; 5-Limiting part; 6-Cylinder; 7-Pick-up port; 8-Cleaning through hole; 9-Dividing part; 10-Ventilation slot. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0026] In the description of this utility model, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] Example 1:

[0029] An IGBT secondary printing and reflow soldering carrier includes a carrier body 1 and a cover plate 3, wherein: the carrier body 1 is provided with a groove 2 for placing a base plate; the cover plate 3 is provided with a substrate through hole 4, and a limiting part 5 is provided around the substrate through hole 4; the carrier body 1 and the cover plate 3 are detachably connected, the groove 2 corresponds to the substrate through hole 4, and the limiting part 5 can prevent the base plate in the groove 2 from falling off.

[0030] The above structure, by providing a groove 2 on the carrier body 1, only requires placing the base plate into the groove 2 for secondary printing; after secondary printing, the cover plate 3 is placed on the carrier body 1, and the limiting part 5 prevents the base plate in the groove 2 from falling off. The substrate is welded onto the base plate through the substrate through hole 4 corresponding to the groove 2 to complete the reflow soldering process; thus, there is no need to change the carrier during secondary printing and reflow soldering, which simplifies the operation and reduces the workload.

[0031] The aforementioned limiting part 5 is located at the end corner of the aforementioned through hole. When the aforementioned carrier body 1 and the aforementioned cover plate 3 are connected in place, the aforementioned limiting part 5 covers the end corner of the aforementioned groove 2. That is, the bottom plate inside the groove 2 is fixed by the bottom of the groove 2 and the limiting part 5, and the substrate is welded to the bottom plate through the substrate through hole 4, so that the work can be completed using only the carrier body 1 and the cover plate 3 during the secondary printing and reflow soldering process.

[0032] Four cylinders 6 are vertically arranged within the groove 2. When the base plate is located within the groove 2, the cylinders 6 are inserted into the base plate. Because the base plate itself has a certain curvature, the traditional production process involves manually applying solder paste to the surface of the base plate. By setting four cylinders 6 within the groove 2, the base plate can be fixed within the groove 2, enabling automatic printing during the secondary printing process. This allows for better control of the amount and uniformity of the solder paste, improving efficiency and product quality.

[0033] The aforementioned groove 2 is rectangular, and there are multiple grooves 2. Setting the groove 2 as a rectangle can adapt to the shape of the base plate, and multiple grooves 2 can operate on multiple base plates at the same time, improving work efficiency.

[0034] The groove 2 has openings 7 on both sides, which are connected to the square groove 2. The openings 7 allow for better handling of the bottom plate inside the groove 2.

[0035] The aforementioned groove 2 is provided with multiple cleaning through holes 8, which penetrate the bottom wall of the square groove 2. When cleaning the carrier body 1, the solution can flow out through the cleaning through holes 8, which facilitates the cleaning of the carrier body 1.

[0036] The aforementioned substrate through-hole 4 has dividing portions 9 on both sides of its middle portion, which divide the substrate through-hole 4 into upper and lower halves. Each of the upper and lower halves of the dividing portion 9 has two base plates, and the dividing portion 9 provides clearance space to prevent short circuits after the upper and lower base plates are welded to the substrate.

[0037] The aforementioned through-hole 4 on the substrate is surrounded by venting slots 10, which are connected to the through-hole 4. The venting slots 10 facilitate the removal of air between the base plate and the substrate during substrate welding, resulting in better product quality.

[0038] The carrier body 1 and the cover plate 3 are detachably connected by screws. During the secondary printing and reflow soldering process, the entire work can be completed simply by disassembling the carrier body 1 and the cover plate 3 using screws.

[0039] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A carrier for secondary printing and reflow soldering of IGBTs, characterized in that: Includes the vehicle body (1) and the cover plate (3), wherein; The vehicle body (1) is provided with a groove (2), which is used to place the base plate; The cover plate (3) is provided with a substrate through hole (4), and a limiting part (5) is provided around the substrate through hole (4); The carrier body (1) is detachably connected to the cover plate (3), the groove (2) corresponds to the position of the through hole (4) of the substrate, and the limiting part (5) cooperates with the carrier body (1) to clamp and fix the bottom plate located in the groove (2).

2. The IGBT secondary printing and reflow soldering carrier according to claim 1, characterized in that: The limiting part is located at the end corner of the through hole (4). When the carrier body (1) and the cover plate (3) are connected in place, the limiting part covers the end corner of the groove.

3. The IGBT secondary printing and reflow soldering carrier according to claim 1, characterized in that: Four cylinders (6) are vertically arranged in the groove (2). When the base plate is located in the groove, the cylinders (6) are inserted into the base plate.

4. The IGBT secondary printing and reflow soldering carrier according to claim 1, characterized in that: The groove (2) is rectangular, and there are multiple grooves (2).

5. The IGBT secondary printing and reflow soldering carrier according to claim 1, characterized in that: The groove (2) has pick-up and put-out openings (7) on both sides, and the pick-up and put-out openings are connected to the square groove (2).

6. The IGBT secondary printing and reflow soldering carrier according to claim 5, characterized in that: The groove (2) is provided with a plurality of cleaning through holes (8), which penetrate the bottom wall of the square groove (2).

7. The IGBT secondary printing and reflow soldering carrier according to claim 1, characterized in that: The through hole (4) of the substrate has a dividing part (9) on both sides of the middle part, and the dividing part (9) divides the through hole (4) of the substrate into upper and lower halves.

8. The IGBT secondary printing and reflow soldering carrier according to claim 7, characterized in that: The substrate through hole (4) is provided with ventilation slots (10) around its perimeter, and the ventilation slots (10) are connected to the substrate through hole (4).

9. The IGBT secondary printing and reflow soldering carrier according to claim 7, characterized in that: The vehicle body (1) and the cover plate (3) are detachably connected by screws.

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