Vacuum chucking jig

Abstract

The utility model discloses a kind of vacuum adsorption jigs, multiple installation grooves of staggered distribution are formed on each sub-vacuum adsorption module, multiple negative pressure holes are distributed in installation groove, negative pressure hole is communicated negative pressure source, a gasket is clamped into installation groove and forms the area of circumferential closure, the planar shape and size of gasket and chip packaging panel are same, chip packaging panel is placed on gasket.In the present application, gasket is first installed in the installation groove of sub-vacuum adsorption module, the area same with the planar shape and size of chip packaging panel is circled, then chip packaging panel is placed in the area, then closed negative pressure environment is formed in the area to adsorb chip packaging panel and adhere to the top of sub-vacuum adsorption module, because of the reason of negative pressure adsorption, warped chip packaging panel is flattened, and warped product measurement interference lens is avoided.

Description

Technical Field

[0001] This utility model relates to the field of panel measurement technology for chip packaging, and in particular to a vacuum adsorption fixture. Background Technology

[0002] like Figure 4 As shown, the AF automated microscope platform is used for the automatic measurement of the chip packaging panel 2. It uses a single piece of glass as the platform 1, with the lens 3 positioned above the platform 1. The chip packaging panel 2 is placed above the platform 1, but the chip packaging panel 2 suffers from product warping interference, preventing the microscope from performing Auto Focus automatic measurement.

[0003] Therefore, it is necessary to develop a vacuum adsorption fixture to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to design a vacuum adsorption fixture to solve the above problems.

[0005] This utility model achieves the above objectives through the following technical solutions: A vacuum adsorption fixture includes a fixture body, the top of which includes multiple sub-vacuum adsorption modules. Each sub-vacuum adsorption module has multiple staggered mounting grooves. Multiple negative pressure holes are distributed in the mounting grooves and are connected to a negative pressure source. A gasket is inserted into the mounting groove to form a circumferentially closed area. The gasket has the same planar shape and size as the chip packaging panel, and the chip packaging panel is placed on the gasket.

[0006] The beneficial effects of this utility model are as follows: In this application, the gasket is first installed in the mounting slot of the sub-vacuum adsorption module, outlining an area with the same shape and size as the chip packaging panel. Then, the chip packaging panel is placed in this area, creating a closed negative pressure environment that adsorbs and adheres the chip packaging panel to the top of the sub-vacuum adsorption module. Due to the negative pressure adsorption, the warped chip packaging panel is flattened, avoiding interference with the measurement lens caused by warped products. In addition, the gasket can outline multiple areas of different shapes and sizes within the mounting slot to adsorb and match chip packaging panels of different sizes, making the operation convenient. Attached Figure Description

[0007] Figure 1 This is the front view of this application; Figure 2 This is a schematic diagram of the gas path in this application; Figure 3 This is a top view of this application; Figure 4 This is a prior art schematic diagram of this application.

[0008] In the diagram, 1-platform, 2-chip packaging panel, 3-lens, 4-fixture body, 5-connection channel, 6-mounting slot, 7-washer, 8-sub-vacuum adsorption module, 9-negative pressure hole, 10-positioning block, 11-pressure regulating valve, 12-throttle valve, 13-on / off valve. Detailed Implementation

[0009] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0010] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0011] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0012] In the description of this utility model, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0013] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0014] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0015] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0016] like Figure 1-3 As shown, a vacuum adsorption fixture includes a fixture body 4. The top of the fixture body 4 includes four sub-vacuum adsorption modules 8, which are arranged in a rectangular array. Each sub-vacuum adsorption module 8 has multiple staggered mounting grooves 6. Multiple negative pressure holes 9 are distributed in the mounting grooves 6, which are connected to a negative pressure source. A gasket 7 is inserted into the mounting groove 6 to form a circumferentially closed area. The gasket 7 has the same planar shape and size as the chip packaging panel 2, and the chip packaging panel 2 is placed on the gasket 7.

[0017] In some embodiments, such as Figure 2 As shown, four connecting channels 5 are formed on the main body 4 of the fixture, and the first ends of the four connecting channels 5 are respectively connected to the negative pressure holes 9 on the four sub-vacuum adsorption modules 8.

[0018] In some embodiments, such as Figure 2 and 3 As shown, the vacuum adsorption fixture also includes a throttle valve 12, four pressure regulating valves 11, and four on / off valves 13. The first end of the throttle valve 12 is connected to a negative pressure source, the second end of the throttle valve 12 is connected to the first ends of the four pressure regulating valves 11, the second ends of the four pressure regulating valves 11 are connected to the first ends of the four on / off valves 13, and the second ends of the four on / off valves 13 are connected to the second ends of the four connecting channels 5. The throttle valve 12 is used to control the vacuum level to meet the adsorption requirements of different chip packaging panels 2 and avoid excessive vacuum adsorption that may cause marks. The pressure regulating valves 11 are pointer-type pressure regulating valves, which can accurately and independently control the vacuum level of the four sub-vacuum adsorption modules 8. The design scheme of this application can be used on any microscope platform after being connected to a vacuum.

[0019] In some embodiments, such as Figure 3 As shown, the multiple mounting slots 6 include multiple parallel horizontal mounting slots 6 and multiple parallel vertical mounting slots 6, with the horizontal mounting slots 6 and the vertical mounting slots 6 interspersed. The spacing between two adjacent horizontal mounting slots 6 is the same, and the spacing between two adjacent vertical mounting slots 6 is also the same.

[0020] In some embodiments, the spacing between two adjacent horizontal mounting slots 6 is the same as the spacing between two adjacent vertical mounting slots 6.

[0021] In other embodiments, the multiple mounting slots 6 may include multiple annular mounting slots 6, which sequentially cover the space from the outside in.

[0022] In practical use, washer 7 can be used as follows: Figure 3 The rectangle shown can also be an irregular polygon. Alternatively, it can be enclosed in a ring within the previous embodiment.

[0023] In some embodiments, such as Figure 2 As shown, a positioning block 10 is also installed on the outermost side of the sub-vacuum adsorption module 8 to position the chip packaging panel 2 placed on the sub-vacuum adsorption module 8. The top height of the positioning block 10 is higher than the top height of the fixture body 4. In actual use, multiple positioning blocks 10 can be pressed against one or more sides of the chip packaging panel 2. Positioning blocks 10 are installed on at most the outermost two sides of each sub-vacuum adsorption module 8.

[0024] In actual use, each sub-vacuum adsorption module 8 can adsorb multiple chip packaging panels 2 individually, or multiple sub-vacuum adsorption modules 8 can be used together to adsorb one chip packaging panel 2, depending on the specific situation.

[0025] In some embodiments, such as Figure 1 As shown, after the washer 7 is installed in the mounting groove 6, the top of the washer 7 is slightly higher than the top of the fixture body 4.

[0026] In some embodiments, the top dimensions of the fixture body 4 are 545 x 525 mm, and the vacuum area of ​​the sub-vacuum adsorption module 8 is 235 x 248 mm.

[0027] In some embodiments, a plurality of negative pressure holes 9 are evenly distributed within the mounting groove 6.

[0028] In some embodiments, gasket 7 is a flexible silicone gasket.

[0029] Working principle: During operation, a washer is first inserted into the selected mounting slot to define an area that matches the shape and size of the chip packaging panel. The chip packaging panel is then placed on this area. The on / off valve is then opened to create a negative pressure environment that attracts and flattens the chip packaging panel. Subsequently, the microscope can begin automatic measurement. Throttling and pressure regulating valves can be used for products made of different materials to adjust the vacuum circuit pressure.

[0030] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

Claims

1. A vacuum adsorption fixture, characterized in that, The fixture includes a main body, the top of which includes multiple sub-vacuum adsorption modules. Each sub-vacuum adsorption module has multiple staggered mounting grooves. Multiple negative pressure holes are distributed in the mounting grooves and are connected to a negative pressure source. A gasket is inserted into the mounting groove to form a circumferentially closed area. The gasket has the same planar shape and size as the chip packaging panel, and the chip packaging panel is placed on the gasket.

2. The vacuum adsorption fixture according to claim 1, characterized in that, The main body of the fixture has the same number of connection channels as the sub-vacuum adsorption modules, and the first ends of the multiple connection channels are respectively connected to the negative pressure holes on the multiple sub-vacuum adsorption modules.

3. The vacuum adsorption fixture according to claim 2, characterized in that, The vacuum adsorption fixture also includes a throttling valve and the same number of on / off valves and pressure regulating valves as the sub-vacuum adsorption module. The first end of the throttling valve is connected to a negative pressure source, the second end of the throttling valve is connected to the first end of multiple pressure regulating valves, the second end of multiple pressure regulating valves is connected to the first end of multiple on / off valves, and the second end of multiple on / off valves is connected to the second end of multiple connecting channels.

4. The vacuum adsorption fixture according to claim 1, characterized in that, Multiple sub-vacuum adsorption modules are arranged in a rectangular array.

5. A vacuum adsorption fixture according to claim 1, characterized in that, The multiple mounting slots include multiple parallel horizontal mounting slots and multiple parallel vertical mounting slots, with the multiple horizontal mounting slots and the multiple vertical mounting slots being distributed alternately.

6. A vacuum adsorption fixture according to claim 5, characterized in that, The spacing between two adjacent horizontal mounting slots is the same, and the spacing between two adjacent vertical mounting slots is the same.

7. A vacuum adsorption fixture according to claim 6, characterized in that, The spacing between two adjacent horizontal mounting slots is the same as the spacing between two adjacent vertical mounting slots.

8. A vacuum adsorption fixture according to claim 1, characterized in that, The outermost part of the sub-vacuum adsorption module is also equipped with a positioning block for positioning the chip packaging panel placed on the sub-vacuum adsorption module. The top height of the positioning block is higher than the top height of the fixture body.

9. A vacuum adsorption fixture according to claim 1, characterized in that, After the washer is installed in the mounting groove, the top of the washer is higher than the top of the fixture body.

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