A multi-layer metal-coated silicon nitride ceramic substrate

Abstract

The utility model discloses a kind of multilayer metal film silicon nitride ceramic substrate, including composite ceramic substrate and copper foil film;The utility model is provided with composite ceramic substrate, by being covered with anti-deformation film on the upper and lower surface of silicon nitride base film, anti-deformation film uses stainless steel film, stainless steel film has excellent impact resistance and anti-deformation capacity, to help silicon nitride base film resist bending and dimensional deformation, not easy to break under the action of thermal stress, mechanical stress, by laying heat dissipation film in assembly groove, heat dissipation film uses aluminum alloy film or copper alloy film, two kinds of metal film all have excellent heat conduction characteristics, to help silicon nitride base film better heat dissipation, while improving the structural strength of silicon nitride base film, effectively improve the reliability and service life of finished product substrate.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrate technology, specifically to a multilayer metal-coated silicon nitride ceramic substrate. Background Technology

[0002] Silicon nitride ceramic substrates are ceramic substrates made of silicon nitride through a high-temperature sintering process. They are used as heat dissipation carriers or insulating support components for electronic components. They have high airtightness and can isolate water vapor, oxygen and dust, and are widely used in power integrated circuits.

[0003] Existing patent application number: 202110348819.7 A textured silicon nitride ceramic substrate and its cutting method and application include: cutting the textured silicon nitride ceramic into a textured silicon nitride ceramic substrate by means of an electroplated diamond wire saw along a direction perpendicular to the texturing direction of the textured silicon nitride ceramic.

[0004] The aforementioned patent describes a silicon nitride ceramic substrate. Single-layer silicon nitride ceramic substrates generally suffer from low fracture toughness and are prone to cracking or even breakage under thermal and mechanical stress, affecting the reliability of the finished substrate. To address this issue, we propose a multilayer metal-coated silicon nitride ceramic substrate. Utility Model Content

[0005] The purpose of this invention is to provide a multilayer metal-coated silicon nitride ceramic substrate to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a multilayer metal-coated silicon nitride ceramic substrate, comprising a composite ceramic substrate and a copper foil coating, wherein the surface of the composite ceramic substrate is covered with a copper foil coating, the composite ceramic substrate comprises a silicon nitride base film, an anti-deformation coating, an assembly groove, and a heat dissipation coating, the silicon nitride base film is the middle layer of the composite ceramic substrate, the silicon nitride base film is covered with an anti-deformation coating on both its upper and lower surfaces, the anti-deformation coating has an assembly groove in its central area, the assembly groove extends through both the upper and lower surfaces of the anti-deformation coating, the heat dissipation coating passes through the assembly groove and is attached to both the upper and lower surfaces of the silicon nitride base film, wherein the heat dissipation coating is laid flat inside the assembly groove.

[0007] Preferably, the heat dissipation coating and the anti-deformation coating have the same thickness.

[0008] Preferably, the heat dissipation coating and the anti-deformation coating have the same thickness.

[0009] Preferably, the anti-deformation coating is made of stainless steel.

[0010] Preferably, the heat dissipation coating is made of aluminum alloy or copper alloy, and the heat dissipation coatings on both sides of the silicon nitride base film can be made of two different metals.

[0011] Compared with the prior art, the beneficial effects of this utility model are: This invention utilizes a composite ceramic substrate and covers the silicon nitride base film with anti-deformation coatings made of stainless steel. Stainless steel coatings offer excellent impact and deformation resistance, helping the silicon nitride base film resist bending and dimensional deformation, and preventing breakage under thermal and mechanical stress. Furthermore, a heat dissipation coating, made of aluminum alloy or copper alloy, is laid inside the assembly groove. Both metal coatings possess excellent thermal conductivity, aiding in better heat dissipation of the silicon nitride base film while simultaneously enhancing its structural strength, effectively improving the reliability and lifespan of the finished substrate. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This utility model Figure 1 A schematic diagram of the exploded structure; Figure 3 This is a schematic diagram of the silicon nitride-based film in this utility model; Figure 4 This utility model Figure 3 A schematic diagram of the exploded structure; Figure 5 This is a schematic diagram of the anti-deformation coating in this utility model.

[0013] In the figure: composite ceramic substrate-1, silicon nitride base film-11, anti-deformation coating-12, assembly groove-13, heat dissipation coating-14, copper foil coating-2. Detailed Implementation

[0014] To further explain the technical solution of this utility model, a detailed description is provided below through specific embodiments.

[0015] Please see Figure 1 This utility model provides a multilayer metal-coated silicon nitride ceramic substrate, including a composite ceramic substrate 1 and a copper foil coating 2. The surface of the composite ceramic substrate 1 is covered with the copper foil coating 2, which serves to conduct electricity and realize signal transmission and power transmission between electronic components.

[0016] Please see Figure 2-5This utility model provides a multilayer metal-coated silicon nitride ceramic substrate. The composite ceramic substrate 1 includes a silicon nitride base film 11, an anti-deformation coating 12, an assembly groove 13, and a heat dissipation coating 14. The silicon nitride base film 11 is the middle layer of the composite ceramic substrate 1. The anti-deformation coating 12 is provided on both the upper and lower surfaces of the silicon nitride base film 11. An assembly groove 13 is provided in the central area of ​​the anti-deformation coating 12. The assembly groove 13 passes through the upper and lower surfaces of the anti-deformation coating 12. The heat dissipation coating 14 passes through the assembly groove 13 and is attached to the upper and lower surfaces of the silicon nitride base film 11. The heat dissipation coating 14 is laid flat inside the assembly groove 13.

[0017] This utility model provides a multilayer metal-coated silicon nitride ceramic substrate, in which the heat dissipation coating 14 and the anti-deformation coating 12 have the same thickness, ensuring that the surfaces of the heat dissipation coating 14 and the anti-deformation coating 12 are on the same plane and there is no height difference. Furthermore, the heat dissipation coating 14 has the same shape and corresponding size as the assembly groove 13, so that the heat dissipation coating 14 can effectively fill the assembly groove 13 and reduce the connection gap.

[0018] Among them, the anti-deformation coating 12 is made of stainless steel. Stainless steel coating has excellent impact resistance and deformation resistance to improve the structural strength of silicon nitride base film 11 and make it less prone to bending and breaking. The heat dissipation coating 14 is made of aluminum alloy or copper alloy. The heat dissipation coating 14 on both sides of silicon nitride base film 11 can be made of two different metal coatings, which can be adjusted according to actual needs.

[0019] Specifically, an anti-deformation coating 12 is provided on both the top and bottom of the silicon nitride base film 11. The anti-deformation coating 12 is made of stainless steel, which has excellent impact resistance and deformation resistance to help the silicon nitride base film 11 resist bending and dimensional deformation and is not easy to break under thermal stress and mechanical stress. A heat dissipation coating 14 is laid inside the assembly groove 13. The heat dissipation coating 14 is made of aluminum alloy or copper alloy. Both metal coatings have excellent thermal conductivity to help the silicon nitride base film 11 dissipate heat better and improve the structural strength of the silicon nitride base film 11, thereby effectively improving the reliability and service life of the finished substrate.

[0020] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multilayer metal-coated silicon nitride ceramic substrate, characterized in that: The composite ceramic substrate (1) includes a composite ceramic substrate (1) and a copper foil coating (2). The surface of the composite ceramic substrate (1) is covered with a copper foil coating (2). The composite ceramic substrate (1) includes a silicon nitride base film (11), an anti-deformation coating (12), an assembly groove (13), and a heat dissipation coating (14). The silicon nitride base film (11) is the middle layer of the composite ceramic substrate (1). The silicon nitride base film (11) is covered with an anti-deformation coating (12) on both the upper and lower surfaces. An assembly groove (13) is opened in the central area of ​​the anti-deformation coating (12). The assembly groove (13) passes through the upper and lower surfaces of the anti-deformation coating (12). The heat dissipation coating (14) passes through the assembly groove (13) and is attached to the upper and lower surfaces of the silicon nitride base film (11). The heat dissipation coating (14) is laid flat inside the assembly groove (13).

2. The multilayer metal-coated silicon nitride ceramic substrate according to claim 1, characterized in that: The heat dissipation coating (14) has the same thickness as the anti-deformation coating (12).

3. The multilayer metal-coated silicon nitride ceramic substrate according to claim 1, characterized in that: The heat dissipation film (14) has the same shape and corresponding size as the assembly groove (13).

4. The multilayer metal-coated silicon nitride ceramic substrate according to claim 1, characterized in that: The anti-deformation coating (12) is made of stainless steel.

5. The multilayer metal-coated silicon nitride ceramic substrate according to claim 1, characterized in that: The heat dissipation coating (14) is made of aluminum alloy or copper alloy, and the heat dissipation coating (14) on both sides of the silicon nitride base film (11) can be made of two different metals.

Images