A charging device using TEC heat dissipation

Abstract

The utility model relates to charging equipment heat dissipation technical field, and disclose a kind of charging device using TEC heat dissipation, including the charging box being provided with containing cavity, heat conduction plate assembly, TEC heat dissipation component;The heat conduction plate assembly is set on charging box, and at least part is located in containing cavity, the surface of the heat conduction plate assembly in containing cavity is opened with mounting groove corresponding heating element;The TEC heat dissipation component is provided with cold end and hot end, the cold end of the TEC heat dissipation component is attached to heat conduction plate assembly, and the hot end of the TEC heat dissipation component is away from heat conduction plate assembly.This charging device using TEC heat dissipation, while improving space utilization and security can also avoid thermal cascade problem, and can also guarantee IP protection level, avoid circuit board (or heating element) dust, cause circuit board (or heating element) insulation resistance drop.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for charging equipment, and specifically to a charging device that uses TEC heat dissipation. Background Technology

[0002] With the popularization of high-power devices such as electric vehicle fast charging piles and portable energy storage power supplies, charging devices are evolving towards high power density. Such devices face dual challenges in harsh scenarios such as mines, ports, and medical facilities: on the one hand, they need to continuously output ultra-high current (such as 300A), which leads to an increase in the heat flux density of components such as MOSFETs and transformers; on the other hand, they must improve IP protection (i.e., dustproof / waterproof) and salt spray corrosion resistance requirements.

[0003] Currently, most charging devices employ a combination of forced air cooling and water cooling. Some devices use ventilation holes in the enclosure to directly blow air onto the heating elements. However, this ventilation design prevents the enclosure from being completely sealed, allowing dust and moisture to enter the cavity through the airflow channels. This can lead to dust accumulation on the circuit boards, reducing their insulation resistance and potentially causing short circuits. Furthermore, the airflow path necessary for air cooling, and the practice of blowing air onto one heating element before another, can cause thermal cascading. Some charging devices use a combination of air and water cooling, where the water cooling system contacts the heating elements for heat exchange, and the air cooling system dissipates heat from the water cooling system. Since the heating elements are relatively dispersed, the water cooling system needs to be installed one-to-one with each element, requiring numerous pipes and thus occupying a large space. This increases the overall size of the charging device and also increases the risk of leakage, resulting in lower safety and poor space utilization. Therefore, current charging devices cannot solve the thermal cascading problem or improve IP protection ratings through air cooling alone, and using a combination of water and air cooling is not conducive to improving space utilization and safety. Utility Model Content

[0004] The purpose of this invention is to provide a charging device that uses TEC heat dissipation, which can improve space utilization and safety while avoiding thermal cascading problems, and can also ensure IP protection level, preventing dust accumulation on the circuit board (or heating element) and thus reducing the insulation resistance of the circuit board (or heating element).

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] Design a charging device using TEC heat dissipation, including a charging box with a receiving cavity, a heat conduction plate assembly, and a TEC heat dissipation assembly;

[0007] The heat-conducting plate assembly is disposed on the charging box and is at least partially located inside the receiving cavity. The surface of the heat-conducting plate assembly located inside the receiving cavity has a mounting groove corresponding to the heating element.

[0008] The TEC heat dissipation component is provided with a cold end and a hot end. The cold end of the TEC heat dissipation component is in close contact with the heat conduction plate assembly, and the hot end of the TEC heat dissipation component is away from the heat conduction plate assembly.

[0009] Optionally, the TEC heat dissipation assembly includes a TEC heat dissipation mechanism and a heat release mechanism. The TEC heat dissipation mechanism is provided with a low-temperature end and a high-temperature end. The low-temperature end of the TEC heat dissipation mechanism is in close contact with the heat conduction plate assembly, and the high-temperature end of the TEC heat dissipation mechanism is in contact with the heat release mechanism. The heat release mechanism is used to dissipate heat from the high-temperature end of the TEC heat dissipation mechanism.

[0010] Optionally, the TEC heat dissipation mechanism includes a first TEC heat dissipation component and a second TEC heat dissipation component. The first TEC heat dissipation component and the second TEC heat dissipation component are sequentially attached to the surface of the heat-conducting plate assembly along the second direction. The heat-conducting plate assembly is provided with a heat insulation layer at the midpoint position corresponding to the first TEC heat dissipation component and the second TEC heat dissipation component. Both the first TEC heat dissipation component and the second TEC heat dissipation component abut against the heat dissipation mechanism.

[0011] Optionally, the heat dissipation mechanism includes a cold plate, heat dissipation fins, and a fan. The first TEC heat dissipation component and the second TEC heat dissipation component both abut against one surface of the cold plate. The heat dissipation fins and the fan are both disposed on the other surface of the cold plate, and the heat dissipation fins extend along a first direction.

[0012] Optionally, the heat dissipation fin includes a first fin portion, a second fin portion, and two baffles. The first fin portion and the second fin portion are arranged sequentially along a first direction and each is composed of multiple small fins. The multiple small fins are arranged sequentially along a second direction. A midpoint is provided between the first fin portion and the second fin portion, and the fan is located at the midpoint. One baffle is provided on the cold plate and is located on one side of the first fin portion and the second fin portion along the second direction. The other baffle is provided on the cold plate and is located on the other side of the first fin portion and the second fin portion along the second direction.

[0013] Optionally, the heat-conducting plate assembly includes a plate body and a mounting plate, the mounting groove is formed on the mounting plate, the plate body is fixedly connected to the charging box and is at least partially located in the receiving cavity, the surface of the plate body located in the receiving cavity is detachably connected to the mounting plate through the groove, and the mounting plate extends along a first direction.

[0014] Optionally, a silicone grease layer is provided between the plate and the mounting plate, the silicone grease layer being used for heat conduction.

[0015] This utility model provides a charging device using TEC heat dissipation, which has the following beneficial effects:

[0016] The charging device employing TEC heat dissipation connects to the corresponding heating element via a mounting slot on the heat-conducting plate assembly (i.e., the heat-conducting plate assembly abuts against the heating element through the mounting slot, or the heating element is fixedly connected to the mounting slot by bolts). The heat generated by the heating element is conducted to the heat-conducting plate assembly through heat exchange. The heat-conducting plate assembly then abuts against the cold end of the TEC heat dissipation assembly, exchanging the heat conducted by the heating element with the cold end of the TEC heat dissipation assembly. The heat-conducting plate assembly design keeps the charging box's internal cavity sealed, preventing external communication due to airflow cooling requirements and effectively preventing dust accumulation on the internal heating elements and circuit boards, thus avoiding reduced insulation performance. This effectively improves the IP protection level, integrates dispersed heat sources into a unified heat flow, reduces the space occupied by the heat dissipation structure, and avoids the thermal polarity problem caused by airflow blowing on one heat-generating element before blowing on another. The heat between the heat-generating elements is relatively independent and will not affect each other, avoiding the heat superposition effect caused by airflow flowing through different heat-generating elements in sequence, thus ensuring the efficiency and effect of heat dissipation. It can also eliminate the air thermal resistance layer, that is, the solid heat-conducting plate assembly directly touches the heat-generating element and skips the air medium, thereby reducing the thermal resistance. Combined with the close contact with the cold end of the TEC heat dissipation component, it improves the uniformity of temperature distribution, thereby improving the uniformity of heat dissipation. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the charging device using TEC heat dissipation in Embodiment 1 of this utility model;

[0018] Figure 2 This is a schematic diagram of the TEC heat dissipation assembly installation structure in Embodiment 1 of this utility model;

[0019] Figure 3 This is a schematic diagram of the TEC heat dissipation component installation structure in Embodiment 2 of this utility model.

[0020] In the diagram: 10, charging box; 20, heat conduction plate assembly; 21, mounting slot; 22, plate body; 23, mounting plate; 30, TEC heat dissipation assembly; 31, TEC heat dissipation mechanism; 311, first TEC heat dissipation component; 312, second TEC heat dissipation component; 32, heat dissipation mechanism; 321, cold plate; 322, heat dissipation fin component; 3221, first fin section; 3222, second fin section; 3223, enclosure plate; 323, fan. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0022] Please see Figures 1 to 3 This utility model provides a technical solution: a heat dissipation device, specifically applied to a charging device, or it can be a charging device that specifically uses a TEC heat dissipation device for heat dissipation, with the aim of improving the integration effect, reducing the space occupied by heat dissipation, improving the sealing performance, ensuring heat dissipation efficiency, and improving the IP protection level of the internal space of the charging device.

[0023] Example 1:

[0024] Please see Figures 1 to 2 The present invention provides a technical solution: a charging device using TEC heat dissipation, comprising a charging box 10 with a receiving cavity, a heat conduction plate assembly 20, and a TEC heat dissipation assembly 30;

[0025] The heat-conducting plate assembly 20 is disposed on the charging box 10 and is at least partially located in the receiving cavity. The surface of the heat-conducting plate assembly 20 located in the receiving cavity has a mounting groove 21 corresponding to the heating element.

[0026] The TEC heat dissipation component 30 is provided with a cold end and a hot end. The cold end of the TEC heat dissipation component 30 is in close contact with the heat conduction plate assembly 20, and the hot end of the TEC heat dissipation component 30 is away from the heat conduction plate assembly 20.

[0027] The heat-conducting plate assembly 20 uses the mounting groove 21 to embed and fix the heating element, achieving zero-gap physical contact, integrating dispersed heat sources into a unified heat flow, reducing the footprint of the heat dissipation structure, reducing the number of installation parts, and avoiding excessive size. More specifically, when heat dissipation with heat dissipation ducts needs to be used in a high-dust environment, dust can easily clog the heat dissipation ducts. The heat-conducting plate assembly 20 prevents dust from clogging the heat dissipation ducts.

[0028] Furthermore, the end of the heat-conducting plate assembly 20 away from the cold end of the TEC heat dissipation assembly 30 can be bent, that is, it can be adjusted to match the position of the heating element so that the bent end of the heat-conducting plate assembly 20 fits and is fixed to the corresponding heating element, thereby further improving the utilization rate of the installation space and avoiding the need for a single heat dissipation component to occupy part of the space. Each heating element requires a corresponding heat dissipation component and corresponding mounting holes, thus saving space while ensuring heat dissipation efficiency.

[0029] The heat is connected to the corresponding heating element through the mounting groove 21 on the heat-conducting plate assembly 20 (i.e., the heat-conducting plate assembly 20 abuts against the heating element through the mounting groove 21 or the heating element is fixedly connected to the mounting groove 21 by bolts). The heat generated by the heating element is conducted to the heat-conducting plate assembly 20 through heat exchange. The heat-conducting plate assembly 20 abuts against the cold end of the TEC heat dissipation assembly 30, and the heat conducted by the heating element is exchanged with the cold end of the TEC heat dissipation assembly 30. The setting of the heat-conducting plate assembly 20 can keep the cavity inside the charging box 10 in a closed state, avoiding communication with the outside world due to the need for airflow for heat dissipation, and effectively preventing internal heat from flowing out. Dust accumulation on heating elements and circuit boards reduces insulation performance, thereby effectively improving IP protection rating. It also avoids thermal cross-contamination caused by airflow blowing on one heating element before another. The heat between heating elements is relatively independent and will not affect each other, avoiding the heat superposition effect caused by airflow flowing through different heating elements in sequence. This ensures efficient and effective heat dissipation. It also eliminates the air thermal resistance layer, that is, the solid heat-conducting plate assembly 20 directly touches the heating element and bypasses the air medium, reducing thermal resistance. Combined with the close contact with the cold end of the TEC heat dissipation assembly 30, it improves the uniformity of temperature distribution, thereby improving the uniformity of heat dissipation.

[0030] In this embodiment, as a preferred solution, the TEC heat dissipation assembly 30 includes a TEC heat dissipation mechanism 31 and a heat release mechanism 32. The TEC heat dissipation mechanism 31 is provided with a low-temperature end and a high-temperature end. The low-temperature end of the TEC heat dissipation mechanism 31 is in close contact with the heat-conducting plate assembly 20, and the high-temperature end of the TEC heat dissipation mechanism 31 is in contact with the heat release mechanism 32. The heat release mechanism 32 is used to dissipate heat from the high-temperature end of the TEC heat dissipation mechanism 31. The low-temperature end of the TEC heat dissipation mechanism 31 is in close contact with the heat-conducting plate assembly 20, directly absorbing the integrated heat flow. Its high-temperature end is in close contact with the heat release mechanism 32, guiding the heat generated by the work into the heat release mechanism 32 for heat dissipation. This can effectively extend the service life of the TEC heat dissipation mechanism 31. The TEC heat dissipation mechanism 31 is a known prior art, and is only referenced here. It is a whole TEC board. The specific improvement of this utility model is the application of the TEC heat dissipation mechanism 31, and does not involve internal improvements.

[0031] In this embodiment, as a preferred solution, the heat dissipation fin component 322 includes a first fin portion 3221, a second fin portion 3222, and two baffles 3223. The first fin portion 3221 and the second fin portion 3222 are arranged sequentially along a first direction and are each composed of multiple small fins. The multiple small fins are arranged sequentially along a second direction. A midpoint is provided between the first fin portion 3221 and the second fin portion 3222, and the fan 323 is located at the midpoint. One of the baffles 3223 is provided with... The first fin portion 3221 and the second fin portion 3222 are placed on the cold plate 321 and located on one side of the first fin portion 3221 and the second fin portion 3222 along the second direction. The other baffle plate 3223 is disposed on the cold plate 321 and located on the other side of the first fin portion 3221 and the second fin portion 3222 along the second direction. The baffle plate 3223 is used to eliminate lateral overflow. The fan 323 drives the airflow to penetrate the first fin portion 3221 and the second fin portion 3222 in both directions along the first direction. By improving the uniformity of the airflow, the heat exchange efficiency is improved.

[0032] In this embodiment, as a preferred option, the heat-conducting plate assembly 20 includes a plate body 22 and a mounting plate 23. The mounting groove 21 is formed on the mounting plate 23. The plate body 22 is fixedly connected to the charging box 10 and is at least partially located in the receiving cavity. The surface of the plate body 22 located in the receiving cavity is detachably connected to the mounting plate 23 through the groove. The mounting plate 23 extends along a first direction.

[0033] Mounting plate 23 can be a straight plate or a curved plate. As shown in the figure, it is a straight plate, but this does not affect the fact that mounting plate 23 is preset to be a curved plate for attaching to the heating element.

[0034] The mounting groove 21 is not limited to any particular shape. It can be made to correspond to the shape of the heating element so that the mounting groove 21 fits tightly against the heating element to achieve stable and efficient heat exchange. Alternatively, two plates can be clamped on the heating element, forming the mounting groove 21 between the two plates. The clamped heating element is located in the mounting groove 21 and abuts against the two plates respectively. Both of these are solutions in this application document.

[0035] In this embodiment, as a preferred option, a silicone grease layer is provided between the plate 22 and the mounting plate 23. The silicone grease layer is used for heat conduction. Furthermore, silicone grease is a known technology and is only cited here for the purpose of improving the heat conduction effect. At the same time, a silicone grease layer is also applied to the mounting groove 21 corresponding to the heating element. The silicone grease layer is located between the mounting groove 21 and the heating element and is used to conduct the heat of the heating element to the groove wall of the mounting groove 21 for heat exchange.

[0036] The charging box 10 is a known technology with a built-in PCB board. The PCB board has heat-generating components for power conversion or power transmission. This is only cited here for the purpose of improving the heat dissipation device or heat dissipation component on the charging box 10.

[0037] The first direction is not limited to one orientation; it refers to either of two orientations on a directional axis, i.e., the north-south direction. The first direction can be either south or north. The second direction is not limited to one orientation; it refers to either of two orientations on a directional axis, i.e., the north-south direction. The second direction can be either south or north.

[0038] Example 2:

[0039] Please see Figure 3 This utility model also provides another embodiment, with all other structures being the same as in Embodiment 1. The TEC heat dissipation mechanism 31 includes a first TEC heat sink 311 and a second TEC heat sink 312. The first TEC heat sink 311 and the second TEC heat sink 312 are sequentially attached to the surface of the heat-conducting plate assembly 20 along a second direction. The heat-conducting plate assembly 20 is provided with a heat insulation layer at the midpoint corresponding to the first TEC heat sink 311 and the second TEC heat sink 312. Both the first TEC heat sink 311 and the second TEC heat sink 312 abut against the heat dissipation mechanism 32. The first TEC heat sink 311 and the second TEC heat sink 312 are oriented along the surface of the heat-conducting plate, and the heat flow path is physically isolated through the midpoint embedded heat insulation layer. The first TEC heat sink 311 and the second TEC heat sink 312 form relatively independent temperature control areas. The high-temperature end of the C heat sink 312 is synchronously connected to the heat dissipation mechanism 32, which can absorb heat in zones and dissipate heat at the same time. Furthermore, the temperatures of the cold ends (low-temperature ends) of the first TEC heat sink 311 and the second TEC heat sink 312 can be the same or different, which can be controlled according to the heat generation of the heating element in the corresponding area, thereby reducing local overcooling or localized processes. At the same time, the heating elements can be installed according to the different heat dissipation temperature ranges of the first TEC heat sink 311 and the second TEC heat sink 312. That is, the heating element that generates more heat (i.e., high power) is installed corresponding to the first TEC heat sink 311 or the second TEC heat sink 312, and the heating element that generates less heat (i.e., low power) is installed corresponding to the first TEC heat sink 311 or the second TEC heat sink 312. The heating elements with different heating temperatures are connected by bending the end of the heat-conducting component.

[0040] The insulation layer blocks the thermal bridge effect, enabling customized heat dissipation for high / low power heat-generating components. At the same time, it avoids efficiency degradation caused by overload when one of the first TEC heat sink 311 or the second TEC heat sink 312 is used, which would lead to poor heat dissipation.

[0041] In this embodiment, as a preferred option, the heat dissipation mechanism 32 includes a cold plate 321, heat dissipation fins 322 and a fan 323. The first TEC heat dissipation component 311 and the second TEC heat dissipation component 312 are both in contact with one surface of the cold plate 321. The heat dissipation fins 322 and the fan 323 are both disposed on the other surface of the cold plate 321, and the heat dissipation fins 322 extend along a first direction.

[0042] The airflow generated by the fan 323 is formed by the fan 323 drawing air from both sides toward the middle and blowing it out in the direction away from the cold plate 321. The heat dissipation fins 322 are used to help the fan 323 guide the airflow and improve efficiency.

[0043] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A charging device employing TEC heat dissipation, characterized in that: Includes a charging box (10) with a receiving cavity, a heat-conducting plate assembly (20), and a TEC heat dissipation assembly (30). The heat-conducting plate assembly (20) is disposed on the charging box (10) and is at least partially located in the receiving cavity. The surface of the heat-conducting plate assembly (20) located in the receiving cavity has a mounting groove (21) corresponding to the heating element. The TEC heat dissipation component (30) is provided with a cold end and a hot end. The cold end of the TEC heat dissipation component (30) is in close contact with the heat conduction plate assembly (20), and the hot end of the TEC heat dissipation component (30) is away from the heat conduction plate assembly (20).

2. The charging device using TEC heat dissipation according to claim 1, characterized in that: The TEC heat dissipation assembly (30) includes a TEC heat dissipation mechanism (31) and a heat release mechanism (32). The TEC heat dissipation mechanism (31) is provided with a low-temperature end and a high-temperature end. The low-temperature end of the TEC heat dissipation mechanism (31) is in close contact with the heat conduction plate assembly (20), and the high-temperature end of the TEC heat dissipation mechanism (31) is in contact with the heat release mechanism (32). The heat release mechanism (32) is used to dissipate heat from the high-temperature end of the TEC heat dissipation mechanism (31).

3. A charging device employing TEC heat dissipation according to claim 2, characterized in that: The TEC heat dissipation mechanism (31) includes a first TEC heat dissipation component (311) and a second TEC heat dissipation component (312). The first TEC heat dissipation component (311) and the second TEC heat dissipation component (312) are sequentially attached to the surface of the heat-conducting plate assembly (20) along the second direction. The heat-conducting plate assembly (20) is provided with a heat insulation layer at the midpoint of the first TEC heat dissipation component (311) and the second TEC heat dissipation component (312). The first TEC heat dissipation component (311) and the second TEC heat dissipation component (312) are both in contact with the heat dissipation mechanism (32).

4. A charging device employing TEC heat dissipation according to claim 3, characterized in that: The heat dissipation mechanism (32) includes a cold plate (321), heat dissipation fins (322) and a fan (323). The first TEC heat dissipation element (311) and the second TEC heat dissipation element (312) are both in contact with one surface of the cold plate (321). The heat dissipation fins (322) and the fan (323) are both disposed on the other surface of the cold plate (321), and the heat dissipation fins (322) extend along a first direction.

5. A charging device employing TEC heat dissipation according to claim 4, characterized in that: The heat dissipation fin component (322) includes a first fin portion (3221), a second fin portion (3222), and two baffles (3223). The first fin portion (3221) and the second fin portion (3222) are arranged sequentially along a first direction and each is composed of multiple small fins. The multiple small fins are arranged sequentially along a second direction. A midpoint is provided between the first fin portion (3221) and the second fin portion (3222). The fan (323) is located at the midpoint. One baffle (3223) is provided on the cold plate (321) and is located on one side of the first fin portion (3221) and the second fin portion (3222) along the second direction. The other baffle (3223) is provided on the cold plate (321) and is located on the other side of the first fin portion (3221) and the second fin portion (3222) along the second direction.

6. A charging device employing TEC heat dissipation according to claim 1, characterized in that: The heat-conducting plate assembly (20) includes a plate body (22) and a mounting plate (23). The mounting groove (21) is formed on the mounting plate (23). The plate body (22) is fixedly connected to the charging box (10) and is at least partially located in the receiving cavity. The surface of the plate body (22) located in the receiving cavity is detachably connected to the mounting plate (23) through the groove. The mounting plate (23) extends along a first direction.

7. A charging device employing TEC heat dissipation according to claim 6, characterized in that: A silicone grease layer is provided between the plate (22) and the mounting plate (23), and the silicone grease layer is used for heat conduction.

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