Electroplating cell with reciprocating shower plate

Abstract

The utility model provides a kind of electroplating bath device with reciprocating moving type spray disc, including outer pool body, inner pool body, spray disc, reciprocating drive mechanism and circulating spray pump, spray disc includes multiple spray pipes, and multiple liquid spray holes towards electroplating hanger are equipped on spray pipe;Reciprocating drive mechanism drives spray disc to reciprocate along the horizontal direction parallel to electroplating hanger.By spray disc, electroplating solution can be directly sprayed along vertical direction to the surface of electroplating object, greatly strengthen the flow diffusion effect of metal ion in this direction, effectively alleviate the enrichment lag problem of ion on the surface of electroplating object;While reciprocating drive mechanism drives spray disc to move horizontally, let spray cover more comprehensive uniform, avoid the situation that local area ion supply is insufficient or excessive, significantly improve the thickness uniformity of electroplating layer and deposition quality.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging wet process technology, specifically an electroplating tank device with a reciprocating moving spray plate. Background Technology

[0002] In typical wafer or semiconductor electroplating, to accelerate the diffusion of metal cations in the plating solution and reduce ion enrichment lag near the wafer surface, a stirrer is usually added to agitate the plating solution. The stirrer is typically a vertically oriented platen placed between the anode plate and the wafer, and is driven by a mechanism to reciprocate parallel to the wafer direction. This method promotes the uniformity of metal ions in the plating solution; however, because the stirrer is located in front of the wafer, the liquid flow is primarily parallel to the wafer direction, resulting in a relatively small effect on the diffusion of ions along the distance between the anode plate and the wafer. Utility Model Content

[0003] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide an electroplating tank device with a reciprocating moving spray plate.

[0004] To achieve the above objectives, the technical solution adopted by this utility model to solve its technical problem is: an electroplating tank device with a reciprocating moving spray plate, comprising: outer pool body; An inner tank is disposed inside the outer tank, and an overflow pool for receiving electroplating solution overflowing from the inner tank is provided between the inner wall of the outer tank and the outer wall of the inner tank; the inner tank has space for vertically installing electroplating racks and vertically installing anode plate assemblies, and the object to be electroplated is installed on the electroplating racks. A spray plate is movably disposed inside the inner tank, the spray plate being located between the electroplating rack and the anode plate assembly, the spray plate comprising multiple spray pipes, each spray pipe having multiple spray holes facing the electroplating rack. A reciprocating drive mechanism is used to drive the spray disc to reciprocate along a horizontal direction parallel to the electroplating fixture; A circulating spray pump is used to pump the electroplating solution from the overflow tank to the spray plate. When the electroplating solution in the inner tank exceeds the liquid level limit, it overflows into the overflow tank, and is then pumped to the spray plate by the circulating spray pump. It is sprayed from the spray hole onto the surface of the electroplating object on the electroplating rack and returns to the inner tank, forming a circulating spray of electroplating solution onto the surface of the electroplating object. Multiple spray pipes are arranged vertically at equal intervals. The diameter of the spray pipe is a, the distance between adjacent spray pipes is a, the maximum horizontal stroke of the reciprocating drive mechanism driving the spray disc to move back and forth is a, a = (9-11) mm, the horizontal speed of the spray disc moving back and forth is (0.5-2) m / min, and the flow rate of the spray disc is (10-80) L / min.

[0005] This invention utilizes a combination of a spray disc and a circulating spray pump to directly spray the electroplating solution onto the surface of the object along the distance between the anode plate and the object being plated. This significantly enhances the flow and diffusion of metal ions in this direction, effectively alleviating the problem of ion accumulation lag on the object's surface. Simultaneously, a reciprocating drive mechanism moves the spray disc horizontally, ensuring more comprehensive and uniform spray coverage and preventing insufficient or excessive ion supply in localized areas. This significantly improves the uniformity of the electroplated layer thickness and the deposition quality. Compared to traditional parallel stirring methods, this solution combines active directional spraying with reciprocating movement, providing a more targeted and enhanced stirring effect on the electroplating solution and further optimizing the process stability of semiconductor electroplating.

[0006] Furthermore, the reciprocating drive mechanism has multiple reversing position points for driving the spray disc to reciprocate.

[0007] By adopting the above-mentioned preferred scheme, multiple reversing positions allow the spray disc to adjust its movement rhythm according to electroplating requirements throughout the entire stroke, avoiding the problem of excessively long or short spraying time in the end area caused by reciprocating at a fixed endpoint, and further improving the overall electroplating uniformity.

[0008] Furthermore, the reversing position points of the reciprocating drive mechanism that drive the spray disc to reciprocate are evenly distributed along the entire maximum stroke path.

[0009] By adopting the above-mentioned preferred scheme, the evenly distributed reversing position points enable the spray disc to maintain a stable movement rhythm throughout the entire moving stroke, ensuring that the spray frequency and action time of each area on the surface of the electroplated object are highly consistent, thus providing a guarantee for uniform electroplating from the perspective of motion control.

[0010] Furthermore, the reciprocating drive mechanism employs a linear motor.

[0011] By adopting the above-mentioned preferred scheme, the linear motor has the characteristics of fast response speed and high positioning accuracy, and can accurately control the moving speed, position and reversing timing of the spray disc, so as to meet the fine requirements of different electroplating processes for spray movement parameters.

[0012] Furthermore, a filter is installed on the outlet pipe of the circulating spray pump.

[0013] By adopting the above-mentioned preferred solution, the filter can effectively intercept impurities that may exist in the electroplating solution, ensuring the surface quality of the electroplated products.

[0014] Furthermore, a defoamer is installed on the outlet pipe of the circulating spray pump.

[0015] By adopting the above-mentioned preferred solution, the defoamer can remove the bubbles generated during the circulation and transportation of the electroplating solution, prevent the bubbles from adhering to the surface of the electroplated object and forming defects such as pinholes and pits, and significantly improve the density and surface smoothness of the electroplated layer.

[0016] Furthermore, all of the spray pipes are arranged vertically and are distributed at equal intervals along the horizontal direction.

[0017] By adopting the above-mentioned preferred solution, the spray pipe is moved back and forth in the horizontal direction by means of the reciprocating drive mechanism, which can enhance the stirring and mixing effect in the direction parallel to the electroplating rack.

[0018] Furthermore, the inner pool body is provided with a first slot for inserting and installing electroplating fixtures and a second slot for inserting and installing anode plate assemblies on its side wall.

[0019] By adopting the above-mentioned preferred solution, the slot-type structure makes the installation and disassembly of the electroplating rack and anode plate assembly more convenient and efficient, and facilitates subsequent maintenance, replacement and cleaning of the components.

[0020] Furthermore, the bottom of the spray disc is provided with rollers, and the bottom inner side of the inner pool is provided with guide grooves, with the rollers cooperating with the guide grooves.

[0021] By adopting the above-mentioned preferred scheme, the cooperation between the roller and the guide groove provides a stable guiding effect for the reciprocating movement of the spray disc, ensuring that the spray disc always moves in a direction parallel to the electroplating fixture, avoiding spray position deviation caused by offset; the roller structure converts the sliding friction between the spray disc and the bottom of the inner tank into rolling friction, which greatly reduces the moving resistance, reduces the power consumption of the reciprocating drive mechanism, and at the same time reduces component wear and extends the service life of the spray disc and the inner tank.

[0022] Furthermore, an overhead space is provided between the bottom surface of the inner pool and the bottom of the inner side of the outer pool, and the bottom surface of the guide groove is provided with a liquid drop hole that runs vertically through the bottom.

[0023] Using the preferred scheme described above, the liquid discharge hole at the bottom of the guide groove provides a channel for the discharge of accumulated liquid.

[0024] Furthermore, it also includes a lifting drive mechanism, which is used to drive the spray disc to move up and down along the inner pool. It works in conjunction with the reciprocating drive mechanism to drive the spray disc to achieve a composite movement in the horizontal and vertical directions, ensuring that all points on all electroplating surfaces of the electroplating object can receive the spray from the spray holes.

[0025] Using the above-mentioned preferred scheme, in the electroplating process, the lifting drive mechanism drives the spray plate to move unidirectionally, the reciprocating drive mechanism drives the spray plate to move horizontally in one direction, and the lifting drive mechanism and the reciprocating drive mechanism cooperate to drive the spray plate to achieve a composite motion along the curve. In this way, the movement of the spray water column and the overflow direction from bottom to top are coordinated to achieve a constantly changing liquid flow direction on the surface of the object being electroplated. This helps to remove residual cavities in the microstructure of the electroplated surface and effectively prevents the occurrence of electroplating defects such as pinholes, pits, and voids. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a structural schematic diagram of one embodiment of the present invention.

[0028] Figure 2 This is a top view of one embodiment of the present invention.

[0029] Figure 3 This is a cross-sectional view of one embodiment of the present invention.

[0030] Figure 4 This is a top view of one embodiment of the present invention without the electroplating fixture and anode plate assembly.

[0031] Figure 5 This is a structural diagram of one implementation of an electroplating fixture.

[0032] Figure 6 This is a structural schematic diagram of one embodiment of the anode plate assembly.

[0033] Figure 7 This is a structural schematic diagram of one embodiment of the spray disc of this utility model.

[0034] Figure 8 This is a cross-sectional view of another embodiment of the present invention.

[0035] The numbers and letters in the diagram represent the names of the corresponding components: 10-Outer pool body; 11-Elevated space; 20-Inner pool body; 21-First slot; 22-Second slot; 30-Overflow pool; 40-Spray disc; 41-Spray pipe; 43-Pull pin; 50-Reciprocating drive mechanism; 51-Horizontal connecting piece; 60-Circulating spray pump; 61-Filter; 70-Electroplating rack; 71-Rack main board; 72-Cover plate; 73-Cathode conductive connection structure; 74-Electroplating object; 80-Anode plate assembly; 81-Anode liquid tank; 82-Anode conductive connection structure; 83-Anode plate; 831-Intermediate square electrode plate; 832-First loop electrode plate; 833-Second loop electrode plate; 91-Guide rail plate; 92-Guide column; 93-Compression spring; 94-Lower connecting plate; 95-Airbag. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] like Figure 1-7 As shown, one embodiment of this utility model is: an electroplating tank device with a reciprocating moving spray plate, comprising: outer pool body 10; The inner tank 20 is disposed inside the outer tank 10, and there is an overflow tank 30 between the inner wall of the outer tank 10 and the outer wall of the inner tank 20 for receiving the electroplating solution overflowing from the inner tank; the inner tank 20 has a space for vertically installing the electroplating rack 70 and the anode plate assembly 80, and the object to be electroplated 74 is installed on the electroplating rack 70. The spray plate 40 is movably disposed inside the inner tank 20. The spray plate 40 is located between the electroplating rack 70 and the anode plate assembly 80. The spray plate 40 includes multiple spray pipes 41, and the spray pipes 41 are provided with multiple spray holes facing the electroplating rack 70. The reciprocating drive mechanism 50 is used to drive the spray disc 40 to reciprocate along a horizontal direction parallel to the electroplating rack 70. A circulating spray pump 60 is used to pump the electroplating solution in the overflow tank 30 to the spray plate 40. When the electroplating solution in the inner tank 20 exceeds the liquid level limit, it overflows into the overflow tank 30, and is then sent to the spray plate 40 by the circulating spray pump 60. It is sprayed from the spray hole onto the surface of the object to be electroplated 74 on the electroplating rack and returns to the inner tank 20. The electroplating solution then overflows from bottom to top into the overflow tank 30, forming a circulating spray of the electroplating solution onto the surface of the object to be electroplated.

[0038] The beneficial effects of adopting the above technical solution are as follows: Through the cooperation of the spray disc and the circulating spray pump, the electroplating solution can be directly sprayed onto the surface of the electroplating object along the distance between the anode plate and the object being plated, significantly enhancing the flow and diffusion effect of metal ions in this direction and effectively alleviating the problem of ion enrichment lag on the surface of the object being plated. Simultaneously, the reciprocating drive mechanism moves the spray disc horizontally, making the spray coverage more comprehensive and uniform, avoiding insufficient or excessive ion supply in local areas, and significantly improving the thickness uniformity and deposition quality of the electroplated layer. Compared with the traditional parallel stirring method, this solution combines active directional spraying with reciprocating movement, making the stirring enhancement effect of the electroplating solution more targeted and further optimizing the process stability of semiconductor electroplating.

[0039] In some other embodiments of this utility model, multiple spray pipes are arranged vertically at equal intervals. The diameter of the spray pipe is a, the distance between adjacent spray pipes is a, the maximum horizontal stroke of the reciprocating drive mechanism driving the spray disc to move back and forth is a, a = (9-11) mm, the horizontal speed of the spray disc moving back and forth is (0.5-2) m / min, and the flow rate of the spray disc is (10-80) liters / min.

[0040] The spray pipe size parameters, reciprocating stroke and speed parameters of the above-mentioned spray disc can achieve a balance between the mixing effect and the fluctuation of the electroplating solution. Through a large amount of experimental data verification, it is a better choice for improving the uniformity of electroplating.

[0041] The following provides representative and relevant experimental data: Object to be electroplated: Glass substrate; Dimensions: 750mm*620mm; Before electroplating, a Ti layer with a thickness of 0.1 μm and a Cu layer with a thickness of 0.2 μm are pre-deposited on the surface of the glass substrate using a PVD process.

[0042] Evaluation method for electroplating uniformity: Take 9 points in the horizontal and 9 points in the vertical direction on the entire electroplating surface of the glass substrate to form a 9*9 electroplating thickness measurement point matrix. Measure the electroplating thickness at each point using an X-ray thickness gauge. Electroplating uniformity is calculated using the following formula: (maximum coating value - minimum coating value) ÷ (average coating value * 2).

[0043] Experiment 1: The specific parameters of the electroplating tank device of this utility model are as follows: the diameter of the spray pipe is 10mm, the distance between adjacent spray pipes is 10mm, the maximum horizontal stroke of the reciprocating drive mechanism driving the spray plate to move back and forth is 10mm, the vertical distance between the spray holes on the spray pipe is 10mm, the diameter of the spray hole is 1mm, the horizontal speed of the reciprocating movement of the spray plate is 1m / min, and the flow rate of the spray plate is 30L / min; the electroplating solution is copper electroplating solution.

[0044] The measured electroplating layer thickness data at various points at 4μm are as follows, with the thickness values ​​in μm: Vertical 1 4.33 4.65 4.46 4.20 4.18 4.36 4.59 4.55 4.52 Vertical 2 4.57 4.30 4.27 4.30 4.32 4.45 4.51 4.34 4.46 Vertical 3 4.23 4.27 4.19 4.21 4.18 4.27 4.21 4.20 4.47 Vertical 4 4.45 4.26 4.22 4.23 4.12 4.22 4.17 4.16 4.36 Vertical 5 4.26 4.23 4.11 4.13 3.99 4.11 4.11 4.13 4.37 Vertical 6 4.28 4.16 4.08 4.17 4.11 4.17 4.26 4.12 4.23 Vertical 7 4.26 4.33 4.17 4.12 4.09 4.21 4.28 4.21 4.32 Vertical 8 4.34 4.28 4.13 4.26 4.11 4.23 4.21 4.32 4.29 Vertical 9 4.36 4.42 4.26 4.38 4.32 4.46 4.55 4.55 4.47

[0045] From the table above, the electroplating uniformity at 4μm is: (4.65-3.99) / (4.28*2)=7.71%.

[0046] The measured electroplating layer thickness data at various points at 8μm are as follows, with the thickness values ​​in μm: Vertical 1 8.71 8.72 8.37 8.41 8.36 8.44 8.49 8.87 8.93 Vertical 2 8.55 8.37 8.32 8.28 8.27 8.31 8.27 8.43 8.52 Vertical 3 8.42 8.26 8.15 8.18 8.19 8.23 8.27 8.28 8.47 Vertical 4 8.48 8.33 8.24 8.13 8.07 8.12 8.19 8.17 8.29 Vertical 5 8.19 8.12 8.10 8.01 7.91 8.09 8.14 8.11 8.28 Vertical 6 8.27 8.22 8.17 8.21 8.11 8.16 8.22 8.18 8.34 Vertical 7 8.31 8.27 8.22 8.29 8.25 8.23 8.29 8.29 8.36 Vertical 8 8.43 8.30 8.29 8.33 8.19 8.31 8.27 8.37 8.43 Vertical 9 8.69 8.49 8.43 8.35 8.28 8.31 8.39 8.51 8.87 From the table above, the electroplating uniformity at 8μm is: (8.93-7.91) / (8.32*2)=6.13%.

[0047] Experiment 2: The specific parameters of the electroplating tank device are as follows: the diameter of the spray pipe is 9mm, the distance between adjacent spray pipes is 9mm, the maximum horizontal stroke of the reciprocating drive mechanism driving the spray plate to move back and forth is 9mm, the vertical distance between the spray holes on the spray pipe is 9mm, the diameter of the spray hole is 1mm, the horizontal speed of the reciprocating movement of the spray plate is 0.5m / min, and the flow rate of the spray plate is 10L / min; the electroplating solution is copper electroplating solution.

[0048] Experiment 3: The specific parameters of the electroplating tank device are as follows: the diameter of the spray pipe is 11mm, the distance between adjacent spray pipes is 11mm, the maximum horizontal stroke of the reciprocating drive mechanism driving the spray plate to move back and forth is 11mm, the vertical distance between the spray holes on the spray pipe is 11mm, the diameter of the spray hole is 1mm, the horizontal speed of the reciprocating movement of the spray plate is 2m / min, and the flow rate of the spray plate is 80L / min; the electroplating solution is copper electroplating solution.

[0049] Experiment 4: The specific parameters of the electroplating tank device are as follows: the diameter of the spray pipe is 6mm, the distance between adjacent spray pipes is 6mm, the maximum horizontal stroke of the reciprocating drive mechanism driving the spray plate to move back and forth is 6mm, the vertical distance between the spray holes on the spray pipe is 6mm, the diameter of the spray hole is 1mm, the horizontal speed of the reciprocating movement of the spray plate is 0.2m / min, and the flow rate of the spray plate is 5L / min; the electroplating solution is copper electroplating solution.

[0050] Experiment 5: The specific parameters of the electroplating tank device are as follows: the diameter of the spray pipe is 15mm, the distance between adjacent spray pipes is 15mm, the maximum horizontal stroke of the reciprocating drive mechanism driving the spray plate to move back and forth is 15mm, the vertical distance between the spray holes on the spray pipe is 15mm, the diameter of the spray hole is 2mm, the horizontal speed of the reciprocating movement of the spray plate is 3m / min, and the flow rate of the spray plate is 100L / min; the electroplating solution is copper electroplating solution.

[0051] Experiment 6: The specific parameters of the electroplating tank device are as follows: the spray plate is fixed, the diameter of the spray pipe is 15mm, the distance between adjacent spray pipes is 15mm, the vertical distance between the spray holes on the spray pipe is 15mm, the diameter of the spray hole is 2mm, and the flow rate of the spray plate is 100L / min; the electroplating solution is copper electroplating solution.

[0052] Experiment 7: The specific parameters of the electroplating tank device are as follows: it does not have a spray plate, and the electroplating solution is a copper plating solution.

[0053] The electroplating uniformity data obtained from the above experiments are shown in the table below.

[0054] Experiment 1 7.71% 6.13% Experiment 2 7.86% 6.92% Experiment 3 7.96% 7.2% Experiment 4 8.54% 7.8% Experiment 5 9.42% 8.34% Experiment 6 10.58% 10.32% Experiment 7 12.58% 10.98% As can be seen from the table above: in experiments 1-3, the electroplating uniformity was controlled at 6%-8%, which indicates good electroplating uniformity.

[0055] Experiments 4-5 used reciprocating spray discs, but excessively large or small spray pipe size parameters and intense agitation can affect the uniformity of electroplating. The uniformity of electroplating should be controlled at 7%-10%.

[0056] Experiment 6 uses a fixed spray disc. Due to the presence of concentrated spray points, the electroplating uniformity is higher than 10%, indicating poor electroplating uniformity.

[0057] Experiment 7 uses a typical electroplating tank structure, and the electroplating uniformity deteriorates to over 10%.

[0058] In some other embodiments of this utility model, the reciprocating drive mechanism 50 drives the spray disc 40 to reciprocate at more than four reversing positions. The beneficial effect of adopting the above technical solution is that multiple reversing positions allow the spray disc to adjust its movement rhythm according to electroplating requirements throughout its stroke, avoiding the problem of excessively long or short spraying time in the end area caused by reciprocating at a fixed endpoint, and further improving the overall electroplating uniformity.

[0059] In some other embodiments of this invention, the reversing position points of the reciprocating drive mechanism 50 driving the spray disc 40 to reciprocate are evenly distributed along the entire maximum stroke path. Preferably, along the maximum horizontal stroke a of the spray disc's reciprocating movement, positions 0, 1 / 5a, 2 / 5a, 3 / 5a, 4 / 5a, and a are sequentially used as reversing position points, ensuring that each position point serves as a reversing position point with the same frequency in one spray electroplating cycle. The beneficial effect of adopting the above technical solution is that the evenly distributed reversing position points allow the spray disc to maintain a stable movement rhythm throughout the entire movement stroke, ensuring that the spray frequency and action time received by each area of ​​the electroplated object's surface are highly consistent, thus providing a guarantee for uniform electroplating from the perspective of motion control.

[0060] In some other embodiments of this invention, the reciprocating drive mechanism 50 employs a linear motor with a positioning accuracy better than ±0.5mm. A grating sensor can also be configured, achieving a positioning accuracy of ±5μm. The linear motor features fast response and high positioning accuracy, enabling precise control of the spray disc's movement speed, position, and reversal timing, meeting the stringent requirements of different electroplating processes for spray movement parameters.

[0061] In some other embodiments of this utility model, a filter 61 is provided on the outlet pipe of the circulating spray pump 60. The beneficial effect of adopting the above technical solution is that the filter can effectively intercept impurities that may exist in the electroplating solution, ensuring the surface quality of the electroplated products.

[0062] In some other embodiments of this utility model, a defoamer is provided on the outlet pipe of the circulating spray pump 60. The beneficial effects of adopting the above technical solution are: the defoamer can remove the bubbles generated during the circulation and transportation of the electroplating solution, prevent the bubbles from adhering to the surface of the electroplated object and forming defects such as pinholes and pits, and significantly improve the density and surface smoothness of the electroplated layer.

[0063] In some other embodiments of this utility model, the multiple spray pipes 41 are all vertically arranged and evenly spaced along the horizontal direction. The beneficial effect of adopting the above technical solution is that by using a reciprocating drive mechanism to drive the spray pipes to reciprocate in the horizontal direction, the stirring and mixing effect in the direction parallel to the electroplating rack can be enhanced.

[0064] In some other embodiments of this utility model, the side walls of the inner tank 20 are respectively provided with a first slot 21 for inserting and installing the electroplating rack 70 and a second slot 22 for inserting and installing the anode plate assembly 80. The slot-type structure makes the installation and removal of the electroplating rack and the anode plate assembly more convenient and efficient, and facilitates subsequent maintenance, replacement and cleaning of the components.

[0065] like Figure 5As shown, the electroplating rack 70 applicable to the electroplating tank device of this utility model can be of various types, and the specific structure of the electroplating rack is not limited. The electroplating rack 70 generally includes a main rack 71, a cover plate 72, and a cathode conductive connection structure 73. The object to be electroplated 74 is disposed between the main rack 71 and the cover plate 72, and the cathode conductive connection structure 73 is used for the electrical connection between the object to be electroplated 74 and the power cathode. In one installation method of the electroplating rack, the main rack 71 is inserted into the first slot 21 on the side wall of the tank body within the electroplating tank device of this application. Other structures of the electroplating rack can be obtained from the prior art and will not be described in detail in this application.

[0066] like Figure 6 As shown, the anode plate assembly applicable to the electroplating tank device of this utility model can be of various types, and the specific structure of the anode plate assembly 80 is not limited. The anode plate assembly 80 generally includes an anode liquid tank 81, an ion membrane, an anode plate 83, and an anode conductive connection structure 82. The anode plate 83 is disposed in the anode liquid tank 81 and electrically connected to the power supply anode through the anode conductive connection structure 82. The anode liquid tank 81 contains an anode electroplating solution, and the side wall of the anode liquid tank 81 facing the electroplating fixture has an opening and is sealed with an ion membrane. In one installation method of the anode plate assembly, the anode liquid tank 81 is inserted into the second slot 22 on the side wall of the tank body in the electroplating tank device of this application. In order to improve the uniformity of the electric field lines on the surface of the object to be electroplated, the anode plate 83 can be divided into multiple mutually insulated, sequentially expanding from the inside to the outside, intermediate square electrode plate 831, first loop electrode plate 832, and second loop electrode plate 833, with the distance between the intermediate square electrode plate 831, first loop electrode plate 832, and second loop electrode plate 833 and the object to be electroplated gradually increasing.

[0067] In some other embodiments of this utility model, the bottom of the spray disc 40 is provided with rollers, and the inner bottom of the inner tank 20 is provided with guide grooves, with the rollers cooperating with the guide grooves. The beneficial effects of adopting the above technical solution are: the cooperation between the rollers and the guide grooves provides a stable guiding effect for the reciprocating movement of the spray disc, ensuring that the spray disc always moves in a direction parallel to the electroplating fixture, avoiding spray position deviation caused by offset; the roller structure converts the sliding friction between the spray disc and the bottom of the inner tank into rolling friction, greatly reducing the moving resistance, reducing the power consumption of the reciprocating drive mechanism, and at the same time reducing component wear and extending the service life of the spray disc and the inner tank.

[0068] In some other embodiments of this utility model, an overhead space 11 is provided between the bottom surface of the inner pool 20 and the bottom inner side of the outer pool 10, and the bottom surface of the guide groove is provided with a vertically penetrating drop hole. The beneficial effect of adopting the above technical solution is that the drop hole at the bottom of the guide groove provides a channel for the discharge of accumulated liquid.

[0069] In some other embodiments of this utility model, a lifting drive mechanism is also included. This lifting drive mechanism drives the spray disc 40 to move up and down along the inner tank. It cooperates with the reciprocating drive mechanism 50 to drive the spray disc 40 to achieve a composite movement in both horizontal and vertical directions, ensuring that all points on all electroplated surfaces of the object can receive direct spray from the spray holes. The beneficial effects of the above technical solution are: during the electroplating process, the lifting drive mechanism drives the unidirectional lifting movement of the spray disc, the reciprocating drive mechanism drives the unidirectional horizontal movement of the spray disc, and the lifting drive mechanism and the reciprocating drive mechanism cooperate to drive the spray disc to achieve a composite movement along a curve. This movement of the spray water column, combined with the upward overflow direction, achieves a constantly changing liquid flow direction on the surface of the object being electroplated. This helps to expel residual cavities within the microstructure of the electroplated surface, effectively preventing electroplating defects such as pinholes, pits, and voids.

[0070] like Figure 8 As shown, in some other embodiments of this utility model, the top of the spray disc 40 is provided with a vertically arranged pull pin 43, and also includes a horizontal connecting piece 51. The reciprocating drive mechanism 50 adopts a linear motor. One end of the horizontal connecting piece 51 is connected to the movable end of the linear motor. The horizontal connecting piece 51 is provided with a through hole and is sleeved on the pull pin 43. The pull pin 43 and the through hole are in a sliding fit that can move axially. The linear motor applies a horizontal force to the spray disc 40 through the horizontal connecting piece 51, without affecting the lifting and lowering movement of the spray disc. A liftable guide rail plate 91 is installed at the bottom of the inner pool 20. A guide groove is provided on the guide rail plate 91, and the rollers at the bottom of the spray disc 40 cooperate with the guide groove. A guide post 92, penetrating the bottom wall of the inner pool 20, is provided at the bottom of the guide rail plate 91. A lower connecting plate 94 is connected to the bottom end of the guide post 92. The lower connecting plate 94 is located in the overhead space 11 below the bottom surface of the inner pool 20. A compression spring 93 is fitted around the lower outer periphery of the guide post 92, with its two ends abutting against the bottom surface of the inner pool 20 and the upper surface of the lower connecting plate 94, respectively. The lifting drive mechanism is an airbag 95, located below the lower connecting plate 94. The airbag 95 is connected to an inflation / deflation control valve and an air pump via pipelines. By inflating the airbag 95, the lower connecting plate 94 is lifted, thereby causing the spray disc 40 to rise; by deflating the airbag 95, the spray disc 40 descends with the guide rail plate 91 under the reset action of the compression spring 92.

[0071] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They should not be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. An electroplating tank device with a reciprocating moving spray plate, characterized in that, include: outer pool body; An inner tank is disposed inside the outer tank, and an overflow pool for receiving electroplating solution overflowing from the inner tank is provided between the inner wall of the outer tank and the outer wall of the inner tank; the inner tank has space for vertically installing electroplating racks and vertically installing anode plate assemblies, and the object to be electroplated is installed on the electroplating racks. A spray plate is movably disposed inside the inner tank, the spray plate being located between the electroplating rack and the anode plate assembly, the spray plate comprising multiple spray pipes, each spray pipe having multiple spray holes facing the electroplating rack. A reciprocating drive mechanism is used to drive the spray disc to reciprocate along a horizontal direction parallel to the electroplating fixture; A circulating spray pump is used to pump the electroplating solution from the overflow tank to the spray plate. When the electroplating solution in the inner tank exceeds the liquid level limit, it overflows into the overflow tank, and is then pumped to the spray plate by the circulating spray pump. It is then sprayed from the spray hole onto the surface of the electroplating object on the electroplating rack and returns to the inner tank, forming a circulating spray of the electroplating solution onto the surface of the electroplating object.

2. The electroplating tank apparatus with a reciprocating moving spray plate according to claim 1, characterized in that, The reciprocating drive mechanism drives the spray disc to reciprocate at more than four reversing positions.

3. The electroplating tank apparatus with a reciprocating moving spray plate according to claim 2, characterized in that, The reversing position points of the reciprocating drive mechanism that drive the spray disc to move back and forth are evenly distributed along the entire maximum stroke path.

4. The electroplating tank apparatus with a reciprocating moving spray plate according to claim 1, characterized in that, The reciprocating drive mechanism uses a linear motor.

5. The electroplating tank apparatus with a reciprocating moving spray plate according to claim 1, characterized in that, The multiple spray pipes are arranged vertically at equal intervals. The diameter of the spray pipe is a, the distance between adjacent spray pipes is a, and the maximum horizontal stroke of the reciprocating drive mechanism driving the spray disc to move back and forth is a, where a = (9-11) mm.

6. The electroplating tank apparatus with a reciprocating moving spray plate according to claim 1, characterized in that, The outlet pipe of the circulating spray pump is equipped with a filter and / or a defoamer.

7. The electroplating tank apparatus with a reciprocating moving spray plate according to claim 1, characterized in that, The inner tank body has a first slot for inserting and installing electroplating fixtures and a second slot for inserting and installing anode plate assemblies on its side walls.

8. The electroplating tank apparatus with a reciprocating moving spray plate according to claim 1, characterized in that, The bottom of the spray disc is provided with rollers, and the bottom inner side of the inner pool is provided with guide grooves, with the rollers cooperating with the guide grooves.

9. The electroplating tank apparatus with a reciprocating moving spray plate according to claim 8, characterized in that, An overhead space is provided between the bottom surface of the inner pool and the bottom of the inner side of the outer pool, and the bottom surface of the guide groove is provided with a liquid drop hole that runs vertically through the bottom.

10. The electroplating tank apparatus with a reciprocating moving spray plate according to claim 9, characterized in that, It also includes a lifting drive mechanism, which is used to drive the spray disc to move up and down along the inner pool.

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