Detection device
By designing a testing device that includes an electrical testing device, an optical testing device, and a fixing device, the electrical and optical testing of co-packaged optical components can be performed simultaneously, solving the problems of long testing time and high cost in the prior art, improving production efficiency and reducing manufacturing costs.
Patent Information
- Application Number
- CN202521486302.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2025-07-02
- Filing Date
- 2025-07-16
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-07-16
AI Technical Summary
Existing testing equipment cannot simultaneously test the electrical and optical properties of electronic and optical components, resulting in lengthy testing times, reduced production rates, and increased manufacturing costs.
Design a testing device comprising an electrical testing device, an optical testing device, and a fixing device, for simultaneously performing contact electrical testing and non-contact optical testing. The fixing device integrates and fixes the object under test to achieve simultaneous electrical and optical testing.
Significantly shorten testing time, reduce equipment changeover and product transfer time, increase production speed and reduce manufacturing costs.
Smart Images
Figure CN224681597U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a testing device, and more particularly to a testing device for testing optoelectronic components. Background Technology
[0002] With the explosive growth in computing speed and data volume of various information and communication devices, especially mobile devices, semiconductor components, which are the core of these devices, not only need to improve their processing speed, but also accelerate their data transmission speed, while still taking into account the requirements for miniaturization.
[0003] Based on the above-mentioned needs, co-packaged optical components, which integrate electronic and optical components into one unit, and related packaging technologies have emerged and become the future trend.
[0004] However, since existing testing equipment can only test the electrical or optical characteristics of components separately, it takes two testing sessions to perform the relevant tests. Furthermore, the time required to switch between testing equipment or transfer the tested component from one testing equipment to another between these two different characteristic tests results in a decrease in overall production speed and a corresponding increase in manufacturing costs.
[0005] Therefore, overcoming the various problems of the existing technologies has become a pressing issue that the industry urgently needs to address. Utility Model Content
[0006] In view of the various deficiencies of the prior art, this application provides a testing device for simultaneously performing electrical and optical tests on a test object having relative electronic and optical functional surfaces, comprising: an electrical testing device for performing contact electrical tests on the test object; an optical testing device for performing non-contact optical tests on the test object; and a fixing device for carrying the test object and fixing the electrical testing device and the test object, such that the test object is located between the electrical testing device and the optical testing device.
[0007] This application also provides a detection method, comprising: providing an electrical measuring device and an optical measuring device; using a fixing device to carry the object under test and fixing the electrical measuring device and the object under test, such that the object under test is located between the electrical measuring device and the optical measuring device; and using the electrical measuring device to perform a contact electrical test on the object under test and using the optical measuring device to perform a non-contact optical test on the object under test.
[0008] In the aforementioned testing equipment and method, the object under test includes a co-packaged optical element. The co-packaged optical element includes an electronic component, and its electronic functional surface has multiple connection pads. Each connection pad has a conductive bump formed as a test point. The electronic component is electrically connected to the multiple connection pads via multiple conductive elements, and then forms an electrical connection with the multiple test points. The optical functional surface includes an optical element having at least one optical interface.
[0009] In the aforementioned testing equipment and method, the fixing device includes a carrier and a retainer. The object under test (DUT) is disposed on the carrier of the fixing device with the optical functional surface. The retainer integrates and fixes the electrical testing device, the DUT, and the carrier to form a test module. The carrier has an opening corresponding to the optical functional surface to allow the optical testing device to perform optical testing.
[0010] In the aforementioned detection equipment and method, the electrical measuring device is a probe card having multiple probes for electrical detection of the test object.
[0011] In the aforementioned detection device and method, the optical measuring device includes at least one optical sensing element for detecting the optical characteristics of the object under test, so as to obtain the optical characteristics of the object under test.
[0012] As can be seen from the above, the testing equipment of this application uses the carrier of the fixing device to carry the test object (co-packaged optical element), and the fixing member of the fixing device to integrate and fix the electrical testing device, the test object and the carrier to form a test module, so that the test object is fixed with the electronic functional surface facing down and the optical functional surface facing up. Then, the test module is placed on the electrical testing machine for contact electrical testing, while the optical testing device faces the optical functional surface of the test object to perform non-contact optical testing. Accordingly, electrical and optical testing of co-packaged optical elements can be performed simultaneously. In addition to greatly saving the time required for testing, it can also save the equipment switching time and / or the transmission time of the test product required between two separate electrical and optical tests, thereby improving the overall production rate of co-packaged optical elements and reducing manufacturing costs. Attached Figure Description
[0013] Figures 1 to 4 This is a schematic diagram illustrating the testing method using the testing equipment described in this application.
[0014] Figure 5 for Figure 4 A magnified view of a portion of the image.
[0015] Explanation of reference numerals in the attached figures
[0016] 1. Test substance
[0017] 1a Co-packaged optical components
[0018] 100 Modules Under Test
[0019] 11 Electronic Functional Surface
[0020] 110 Electronic Components
[0021] 110a conductive component
[0022] 110b Connecting Pad
[0023] 111 test points
[0024] 12 Optical Functional Surfaces
[0025] 121 Optical Components
[0026] 121a Optical Interface
[0027] 2. Testing equipment
[0028] 21 Electrical measuring device
[0029] 210 probe
[0030] 22 Fixture
[0031] 221 Bearing component
[0032] 2210 Opening
[0033] 222 Holding component
[0034] 23 Optical Measurement Device
[0035] 3 Image sensing elements
[0036] 4. Electrical testing equipment. Detailed Implementation
[0037] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0038] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, terms such as "above," "below," "one," "first," and "second" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0039] Please see Figures 1 to 4 This is a schematic diagram of a testing method using the testing equipment of this application. The testing equipment 2 is used to simultaneously perform optical and electrical tests on the test object 1. The testing equipment 2 includes an electrical testing device 21, a fixing device 22, and an optical testing device 23. The electrical testing device 21 is used to perform contact electrical tests on the test object 1, and the optical testing device 23 is used to perform non-contact optical tests on the test object 1. The fixing device 22 includes a carrier 221 and a retainer 222, which are used to carry the test object 1 and fix the electrical testing device 21 and the test object 1, so that the test object 1 is located between the electrical testing device 21 and the optical testing device 23.
[0040] Please refer to the following at the same time. Figure 5 The test object 1 is, for example, a wafer containing multiple co-packaged optical elements (CPOs) 1a. The test object 1 (co-packaged optical elements 1a) has opposing electronic functional surfaces 11 and optical functional surfaces 12.
[0041] The co-packaged optical element 1a includes an electronic element 110 and an optical element 121. The electronic element 110 is, for example, an Electronic Integrated Circuit (EIC), and the optical element 121 is, for example, a Photonic Integrated Circuit (PIC). The electronic functional surface 11 has multiple pads 110b. Each pad 110b has a conductive bump formed on its outer surface, which serves as a test point 111. The electronic element 110 can be electrically connected to each pad 110b on the electronic functional surface 11 through multiple conductive elements 110a, and then electrically connected to each test point 111. The optical functional surface 12 has at least one optical interface 121a of the optical element 121. For example, it can be an optical fiber socket for inserting and fixing optical fibers and receiving or transmitting optical signals, or an optical receiver for receiving light or optical signals from other light sources.
[0042] like Figure 1 and Figure 2 As shown, the detection method first uses an image sensing element 3 (e.g., a Charge-Coupled Device, CCD) to align the electrical measuring device 21 of the detection equipment 2 and the object under test 1.
[0043] The test object 1 (commonly packaged optical element 1a) is mounted on the carrier 221 of the fixing device 22 with the optical functional surface 12 facing upward and exposed to the environment.
[0044] The electrical testing device 21 is, for example, a probe card having multiple probes 210 for electrical testing of the test object 1 (commonly packaged optical element 1a). Each probe 210 corresponds to each test point 111 on the electronic functional surface 11 of the common packaged optical element 1a under test.
[0045] like Figure 3 As shown, the electrical testing device 21 of the testing device 2 is placed facing the electronic functional surface 11 of the test object 1 (co-packaged optical element 1a) (the test object 1 is disposed on the carrier 221 with the electronic functional surface 11 facing upward), so that each probe 210 corresponds to each test point 111 on the electronic functional surface 11 of the test object 1 (co-packaged optical element 1a) and forms an electrical contact.
[0046] Since there are many types of electrical characteristics that need to be measured, such as DC resistance, capacitance, inductance, impedance, dielectric constant, and charge / discharge rate, the probes 210 provided in the electrical testing device 21 include at least one of the following: radio frequency probes, DC probes, digital probes, and analog probes. Of course, it can be a combination of at least two or more of these probes 210. This embodiment has no such limitation. Preferably, these probes 210 can also be designed to be easily and quickly replaced individually. Alternatively, these probes 210 can be designed as a modular structure, with each module designed for the position, arrangement, and contact angle of the test points 111 of a specific product. In this way, when testing different co-packaged optical components 1a, only a dedicated probe 210 module needs to be designed for different products under test, and the required probe 210 combination can be quickly replaced when testing different products.
[0047] like Figure 4 As shown, the electrical testing device 21, the object under test 1 and the carrier 221 are integrated and fixed together from bottom to top by the holding member 222 of the fixing device 22, thereby forming a test module 100.
[0048] In this embodiment, the test object 1 is fixed between the electrical testing device 21 and the carrier 221 by the holding member 222, so that the electronic functional surface 11 of the test object 1 (co-encapsulated optical element 1a) corresponds to the electrical testing device 21 of the testing equipment 2, and the optical functional surface 12 corresponds to the carrier 221 of the fixing device 22.
[0049] The retainer 222 may be, for example, a mechanical clamp, an electrostatic chuck, or other suitable retaining structure.
[0050] Next, the holding member 222 is used to flip the module under test 100 so that the module under test 100 is arranged from top to bottom with the carrier member 221, the object under test 1, and the electrical testing device 21, so that the object under test 1 is held with the electronic functional surface 11 facing down and the optical functional surface 12 facing up. Then, the module under test 100 is placed on an electrical testing machine 4, and the optical testing device 23 is positioned to face the optical functional surface 12 of the module under test 100 (object under test 1), so that the electronic functional surface 11 of the object under test 1 (commonly packaged optical element 1a) corresponds to the electrical testing device 21 of the testing equipment 2, so as to perform contact electrical testing according to the pre-set testing conditions and testing process, and to perform non-contact optical testing by positioning the optical functional surface 12 of the object under test 1 (commonly packaged optical element 1a) to correspond to the optical testing device 23 of the testing equipment 2.
[0051] The photometric device 23 may include at least one optical sensing element for detecting the optical characteristics of the test object 1 (commonly packaged optical element 1a), such as a light-emitting element that provides a detection light source, in order to obtain the optical characteristics of the common packaged optical element 1a.
[0052] Furthermore, the carrier 221 of the fixing device 22 has an opening 2210 corresponding to the optical functional surface 12, so that the photometer 23 is aligned with the optical interface 121a, and various predetermined optical tests are performed on the optical element 121, which is co-packaged with the optical element 1a, through the optical interface 121a. The photometer 23 typically performs tests on the test object 1 without contacting it, in order to avoid damage such as scratches caused by contact.
[0053] In summary, the testing equipment of this application utilizes a carrier component of a fixing device to carry the object under test (co-packaged optical element), and integrates and fixes the electrical testing device, the object under test, and the carrier component with a holding component of the fixing device to form a test module. The object under test is held with its electronic functional surface facing down and its optical functional surface facing up. Then, the test module is placed on an electrical testing machine for contact electrical testing, while the optical testing device faces the optical functional surface of the object under test for non-contact optical testing. Accordingly, electrical and optical testing of co-packaged optical elements can be performed simultaneously. In addition to significantly saving the testing time, it also eliminates the equipment switching time and / or the transmission time of the tested product required between two separate electrical and optical tests, thereby improving the overall production rate of co-packaged optical elements and reducing manufacturing costs.
[0054] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. A testing device for simultaneously performing electrical and optical tests on a test object having opposing electronic and optical functional surfaces, characterized in that, include: An electrical testing device used to perform contact-type electrical tests on the object under test; An optical measurement device used to perform non-contact optical testing on the object under test; as well as A fixing device is used to support the object under test and fix the electrical measuring device and the object under test, so that the object under test is located between the electrical measuring device and the optical measuring device.
2. The detection device as described in claim 1, characterized in that, The object under test contains commonly packaged optical components.
3. The detection device as described in claim 2, characterized in that, The co-packaged optical element includes an electronic component. The electronic functional surface has multiple connection pads, and each connection pad has a conductive bump formed as a test point, so that the electronic component is electrically connected to the multiple connection pads through multiple conductive elements and forms an electrical connection with the multiple test points.
4. The detection device as described in claim 2, characterized in that, The optical functional surface is provided with an optical element having at least one optical interface.
5. The detection device as described in claim 1, characterized in that, The fixing device includes a load-bearing component and a retaining component.
6. The detection device as described in claim 5, characterized in that, The object under test is mounted on the carrier of the fixing device with the optical functional surface.
7. The detection device as described in claim 5, characterized in that, The retainer integrates and fixes the electrical testing device, the object under test, and the carrier to form a test module.
8. The detection device as described in claim 5, characterized in that, The support member has an opening corresponding to the optical functional surface, so that the optical measurement device can perform optical tests.
9. The detection device as described in claim 1, characterized in that, The electrical testing device is a probe card with multiple probes for electrical detection of the test object.
10. The detection device as described in claim 1, characterized in that, The optical measurement device includes at least one optical sensing element for detecting the optical properties of the object under test, so as to obtain the optical properties of the object under test.