Plug-in resistance temperature drift test device

Abstract

This utility model relates to the field of resistance testing technology, specifically a device for testing the temperature drift of plug-in resistors. The resistor pins of this utility model are connected to suitable connection pads on a substrate. Power is applied to a power board, and the test assembly is connected to a test device to perform performance testing on the resistors soldered to the connection pads. This method can quickly fix the soldering position of alloy plug-in resistors, ensuring consistency of the test position and reducing testing errors caused by manual soldering.

Description

Technical Field

[0001] This utility model relates to the field of resistance detection technology, and specifically to a plug-in resistor temperature drift testing device. Background Technology

[0002] Existing alloy through-hole resistors generally require temperature drift testing. This testing typically involves soldering test leads to the top of the resistor's solder pads and then immersing the product in a silicone oil bath for testing at different temperature ranges. Because the soldering positions may vary between different products, this can cause differences in temperature drift even within the same batch. Therefore, a temperature drift testing device for through-hole resistors is needed to address this issue. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a temperature drift testing device for alloy plug-in resistors that can quickly fix the welding position of the alloy plug-in resistor, ensure the consistency of the test position, and reduce the test error caused by manual welding.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0005] A plug-in resistance temperature drift testing device, comprising:

[0006] The substrate has test positions on both sides;

[0007] A connection component is disposed at the test position. The connection component includes multiple connection pads, which are spaced apart at the test position and are connected to adjacent connection pads by fixed copper wires.

[0008] A loading component is disposed on the substrate. The loading component includes two power boards, which are respectively disposed at both ends of the substrate. The power boards are connected to one of a plurality of connection pads.

[0009] A test component is disposed on the substrate and connected to the connection pads. The test component is used to perform performance testing on the resistors soldered on the connection pads.

[0010] In one embodiment of this utility model, a guide groove is provided between adjacent connecting pads, and the fixed copper wire is disposed in the guide groove. The guide groove and the fixed copper wire are coated with insulating varnish.

[0011] In one embodiment of this utility model, the connecting pad is provided with a welding through hole for convenient resistor assembly.

[0012] In one embodiment of the present invention, a fixing component is provided on the back side of the substrate. The fixing component includes a plurality of fixing pads, which are arranged in a one-to-one correspondence with the connecting pads. A conductive cylinder is provided in the welding through hole, and the fixing pads and the connecting pads are connected through the conductive cylinder.

[0013] In one embodiment of this utility model, the conductive cylinder has an upper opening and a lower opening, the diameter of the upper opening being larger than the diameter of the lower opening, so that the cross-section of the conductive cylinder has a conical structure.

[0014] In one embodiment of this utility model, positioning grooves are provided at both ends of the substrate, the power board is disposed on the positioning grooves, the power board is made of conductive metal, a tin-plated layer is provided on the power board, and the connecting pads are disposed on the power board.

[0015] In one embodiment of the present invention, the test component includes two test pads, which are respectively disposed on test positions on both sides of the substrate, and the test pads are disposed at the edge of the test positions. The test pads are connected to the connecting pads by copper strips.

[0016] In one embodiment of the present invention, a groove is provided in the middle of the substrate, and the groove is disposed between two test pads, the depth of the groove being 1 / 4 to 1 / 3 of the substrate thickness.

[0017] In one embodiment of this utility model, the substrate is provided with grooves on one side or both sides.

[0018] In one embodiment of this utility model, the fixed pad, the connecting pad, and the conductive cylinder are integrally formed. A fixing groove is provided on the substrate, the conductive cylinder is disposed in the fixing groove, and the connecting pad and the fixed pad are respectively on the openings on both sides of the fixing groove.

[0019] The beneficial effects of this utility model are:

[0020] The resistor pins of this invention are connected to the connection pads at appropriate positions on the substrate. Power is applied to the power board, and the test components are connected to the test equipment to perform performance tests on the resistors soldered to the connection pads. This invention can quickly fix the soldering position of the alloy plug-in resistors, ensuring the consistency of the test position and reducing test errors caused by manual soldering. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a plug-in resistance temperature drift testing device according to this utility model.

[0022] Figure 2 This is a schematic diagram of the substrate of this utility model.

[0023] Figure 3 This is a schematic diagram of the fixing component of this utility model.

[0024] The following are the labels in the diagram: 1. Substrate; 2. Connecting assembly; 21. Connecting pad; 22. Fixing copper wire; 23. Guide groove; 3. Soldering through hole; 4. Test assembly; 41. Test pad; 42. Copper strip; 5. Groove; 6. Loading assembly; 61. Power board; 62. Tin plating layer; 7. Fixing assembly; 71. Fixing pad; 72. Conductive cylinder; 73. Fixing groove. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0026] Reference Figure 1-3 As shown, a plug-in resistance temperature drift testing device includes:

[0027] Substrate 1, with test positions provided on both sides;

[0028] A connection component 2 is disposed at the test position. The connection component 2 includes a plurality of connection pads 21, which are spaced apart at the test position. Adjacent connection pads 21 are connected by a fixed copper wire 22.

[0029] A loading component 6 is disposed on the substrate 1. The loading component 6 includes two power boards 61, which are respectively disposed at both ends of the substrate 1. The power board 61 is connected to one of the multiple connection pads 21.

[0030] Test component 4 is disposed on the substrate 1 and is connected to the connection pad 21. Test component 4 is used to perform performance testing on the resistor soldered on the connection pad 21.

[0031] The resistor pins of this invention are connected to the connection pads 21 at appropriate positions on the substrate 1. Power is applied to the power board 61, and the test component 4 is connected to the test equipment to perform performance testing on the resistors soldered to the connection pads 21. This invention can quickly fix the soldering position of the alloy plug-in resistors, ensuring the consistency of the test position and reducing test errors caused by manual soldering.

[0032] In one embodiment of the present invention, a guide groove 23 is provided between adjacent connecting pads 21, and the fixed copper wire 22 is disposed in the guide groove 23. The guide groove 23 and the fixed copper wire 22 are coated with insulating varnish.

[0033] Specifically, the fixed copper wire 22 is set in the guide groove 23. A large flow of copper wire can be used to ensure comprehensive performance testing. The guide groove 23 and the fixed copper wire 22 are coated with insulating varnish to prevent conduction with the workshop resistor and ensure test stability.

[0034] In one embodiment of this utility model, the connecting pad 21 is provided with a welding through hole 3 for convenient resistor assembly.

[0035] Specifically, by inserting the pins into the soldering through holes 3 of the connecting pad 21 and passing the pins through the fixed pad 71, it is possible to quickly solder the resistor pins, reduce the difficulty of soldering the resistor pins, and also facilitate the positioning of the resistor, thereby improving the soldering effect.

[0036] In one embodiment of the present invention, a fixing component 7 is provided on the back side of the substrate 1. The fixing component 7 includes a plurality of fixing pads 71, and the fixing pads 71 ​​are provided in a one-to-one correspondence with the connecting pads 21. A conductive cylinder 72 is provided in the welding through hole 3, and the fixing pads 71 ​​and the connecting pads 21 are connected through the conductive cylinder 72.

[0037] Specifically, solder paste is applied to the fixing pad 71 on the reverse side of the substrate 1, and the fixing pad 71 is heated with a soldering iron or other soldering equipment to solder the pins of the resistor onto the fixing pad 71. The fixing pad 71 and the connecting pad 21 are connected through the conductive cylinder 72, which facilitates the soldering of the plug-in resistor and ensures the fixing effect of the resistor.

[0038] In one embodiment of the present invention, the conductive cylinder 72 has an upper opening and a lower opening, the diameter of the upper opening being larger than the diameter of the lower opening, so that the cross-section of the conductive cylinder 72 is tapered.

[0039] Specifically, the diameter of the upper opening is larger than the diameter of the lower opening, making the cross-section of the conductive cylinder 72 tapered. This facilitates the insertion of resistor pins into the conductive cylinder 72 and also improves the compatibility of the connecting pad 21 with plug-in resistors, resulting in good applicability.

[0040] In one embodiment of the present invention, the substrate 1 is provided with positioning grooves at both ends, the power board 61 is disposed on the positioning grooves, the power board 61 is made of conductive metal, the power board 61 is provided with a tin plating layer 62, and the connecting pad 21 is disposed on the power board 61.

[0041] Specifically, the power board 61 is made of conductive metal, and power connection wires are soldered onto the power board 61 to facilitate quick power connection and improve testing efficiency. At the same time, the bottom of the substrate 1 is provided with anti-slip texture, which is positioned opposite to the power board 61, making it easy to connect items such as clips to the power board 61 and ensuring connection stability.

[0042] In one embodiment of the present invention, the test component 4 includes two test pads 41, which are respectively disposed on test positions on both sides of the substrate 1, and the test pads 41 are disposed at the edge of the test positions. The test pads 41 are connected to the connecting pads 21 by copper strips 42.

[0043] Specifically, the test pad 41 is located at the edge of the test position, which makes it easy to solder the test connection lines of the test equipment onto the test pad 41. It is convenient to use, will not interfere with the resistance, and improves the test stability.

[0044] In one embodiment of the present invention, a groove 5 is provided in the middle of the substrate 1, and the groove 5 is disposed between two test pads 41. The depth of the groove 5 is 1 / 4 to 1 / 3 of the thickness of the substrate 1.

[0045] Specifically, the groove 5 is set between the two test pads 41 to obtain two identical substrates 1. The entire substrate 1 is separated by the groove 5. Many through-hole resistors with different span sizes can share a set of substrates 1, saving testing costs. It is suitable for resistors with many non-fixed spans due to variations in resistance and size.

[0046] In one embodiment of the present invention, the substrate 1 is provided with a groove 5 on one side or both sides.

[0047] Specifically, the substrate 1 has grooves 5 on one side or both sides. When the span of the solder through hole 3 on the substrate 1 is consistent with the pin of the plug-in resistor, the substrate 1 can be easily and quickly broken off to obtain two separate substrates 1, ensuring that the two substrates 1 are intact and improving ease of use.

[0048] In one embodiment of the present invention, the fixed pad 71, the connecting pad 21 and the conductive cylinder 72 are integrally formed. The substrate 1 is provided with a fixing groove 73, the conductive cylinder 72 is disposed in the fixing groove 73, and the connecting pad 21 and the fixed pad 71 are respectively on the openings on both sides of the fixing groove 73.

[0049] Specifically, the fixed pad 71, the connecting pad 21, and the conductive cylinder 72 are integrally formed. They can be assembled into the fixed groove 73 by means of hot melting, which greatly ensures the conductivity of the resistor and the accuracy of the test. At the same time, the integral forming has high strength and will not be damaged by pulling during repeated tests, thus ensuring the stability of the test.

[0050] Usage process

[0051] Before performing temperature drift testing on the plug-in resistor, select a suitable connection pad 21 on the substrate 1 according to the pin position of the plug-in resistor. When the span of the soldering through-hole 3 on the substrate 1 matches the pin of the plug-in resistor, insert the pin into the soldering through-hole 3 of the connection pad 21 and pass the pin through the fixed pad 71. Apply solder paste to the fixed pad 71, test pad 41, and tin plating layer 62 on the reverse side of the substrate 1. Heat the fixed pad 71 with a soldering iron or other soldering equipment to solder the resistor pin to the fixed pad 71. Solder the power connection wires to the power board 61 and solder the test connection wires of the test equipment to the test pad 41. Then place the substrate 1 in the temperature drift testing equipment and turn on different temperature ranges. The test involves breaking the substrate 1 along the groove 5 on the substrate 1 when the span of the solder through-hole 3 is inconsistent with the pins of the plug-in resistor. This results in two separate substrates 1. The positions of the two separate substrates are adjusted, and the two pins of the plug-in resistor are then inserted into the solder through-hole 3 of the separate substrates 1 for soldering. After soldering the power connection wires and test connection wires, the two broken boards and the resistor are placed in a temperature drift tester to perform tests at different temperature ranges. This fixes the soldering position of the alloy plug-in resistors with the same span, ensuring the consistency of the test position and reducing test errors caused by manual soldering. At the same time, by separating the entire substrate 1 through the groove 5, plug-in resistors with many span sizes can share a single substrate 1, saving test costs.

[0052] The above-described embodiments are merely preferred embodiments provided to fully illustrate the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the claims.

Claims

1. A plug-in resistance temperature drift testing device, characterized in that, include: The substrate has test positions on both sides; A connection component is disposed at the test position. The connection component includes multiple connection pads, which are spaced apart at the test position and are connected to adjacent connection pads by fixed copper wires. A loading component is disposed on the substrate. The loading component includes two power boards, which are respectively disposed at both ends of the substrate. The power boards are connected to one of a plurality of connection pads. A test component is disposed on the substrate and connected to the connection pads. The test component is used to perform performance testing on the resistors soldered on the connection pads.

2. The plug-in resistance temperature drift testing device as described in claim 1, characterized in that, A guide groove is provided between adjacent connecting pads, and the fixed copper wire is placed in the guide groove. The guide groove and the fixed copper wire are coated with insulating varnish.

3. The plug-in resistance temperature drift testing device as described in claim 1, characterized in that, The connecting pads are provided with welding through holes for easy resistor assembly.

4. The plug-in resistance temperature drift testing device as described in claim 3, characterized in that, A fixing component is provided on the back side of the substrate. The fixing component includes multiple fixing pads, which are arranged in a one-to-one correspondence with the connecting pads. A conductive cylinder is provided in the welding through hole, and the fixing pads and the connecting pads are connected through the conductive cylinder.

5. The plug-in resistance temperature drift testing device as described in claim 4, characterized in that, The conductive cylinder has an upper opening and a lower opening, with the diameter of the upper opening being larger than the diameter of the lower opening, resulting in a tapered cross-section of the conductive cylinder.

6. The plug-in resistance temperature drift testing device as described in claim 1, characterized in that, The substrate has positioning grooves at both ends, the power board is disposed on the positioning grooves, the power board is made of conductive metal, the power board has a tin plating layer, and the connection pads are disposed on the power board.

7. The plug-in resistance temperature drift testing device as described in claim 1, characterized in that, The test component includes two test pads, which are respectively located at test positions on both sides of the substrate. The test pads are located at the edges of the test positions and are connected to the connecting pads by copper strips.

8. The plug-in resistance temperature drift testing device as described in claim 7, characterized in that, A groove is provided in the middle of the substrate, and the groove is located between two test pads. The depth of the groove is 1 / 4 to 1 / 3 of the substrate thickness.

9. The plug-in resistance temperature drift testing device as described in claim 8, characterized in that, The substrate has grooves on one side or both sides.

10. The plug-in resistance temperature drift testing device as described in claim 4, characterized in that, The fixed pad, connecting pad, and conductive cylinder are integrally formed. The substrate is provided with a fixing groove, the conductive cylinder is disposed in the fixing groove, and the connecting pad and the fixed pad are respectively on the openings on both sides of the fixing groove.

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