Radio frequency receiving device

Abstract

The present disclosure relates to the technical field of nuclear magnetic resonance, and discloses a radio frequency receiving device, which comprises an electronic component, a heat-conducting material layer and a protective outer garment arranged outside the electronic component and the heat-conducting material layer, wherein the electronic component comprises a heat-generating component, and the heat-conducting material layer is wrapped around the heat-generating component. Since the heat-generating component in the electronic component is wrapped in the heat-conducting material layer, the heat generated by the heat-generating component can be quickly conducted to the surrounding area by the heat-conducting material layer, effectively reducing the temperature at the position of the heat-generating component, and helping to prevent the local temperature of the radio frequency receiving device from exceeding 41℃ due to overheating. In addition, the heat-conducting material layer prevents heat from accumulating at the position of the heat-generating component by quickly conducting heat, so that the radio frequency receiving device can maintain operation within an ideal temperature range, and help the radio frequency receiving device to maintain good performance.

Description

Technical Field

[0001] The present disclosure relates to the technical field of nuclear magnetic resonance, for example, to a radio frequency receiving device. Background Art

[0002] In a magnetic resonance imaging (MRI) system, a radio frequency receiving device is responsible for receiving magnetic resonance signals and performing a series of processing steps on them, including tuning / detuning, amplification, and filtering, etc., to ensure the quality and stability of the signals. According to the IEC 60601-1 standard, the surface temperature of the radio frequency receiving device shall not exceed 41 °C under extreme environments to ensure patient safety.

[0003] In the related art, the radio frequency receiving device includes a protective outer layer and electronic components for processing magnetic resonance signals, and the electronic components are encapsulated within the protective outer layer. The electronic components include heat-generating components. To prevent these heat-generating components from causing the surface temperature of the radio frequency receiving device to be too high, the protective outer layer is usually designed to be relatively thick, thereby forming a large air gap around the heat-generating elements. This design can effectively delay the heat conduction to the surface of the radio frequency receiving device and prevent the local temperature on the surface of the radio frequency receiving device from exceeding 41 °C due to overheating of the heat-generating elements.

[0004] For the radio frequency receiving device in the related art, although it can prevent the local temperature on its surface from exceeding 41 °C, the heat generated by the heat-generating components in the electronic components will accumulate inside the radio frequency receiving device for a long time and cannot be released in time, which may affect the performance of the radio frequency receiving device.

[0005] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of the present disclosure, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Utility Model

[0006] To have a basic understanding of some aspects of the disclosed embodiments, a simple summary is given below. This summary is not a general review, nor is it intended to identify key / important elements or delineate the protection scope of these embodiments, but rather serves as a preface to the subsequent detailed description.

[0007] Embodiments of the present disclosure provide a radio frequency receiving device that can both prevent the local temperature of the radio frequency receiving device from exceeding 41 °C due to overheating and prevent heat from accumulating inside the radio frequency receiving device, which helps the radio frequency receiving device maintain good performance. The radio frequency receiving device provided by the embodiments of the present disclosure includes electronic components, a heat-conducting material layer, and a protective outer layer disposed outside the electronic components and the heat-conducting material layer. The electronic components include heat-generating components, and the heat-conducting material layer wraps around the heat-generating components.

[0008] In some embodiments, the heat-generating component includes a circuit board and a plurality of signal processing elements disposed on the circuit board. The plurality of signal processing elements includes a plurality of heat-generating elements, and the plurality of heat-generating elements are in contact with a heat-conducting material layer.

[0009] In some embodiments, the plurality of heat-generating elements are discretely arranged.

[0010] In some embodiments, the plurality of heat-generating elements are distributed on the upper and lower surfaces of the circuit board.

[0011] In some embodiments, the electronic component further includes a protection box, the protection box covers the outside of the heat-generating component, and the heat-conducting material layer is located between the protection shell and the heat-generating component.

[0012] In some embodiments, the heat-generating component includes a notch filter. The notch filter includes an LC oscillation circuit body and a protective layer disposed outside the LC oscillation circuit body. The LC oscillation circuit body includes a conductor, and the protective layer includes a window exposing the conductor. The heat-conducting material layer is in contact with the conductor through the window.

[0013] In some embodiments, the capacitor of the LC oscillation circuit body is disposed at one end of the notch filter, and the window is disposed adjacent to the capacitor.

[0014] In some embodiments, the heat-generating component includes a notch filter. The notch filter includes an LC oscillation circuit body. The LC oscillation circuit body includes a conductor and a capacitor connected to the conductor. The heat-conducting material layer is in contact with the capacitor.

[0015] In some embodiments, the heat-conducting material layer is a flexible heat-conducting material layer.

[0016] In some embodiments, the heat-conducting material layer is made of a glass fiber-reinforced ceramic-filled silicone rubber material.

[0017] In some embodiments, the radio frequency receiving device is a flexible receiving device.

[0018] The radio frequency receiving device provided by the embodiments of the present disclosure can achieve the following technical effects: Since the heat-generating component in the electronic component is wrapped in the heat-conducting material layer, the heat generated by the heat-generating component can be quickly conducted by the heat-conducting material layer to the surrounding area, effectively reducing the temperature at the position where the heat-generating component is located, and helping to prevent the local temperature of the radio frequency receiving device from exceeding 41 °C due to overheating. In addition, the heat-conducting material layer prevents the accumulation of heat at the position where the heat-generating component is located by quickly conducting heat, enabling the radio frequency receiving device to operate within an ideal temperature range, and helping the radio frequency receiving device to maintain good performance.

[0019] The above general description and the description below are exemplary and illustrative only and are not intended to limit this disclosure. Attached Figure Description

[0020] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein: Figure 1 This is a schematic diagram showing the layout of multiple components in a radio frequency receiving device provided in an embodiment of this disclosure; Figure 2 This is a schematic diagram of the assembly of a circuit board and a signal processing element provided in an embodiment of this disclosure; Figure 3 This is a cross-sectional schematic diagram of a radio frequency receiving device provided in an embodiment of the present disclosure near a signal processing unit; Figure 4 This is a cross-sectional schematic diagram of a radio frequency receiving device provided in an embodiment of this disclosure near a notch filter; Figure 5 This is an assembly diagram of a protective box, circuit board, signal processing element and thermally conductive material layer provided in an embodiment of this disclosure; Figure 6 This is a schematic diagram of the appearance of a radio frequency receiving device provided in an embodiment of this disclosure.

[0021] Explanation of icon numbers: 100 electronic components, 200 thermal conductive material layer, 300 protective outer casing, 400 cable outlet; 1. Signal processing unit; 11. Circuit board; 12. Signal processing components; 2. Notch filter; 21 LC oscillation circuit body, 22 protective layer, 211 conductor, 212 capacitor; 3 cables, 4 antennas, 5 protection boxes; 51 Top cover, 52 Bottom shell, 53 Hollowed-out area. Detailed Implementation

[0022] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0023] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0024] Unless otherwise stated, the term "multiple" means two or more.

[0025] In this embodiment of the disclosure, the character " / " indicates that the objects before and after it are in an "or" relationship. For example, A / B means: A or B.

[0026] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0027] The term "correspondence" can refer to an association or binding relationship. The correspondence between A and B means that there is an association or binding relationship between A and B.

[0028] In a magnetic resonance imaging (MRI) system, the radio frequency (RF) receiver is responsible for receiving MRI signals and performing a series of processing steps, including tuning / detuning, amplification, and filtering, to ensure signal quality and stability. According to the IEC 60601-1 standard, the surface temperature of the RF receiver must not exceed 41°C in extreme environments to ensure patient safety.

[0029] In related technologies, radio frequency (RF) receivers include a protective outer layer and electronic components for processing magnetic resonance signals, with the electronic components encapsulated within the protective outer layer. Specifically, the protective outer layer comprises a rigid protective box and a flexible protective sheath. The electronic components are housed inside the protective box, and the protective box, along with the electronic components, is encapsulated within the protective sheath. The signal processing unit contains heat-generating components. To prevent these heat-generating components from causing excessively high surface temperatures on the RF receiver, the protective box is typically designed to be thick, providing ample internal space and creating large air gaps around the heat-generating components. This design effectively delays heat conduction to the surface of the RF receiver, preventing localized surface temperatures from exceeding 41°C due to overheating of the heat-generating components.

[0030] Although the radio frequency receiving device of the related technology can avoid the local temperature of its surface from exceeding 41°C, the heat generated by the heat-generating components in the electronic components will accumulate inside the radio frequency receiving device for a long time and cannot be released in time, which may affect the performance of the radio frequency receiving device.

[0031] Furthermore, the related RF receivers also include notch filters, which also generate heat. However, the related RF receivers cannot effectively block the heat generated by the notch filters, and there is a risk that the local temperature of the RF receiver may exceed 41°C due to overheating of the heating elements.

[0032] This disclosure provides a radio frequency receiving device, combined with... Figure 1 As shown, the radio frequency receiving device includes an electronic component 100, a thermally conductive material layer 200, and a protective outer casing 300 disposed outside the electronic component 100 and the thermally conductive material layer 200. The electronic component 100 includes a heating element, and the thermally conductive material layer 200 covers the heating element. Here, the heating element may include a signal processing unit 1 and a notch filter 2, and the thermally conductive material layer 200 covers each of the signal processing unit 1 and the notch filter 2, wherein, for example... Figure 2 As shown, the signal processing unit 1 includes a circuit board 11 and a plurality of signal processing elements 12 disposed on the circuit board 11. It should be noted that the covering may completely cover the surface of the heat-generating component, or it may cover opposite sides of the heat-generating component; the degree of covering is related to the structure of the electronic component and the material properties of the thermally conductive material layer.

[0033] In this embodiment, the electronic component 100 further includes cables 3. The signal processing unit 1, the notch filter 2, and the cables 3 correspond one-to-one. The signal processing unit 1 is connected to the corresponding cable 3, and the notch filter 22 is fitted onto the corresponding cable 3. The number of signal processing units 1, notch filters 2, and cables 3 can be determined according to actual design needs. For example, the number of signal processing units 1, notch filters 2, and cables 3 can all be 12, forming one signal transmission group consisting of one signal processing unit 1, one notch filter 2, and one cable 3. In one signal transmission group, the signal processing unit 1 is connected to the cable 3, and the notch filter 2 is fitted onto the cable 3. Three signal transmission groups form a column, and the column of signal transmission groups is arranged along a first direction. In a column of signal transmission groups, the cable 3 of the rear signal transmission group passes through the notch filter 2 of its own group, as well as through the notch filters 2 of each signal transmission group located in front of that group.

[0034] Figure 3 A cross-sectional schematic diagram of the radio frequency receiving device near a signal processing unit 11 is shown. Figure 4 A schematic cross-sectional view of the radio frequency receiving device near a notch filter 2 is shown. Figure 1 , Figure 3 and Figure 4 As shown, a thermally conductive material layer 200 encloses the signal processing unit 1, the notch filter 2, and a portion of the cable 3. (As shown...) Figure 3 and Figure 4As shown, the thermally conductive material layer 200 can be divided into upper and lower sides. The two thermally conductive material layers 200 are respectively attached to two opposite sides of the signal processing unit 1 and two opposite sides of the notch filter 2. Of course, the thermally conductive material layer 200 can also be a single unit, completely enclosing the signal processing unit 1 and the notch filter 2.

[0035] Because the heat-generating component in the electronic component 100 is encased in the thermally conductive material layer 200, the heat generated by the heat-generating component can be rapidly conducted to the surrounding area by the thermally conductive material layer 200, effectively reducing the temperature at the location of the heat-generating component. This helps prevent the local temperature of the RF receiver from exceeding 41°C due to overheating. Furthermore, by rapidly conducting heat, the thermally conductive material layer 200 prevents heat accumulation at the location of the heat-generating component, enabling the RF receiver to operate within an ideal temperature range and contributing to its optimal performance.

[0036] Specifically, the heat generated by the signal processing unit 1 and the notch filter 2 can be rapidly conducted to the surrounding area by the thermally conductive material layer 200, effectively reducing the temperature at the location of the signal processing unit 1 and the notch filter 2. This helps prevent the local temperature of the RF receiving device from exceeding 41°C due to overheating. Furthermore, by rapidly conducting heat, the thermally conductive material layer 200 prevents heat accumulation at the location of the signal processing unit 1 and the notch filter 2, allowing the RF receiving device to operate within an ideal temperature range and contributing to its optimal performance.

[0037] In some embodiments, as described above, the signal processing unit 1 in the heating component includes a circuit board 11 and a plurality of signal processing elements 12 disposed on the circuit board 11. Here, the plurality of signal processing elements 12 include a plurality of heating elements, which are in contact with the thermally conductive material layer 200. Of course, the plurality of signal processing elements 12 may also include non-heating elements. The plurality of signal processing elements 12 on the circuit board 11 include elements in the detuning tuning assembly, elements in the notch filter circuit, elements in the matching circuit, amplifiers, etc. Among them, the elements in the detuning tuning assembly, the elements in the notch filter circuit, and the amplifier are all heating elements, while the elements in the matching circuit are non-heating elements. The detuning tuning assembly includes an inductor, a capacitor, and a diode. When the diode is conducting, its circuit is equivalent to a high impedance at the radio frequency, which hinders the flow of radio frequency current in the receiving unit of the radio frequency receiving device and prevents radio frequency power coupling into the radio frequency receiving device. The notch filter circuit is composed of an inductor and a capacitor connected in parallel. It resonates at the radio frequency and is equivalent to a high impedance. Its function is to eliminate the common-mode effect.

[0038] In some embodiments, the signal processing unit 1 is configured with an antenna 4, which is connected to a detuning assembly on a circuit board 11 in the signal processing unit 1. The antenna 4 is a flexible loop, where the signal processing element 12 for processing signals is integrated into the circuit board 11, which occupies a smaller area, while no other elements are placed on the antenna 4, which occupies a larger area, thereby enhancing the flexibility of the antenna 4 and improving the overall flexibility of the radio frequency receiving device.

[0039] In some embodiments, multiple heating elements are arranged discretely, which can avoid excessive heat concentration due to the heating elements being too close together, thus affecting the heat dissipation speed.

[0040] In some embodiments, multiple heating elements are distributed on the upper and lower surfaces of the circuit board 11. Distributing the heating elements across the upper and lower surfaces of the circuit board 11 increases the overall distance between the heating elements, preventing excessive heat concentration caused by the heating elements being too close together, which would affect the heat dissipation speed. In addition, this arrangement of heating elements can make full use of the upper and lower thermally conductive material layers 200 to conduct heat, thereby improving heat dissipation efficiency.

[0041] In some embodiments, the electronic component 100 further includes a protective housing 5, which covers the outside of the heat-generating component, with a thermally conductive material layer 200 located between the protective housing and the heat-generating component. Specifically, the protective housing 5 covers the circuit board 11 and a plurality of signal processing elements 12 thereon. The protective housing 5 is made of a non-conductive material; for example, it may be made of plastic. The wall thickness of the protective housing 5 can be determined according to actual design requirements; for example, the wall thickness of the protective housing 55 may be millimeters.

[0042] The protective box 5 can be a shell formed using a one-piece molding process, or it can be composed of multiple parts. Taking a protective box 5 composed of multiple parts as an example... Figure 5 The protective box 5 is designed for use in an exploded state. The protective box 5 includes an upper cover 51 and a bottom shell 52, with the upper cover 51 fastened to the bottom shell 52 to form a complete protective box 5. The circuit board 11 and its multiple signal processing components 12 are located inside the protective box 5 to prevent damage to the signal processing components 12. The protective box 5 has a cutout area 53 through which a portion of the thermally conductive material layer 200 passes, encasing the circuit board 11 and signal processing components 12 within the protective box 5.

[0043] In some embodiments, the height of the signal processing unit 1 is between 6 mm and 16 mm. Limiting the height of the signal processing element 12 helps to reduce the overall thickness of the radio frequency receiving device.

[0044] In some embodiments, the height of the signal processing element 12 on the circuit board 11 in the signal processing unit 1 is between 2.5 mm and 4 mm. Optionally, the maximum height of the signal processing element 12 located on the upper surface of the circuit board 11 does not exceed 4 mm, and the maximum height of the signal processing element 12 located on the lower surface of the circuit board 11 does not exceed 2 mm.

[0045] In some embodiments, as described above, the heat-generating component includes a notch filter 2. The notch filter 2 includes an LC oscillator circuit body 21 and a protective layer 22 disposed outside the LC oscillator circuit body 21. The LC oscillator circuit body 21 includes a conductor 211, and the protective layer 22 includes an opening exposing the conductor 211. A thermally conductive material layer contacts the conductor 211 through the opening. By directly contacting the conductor 211 with the thermally conductive material layer 200, the heat generated by the conductor 211 can be directly conducted to the thermally conductive material layer 200, improving heat dissipation efficiency. The conductor can constitute the inductor portion of the LC oscillator circuit body.

[0046] In some embodiments, the capacitor 212 of the LC oscillation circuit body 21 is disposed at one end of the notch filter 2, and the window is disposed adjacent to the capacitor 212. The capacitor 212 is the component in the notch filter 2 that generates the most heat. The placement of the window adjacent to the capacitor 212 allows the capacitor 212 to be in direct contact with the thermally conductive material layer 200, and the heat generated by the capacitor 212 can be directly conducted to the thermally conductive material layer 200, which significantly improves the heat dissipation efficiency.

[0047] In some embodiments, the notch filter 2 includes an LC oscillator circuit body 21, which includes a conductor 211 and a capacitor 212. The conductor can constitute the inductor portion of the LC oscillator circuit body. A thermally conductive material layer is in contact with the capacitor 212. In the LC oscillator circuit, the capacitor is the main heat source. Since part of the capacitor in the notch filter is exposed, the direct contact between the thermally conductive material layer and the capacitor 212 facilitates the direct conduction of the heat generated by the capacitor into the surrounding environment.

[0048] In some embodiments, combined with Figure 1 , Figure 3 , Figure 4 and Figure 6 As shown, the radio frequency receiving device also includes a cable outlet 400, to which a cable 3 located outside the thermally conductive material layer 200 is connected. In other words, the signal processing unit 1 is connected to the cable outlet 400 via the cable 3. Here, the cable outlet 400 can be connected to other devices.

[0049] In some embodiments, the radio frequency receiving device is a flexible receiving device.

[0050] In some embodiments, the thermally conductive material layer 200 is a flexible thermally conductive material layer. Specifically, the thermally conductive material layer 200 is made of a flexible material, for example, it is made of glass fiber reinforced ceramic-filled silicone rubber material, which helps to increase the overall flexibility of the radio frequency receiving device.

[0051] In some embodiments, the protective outer cover 300 is made of multi-layer flame-retardant sponge, silk floss, or leather, etc. A cable outlet 400 is located outside the protective outer cover 300 so that it can be connected to other devices.

[0052] In some embodiments, the thickness of the radio frequency receiving device is between 10 mm and 30 mm.

[0053] The foregoing description and accompanying drawings fully illustrate embodiments of this disclosure to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, procedural, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the terminology used in this application is for describing embodiments only and is not intended to limit the claims. As used in the description of embodiments and claims, the singular forms “a,” “an,” and “the” are intended to equally include the plural forms unless the context clearly indicates otherwise. Similarly, the term “and / or” as used in this application means including one or more of the associated listed items and all possible combinations thereof. Additionally, when used in this application, the term "comprise" and its variations "comprises" and / or "comprising" refer to the presence of stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. Without further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the process, method, or apparatus that includes said element. In this document, each embodiment may focus on the differences from other embodiments, and similar or identical parts between embodiments can be referred to mutually. For methods, products, etc., disclosed in the embodiments, if they correspond to the method section disclosed in the embodiments, the relevant parts can be referred to the description of the method section.

[0054] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of this disclosure. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0055] The methods and products disclosed in the embodiments herein (including but not limited to devices and equipment) can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units may be merely a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be electrical, mechanical, or other forms. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to implement this embodiment according to actual needs. In addition, the functional units in the embodiments of this disclosure may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0056] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than that shown in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. Each block in a block diagram and / or flowchart, and combinations of blocks in a block diagram and / or flowchart, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

Claims

1. A radio frequency receiving device, characterized in that, It includes electronic components, a thermally conductive material layer, and a protective outer casing disposed on the outside of the electronic components and the thermally conductive material layer. The electronic components include a heating element, and the thermally conductive material layer wraps around the heating element. The heating element includes a notch filter. The notch filter includes an LC oscillating circuit body and a protective layer disposed outside the LC oscillating circuit body. The LC oscillating circuit body includes a conductor, and the protective layer includes a window exposing the conductor. A thermally conductive material layer contacts the conductor through the window. Alternatively, the notch filter includes an LC oscillating circuit body, which includes a conductor and a capacitor connected to the conductor. A thermally conductive material layer contacts the capacitor.

2. The radio frequency receiving device according to claim 1, characterized in that, The heating component includes a circuit board and multiple signal processing elements disposed on the circuit board. The multiple signal processing elements include multiple heating elements, and the multiple heating elements are in contact with a thermally conductive material layer.

3. The radio frequency receiving device according to claim 2, characterized in that, Multiple heating elements are arranged discretely.

4. The radio frequency receiving device according to claim 2, characterized in that, Multiple heating elements are distributed on the upper and lower surfaces of the circuit board.

5. The radio frequency receiving device according to claim 2, characterized in that, The electronic components also include a protective case, which covers the outside of the heat-generating component, with a thermally conductive material layer located between the protective case and the heat-generating component.

6. The radio frequency receiving device according to claim 1, characterized in that, The capacitor of the LC oscillation circuit body is located at one end of the notch filter, and the window is located near the capacitor.

7. The radio frequency receiving device according to any one of claims 1-6, characterized in that, The thermally conductive material layer is a flexible thermally conductive material layer.

8. The radio frequency receiving device according to any one of claims 1-6, characterized in that, The radio frequency receiving device is a flexible receiving device.

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