A kind of projector external heat dissipation device based on semiconductor refrigeration sheet

Abstract

The utility model belongs to the technical field of projector heat dissipation device relates to a kind of projector external heat dissipation device based on semiconductor refrigeration piece, comprising: semiconductor refrigeration piece;Refrigeration component, including refrigeration conduction fin and cold air fan;Heat dissipation component, including heat dissipation conduction fin and heat dissipation fan;The semiconductor refrigeration piece is embedded in the mounting hole of base plate, and the refrigeration component and heat dissipation component are respectively installed in the two sides of base plate, and the cold end of semiconductor refrigeration piece is closely combined with refrigeration conduction fin, and the hot end of semiconductor refrigeration piece is closely combined with heat dissipation conduction fin.The projector external heat dissipation device based on semiconductor refrigeration piece provided by the utility model has the advantages of compact structure and high heat dissipation efficiency.

Description

Technical Field

[0001] This utility model belongs to the technical field of projector heat dissipation devices, and relates to an external heat dissipation device for projectors based on a semiconductor cooling chip. Background Technology

[0002] Current projectors are equipped with two or three cooling fans to conduct heat from inside the projector to the outside, thereby reducing the internal temperature of the projector. However, this type of room temperature air cooling has disadvantages such as poor heat dissipation and high noise.

[0003] Semiconductor cooling chips have advantages such as small size, rapid cooling, no moving parts, and precise temperature control, and are beginning to be used for local heat dissipation. Chinese utility model patent CN206725939U (publication date: 2017.12.08) discloses a heat dissipation device for a miniature projector, including a projector mounting shell and a cooling device; the cooling device includes a shell, inside which a semiconductor cooling chip, a cooling fan located on the heating side of the cooling chip, and a blower located on the cooling side of the cooling chip; the upper and lower surfaces and sides of the projector mounting shell are provided with multiple vent holes; the lower surface of the projector mounting shell is provided with an air inlet; the connection port is connected to the air inlet through an air pipe; a baffle is provided at the end of the air pipe away from the cooling device, and the baffle is made of multiple metal wires wound and woven together.

[0004] The aforementioned heat dissipation device uses a blower to send cold air into the projector through an air pipe, and disperses the cold air through a spoiler; its shortcomings are that the structure is not compact enough and the loss of cold air is also large. Utility Model Content

[0005] This invention addresses the shortcomings of existing technologies by providing an external heat dissipation device for projectors based on a semiconductor cooling chip, which has the advantages of compact structure and high heat dissipation efficiency.

[0006] To solve the above-mentioned technical problems, the objective of this utility model is achieved through the following technical solution: An external heat dissipation device for a projector based on a semiconductor cooling chip includes: Semiconductor cooling chip; The cooling assembly includes cooling conduction fins and a cooling fan, wherein the cooling fan is disposed on one side of the cooling conduction fins and is used to blow the cold air flowing through the cooling conduction fins toward the projector. A heat dissipation assembly includes heat dissipation fins and a cooling fan. The cooling fan is disposed on one side of the heat dissipation fins and is used to blow hot air flowing through the heat dissipation fins to the outside of the device. The semiconductor cooling chip is embedded in the mounting hole of the substrate, and the cooling component and the heat dissipation component are respectively mounted on both sides of the substrate. The cold end of the semiconductor cooling chip is in close contact with the cooling conduction fins, and the hot end of the semiconductor cooling chip is in close contact with the heat dissipation conduction fins.

[0007] In the above-mentioned external heat dissipation device for a projector based on a semiconductor cooling chip, the cooling component is covered by an inner cover, and the inner cover is provided with an air outlet channel that directs cold air to the heat dissipation holes of the projector; the heat dissipation component is covered by an outer cover, and the outer cover is provided with an exhaust channel that dissipates heat to the outside; both the inner cover and the outer cover are mounted on a substrate.

[0008] In the above-mentioned external heat dissipation device for a projector based on a semiconductor refrigeration chip, thermally conductive silicone is provided between the cold end of the semiconductor refrigeration chip and the cooling conduction fins; thermally conductive silicone is provided between the hot end of the semiconductor refrigeration chip and the heat dissipation conduction fins.

[0009] In the above-mentioned external heat dissipation device for a projector based on a semiconductor cooling chip, the cooling conduction fins and the cooling fan are assembled into a cooling assembly by a cooling fin mounting bracket, and the cooling assembly is mounted on the substrate by a cooling assembly mounting bracket and a compression screw.

[0010] In the above-mentioned external heat dissipation device for a projector based on a semiconductor cooling chip, the heat dissipation fins and the cooling fan are assembled into a heat dissipation assembly by a heat dissipation fin mounting bracket, and the heat dissipation assembly is mounted on the substrate by fastening screws.

[0011] In the above-mentioned external heat dissipation device for a projector based on a semiconductor cooling chip, the semiconductor heat dissipation device is mounted on the projector mounting plate via an external mounting bracket, and the projector is mounted on the projector mounting plate; preferably, multiple external mounting brackets are provided; preferably, the external mounting bracket is provided with a position adjustment structure consisting of strip holes and bolts.

[0012] In the above-mentioned external heat dissipation device for a projector based on a semiconductor cooling chip, the projector is equipped with a projector T-shaped frame for adjusting its projection angle. The projector T-shaped frame is mounted on a projector conversion plate by a triangularly distributed spring screw. The projector conversion plate is mounted on a projector mounting plate and / or an external mounting bracket.

[0013] In the above-mentioned external heat dissipation device for a projector based on a semiconductor cooling chip, the semiconductor cooling chip, the cooling component, and the heat dissipation component constitute a heat dissipation unit. Multiple heat dissipation units can be provided, and all multiple heat dissipation units are mounted on the same substrate. Preferably, the multiple heat dissipation units are distributed vertically.

[0014] Compared with the prior art, this utility model has the following advantages: This invention provides an external heat dissipation device for projectors based on a semiconductor cooling chip. Utilizing active cooling with a semiconductor cooling chip, it directly blows cool air to the projector's heat source via a cooling component. This results in significantly higher heat dissipation efficiency than traditional passive air cooling, effectively controlling the projector's core temperature, ensuring stable operation, and extending its lifespan. By externalizing the main heat dissipation system, this invention greatly reduces the projector's size and internal heat buildup, facilitating miniaturized projector design. Furthermore, this invention employs a modular design, allowing for excellent compatibility with various projector models. Attached Figure Description

[0015] Figure 1 This is an exploded view of this utility model; Figure 2 This is a cross-sectional view of the present invention; Figure 3 This is an exploded view of the refrigeration component of this utility model; Figure 4 This is an exploded view of the heat dissipation component of this utility model; Figure 5 This is a perspective view of the present invention installed at the rear; Reference numerals: 1. Semiconductor cooling chip; 2. Cooling conduction fins; 3. Cooling fan; 4. Projector; 5. Heat dissipation conduction fins; 6. Cooling fan; 7. Substrate; 8. Inner casing; 9. Outer casing; 10. Cooling fin mounting bracket; 11. Cooling component mounting bracket; 12. Compression screw; 13. Heat dissipation fin mounting bracket; 14. Fastening screw; 15. External mounting bracket; 16. Projector mounting plate. Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. See also: Figure 1-5 : An external heat dissipation device for a projector 4 based on a semiconductor cooling chip 1 includes: Semiconductor cooling chip 1; The cooling assembly includes a cooling conduction fin 2 and a cold air fan 3. The cold air fan 3 is disposed on one side of the cooling conduction fin 2 and is used to blow the cold air flowing through the cooling conduction fin 2 toward the projector 4. Furthermore, the cooling assembly is covered by an inner cover 8, and the inner cover 8 is provided with an air outlet channel that guides the cold air to the heat dissipation holes of the projector 4. The heat dissipation assembly includes heat dissipation fins 5 and a cooling fan 6. The cooling fan 6 is disposed on one side of the heat dissipation fins 5 and is used to blow the hot air flowing through the heat dissipation fins 5 to the outside of the device. Furthermore, the heat dissipation assembly is covered by an outer shell 9, and the outer shell 9 is provided with an exhaust channel for dissipating heat to the outside.

[0017] Comparison Appendix Figure 2 The semiconductor cooling device, consisting of the semiconductor cooling chip 1, the cooling component, and the heat dissipation component, is the core functional module of this embodiment. The semiconductor cooling chip 1 is sandwiched between the cooling component and the heat dissipation component by thermally conductive silicone coated on its cold and hot sides. When the semiconductor cooling chip 1 is powered on, it generates cold air that is transmitted and diffused through the cooling conduction fins 2, and then blown into the projector 4 through the heat dissipation holes of the projector 4 by the cooling fan 3 in the direction shown in the figure. Finally, it is exhausted to the outside of the projector 4 by the heat dissipation fan 6 of the projector 4 itself, and this cycle continues to operate, cooling the projector 4. The heat generated by the semiconductor cooling chip 1 is transmitted and diffused through the heat dissipation conduction fins 5, and then blown to the outside of the outer casing 9 by the heat dissipation fan 6 in the direction shown in the figure.

[0018] The specific installation structure of this embodiment is as follows: Comparison Appendix Figure 1 The semiconductor cooling chip 1 is embedded in the mounting hole of the substrate 7. The cooling component and the heat dissipation component are respectively mounted on both sides of the substrate 7. The cold end of the semiconductor cooling chip 1 is tightly attached to the cooling conduction fin 2, and the hot end of the semiconductor cooling chip 1 is tightly attached to the heat dissipation conduction fin 5. The inner cover 8 and the outer cover 9 are both mounted on the substrate 7.

[0019] Furthermore, refer to the appendix Figure 3 The cooling conduction fins 2 and the cold air fan 3 are assembled into a cooling assembly via the cooling fin mounting bracket 10. The cooling assembly is mounted on the substrate 7 via the cooling assembly mounting bracket 11 and the spring screw 12.

[0020] Furthermore, refer to the appendix Figure 4 The heat dissipation fins 5 and the heat dissipation fan 6 are assembled into a heat dissipation assembly by the heat dissipation fin mounting bracket 13, and the heat dissipation assembly is mounted on the substrate 7 by fastening screws 14.

[0021] To increase heat dissipation efficiency, the semiconductor cooling chip 1, the cooling component, and the heat dissipation component form a heat dissipation unit. Multiple heat dissipation units can be provided, and all multiple heat dissipation units are mounted on the same substrate 7. Preferably, the multiple heat dissipation units are distributed vertically.

[0022] Comparison Appendix Figure 5 The specific installation structure of the external heat dissipation device and the projector 4 in this embodiment is as follows: The semiconductor heat dissipation device is mounted on the projector mounting plate 16 via an external mounting bracket 15, and the projector 4 is mounted on the projector mounting plate 16. Preferably, multiple external mounting brackets 15 are provided, and the vertically distributed external mounting brackets 15 can make the mounting structure more stable. Preferably, the external mounting bracket 15 is provided with a position adjustment structure consisting of strip holes and bolts, and the installation position of the external heat dissipation device can be finely adjusted by the position adjustment device.

[0023] Furthermore, the projector 4 is equipped with a projector T-shaped frame for adjusting its projection angle. The projector T-shaped frame is mounted on the projector conversion plate by a triangular distribution of spring screws 12. The projector conversion plate is mounted on the projector mounting plate 16 and / or the external mounting bracket 15. The projection angle of the projector 4 can be adjusted by adjusting the spring screws 12. The spring screws 12 can also serve as shock absorbers.

[0024] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of protection of the present utility model. Therefore, all equivalent changes made to the structure, shape, and principle of the present utility model should be covered within the scope of protection of the present utility model.

Claims

1. An external heat dissipation device for a projector based on a semiconductor cooling chip, characterized in that, include: Semiconductor cooling chip (1); The cooling assembly includes a cooling conduction fin (2) and a cold air fan (3). The cold air fan (3) is disposed on one side of the cooling conduction fin (2) and is used to blow the cold air flowing through the cooling conduction fin (2) toward the projector (4). The heat dissipation assembly includes heat dissipation fins (5) and a heat dissipation fan (6). The heat dissipation fan (6) is disposed on one side of the heat dissipation fins (5) and is used to blow the hot air flowing through the heat dissipation fins (5) to the outside of the device. The semiconductor cooling chip (1) is embedded in the mounting hole of the substrate (7). The cooling component and the heat dissipation component are respectively installed on both sides of the substrate (7). The cold end of the semiconductor cooling chip (1) is closely attached to the cooling conduction fin (2), and the hot end of the semiconductor cooling chip (1) is closely attached to the heat dissipation conduction fin (5).

2. The projector external heat dissipation device based on a semiconductor cooling chip according to claim 1, characterized in that, The cooling component is provided with an inner cover (8), and the inner cover (8) is provided with an air outlet channel that directs the cold air to the heat dissipation holes of the projector (4); the heat dissipation component is provided with an outer cover (9), and the outer cover (9) is provided with an exhaust channel that discharges heat outward; both the inner cover (8) and the outer cover (9) are mounted on the substrate (7).

3. The projector external heat dissipation device based on a semiconductor cooling chip according to claim 1, characterized in that, Thermally conductive silicone is provided between the cold end of the semiconductor cooling chip (1) and the cooling conduction fin (2); thermally conductive silicone is provided between the hot end of the semiconductor cooling chip (1) and the heat dissipation conduction fin (5).

4. The projector external heat dissipation device based on a semiconductor cooling chip according to claim 1, characterized in that, The cooling conduction fins (2) and the cold air fan (3) are assembled into a cooling assembly by a cooling fin mounting bracket (10), and the cooling assembly is mounted on the substrate (7) by a cooling assembly mounting bracket (11) and a spring screw (12).

5. The projector external heat dissipation device based on a semiconductor cooling chip according to claim 1, characterized in that, The heat dissipation fins (5) and the cooling fan (6) are assembled into a heat dissipation assembly by means of a heat dissipation fin mounting bracket (13), and the heat dissipation assembly is mounted on the substrate (7) by means of fastening screws (14).

6. The projector external heat dissipation device based on a semiconductor cooling chip according to claim 1, characterized in that, The external heat dissipation device is mounted on the projector mounting plate (16) on the side of the projector (4) via an external mounting bracket (15).

7. The projector external heat dissipation device based on a semiconductor cooling chip according to claim 1, characterized in that, The semiconductor cooling chip (1), the cooling component, and the heat dissipation component constitute a heat dissipation unit. Multiple heat dissipation units are provided, and all multiple heat dissipation units are installed on the same substrate (7).

Images