A wafer processing glue coating device

Abstract

The utility model provides a kind of gluing device for wafer processing, including table body and be equipped with gluing assembly in table body top, the upper end of the table body is rotatably installed with rotary adsorption disc, the outside symmetry of the rotary adsorption disc is equipped with two protective parts, the bottom surface of each The protective part is equipped with the circular hole compatible with table body. The utility model forms half-enclosing protective structure by the butt joint of symmetry arrangement protective part, when gluing operation, the centrifugal force caused by wafer rotation produces excess glue liquid, which will be blocked by the inner wall of protective part, avoid glue liquid splashes to table body, rotary adsorption disc periphery or external environment, both reduce glue liquid waste, avoid device component pollution;The fixation of protective part adopts the combined mode of "magnetic attraction preliminary fixation+fixed ring locking", without complex bolt disassembly or welding separation: twist fixed ring can release the locking of protective part, directly separate the two protective parts of magnetic attraction connection, protective part can be quickly removed from device to clean inner wall.

Description

Technical Field

[0001] This utility model belongs to the field of wafer processing technology, and more specifically, it relates to a coating device for wafer processing. Background Technology

[0002] In wafer manufacturing, resist coating is a critical step, aiming to form a uniform resist film on the wafer surface to lay the foundation for subsequent processes such as photolithography. Existing wafer resist coating equipment typically uses a rotating carrier (such as a rotating structure that holds the wafer in place) to rotate the wafer, utilizing centrifugal force to achieve uniform diffusion of the resist on the wafer surface. However, during this process, some resist is easily thrown off the wafer by centrifugal force, splashing onto the equipment body or the surrounding environment. This not only wastes the resist but also contaminates core components of the equipment (such as the rotating carrier and the platform surface), increasing the difficulty and cost of subsequent equipment cleaning and maintenance.

[0003] Existing coating devices with basic protective functions often employ fixed welding or complex bolt connections for their protective structures. This results in cumbersome disassembly and assembly procedures, making it difficult to quickly remove and thoroughly clean the protective structures. Furthermore, when significant amounts of residual adhesive adhere to the inner walls of the protective structures, disassembly and maintenance require considerable time and are therefore tedious. Consequently, there is an urgent need for a wafer coating device that features easily detachable and reassembled protective structures, effectively prevents adhesive splashing, and is easy to maintain, thereby addressing the shortcomings of existing technologies. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a coating device for wafer processing, which is achieved by the following specific technical means:

[0005] A coating device for wafer processing includes a platform and a coating assembly disposed above the platform. A rotating adsorption disk is rotatably mounted on the upper end of the platform. Two protective components are symmetrically mounted on the outer side of the rotating adsorption disk. Each protective component has a circular hole on its bottom surface that matches the platform, and a groove on its upper surface. A matching magnetic strip is fixedly connected to the two opposite ends of the two grooves. Both protective components are sleeved on the platform, and the bottom end of each protective component is integrally formed on an arc-shaped plate. A fixing ring is sleeved on the platform, and an annular groove is formed on the inner wall of the upper port of the fixing ring. The two arc-shaped plates are located in the annular groove for locking the two protective components.

[0006] Furthermore, the outer wall of the platform is provided with an external thread, and the inner wall of the fixing ring is provided with an internal thread that matches the external thread. The fixing ring is threaded onto the platform through the engagement of the internal thread and the external thread.

[0007] Furthermore, a base is fixedly installed at the bottom end of the platform.

[0008] Furthermore, positioning grooves are symmetrically provided on both sides of the platform, and positioning blocks are fixedly installed on the inner sides of the two arc-shaped plates, with each positioning block inserted into the positioning groove.

[0009] Furthermore, each of the protective components is designed in a semi-circular shape, and the two grooves close to form a semi-enclosed protective structure.

[0010] Furthermore, a support arm is fixedly installed on the base, the adhesive application assembly is installed on the support arm, and the rotating adsorption disk is located in two grooves.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] 1. This device uses symmetrically arranged protective components to form a semi-enclosed protective structure. During the adhesive application process, the centrifugal force generated by the wafer rotation will block excess adhesive from the inner wall of the protective components, preventing adhesive from splashing onto the platform, the area around the rotating adsorption plate, or the external environment. This reduces adhesive waste and avoids contamination of device components. The protective components are fixed using a combination of "magnetic initial fixation + fixing ring locking," eliminating the need for complex bolt disassembly or welding separation. Twisting the fixing ring releases the lock on the protective component, allowing direct separation of the two magnetically connected protective components. The protective components can then be quickly removed from the device for internal cleaning. After cleaning, the protective components are quickly reconnected via the positioning structure and then locked back in place by magnetic attraction and fixing ring. The entire assembly and disassembly process is simple and efficient.

[0013] Second, during the installation of the protective components, precise alignment can be achieved with the help of the positioning structure (positioning block and positioning groove), avoiding splash-proof gaps caused by misalignment of the protective components. At the same time, the initial magnetic fixation ensures that the two protective components are tightly connected, and the subsequent locking of the fixing ring further enhances the installation stability of the protective components. Even if the wafer vibrates at high speed, the protective components are not easy to shift, always maintaining a reliable semi-enclosed protective state, ensuring the stability of the splash-proof effect. The design of the cooperation between the protective components and the main body of the device (stage, rotating adsorption plate, and coating assembly) is reasonable. The way the protective components are installed does not interfere with the adsorption and fixation of the wafer by the rotating adsorption plate and the rotation operation, nor does it hinder the coating assembly from dispensing adhesive onto the wafer. While achieving reliable protection, it fully ensures the normal progress of wafer coating processing, taking into account both protective function and processing convenience, and is highly practical. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall coating device for wafer processing according to this utility model.

[0015] Figure 2 This is a schematic diagram of the protective component of this utility model.

[0016] Figure 3 This is a schematic diagram of the positioning groove of this utility model.

[0017] Figure 4 This is a schematic diagram of the fixing ring of this utility model.

[0018] In the diagram, the correspondence between component names and drawing numbers is as follows:

[0019] 1. Platform; 11. Rotating adsorption plate; 12. Base; 13. External thread; 14. Support arm; 2. Protective component; 21. Groove; 22. Arc plate; 23. Magnetic strip one; 24. Positioning block; 3. Positioning groove; 4. Fixing ring; 41. Internal thread; 42. Annular groove; 5. Glue application assembly. Detailed Implementation

[0020] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0021] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] Example:

[0024] As attached Figure 1 To be continued Figure 4 As shown:

[0025] This utility model provides a coating device for wafer processing, including a platform 1 and a coating assembly 5 disposed above the platform 1. A rotating adsorption disk 11 is rotatably mounted on the upper end of the platform 1. Two protective components 2 are symmetrically mounted on the outer side of the rotating adsorption disk 11. The bottom surface of each protective component 2 has a circular hole adapted to the platform 1. The upper surface of each protective component 2 has a recessed groove 21. The two opposite ends of the two grooves 21 are fixedly connected to the corresponding magnetic strips 23. The two protective components 2 are sleeved on the platform 1. The bottom end of each protective component 2 is integrally formed on an arc plate 22. A fixing ring 4 is sleeved on the platform 1. An annular groove 42 is opened on the inner wall of the upper port of the fixing ring 4. The two arc plates 22 are located in the annular groove 42 for locking the two protective components 2.

[0026] The outer wall of the platform 1 is provided with an external thread 13, and the inner wall of the fixing ring 4 is provided with an internal thread 41 that is compatible with the external thread 13. The fixing ring 4 is threaded onto the platform 1 through the engagement of the internal thread 41 and the external thread 13. The internal thread 41 on its inner wall engages with the external thread 13 on the outer wall of the platform 1, allowing the fixing ring 4 to move vertically along the platform 1, which is used to lock the two protective parts 2.

[0027] A base 12 is fixedly installed at the bottom of the platform 1 to support the entire device.

[0028] The two sides of the platform 1 are symmetrically provided with positioning grooves 3. Positioning blocks 24 are fixedly installed on the inner side of the two arc plates 22. Each positioning block 24 is inserted into the positioning groove 3 to position the installation of the protective component 2.

[0029] Each protective component 2 is designed in a semi-circular shape. The two grooves 21 close to form a semi-enclosed protective structure. The grooves 21 of the two protective components 2 close to form a semi-enclosed space, which houses the rotating adsorption disk 11 and the wafer cover, preventing the adhesive from being splashed out to the outside, causing pollution and waste.

[0030] A support arm 14 is fixedly installed on the base 12, an adhesive application assembly 5 is installed on the support arm 14, and a rotating adsorption plate 11 is located in two grooves 21.

[0031] The platform 1 is equipped with a drive device for driving the rotating adsorption disk 11 and a vacuum device. The surface of the rotating adsorption disk 11 has micropores, which can be used to adsorb and fix the wafer. This is a mature existing technology and will not be described in detail again.

[0032] The working principle of this embodiment:

[0033] Step 1: The vacuum equipment (existing mature technology, not numbered) pre-installed inside the platform 1 is activated. The micropores on the surface of the rotating adsorption disk 11 generate negative pressure, stably adsorbing the wafer to be processed onto the rotating adsorption disk 11, preventing wafer displacement during adhesive application. Simultaneously, the installation status of the protective components 2 is checked: the two semi-circular protective components 2 are fitted onto the platform 1 via the arc-shaped plates 22 at their bottom ends. The positioning blocks 24 on the inner side of the arc-shaped plates 22 are inserted into the positioning grooves 3 on both sides of the platform 1, achieving precise positioning. The magnetic strips 23 at the mating ends of the two protective components 2 attract each other, completing the initial fixation. The fixing ring 4 is rotated, and its internal thread 41 engages with the external thread 13 on the outer wall of the platform 1, causing the fixing ring 4 to move upwards along the platform 1 until the annular groove 42 at the upper end of the fixing ring 4 completely encloses it. Two arc-shaped plates 22 are wrapped around the protective component 2 to achieve final locking. At this time, the grooves 21 of the two protective components 2 are closed to form a semi-enclosed space, which houses the rotating adsorption disk 11 and the wafer cover. The drive device inside the platform 1 (existing mature technology, not marked with a number) is started to drive the rotating adsorption disk 11 to rotate at a set speed, thereby driving the adsorbed wafer to rotate synchronously. The adhesive application component 5 installed at the end of the support arm 14 above the base 12 drips a certain amount of adhesive onto the surface of the rotating wafer. With the help of the centrifugal force of the wafer, the adhesive spreads evenly along the surface of the wafer to form an adhesive film of a preset thickness. During this process, some of the excess adhesive thrown out by the centrifugal force will be blocked by the inner wall of the groove 21 of the surrounding protective component 2 to prevent the adhesive from splashing onto the platform 1 or the external environment, causing pollution and waste.

[0034] Step 2: After the glue application is completed, turn off the drive equipment and the glue application assembly 5. After the rotating adsorption plate 11 stops rotating, remove the processed wafer. If it is necessary to clean the protective part 2 (excess glue adhered to the inner wall), rotate the fixing ring 4 in the opposite direction to move it downward along the external thread 13 until the annular groove 42 disengages from the arc plate 22, thus releasing the lock on the protective part 2. Manually separate the two protective parts 2 that are magnetically attracted by the magnetic strip 23 and remove them from the platform 1 (disengaging from the platform 1 through the circular hole on the bottom surface). Clean the inner wall of the groove 21. After cleaning, reinstall the protective part 2 according to the above operation steps: first, position it with the positioning block 24 and the positioning groove 3, then initially fix it with the magnetic strip 23, and finally lock it with the fixing ring 4 to ensure that the device returns to the working state and is ready for the next glue application operation.

[0035] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A coating apparatus for wafer processing, comprising a platform (1) and a coating assembly (5) disposed above the platform (1), wherein a rotating adsorption disk (11) is rotatably mounted on the upper end of the platform (1), characterized in that: Two protective components (2) are symmetrically installed on the outer side of the rotating adsorption disk (11). Each protective component (2) has a circular hole on its bottom surface that is compatible with the platform (1). Each protective component (2) has a groove (21) recessed on its upper surface. The two opposite ends of the two grooves (21) are fixedly connected to a matching magnetic strip (23). Both protective components (2) are sleeved on the platform (1). The bottom end of each protective component (2) is integrally formed on the arc plate (22). A fixing ring (4) is fitted on the platform (1). An annular groove (42) is opened on the inner wall of the upper port of the fixing ring (4). Two arc-shaped plates (22) are located in the annular groove (42) and are used to lock the two protective parts (2).

2. The coating apparatus for wafer processing as described in claim 1, characterized in that: The outer wall of the platform (1) is provided with an external thread (13), and the inner wall of the fixing ring (4) is provided with an internal thread (41) that is compatible with the external thread (13). The fixing ring (4) is threaded onto the platform (1) through the cooperation of the internal thread (41) and the external thread (13).

3. The coating apparatus for wafer processing as described in claim 1, characterized in that: A base (12) is fixedly installed at the bottom end of the platform (1).

4. The coating apparatus for wafer processing as described in claim 1, characterized in that: The platform (1) has symmetrically provided positioning grooves (3) on both sides. The inner sides of the two arc plates (22) are fixedly installed with positioning blocks (24), and each positioning block (24) is inserted into the positioning groove (3).

5. The coating apparatus for wafer processing as described in claim 1, characterized in that: Each of the protective components (2) is designed in a semi-circular shape, and the two grooves (21) close to form a semi-enclosed protective structure.

6. The coating apparatus for wafer processing as described in claim 3, characterized in that: A support arm (14) is fixedly installed on the base (12), the adhesive application assembly (5) is installed on the support arm (14), and the rotating adsorption disk (11) is located in two grooves (21).

Images