Analog heating test module and cooling effect testing device
By integrating the simulated heat generation test module and cooling effect test device, the problem that existing liquid cooling test devices cannot simulate multi-chip collaborative work and adapt to standard server chassis has been solved. This achieves high-precision, compact liquid cooling test, supports multi-chip collaborative work and rapid replacement and expansion.
Patent Information
- Application Number
- CN202520941370.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-14
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-05-14
AI Technical Summary
Existing liquid cooling test equipment cannot simultaneously simulate multi-chip collaborative working scenarios. The separate design of the heat source module and the cold plate results in a large size, and the operation of the cooling circuit is cumbersome, making it difficult to adapt to standard server chassis.
The integrated design of the simulated heating test module includes CPU and GPU simulated heating blocks, cold plates are attached to the heating elements, the coolant flow channels are equipped with spade teeth, the main pipe and water circuit connectors adopt a standardized design to support quick replacement and expansion, and the cooling circuit adopts a distributed connection.
It achieves high-precision, compact liquid-cooled testing, supports multi-chip collaborative working scenarios, is compatible with standard server chassis, and improves testing efficiency and security.
Smart Images
Figure CN224682644U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of server liquid cooling technology, specifically to a simulated heat generation test module and a cooling effect test device. Background Technology
[0002] With the widespread application of high-power chips (such as GPUs and CPUs) in data centers and artificial intelligence, traditional air cooling can no longer meet their high heat flux density cooling requirements, and liquid cooling technology is gradually becoming the mainstream solution. However, the performance verification of liquid cooling systems relies on high-precision and high-reliability testing equipment.
[0003] In existing technologies, liquid cooling test devices often have the following problems: traditional test devices can only simulate the heat generation of a single type of chip (such as CPU or GPU) and cannot simultaneously cover multi-chip collaborative working scenarios; the heat source module and cold plate are designed separately, resulting in a large test system size that is difficult to adapt to standard server chassis; the cooling circuit uses fixed pipe connections, making it cumbersome to replace components or adjust the test configuration.
[0004] Therefore, there is an urgent need for an integrated, high-precision, and flexibly expandable liquid cooling test device to accurately verify the heat dissipation performance of liquid cooling systems. Utility Model Content
[0005] To overcome the shortcomings of the prior art, this utility model provides a simulated heating test module and a cooling effect test device, which has the advantages of integrating multiple analog chips, compact structure, and easy replacement and debugging.
[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: A simulated heat generation testing module includes a chassis, which is a standard server chassis, and components integrated and installed within the chassis: A heat source module, comprising several heating elements, including a CPU-simulated heating block and a GPU-simulated heating block; Temperature sensors are used to detect the temperature of heating elements; The liquid cooling module includes a cold plate corresponding to each heating element. The cold plate is attached to the surface of the heating element, and each cold plate has a coolant flow channel. A pair of main pipes, one for liquid inlet and one for liquid outlet, are connected to the coolant flow channel inside the cold plate. The chassis is equipped with water connectors that are connected to the pair of main pipes respectively.
[0007] Furthermore, in the simulated heating test module of this application, the heat source module includes a bottom shell and a cover plate. The bottom shell has a cavity with one end open, and the cover plate covers the open end of the bottom shell. The heating element is installed in the cavity of the bottom shell, and a pad is provided between the heating element and the bottom plate of the bottom shell.
[0008] Furthermore, in the simulated heating test module of this application, the water circuit connector is located at one end of the chassis, the water circuit connector is a UQD04 connector, and a set of power connectors is provided at the end of the chassis away from the water circuit connector, the power connectors being electrically connected to the heating element.
[0009] Furthermore, in the simulated heating test module of this application, each heat source module includes a CPU simulated heating block and a pair of GPU simulated heating blocks; The cold plate corresponding to the CPU simulation heating block is provided with a pair of first flow channel pipes that connect to the internal coolant flow channels. The pair of first flow channel pipes are respectively connected to the coolant flow channels in the cold plates corresponding to a pair of GPU simulation heating blocks. It also includes a T-connector, which is connected to the coolant flow channels in the cold plates corresponding to a pair of GPU simulation heating blocks. The coolant flow channels in the cold plates corresponding to the CPU simulation heating block and the T-connector are respectively connected to a pair of main pipes through pipelines. The heat source modules are set in pairs.
[0010] Furthermore, in the simulated heating test module of this application, a pair of GPU simulated heating blocks are arranged in each heat source module, a three-way connector is located between the pair of GPU simulated heating blocks, a CPU simulated heating block is located on the side of the pair of GPU simulated heating blocks perpendicular to the arrangement direction, and the pair of heat source modules are arranged in the same direction as the pair of GPU simulated heating blocks inside.
[0011] A cooling effect testing device includes a simulated heat generation testing module and an integrated cabinet. Several simulated heat generation testing modules are arranged longitudinally in the integrated cabinet. A pair of water distributors are provided on the integrated cabinet. The water distributors are located on one side of the integrated cabinet and have water distributor inlets that are connected to water circuit connectors.
[0012] Furthermore, in this application, a cooling effect testing device is provided with a controller in an integrated cabinet. The controller includes a power control module and a temperature monitoring module. The temperature monitoring module is communicatively connected to the temperature sensors in each cabinet to monitor the temperature of each heating element in real time. The power control module is electrically connected to the heating elements in the simulated heating test module to control the power on or off of each heating element.
[0013] Furthermore, in a cooling effect testing device of this application, the number of simulated heating test modules ranges from 1 to 18, and it also includes a power distribution unit. The power distribution unit is electrically connected between the power control module and the heating element. The power control module controls the power distribution unit to perform power-on or power-off of each heating element.
[0014] Furthermore, the cooling effect testing device in this application also includes a flow controller, which includes a flow monitoring sensor and a flow control valve. The flow monitoring sensor is used to monitor the flow rate of coolant in the flow channel. The flow channel is connected to or located in the water distributor. The flow control valve is connected to the flow channel.
[0015] Furthermore, in the cooling effect testing device of this application, the flow controller also includes a cabinet mounted on an integrated cabinet, with a pipe body connected to the water distributor fixed inside the cabinet, and a flow monitoring sensor and a flow control valve mounted on the pipe body.
[0016] As can be seen from the above technical solution, this utility model has the following beneficial effects: This invention provides a simulated heat generation testing module and a cooling effect testing device. Through a highly integrated chassis design, multi-type heat source simulation capabilities, and a modular liquid cooling circuit, it solves the problems of large size, low accuracy, and poor flexibility in existing testing devices. It provides an efficient, reliable, and easily expandable verification solution for high-power chip liquid cooling systems. Its technical effects directly contribute to the optimization of chip heat dissipation performance and the iterative upgrade of data center liquid cooling technology. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of a simulated heat generation test module according to Embodiment 1 of this application; Figure 2 This is an exploded view of the components corresponding to the heating element and cold plate in a simulated heating test module according to Embodiment 1 of this application; Figure 3 for Figure 1 A schematic diagram of the internal structure of the simulated heating test module; Figure 4 This is a schematic diagram of a cooling effect testing device according to Embodiment 2 of this application; Figure 5 This is an exploded schematic diagram of the components of a cooling effect testing device according to Embodiment 2 of this application; Figure 6 This is a schematic diagram of the flow controller in Embodiment 2 of this application.
[0018] In the diagram: 1-Heat source module; 11-CPU simulated heating block; 12-GPU simulated heating block; 21-Cold plate; 22-First flow channel pipe; 23-T-connector; 3-Main pipe; 4-Chassis; 41-Bottom shell; 42-Cover plate; 43-Padded block; 44-Water circuit connector; 45-Power connector; 5-Integrated cabinet; 51-Water distributor; 6-Controller; 61-Power distribution unit; 7-Flow controller; 71-Flow monitoring sensor; 72-Flow control valve; 73-Box; 74-Pipe body. Detailed Implementation
[0019] A simulated heat generation test module includes a chassis 4, which is a standard server chassis, and components integrated and installed within the chassis 4: Heat source module 1 includes several heating elements, including CPU simulation heating block 11 and GPU simulation heating block 12; used to simulate the heat generation of GB200 GPU and CPU.
[0020] A temperature sensor is used to detect the temperature of the heating element. In this embodiment, the temperature sensor is a T-type thermocouple (TT-T-36, monitoring range -200~260℃) to monitor the temperature in real time and achieve high-precision control of the temperature difference in the heating area ≤2°C.
[0021] The liquid cooling module includes a cold plate 21 corresponding to each heating element. The cold plate 21 is attached to the surface of the heating element, and each cold plate 21 is provided with a coolant flow channel. A pair of main pipes 3, which are respectively the inlet pipe and the outlet pipe, are connected to the coolant flow channel in the cold plate 21. The chassis 4 is provided with water connectors 44 that are connected to the pair of main pipes 3 respectively.
[0022] Based on the above structure, the principle of the device is as follows: Chassis 4 is a standard server chassis, thus maintaining consistency with the installation and operation environment of the server chips. The CPU simulated heating block 11 and GPU simulated heating block 12 respectively simulate the heat sources of the CPU and GPU within the server. The liquid cooling module cools the heating elements through the cold plate 21. Coolant flows from the inlet pipe into the coolant channel of the cold plate 21 and then flows out from the outlet pipe. The water connector 44 is used to connect to external pipes. Temperature sensors detect the temperature of the heating elements to monitor the temperature of each heating element in real time. This can simulate the heat generation of the CPU and GPU and verify the cooling effect of the server cooling system on the CPU and GPU within the server, thus avoiding damage to the chips due to insufficient cooling system stability. In this embodiment, the coolant channel within the cold plate 21 is equipped with spade-like teeth to improve heat dissipation. Chassis 4 is a 1U chassis. By integrating the heat source module, cold plate, and cooling circuit into a standard server chassis (1U size), this device achieves a compact design. Weighing only 15kg, it can be directly deployed in a data center rack without additional environmental modifications. The standardized design of the water circuit connectors (such as UQD04) and main pipes (inlet / outlet pipes) enables seamless integration with existing liquid cooling systems and adaptability to real-world application scenarios.
[0023] In this embodiment, the heating element is made of aluminum nitride, and the cold plate 21 is made of copper. In this embodiment, the cold plate 21 is fixed to the heating element with screws.
[0024] In this embodiment, the heat source module 1 includes a bottom shell 41 and a cover plate 42. The bottom shell 41 has a cavity with one end open. The cover plate 42 covers the open end of the bottom shell 41. The heating element is installed in the cavity of the bottom shell 41. A pad 43 is provided between the heating element and the bottom plate of the bottom shell 41.
[0025] In this embodiment, the water connector 44 is located at one end of the chassis 4. The water connector 44 is a UQD04 connector. A set of power connectors 45 is located at the end of the chassis 4 furthest from the water connector 44, and the power connectors 45 are electrically connected to the heating element. The cooling circuit uses a quick-plug interface (such as a UQD04 floating head connector) and spring screws for fixation, supporting rapid replacement and expansion of the liquid cooling module. For example, the cold plate is fixed with four M3 screws, reducing disassembly and assembly time to minutes, significantly improving testing efficiency. The connection method between the main pipe and the distributed cold plate allows for flexible adjustment of the test configuration to adapt to different chip layout scenarios. The water and power connectors are located at opposite ends of the chassis 4, achieving effective water and electricity isolation and improving safety. The chassis 4 also has a communication port for telecommunication connection to sensors inside the chassis (such as temperature sensors and leakage detection sensors).
[0026] In this embodiment, each heat source module 1 includes a CPU simulated heating block 11 and a pair of GPU simulated heating blocks 12; A pair of first flow channel pipes 22, connected to the internal coolant flow channels, are provided on the cold plate 21 corresponding to the CPU simulation heating block 11. These first flow channel pipes 22 are respectively connected to the coolant flow channels within the cold plate 21 corresponding to a pair of GPU simulation heating blocks 12. A three-way connector 23 is also included, connected to the coolant flow channels within the cold plate 21 corresponding to the pair of GPU simulation heating blocks 12. The coolant flow channels within the cold plate 21 corresponding to the CPU simulation heating block 11 and the three-way connector 23 are respectively connected to a pair of main pipes 3 via pipes. The heat source modules 1 are arranged in pairs to ensure uniform cooling. The heat source module includes independent CPU simulation heating blocks (400W×2) and GPU simulation heating blocks (1500W×4), capable of simultaneously simulating the mixed heat dissipation conditions of multiple types of chips in a server. During testing, the complex thermal field distribution when the GPU and CPU work together can be reproduced, meeting the testing requirements of high-power chipsets (total power 6.8kW). Therefore, it supports full-scenario testing from single chips (such as 400W CPU) to multi-chipsets (such as 4×1500W GPU + 2×400W CPU), covering needs such as chip R&D, data center liquid cooling verification, and long-term stability testing.
[0027] In this embodiment, a pair of GPU simulated heating blocks 12 are arranged in each heat source module 1, a three-way connector 23 is located between the pair of GPU simulated heating blocks 12, and a CPU simulated heating block 11 is located on one side of the pair of GPU simulated heating blocks 12 perpendicular to the arrangement direction. The pair of heat source modules 1 and the pair of GPU simulated heating blocks 12 inside them are arranged in the same direction. This has the advantage of a compact structure.
[0028] Example 2 This embodiment provides a cooling effect testing device, including the simulated heat generation testing module of Embodiment 1, and an integrated cabinet 5. Several simulated heat generation testing modules are arranged longitudinally within the integrated cabinet 5. A pair of water distributors 51 are provided on the integrated cabinet 5, located on one side of the integrated cabinet 5. Each water distributor 51 has a water distributor socket connected to a water circuit connector 44. Based on this structure, the chassis 4 is placed in the cabinet 5. Each pair of water circuit connectors 44 on each chassis 4 is plugged into the water distributor sockets on the pair of water distributors 51, offering the advantage of convenient connection. The water distributors 51 are connected to the coolant source and are blind-plug water distributors.
[0029] In this embodiment, the integrated cabinet 5 is equipped with a controller 6, which includes a power control module and a temperature monitoring module. The temperature monitoring module is communicatively connected to the temperature sensors in each chassis 4 to monitor the temperature of each heating element in real time. The power control module is electrically connected to the heating elements in the simulated heating test module to control the power supply or de-energization of each heating element. If the temperature monitoring module detects that the temperature of a heating element is too high, the power control module will cut off the power to the corresponding heating element, thus providing power-off protection. The controller 6 is connected to the communication port on the chassis via a wire to obtain signals from the sensors inside the chassis. In one embodiment, a leakage detection sensor is installed inside the chassis. The controller 6 includes a leakage detection module, which receives the monitoring signal sent by the leakage detection sensor in real time. If the received signal corresponds to a leakage status, the power supply to the corresponding simulated heating test module is cut off through the power control module.
[0030] In this embodiment, the integrated cabinet 5 is an ORV3 cabinet.
[0031] In this embodiment, the number of simulated heating test modules ranges from 1 to 18, and it also includes a power distribution unit 61 (PDU). The power distribution unit 61 is electrically connected between the power control module and the heating elements. The power control module controls the power distribution unit 61 to perform power-on or power-off operations on each heating element. Specifically, the number of power distribution units 61 is 5. Specifically, the power distribution unit 61 is electrically connected to the power connector 45.
[0032] Furthermore, this embodiment also includes a flow controller 7, which includes a flow monitoring sensor 71 and a flow control valve 72. The flow monitoring sensor is used to monitor the coolant flow rate in the flow channel, which is connected to or located within the water distributor 51. The flow control valve 72 is connected to the flow channel. Specifically, the flow monitoring sensor 71 is a flow transmitter, and the flow control valve 72 is an electric ball valve. When the system detects an abnormal coolant flow rate through the flow monitoring sensor, it automatically shuts down all heating modules via the power control module to protect the safe operation of the 18 TTV simulated heating modules. The flow control valve 72 is used to control the coolant flow rate passing through the simulated heating test module.
[0033] Furthermore, in this embodiment, the flow controller 7 also includes a housing 73 mounted on the integrated cabinet 5. A pipe 74 connected to the water distributor 51 is fixed inside the housing 73, and the flow monitoring sensor 71 and the flow control valve 72 are mounted on the pipe 74.
[0034] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on the explanation herein, those skilled in the art can conceive of other specific embodiments of this utility model without creative effort, and these embodiments will all fall within the scope of protection of this utility model.
Claims
1. A simulated heating test module, characterized in that, Includes a chassis (4), which is a standard server chassis, and components integrated and installed within the chassis (4): The heat source module (1) includes several heating elements, including a CPU simulated heating block (11) and a GPU simulated heating block (12). Temperature sensors are used to detect the temperature of heating elements; The liquid cooling module includes a cold plate (21) corresponding to each heating element. The cold plate (21) is attached to the surface of the heating element, and each cold plate (21) is provided with a coolant flow channel. A pair of main pipes (3) are respectively the inlet pipe and the outlet pipe. The pair of main pipes (3) are connected to the coolant flow channel in the cold plate (21). The chassis (4) is provided with water connectors (44) that are connected to the pair of main pipes (3).
2. The simulated heating test module according to claim 1, characterized in that: The heat source module (1) includes a bottom shell (41) and a cover plate (42). The bottom shell (41) has a cavity with one end open. The cover plate (42) covers the open end of the bottom shell (41). The heating element is installed in the cavity of the bottom shell (41). A pad (43) is provided between the heating element and the bottom plate of the bottom shell (41).
3. The simulated heating test module according to claim 1, characterized in that: The water connector (44) is located at one end of the chassis (4). The water connector (44) is a UQD04 connector. A set of power connectors (45) is provided at the end of the chassis (4) away from the water connector (44). The power connectors (45) are electrically connected to the heating element.
4. The simulated heating test module according to claim 1, characterized in that: Each heat source module (1) includes a CPU-simulated heating block (11) and a pair of GPU-simulated heating blocks (12); A pair of first flow channel pipes (22) are provided on the cold plate (21) corresponding to the CPU simulation heating block (11) to connect the internal coolant flow channels. The pair of first flow channel pipes (22) are respectively connected to the coolant flow channels in the cold plate (21) corresponding to the pair of GPU simulation heating blocks (12). The cold plate (23) also includes a three-way connector (23), which is connected to the coolant flow channels in the cold plate (21) corresponding to the pair of GPU simulation heating blocks (12). The coolant flow channels in the cold plate (21) corresponding to the CPU simulation heating block (11) and the three-way connector (23) are respectively connected to a pair of main pipes (3) through pipelines. The heat source modules (1) are set in pairs.
5. The simulated heating test module according to claim 4, characterized in that: In each heat source module (1), a pair of GPU analog heating blocks (12) are arranged in a row. A three-way connector (23) is located between the pair of GPU analog heating blocks (12). A CPU analog heating block (11) is located on one side of the pair of GPU analog heating blocks (12) perpendicular to the arrangement direction. The pair of heat source modules (1) are arranged in the same direction as the pair of GPU analog heating blocks (12) inside.
6. A cooling effect testing device, characterized in that: The system includes the simulated heating test module as described in claim 1, and also includes an integrated cabinet (5). Several simulated heating test modules are arranged longitudinally in the integrated cabinet (5). A pair of water distributors (51) are provided on the integrated cabinet (5). The water distributors (51) are located on one side of the integrated cabinet (5). The water distributors (51) are provided with a water distributor socket connected to the water circuit connector (44).
7. The cooling effect testing device according to claim 6, characterized in that: The integrated cabinet (5) is equipped with a controller (6), which includes a power control module and a temperature monitoring module. The temperature monitoring module is connected to the temperature sensor in each chassis (4) to monitor the temperature of each heating element in real time. The power control module is electrically connected to the heating element in the simulated heating test module to control the power on or off of each heating element.
8. The cooling effect testing device according to claim 7, characterized in that: The number of simulated heating test modules ranges from 1 to 18, and also includes a power distribution unit (61). The power distribution unit (61) is electrically connected between the power control module and the heating element. The power control module controls the power distribution unit (61) to perform power-on or power-off of each heating element.
9. A cooling effect testing device according to claim 6, characterized in that: It also includes a flow controller (7), which includes a flow monitoring sensor (71) and a flow control valve (72). The flow monitoring sensor is used to monitor the flow rate of coolant in the flow channel. The flow channel is connected to or located in the water distributor (51). The flow control valve (72) is connected to the flow channel.
10. A cooling effect testing device according to claim 9, characterized in that: The flow controller (7) also includes a housing (73) installed on the integrated cabinet (5), and a pipe (74) connected to the water distributor (51) is fixed inside the housing (73). The flow monitoring sensor (71) and the flow control valve (72) are installed on the pipe (74).