nameplate identification

Abstract

The application provides a nameplate identification, which comprises a first base layer, a chip layer, a printing layer and a protective layer arranged in sequence. The bottom side of the first base layer is provided with a plurality of heat dissipation holes, the adjacent heat dissipation holes are communicated with each other, and at least one through hole is arranged at the edge of the first base layer and communicated with the heat dissipation holes. The chip layer is arranged on the upper side of the first base layer, and the chip layer comprises an NFC chip and a radio frequency coil, and the NFC chip is electrically connected with the radio frequency coil. The printing layer is arranged on the upper side of the chip layer, and the protective layer is arranged on the upper side of the printing layer. The nameplate identification provided by the application is provided with the heat dissipation holes arranged on the bottom side of the first base layer and the through holes communicated with the heat dissipation holes, so that the heat dissipation channels are formed on the first base layer, the heat accumulated in each layer can be quickly led out, the overall temperature of the nameplate identification is reduced, and the heat resistance of the nameplate identification is improved.

Description

Technical Field

[0001] This application relates to the field of information identification and marking technology, and in particular to a nameplate marking. Background Technology

[0002] In the inspection of wind turbine towers, accurate acquisition of relevant equipment information is crucial for ensuring inspection quality and normal equipment operation and maintenance. Specifically, staff can use the built-in readers of mobile phones and other electronic devices to quickly verify nameplate markings and efficiently obtain detailed information about the wind turbine equipment, such as model number, manufacturer, production date, technical parameters, and maintenance records. This method greatly simplifies the traditional manual recording and information retrieval process, significantly improving the efficiency of inspection work.

[0003] However, in practical applications, some wind turbine equipment is located in hot regions, and the high temperature environment will accelerate the aging process of the nameplate material, making the relevant markings on the nameplate surface prone to failure, thereby shortening the service life of the nameplate. Utility Model Content

[0004] This application provides a nameplate marking that improves the heat resistance of the nameplate marking.

[0005] This application provides a nameplate identifier, including:

[0006] The first base layer has a plurality of heat dissipation holes on its bottom side, adjacent heat dissipation holes are interconnected, and the first base layer has at least one through hole on its edge, the through hole being connected to the heat dissipation holes;

[0007] A chip layer is disposed on the upper side of the first base layer. The chip layer includes an NFC chip and a radio frequency coil, and the NFC chip is electrically connected to the radio frequency coil.

[0008] A printed layer is disposed on the upper side of the chip layer;

[0009] A protective layer is disposed on the upper side of the printed layer.

[0010] In one possible implementation, the first base layer is a plate-like structure made of polyvinyl chloride material, and the first base layer includes silica particles.

[0011] In one possible implementation, the depth of the heat dissipation hole is at least one-fifth of the thickness of the first base layer.

[0012] In one possible implementation, the adjacent heat dissipation holes are spaced apart by a distance of 2-3 mm; and / or, the heat dissipation holes are regular hexagons, and the side length of the heat dissipation holes is 1-1.5 mm.

[0013] In one possible implementation, a ferrite isolation layer is provided between the first base layer and the chip layer.

[0014] In one possible implementation, the chip layer is bonded to the ferrite isolation layer using conductive silver paste.

[0015] In one possible implementation, the protective layer is bonded to the printed layer with transparent adhesive; and / or, the first base layer is bonded to the ferrite isolation layer with structural adhesive.

[0016] In one possible implementation, a second base layer is provided between the chip layer and the printed layer, the second base layer being a plate-like structure made of polyvinyl chloride material.

[0017] In one possible implementation, the protective layer is a thin film made of polyurethane material with a thickness of 0.15-0.25 mm.

[0018] In one possible implementation, the nameplate markings further include:

[0019] Nameplate body;

[0020] The edge banding is provided around the nameplate body and is a plate-shaped structure made of the same material as the first base layer.

[0021] The nameplate provided in this application provides a heat dissipation channel on the first base layer by setting heat dissipation holes and through holes communicating with the heat dissipation holes on the bottom side of the first base layer. This facilitates the rapid dissipation of heat accumulated in each layer, reduces the overall temperature of the nameplate, and improves the heat resistance of the nameplate. This allows the nameplate to effectively resist aging in high-temperature environments in hot regions, significantly extends its service life, and reduces the replacement frequency and cost of the nameplate. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0023] Figure 1 A structural schematic diagram of the nameplate markings provided in this application;

[0024] Figure 2 A schematic diagram of the printed layer of the nameplate markings provided in this application;

[0025] Figure 3 Another structural diagram of the nameplate marking provided in this application.

[0026] Figure label:

[0027] 10-First base layer, 11-Heat dissipation hole, 12-Through hole, 20-Chip layer, 30-Printed layer, 40-Protective layer, 50-Ferrite isolation layer, 60-Second base layer;

[0028] 100 - Nameplate body; 110 - Edge sealing.

[0029] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0030] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0031] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in a sequence other than those illustrated or described herein.

[0032] In this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner. First, the terms involved in this application are explained:

[0033] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0034] Please see Figure 1 This application provides a nameplate, which includes a first base layer 10, a chip layer 20, a printed layer 30 and a protective layer 40 arranged sequentially.

[0035] The bottom side of the first base layer 10 is provided with a plurality of heat dissipation holes 11, and adjacent heat dissipation holes 11 are interconnected. The edge of the first base layer 10 is provided with at least one through hole 12, which is connected to the heat dissipation holes 11.

[0036] The first base layer 10 serves as the basic support structure for the entire nameplate. The heat dissipation holes 11 on the bottom side of the first base layer 10 increase the contact area between the first base layer 10 and the outside air. When the nameplate is in a high-temperature environment, heat can be exchanged with the air through the heat dissipation holes 11 and dissipated to the outside, which helps to reduce the accumulation of heat on the first base layer 10.

[0037] Adjacent heat dissipation holes 11 can be interconnected through gaps or through holes, and through holes 12 are open to the external environment. Heat dissipation holes 11 and through holes 12 can form a heat dissipation channel. When heat is transferred to the first base layer 10, some of the heat is dissipated through the heat dissipation holes 11 and through holes 12. At this time, outside air can enter through through holes 12 and flow in the gaps or through holes between adjacent heat dissipation holes 11. During the flow, a large amount of heat is carried away, realizing convective heat dissipation, which helps to improve the heat dissipation efficiency of the first base layer 10 and cools the upper structure of the first base layer 10.

[0038] The chip layer 20 is disposed on the upper side of the first base layer 10. The chip layer 20 includes an NFC chip and an RF coil. The NFC chip and the RF coil are electrically connected. The printed layer 30 is disposed on the upper side of the chip layer 20, and the protective layer 40 is disposed on the upper side of the printed layer 30.

[0039] It should be noted that the NFC chip can store wind turbine equipment information, which can be quickly read by readers of electronic devices such as mobile phones. Specifically, the NFC chip is electrically connected to an RF coil, allowing it to communicate with the NFC reader in mobile phones and other electronic devices, thus enabling information exchange. The stored wind turbine equipment information can include the manufacturer, production date, maintenance records, etc.

[0040] Please see Figure 2 The printing layer 30 can be used to print equipment information, QR codes, coded numbers, coded letters, coded graphics, etc. It can have multiple printing areas on its plane, and each printing area can print different information or patterns. For example, the printing layer 30 can be drawn with patterns, text, or codes using laser-etched anti-stain ink, or patterns, text, or codes can be set on the surface of the printing layer 30 using processes such as heat transfer, engraving, and hot stamping.

[0041] The protective layer 40 can block the direct baking of the printing layer 30 and the chip layer 20 by the high temperature of the outside, resist the aging effect of ultraviolet rays on the QR code and the chip, and prevent the intrusion of corrosive media such as dust and moisture, thus providing a stable working environment for the printing layer 30 and the chip layer 20.

[0042] The nameplate provided in this embodiment forms a heat dissipation channel on the lower side of the first base layer 10 by setting heat dissipation holes 11 and through holes 12 communicating with the heat dissipation holes 11. This facilitates the rapid dissipation of heat accumulated in each layer, reduces the overall temperature of the nameplate, and improves the heat resistance of the nameplate. This allows the nameplate to effectively resist aging in high-temperature environments in hot regions, significantly extends its service life, and reduces the replacement frequency and cost of the nameplate.

[0043] In addition, the nameplate markings in this embodiment can also achieve dual data interaction of scanning and near-field communication through the QR code on the printed layer 30 and the NFC chip on the chip layer 20, which helps to improve the convenience of device information identification.

[0044] For example, the nameplate in this embodiment can also achieve dual anti-counterfeiting or key authentication through the NFC chip and the QR code on the printed layer 30. For example, maintenance personnel can scan the QR code on the printed layer 30 to obtain the device's public key and encrypted basic information, such as model number and last maintenance time, thereby verifying the device's identity; then, by touching the NFC chip, the NFC chip returns a dynamic session key and encrypted real-time operating data, such as temperature and vibration parameters. The terminal device uses the session key to decrypt the data and verifies the chip's digital signature using the public key to ensure the data has not been tampered with. When the data is uploaded to the cloud, it is simultaneously written to the blockchain, forming an immutable audit record.

[0045] In one possible implementation, the first base layer 10 is a plate-like structure made of polyvinyl chloride material, and the first base layer 10 includes silica particles.

[0046] Polyvinyl chloride (PVC) material has good high temperature resistance and mechanical strength, and can maintain structural stability at high ambient temperatures in hot regions, meeting the support requirements for the upper chip layer 20 and printed layer 30; at the same time, it has strong chemical stability and is not easily corroded by common corrosive media, making it suitable for the complex environment of outdoor wind turbine equipment.

[0047] The exemplary silica particles are nanoscale. Nanoscale silica particles can be uniformly embedded in the gaps between polyvinyl chloride molecular chains to form physical support, enhance the tensile and crack resistance of the base layer, and reduce the internal stress caused by thermal expansion and contraction under high temperature conditions.

[0048] Therefore, in this embodiment, silica particles are placed inside the first base layer 10, which helps to reduce the thermal oxidation rate of the material at high temperatures.

[0049] In one possible implementation, the depth of the heat dissipation hole 11 is at least one-fifth of the thickness of the first base layer 10.

[0050] The depth of the heat dissipation holes 11 needs to balance heat dissipation efficiency and the structural strength of the first base layer 10. If the hole depth is less than one-fifth of the thickness, the heat conduction path inside the base layer is short, making it difficult to effectively dissipate heat through the heat dissipation holes 11. Especially in high-temperature environments, heat is prone to accumulate inside the base layer, weakening the heat dissipation effect. On the other hand, controlling the hole depth to at least one-fifth of the thickness can form a sufficiently long heat dissipation channel, allowing the heat inside the nameplate to be dissipated to the outside through the heat dissipation channel. At the same time, it avoids the decrease in the mechanical strength of the base layer due to excessive hole depth, ensuring the stability of the first base layer 10 when supporting the upper structure.

[0051] For example, the depth of the heat dissipation hole 11 is one-half, one-third, one-quarter, or any two of the thickness of the first base layer 10.

[0052] In one possible implementation, adjacent heat dissipation holes 11 are spaced apart by a distance of 2-3 mm.

[0053] Setting the spacing between adjacent heat dissipation holes 11 to 2-3mm ensures sufficient structural material while maintaining the number of holes 11, allowing the substrate to maintain its mechanical properties under long-term high-temperature conditions. If the spacing is less than 2mm, the dense distribution of heat dissipation holes 11 will result in insufficient remaining material between the holes, reducing the tensile and bending resistance of the substrate and making it prone to cracking under the effects of thermal expansion and contraction at high temperatures. If the spacing is greater than 3mm, the number of heat dissipation holes 11 will decrease, resulting in insufficient heat dissipation channels per unit area, making it impossible to form a dense convection heat dissipation network and affecting the overall heat dissipation efficiency.

[0054] In one possible implementation, the heat dissipation hole 11 is a regular hexagon, and the side length of the heat dissipation hole 11 is 1-1.5mm.

[0055] The hexagonal heat dissipation holes 11 can be arranged more closely, that is, more heat dissipation holes 11 can be accommodated in the same area. Compared with circles or squares, the gaps between the holes are smaller, which can maximize the use of the base surface space and increase the heat dissipation contact area.

[0056] In one possible implementation, a ferrite isolation layer 50 is provided between the first base layer 10 and the chip layer 20.

[0057] The ferrite isolation layer can limit the outward diffusion of the electromagnetic field generated by the chip itself, reduce mutual interference with the external electromagnetic environment, and at the same time avoid the influence of metal impurities that may be contained in the first base layer 10 on the NFC magnetic field distribution, ensuring the stability of the electromagnetic coupling strength between the chip and the reading and writing device, and improving the accuracy of information interaction.

[0058] Meanwhile, ferrite materials have high magnetic permeability, which can absorb high-frequency electromagnetic energy from the outside through hysteresis loss, forming an electromagnetic barrier to prevent external electromagnetic fields from penetrating to the chip layer 20.

[0059] Therefore, in this embodiment, a ferrite isolation layer 50 is provided between the first base layer 10 and the chip layer 20, which helps to ensure the stability of NFC chip communication and the accuracy of data transmission.

[0060] For example, the ferrite isolation layer 50 is a thin sheet structure with a thickness of 0.1-0.3 mm, made of manganese zinc ferrite or nickel zinc ferrite material, and is tightly bonded to the upper side of the first base layer 10 and the lower side of the chip layer 20 by a high temperature resistant adhesive, completely covering the projection area of ​​the chip layer 20.

[0061] In one possible implementation, the chip layer 20 is bonded to the ferrite isolation layer 50 by conductive silver paste.

[0062] The conductivity of the conductive silver paste reduces the contact resistance between the chip layer 20 and the ferrite isolation layer 50, thereby reducing signal transmission loss. The ferrite isolation layer 50 itself has anti-electromagnetic interference properties, while the conductive path formed by the conductive silver paste can cooperate with the NFC signal transmission of the chip layer 20 to ensure the communication stability between the chip and external reading and writing devices in complex electromagnetic environments, such as electromagnetic interference during the operation of wind turbine equipment.

[0063] Meanwhile, the conductive silver paste has excellent bonding strength and can maintain stable bonding performance in high-temperature environments. It can firmly bond the chip layer 20 and the ferrite isolation layer 50, avoiding separation caused by stress due to thermal expansion and contraction, and ensuring the integrity of the interlayer structure.

[0064] In one possible implementation, the protective layer 40 is bonded to the printed layer 30 with transparent adhesive; the first base layer 10 is bonded to the ferrite isolation layer 50 with structural adhesive.

[0065] The transparent adhesive tightly bonds the protective layer 40 to the printed layer 30, forming a continuous sealed interface that prevents moisture, dust, and other impurities from penetrating the printed layer 30 and avoids the QR code from becoming invalid due to contamination. In addition, the transparent adhesive can alleviate the stress caused by the thermal expansion and contraction of the materials in each layer under high temperature conditions, reduce the risk of interface cracking, and further ensure the structural integrity of the printed layer 30.

[0066] For example, the transparent adhesive is a high-temperature resistant, high-transmittance silicone-based adhesive, which has good light transmittance and will not obstruct or interfere with the QR code recognition of the printed layer 30.

[0067] The structural adhesive has excellent temperature resistance and chemical stability. It is not easily degraded under high temperature and ultraviolet radiation and can maintain long-term bonding strength. At the same time, the adhesive layer formed after curing has a certain buffering performance, which can absorb the slight vibration generated by the operation of the fan equipment, prevent the ferrite isolation layer 50 from rubbing against the first base layer 10 due to vibration, ensure the stability of its electromagnetic shielding function, and indirectly ensure the signal transmission quality of the chip layer 20.

[0068] For example, the structural adhesive is an epoxy-based high-strength adhesive, which has good tensile and shear strength, and can meet the rigid connection requirements between the first base layer 10 and the ferrite isolation layer 50, ensuring that the ferrite isolation layer 50 will not shift or fall off during long-term use.

[0069] In one possible implementation, a second base layer 60 is provided between the chip layer 20 and the printed layer 30, and the second base layer 60 is a plate-like structure made of polyvinyl chloride material.

[0070] The second base layer 60 can serve as a physical isolation carrier between the chip layer 20 and the printed layer 30, preventing the electronic components of the chip layer 20 from making physical contact and friction with the QR code of the printed layer 30, thus providing bidirectional protection.

[0071] The insulating properties of polyvinyl chloride (PVC) can block electrostatic conduction between the chip layer 20 and the printed layer 30, preventing electrostatic interference with the NFC chip's signal and ensuring the stability of chip data reading and writing. Simultaneously, its high-temperature resistance and anti-aging properties are compatible with the overall structure's weather resistance, ensuring that it will not delaminate due to aging in hot environments. It is understandable that the second base layer 60, like the first base layer 10, can incorporate silica particles to enhance its anti-aging properties.

[0072] Therefore, in this embodiment, the second base layer 60 improves the structural stability of the connection between the chip layer 20 and the printed layer 30, reduces the stress deformation caused by the difference in the coefficients of thermal expansion and contraction between the two layers, and, combined with the environmental adaptability of polyvinyl chloride material, further extends the overall service life of the nameplate marking in high-temperature environments, indirectly ensuring the long-term effective storage and recognition of NFC chip and QR code information.

[0073] In one possible implementation, the protective layer 40 is a thin film made of polyurethane material with a thickness of 0.15-0.25 mm.

[0074] Polyurethane film exhibits excellent high-temperature resistance, maintaining stable physical properties in environments above 80°C and is not prone to softening or cracking due to sustained high temperatures in hot regions. Simultaneously, the urethane groups in its molecular structure endow the material with good UV resistance, effectively blocking the aging effects of ultraviolet rays on the underlying printed layer 30, delaying the fading of QR code ink and substrate degradation. Furthermore, polyurethane material possesses high flexibility and elasticity, allowing the film to adhere tightly to the surface of the printed layer 30. Even when the nameplate undergoes slight deformation due to changes in ambient temperature, it maintains good sealing properties, preventing dust, moisture, and other corrosive media from penetrating the printed layer 30 and the chip layer 20.

[0075] Setting the film thickness to 0.15-0.25mm ensures that the film has sufficient mechanical strength and puncture resistance to effectively resist damage to the printing layer 30 from external physical friction or minor impacts; it also maintains high transparency so as not to obstruct or interfere with the optical recognition of the QR code on the printing layer 30, ensuring that the QR code information can be clearly read when scanned by mobile phones and other devices.

[0076] Therefore, the protective layer 40 made of polyurethane material in this embodiment can effectively block high temperature, ultraviolet rays and corrosive media in hot environments, while also taking into account lightweight, transparency and adhesion. It works in conjunction with the printed layer 30, the first base layer 10 and other structures to extend the overall life of the nameplate and ensure the stability of information recognition.

[0077] Please see Figure 3 In one possible implementation, the nameplate also includes a nameplate body 100 and an edge banding 110, the edge banding 110 being disposed around the nameplate body 100 and being a plate-like structure made of the same material as the first base layer 10.

[0078] The nameplate body 100 includes a first base layer 10, a chip layer 20, a printed layer 30, a protective layer 40, a ferrite isolation layer 50, and a second base layer 60 arranged sequentially. The edge seal 110 is arranged in a ring around the outer periphery of the nameplate body 100, and its cross-sectional shape is adapted to the cross-section of the edge of the nameplate body 100. It can be connected to the edge of the nameplate body 100 by integral molding or high-temperature welding process to form a complete integral structure.

[0079] The edge banding 110 is made of the same material as the first base layer 10, ensuring they have the same coefficient of thermal expansion. This prevents gaps or peeling caused by excessive thermal expansion and contraction between the edge banding 110 and the nameplate body 100 in hot environments, thus guaranteeing the stability of the overall structure and reducing the risk of edge cracking. Furthermore, the use of the same material facilitates processing and molding, allowing the edge banding 110 to be manufactured using the same processes as the first base layer 10, such as melt blending and cutting. This reduces manufacturing complexity and cost while ensuring the strength of the connection between the edge banding 110 and the nameplate body 100, enhancing the overall durability of the nameplate.

[0080] Furthermore, the edge sealing 110 has the same UV resistance and high temperature aging resistance as the first base layer 10, which can effectively block external high temperature, moisture and dust from intruding from the edge of the nameplate body 100.

[0081] Therefore, by using the same material as the first base layer 10 for the edge sealing 110, this embodiment helps to further improve the heat resistance and structural stability of the nameplate markings.

[0082] In some embodiments, the edge banding 110 is provided with mounting holes so that the nameplate can be fixedly mounted to the device exterior by fasteners.

[0083] Finally, it should be noted that other embodiments of this utility model will readily occur to those skilled in the art upon consideration of the specification and practice of the utility model disclosed herein. This utility model is intended to cover any variations, uses, or adaptations of this utility model that follow the general principles of this utility model and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this utility model is limited only by the appended claims.

Claims

1. A nameplate, characterized in that, include: A first base layer (10) is provided with a plurality of heat dissipation holes (11) on its bottom side, and adjacent heat dissipation holes (11) are interconnected. The first base layer (10) has at least one through hole (12) on its edge, and the through hole (12) is connected to the heat dissipation holes (11). A chip layer (20) is disposed on the upper side of the first base layer (10). The chip layer (20) includes an NFC chip and a radio frequency coil. The NFC chip is electrically connected to the radio frequency coil. A printed layer (30) is disposed on the upper side of the chip layer (20); A protective layer (40) is disposed on the upper side of the printed layer (30).

2. The nameplate marking according to claim 1, characterized in that, The first base layer (10) is a plate-shaped structure made of polyvinyl chloride material, and the first base layer (10) includes silica particles.

3. The nameplate marking according to claim 2, characterized in that, The depth of the heat dissipation hole (11) is at least one-fifth of the thickness of the first base layer (10).

4. The nameplate marking according to claim 2, characterized in that, The adjacent heat dissipation holes (11) are spaced apart, with a spacing of 2-3 mm; And / or, the heat dissipation hole (11) is a regular hexagon, and the side length of the heat dissipation hole (11) is 1-1.5mm.

5. The nameplate marking according to any one of claims 1 to 3, characterized in that, A ferrite isolation layer (50) is provided between the first base layer (10) and the chip layer (20).

6. The nameplate marking according to claim 5, characterized in that, The chip layer (20) and the ferrite isolation layer (50) are bonded together with conductive silver paste.

7. The nameplate marking according to claim 5, characterized in that, The protective layer (40) and the printed layer (30) are bonded together with transparent adhesive. And / or, the first base layer (10) is bonded to the ferrite isolation layer (50) by structural adhesive.

8. The nameplate marking according to claim 5, characterized in that, A second base layer (60) is provided between the chip layer (20) and the printed layer (30), and the second base layer (60) is a plate-shaped structure made of polyvinyl chloride material.

9. The nameplate marking according to claim 5, characterized in that, The protective layer (40) is a thin film made of polyurethane material, and the film thickness is 0.15-0.25 mm.

10. The nameplate marking according to claim 5, characterized in that, Also includes: Nameplate body (100); Edge sealing (110) is provided around the nameplate body (100), and the edge sealing (110) is a plate-shaped structure made of the same material as the first base layer (10).

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