Display module and electronic device

Abstract

The application provides a display module and an electronic device, and relates to the technical field of display. The display module comprises a display panel, a driving chip and a support structure. The display panel comprises a display part, a bending part and a binding part. The display part comprises a display surface. The binding part is located on the side of the display part away from the display surface. The bending part is connected between the display part and the binding part. The driving chip is electrically connected to the binding part, and the driving chip is located on the side of the binding part away from the display part. At least part of the support structure is stacked between the display part and the binding part. The support structure is provided with a cavity. At least part of the orthographic projection of the driving chip on the display surface is located in the orthographic projection of the cavity on the display surface. The cavity of the support structure can be used as a buffer space to absorb part of the impact force, so as to reduce the stress acting on the driving chip. The driving chip is not prone to breakage or wear, and the possibility of black screen of the display panel due to damage of the driving chip can be reduced.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display module and an electronic device. Background Technology

[0002] Currently, the trend is to achieve thinner and lighter electronic devices by thinning the layers of the light-transmitting cover plate of the display module. However, when the display module is squeezed or hit, the driver chip is prone to breakage under stress, which can cause the display panel to go black and affect its use. Utility Model Content

[0003] This application provides a display module and an electronic device. The cavity of the support structure can serve as a buffer space to absorb part of the impact force, thereby reducing the stress acting on the driver chip. The driver chip is less likely to break or wear, which can reduce the possibility of the display panel going black due to damage to the driver chip.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, this application provides a display module, which includes a display panel, a driver chip, and a support structure. The display panel includes a display part, a bending part, and a bonding part. The display part includes a display surface, the bonding part is located on the side of the display part opposite to the display surface, and the bending part connects the display part and the bonding part.

[0006] The driver chip can be used to implement the driving control functions of the display module. For example, the driver chip can control the generation and display process of images on the display panel. The driver chip is electrically connected to the bonding part and is located on the side of the bonding part facing away from the display part. This allows the traces of the display panel to be bent to the back side of the display panel, facilitating the electrical connection between the display panel and the circuit board via the bonding part. This not only reduces the difficulty of electrical connection between the display panel and the circuit board but also helps to reduce the bezel width of the display panel, thereby increasing the screen-to-body ratio.

[0007] At least a portion of the support structure is stacked between the display unit and the mounting unit. This stacking can be a part of the support structure or the entire support structure. The support structure provides support between the display unit and the mounting unit. Furthermore, the support structure can conform to the shape of the display unit, thus protecting it and reducing the likelihood of damage when the display module is subjected to impact, ensuring its normal operation.

[0008] The support structure has a cavity, and at least a portion of the orthographic projection of the driving chip on the display surface lies within the orthographic projection of the cavity onto the display surface. The cavity of the support structure can serve as a buffer space, providing a good buffering effect.

[0009] It should be understood that when the display module is subjected to pressure or collision, the buffer space can absorb some of the impact force to reduce the stress acting on the driver chip, thereby protecting the driver chip. The driver chip is less likely to break or wear, which can reduce the possibility of the display panel going black due to damage to the driver chip, thus ensuring the normal operation of the display module.

[0010] In addition, by setting cavities in the support structure to achieve buffering, not only is the buffering effect good, but the weight of the display module can also be reduced, which is beneficial to the lightweight design of electronic devices.

[0011] In some embodiments provided in the first aspect of this application, the orthographic projection of the driver chip on the display surface is entirely within the orthographic projection of the cavity on the display surface. This prevents scratches or wear on the driver chip from the sharp edges of the cavity, ensuring the normal function of the driver chip, even in the event of cavity deformation.

[0012] In some embodiments provided in the first aspect of this application, the minimum distance between the edge of the cavity's orthographic projection on the display surface and the edge of the driver chip's orthographic projection on the display surface is greater than or equal to 0.15 mm. It is worth noting that when the support structure deforms due to impact, the cavity will also deform accordingly. The edge of the cavity will gradually approach the driver chip due to deformation, and the sharp edges of the cavity edge may scratch or wear down the driver chip.

[0013] Therefore, by ensuring that the minimum distance between the edge of the cavity's orthographic projection on the display surface and the edge of the driver chip's orthographic projection on the display surface is greater than or equal to 0.15mm, the cavity and driver chip can be separated even if the cavity is deformed. This can better prevent the sharp edges of the cavity from scratching or wearing down the driver chip, thus ensuring the normal function of the driver chip.

[0014] In some embodiments provided in the first aspect of this application, the cross-sectional area of ​​the cavity gradually increases in the direction from the display portion to the bonding portion. For example, the cavity may be frustum-shaped, and the cross-section of the cavity may be polygonal.

[0015] It is understandable that the closer the cavity is to the driver chip, the larger the cross-sectional area of ​​the cavity. Correspondingly, the distance between the edge of the cavity's orthographic projection on the display surface and the edge of the driver chip's orthographic projection on the display surface is also larger. This can better protect the driver chip. When the support structure is deformed by impact force, the larger gap between the edge of the cavity and the driver chip can better avoid the sharp edges of the cavity scratching or wearing the driver chip, so as to ensure the normal function of the driver chip.

[0016] Furthermore, the cross-sectional area of ​​the cavity near the display portion can be smaller than that of the driver chip, while the cross-sectional area of ​​the cavity near the bonding portion can be larger than that of the driver chip. In this way, the cross-sectional area of ​​the cavity gradually increases from the display portion towards the bonding portion. This ensures a large distance between the cavity edge and the driver chip while minimizing the volume of the cavity cut into the support structure, thus guaranteeing the structural strength of the support structure.

[0017] Furthermore, the cavity has a smaller volume on the side closest to the light-transmitting cover, resulting in higher structural strength of the support structure, which in turn enhances the support strength of the support structure for the light-transmitting cover and the display unit.

[0018] In some embodiments provided in the first aspect of this application, the cross-sectional area of ​​the cavity remains constant in the direction from the display portion to the bonding portion. For example, the cavity may be cylindrical or prismatic, and its cross-section may be circular or polygonal in the direction from the display portion to the bonding portion. Since the cross-sectional area of ​​the cavity is always larger than that of the driver chip in the direction from the display portion to the bonding portion, the cavity can better protect the driver chip when the display module is subjected to impact, and the cavity will not compress or wear the driver chip due to deformation.

[0019] In some embodiments provided in the first aspect of this application, the support structure includes a first top surface and a first bottom surface facing away from each other, with the first top surface facing the display portion. A cavity penetrates at least one of the first top surface and the first bottom surface. It should be understood that the cavity may penetrate the first top surface; or, the cavity may penetrate the first bottom surface; or, the cavity may penetrate both the first top surface and the first bottom surface simultaneously. This cavity not only provides a buffering effect, reducing stress on the driver chip, but also allows for easy fabrication by creating cavities in both the first top surface and the first bottom surface.

[0020] In some embodiments provided in the first aspect of this application, the support structure includes a first top surface and a first bottom surface facing away from each other, with the first top surface facing the display portion. In the arrangement direction of the first top surface and the first bottom surface, both the first top surface and the first bottom surface are spaced apart from the inner wall surface of the cavity. It is understood that the cavity does not penetrate the first top surface or the first bottom surface, thus the areas where the first top surface and the first bottom surface are located still have high structural strength, providing strong support for the display portion and the mounting portion.

[0021] Therefore, by separating the first top surface and the first bottom surface from the inner wall of the cavity, the cavity can not only buffer the impact force acting on the display module and reduce the stress acting on the driver chip, but also ensure the support effect of the support structure on the display panel, thereby ensuring the structural strength of the display panel.

[0022] In some embodiments provided in the first aspect of this application, the support structure includes multiple stacked support layers, with cavities formed in at least one support layer. This allows for flexibility in selecting the location of the cavities based on needs and the characteristics of each support layer.

[0023] In some embodiments provided in the first aspect of this application, the support structure includes a back film layer, which includes a first back film and a second back film. The first back film is attached to the side of the display portion facing away from the display surface and provides support to the display portion, thereby enhancing the structural strength of the display portion. The second back film is attached to the side of the bonding portion facing the display portion and provides support to the bonding portion, thereby enhancing the structural strength of the bonding portion.

[0024] Therefore, the back film layer can support the display panel, enhancing its structural strength and facilitating transportation and sales. Furthermore, the back film layer can be adhered to the display panel before bending, and then it can be separated at the corresponding bending point to divide the back film layer into a first back film and a second back film before bending the display panel. This facilitates bending and helps reduce bending stress.

[0025] In some embodiments provided in the first aspect of this application, at least a portion of the cavity is formed on the first back film, so that the first back film can not only provide support for the display, but the cavity on the first back film can also absorb part of the impact force to protect the driver chip, and facilitate the processing of the cavity on the first back film.

[0026] At least a portion of the cavity is formed on the second back film, so that the second back film can not only provide support for the bonding portion and enhance the structural strength of the bonding portion, thus protecting the driver chip; the cavity on the second back film can absorb part of the impact force to enhance the protection of the driver chip, and facilitate the processing of the cavity on the second back film.

[0027] At least a portion of the cavity is formed on the first back film, and at least a portion of the cavity is formed on the second back film. In this way, the back film layer can not only provide support for the display panel, but the cavities on the first and second back films can also absorb some of the impact force to protect the driver chip, reduce the stress acting on the driver chip, and facilitate the processing of cavities on the back film layer.

[0028] In some embodiments provided in the first aspect of this application, the support structure includes a composite film layer, at least a portion of which is stacked between a first back film and a second back film. The composite film layer includes a buffer layer and a conductive layer stacked together, the buffer layer being disposed on the side of the first back film opposite to the display portion, and the conductive layer being disposed on the side of the buffer layer opposite to the first back film.

[0029] The buffer layer acts as a shock absorber, improving the display module's impact resistance. This buffer layer can be made of cushioning foam or silicone. The conductive layer can be a metal layer; for example, it could be a copper foil layer. Thus, the conductive layer not only dissipates heat, improving the display module's heat dissipation capacity, but it also helps release static electricity.

[0030] At least a portion of the cavity is formed in the composite film layer. Alternatively, at least a portion of the cavity is formed in the buffer layer; or, at least a portion of the cavity is formed in the conductive layer; or, a portion of the cavity is formed in the buffer layer, and other portions of the cavity are formed in the conductive layer.

[0031] It should be understood that the conductive layer is usually a metal layer, which is difficult for light to pass through. By creating cavities in the conductive layer, not only can it have a buffering effect, but it can also facilitate the transmission of light.

[0032] In this way, at least part of the cavity is formed in the composite film layer, which can not only buffer the impact force acting on the display module and reduce the stress acting on the driver chip, but also facilitate light transmission.

[0033] In some embodiments provided in the first aspect of this application, the support structure includes a padding layer, which is at least partially stacked between the composite film layer and the second back film. Exemplarily, the padding layer may be located between the conductive layer of the composite film layer and the second back film.

[0034] The support structure acts as a support between the display section and the bonding section, ensuring the spacing between them and thus guaranteeing the bending radius of the bent section. Understandably, due to bending stress, if the bending radius of the display panel is too small, the film layer at the bent section is prone to cracking or peeling. The support structure between the display section and the bonding section ensures the bending radius of the display panel, reduces bending stress, and lowers the risk of cracking and film peeling.

[0035] At least a portion of the cavity is formed in the padding layer, which not only buffers the impact force acting on the display module and reduces the stress on the driver chip, but also ensures the support structure's support effect on the display panel, thereby guaranteeing the structural strength of the display panel.

[0036] In some embodiments provided in the first aspect of this application, a protective adhesive layer is provided on the outer periphery of the driver chip. The protective adhesive layer separates the driver chip from the peripheral components and protects the driver chip from damage by the surrounding components.

[0037] In some embodiments provided in the first aspect of this application, the display module includes a light-transmitting cover plate, which is stacked on one side of the display section away from the binding section. The light-transmitting cover plate is mainly used to protect the display panel and prevent dust.

[0038] In some embodiments provided in the first aspect of this application, the thickness of the light-transmitting cover is less than or equal to 0.6 mm. The thinner light-transmitting cover helps to achieve the thinner and lighter design of the entire electronic device.

[0039] In some embodiments provided in the first aspect of this application, the display module further includes a protective structure. The protective structure is disposed on the side of the bonding portion facing away from the display portion, and the driver chip is accommodated in the accommodating space formed by the bonding portion and the protective structure. The protective structure can protect the driver chip and reduce the possibility of the structure outside the accommodating space squeezing and damaging the driver chip.

[0040] In some embodiments, the protective structure may include a first insulating layer, a shielding layer, and a second insulating layer stacked together, with the shielding layer disposed between the first and second insulating layers. The shielding layer serves to shield signals, effectively reducing or eliminating electromagnetic interference between the driver chip and other electronic components. The first and second insulating layers provide insulation, preventing electrical connection between the shielding layer and the bonding portion.

[0041] Secondly, this application provides an electronic device that includes the display module in any of the above technical solutions, and the device also includes a housing, on which the display module is disposed.

[0042] The technical effects of any design method in the second aspect can be found in the technical effects of different design methods in the first aspect, and will not be repeated here.

[0043] In some embodiments provided in the second aspect of this application, the display module includes a driver chip, and a buffer structure is provided between the housing and the driver chip. When the electronic device is subjected to an impact, the buffer structure can absorb part of the impact force to reduce the pressure of the housing on the driver chip and achieve protection of the driver chip. Attached Figure Description

[0044] Figure 1 This is a perspective view of an electronic device according to some embodiments of this application;

[0045] Figure 2 According to Figure 1 A schematic diagram of a partial cross-sectional structure of the electronic device shown at line AA;

[0046] Figure 3 This is a partial cross-sectional structural diagram of an electronic device according to some embodiments of this application;

[0047] Figure 4 This is a schematic diagram of the structure of a display module according to some embodiments of this application;

[0048] Figure 5 According to Figure 4 The diagram shows a partial cross-sectional view of the display module at the BB line.

[0049] Figure 6 This is a schematic diagram illustrating the interaction between the driver chip and the foam layer in some embodiments of this application. Figure 1 ;

[0050] Figure 7 This is a schematic diagram illustrating the interaction between the driver chip and the foam layer in some embodiments of this application. Figure 2 ;

[0051] Figure 8 This is a schematic diagram illustrating the interaction between the driver chip and the metal protective shell in some embodiments of this application;

[0052] Figure 9 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 1 ;

[0053] Figure 10 According to Figure 9 A schematic diagram of the cavity and driver chip projected onto the display surface;

[0054] Figure 11 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 2 ;

[0055] Figure 12 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 3 ;

[0056] Figure 13 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 4 ;

[0057] Figure 14 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 5 ;

[0058] Figure 15 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 6 ;

[0059] Figure 16 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 7 ;

[0060] Figure 17 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 8 ;

[0061] Figure 18 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 9 ;

[0062] Figure 19 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 10 ;

[0063] Figure 20 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 10 one;

[0064] Figure 21 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 10 two;

[0065] Figure 22 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 10 three;

[0066] Figure 23 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 10 Four;

[0067] Figure 24 This is a schematic diagram of a partial cross-sectional structure of a display module according to some embodiments of this application. Figure 10 five;

[0068] Figure 25 According to Figure 5 The stress cloud diagram of the driver chip and the schematic diagram of the middle frame of the display module during the drop ball test are shown.

[0069] Figure 26 According to Figure 9 The stress cloud diagram of the driver chip and the schematic diagram of the middle frame of the display module during the drop ball test are shown.

[0070] Figure 27 According to Figure 22 The stress cloud diagram of the driver chip and the schematic diagram of the middle frame of the display module during the drop ball test are shown.

[0071] Figure 28 According to Figure 23 The diagram shows the stress cloud of the driver chip and the schematic diagram of the middle frame when the display module is subjected to a ball drop test.

[0072] Figure Labels

[0073] 100. Electronic devices;

[0074] 10. Display module; 101. Component area; 11. Light-transmitting cover plate; 12. Display panel; 120. Display surface; 121. Display part; 122. Bending part; 123. Bonding part; 13. Polarizing layer; 14. First adhesive layer; 15. Support structure; 15a. First top surface; 15b. First bottom surface; 150. Cavity; 151. Back film layer; 151a. First back film; 151b. Second back film; 152. Composite film layer; 152a. Buffer layer; 152b. Conductive layer; 153. Pad layer; 16. Driver chip; 17. Protective adhesive layer; 18. Protective structure; 19. Accommodation space; 190. Foam layer; 191. Metal protective shell;

[0075] 20. Housing; 21. Back cover; 22. Frame; 23. Middle frame; 24. Buffer structure; 30. Battery; 40. Circuit board; 50. Accommodation space. Detailed Implementation

[0076] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0077] In the embodiments of this application, the terms "first," "second," "third," "fourth," and "fifth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," "third," "fourth," and "fifth" may explicitly or implicitly include one or more of that feature.

[0078] In the description of the embodiments of this application, the term "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be a single item or multiple items.

[0079] In the description of the embodiments of this application, the term "and / or" refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" describes an association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "or" relationship.

[0080] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the embodiments of this application, such as "inner," "outer," "upper," "lower," "front," "rear," "left," and "right," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0081] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0082] In the embodiments of this application, unless otherwise specified, the description of "parallel" indicates approximate parallelism within a certain allowable error range, which can be a range where the angle of deviation from absolute parallelism is less than or equal to 5°. The description of "perpendicular" indicates approximate perpendicularity within a certain allowable error range, which can be a range where the angle of deviation from absolute perpendicularity is less than or equal to 5°.

[0083] This application provides an electronic device 100, which is an electronic device 100 having a display module 10. Specifically, the electronic device 100 can be a mobile phone, a portable Android device (PAD), a laptop computer, a camera, a drone, a smart home device, a smart wearable device (e.g., a smartwatch, a smart bracelet, smart glasses, a smart helmet), a virtual reality (VR) terminal device (e.g., VR glasses), an augmented reality (AR) terminal device (e.g., AR glasses), or other mobile or fixed terminals. The form of the electronic device 100 is not specifically limited in the embodiments of this application.

[0084] Please refer to the following: Figure 1 and Figure 2 , Figure 1 This is a perspective view of an electronic device 100 according to some embodiments of this application. Figure 2 According to Figure 1 The diagram shows a partial cross-sectional view of the electronic device 100 at line AA. "At line AA" refers to line AA and the plane indicated by the arrows at both ends of line AA. The same understanding should be applied to similar diagrams in the following text, and will not be repeated hereafter. This embodiment and the following embodiments illustrate the electronic device 100 as a device with wireless communication capabilities. This device with wireless communication capabilities can be a mobile phone, and the electronic device 100 can be a curved screen mobile phone. In other embodiments, the electronic device 100 can also be a flat screen mobile phone or a foldable screen mobile phone.

[0085] The electronic device 100 includes a housing 20, a display module 10, a circuit board 40, and a battery 30. The circuit board 40 and the battery 30 are located inside the electronic device 100, and therefore their outlines are shown as dashed lines.

[0086] Understandable Figure 1 The accompanying drawings below only schematically illustrate some components included in the electronic device 100; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 As well as the limitations of the accompanying figures below.

[0087] exist Figure 1 In the illustrated embodiment, the electronic device 100 is generally rectangular and flat. For ease of description in the following embodiments, an XYZ coordinate system is established, defining the width direction of the electronic device 100 as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis. It is understood that the coordinate system settings of the electronic device 100 can be flexibly configured according to actual needs, and are not specifically limited here.

[0088] In other embodiments, the shape of the electronic device 100 may also be a square plate, a rhomboid plate, a circular plate, an elliptical plate, or an irregularly shaped plate, etc., and no specific limitation is made here.

[0089] See Figure 2 The housing 20 can be used to carry the display module 10 and to house and protect the internal electronic components of the electronic device 100. The housing 20 includes a back cover 21 and a frame 22. The frame 22 is fixed to the back cover 21 and is arranged around the edge of the back cover 21. For example, the frame 22 can be fixed to the back cover 21 by adhesive. Alternatively, the frame 22 can be integrally formed with the back cover 21, i.e., the frame 22 and the back cover 21 are a single, integral structure.

[0090] In some embodiments, please refer to Figure 2 and Figure 3 , Figure 3 This is a partial cross-sectional structural diagram of an electronic device according to some embodiments of this application. The housing 20 also includes a middle frame 23. The middle frame 23 is fixed around the inner surface of the frame 22. Exemplarily, the middle frame 23 can be fixed to the frame 22 by welding, or the middle frame 23 can be integrally formed with the frame 22. The middle frame 23 serves as the structural "skeleton" of the electronic device, and components such as circuit boards and batteries 30 can be fixed to the middle frame 23 by means of bonding, threaded connection, snap-fit, welding, etc. When the electronic device does not include the middle frame 23, components such as circuit boards and batteries 30 can be fixed to the inner surface of the back cover 21 by means of threaded connection, snap-fit, welding, etc., or can be fixed to the surface of the display module 10 facing the back cover 21 by means of threaded connection, snap-fit, welding, etc.

[0091] Display module 10 is used to display images, videos, etc. Display module 10 is mounted on housing 20. (See also...) Figure 3 and Figure 4 , Figure 4 This is a schematic diagram of the structure of a display module 10 according to some embodiments of this application. Specifically, the display module 10 may include a light-transmitting cover plate 11 and a display panel 12. The light-transmitting cover plate 11 and the display panel 12 are stacked and fixedly connected. The light-transmitting cover plate 11 is mainly used to protect the display panel 12 and prevent dust. The material of the light-transmitting cover plate 11 includes, but is not limited to, glass, acrylic, etc.

[0092] In some embodiments, see Figure 3 The thickness D of the light-transmitting cover 11 is less than or equal to 0.6 mm. For example, the thickness D of the light-transmitting cover 11 can be 0.55 mm, 0.5 mm, 0.45 mm, or 0.4 mm. The thinner light-transmitting cover 11 helps to achieve the overall thinning and weight reduction of the electronic device 100.

[0093] In this embodiment, the light-transmitting cover 11 is a 3D cover, which makes the electronic device 100 more aesthetically pleasing. In other embodiments, the light-transmitting cover 11 can also be a 2D cover or a 2.5D cover. It should be noted that the 3D cover is a completely curved design, with both the central area and the edges being curved surfaces; the 2.5D cover has a flat central area and curved edges; and the 2D cover is a completely flat design.

[0094] See Figure 2 The light-transmitting cover 11 and the back cover 21 are disposed opposite to each other, and the light-transmitting cover 11, the back cover 21 and the frame 22 form an internal accommodating space 50 of the electronic device 100. This accommodating space 50 houses the display panel 12, the circuit board 40 and the battery 30. It is understood that in other embodiments, the display module 10 may not include the light-transmitting cover 11.

[0095] The display panel 12 can be an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, a micro light-emitting diode (Micro LED) display panel, a quantum dot electroluminescent (QDEL) display panel, or a liquid crystal display (LCD) panel, etc.

[0096] In some embodiments, see Figure 5 , Figure 5 According to Figure 4 The diagram shows a partial cross-sectional view of the display module 10 at the BB line. The display panel 12 can be a flexible display panel, which may include a display portion 121, a bending portion 122, and a bonding portion 123. The display portion 121 includes a display surface 120 facing the light-transmitting cover plate 11. The bonding portion 123 is located on the side of the display portion 121 opposite to the display surface 120, and the bending portion 122 connects the display portion 121 and the bonding portion 123. For example, the bending portion 122 may be arc-shaped.

[0097] Of course, the display panel 12 can also be partially a flexible display panel and partially a rigid display panel. For example, the display part 121 and the binding part 123 can be configured as a rigid display panel, while the bending part 122 can be configured as a flexible display panel.

[0098] See Figure 3The display module 10 may also include a polarizing layer 13, which is disposed between the display panel 12 and the light-transmitting cover plate 11. The polarizing layer 13 may include a polarizer (POL), also known as a polarizing filter, which is used to control the polarization direction of the light beam. That is, when natural light passes through the polarizer, the light whose vibration direction is perpendicular to the transmission axis of the polarizer will be absorbed, and only the polarized light whose vibration direction is parallel to the transmission axis of the polarizer remains.

[0099] Because the display panel 12 contains many reflective structures, ambient light entering the display panel 12 from its light-emitting surface is reflected by these structures. This reflected light mixes with the effective light emitted by the display panel 12 and interferes with the image to be displayed. Therefore, by placing a polarizing layer 13 between the light-transmitting cover 11 and the display panel 12, the reflection of ambient light by the display panel 12 can be reduced, thereby improving the display effect of the display panel 12.

[0100] Further, see Figure 5 A first adhesive layer 14 is provided between the polarizing layer 13 and the light-transmitting cover plate 11, and the polarizing layer 13 and the light-transmitting cover plate 11 are connected by the first adhesive layer 14. For example, the first adhesive layer 14 can be an optically clear adhesive (OCA) layer. Optical adhesives are colorless and transparent, have high light transmittance (e.g., total light transmittance > 99%), high adhesion, high temperature resistance, and UV resistance, and have a controlled thickness, providing uniform spacing. They do not yellow, peel, or deteriorate over long-term use. Therefore, the first adhesive layer 14 is an optical adhesive layer, which ensures that the display effect of the display module 10 is not affected.

[0101] The display panel 12 and the polarizing layer 13 are connected by a second adhesive layer (not shown in the figure). The second adhesive layer can be a pressure-sensitive adhesive (PSA) layer, which has the characteristics of low light leakage and reusability. Specifically, the second adhesive layer can be a mesh adhesive layer, which can be a mesh double-sided adhesive. The surface of the mesh double-sided adhesive is designed with a mesh structure, which can effectively disperse the pressure of the mesh adhesive in contact with the object, and also has high adhesion and good water resistance. During assembly, the display panel 12 can be bonded to the second adhesive layer, thereby fixing the display panel 12 and the polarizing layer 13.

[0102] See Figure 5The display module 10 also includes a support structure 15, at least a portion of which is stacked between the display portion 121 and the bonding portion 123. For example, a portion of the support structure 15 is stacked between the display portion 121 and the bonding portion 123; or, the entire support structure 15 is stacked between the display portion 121 and the bonding portion 123.

[0103] The support structure 15 serves to support the display unit 121 and the binding part 123. Furthermore, the support structure 15 can be shaped to match the display unit 121, thus protecting the display unit 121 and reducing the possibility of damage to the display unit 121 when it is subjected to impact, thereby ensuring the normal use of the display module 10.

[0104] See Figure 5 The support structure 15 includes multiple support layers stacked together, which may include a back film layer 151, a composite film layer 152, and a padding layer 153 stacked together.

[0105] The back film layer 151 can be attached to the display panel 12, and the back film layer 151 provides support for the display panel 12, which can enhance the structural strength of the display panel 12 and facilitate transportation, sales, etc. The material of the back film can be a flexible material; for example, the back film can be polyimide (PI) material.

[0106] Furthermore, the back film layer 151 is broken at the corresponding bending portion 122 to divide the back film layer 151 into a first back film 151a and a second back film 151b. The first back film 151a is attached to the side of the display portion 121 facing away from the display surface 120, and the second back film 151b is attached to the side of the bonding portion 123 facing the display portion 121. The back film layer 151 can be bonded to the display panel 12 before bending, and then the display panel 12 can be bent by breaking the back film at the corresponding bending portion 122. This facilitates bending and helps reduce bending stress.

[0107] See Figure 5 At least a portion of the composite film layer 152 is stacked between the first back film 151a and the second back film 151b. For example, a portion of the composite film layer 152 is stacked between the first back film 151a and the second back film 151b; or, the entire composite film layer 152 is stacked between the first back film 151a and the second back film 151b.

[0108] The composite film layer 152 includes a buffer layer 152a and a conductive layer 152b stacked together. The buffer layer 152a is disposed on the side of the first back film 151a facing away from the display portion 121, and the conductive layer 152b is disposed on the side of the buffer layer 152a facing away from the first back film 151a. The buffer layer 152a and the conductive layer 152b can be bonded together. During assembly, the composite film layer 152 can be entirely bonded to the surface of the first back film 151a facing away from the display panel 12.

[0109] The buffer layer 152a serves to cushion and absorb shock, thereby improving the impact resistance of the display module 10. The buffer layer 152a can be made of cushioning foam or silicone. Of course, the buffer layer 152a can also be made of other media that can provide cushioning; this embodiment of the application does not limit this choice.

[0110] In some embodiments, the conductive layer 152b can be a metal layer; for example, the conductive layer 152b can be a copper foil layer. In this way, the conductive layer 152b not only releases static electricity but also dissipates heat, improving the heat dissipation capability of the display module 10.

[0111] In some embodiments, the composite film layer 152 may be an SCF (super composite film) layer.

[0112] See Figure 5 The padding layer 153 is located between the display portion 121 and the bonding portion 123, and is stacked with the display portion 121 and the bonding portion 123. Specifically, at least a portion of the padding layer 153 may be stacked between the conductive layer 152b and the second back film 151b of the composite film layer 152. For example, a portion of the padding layer 153 is stacked between the conductive layer 152b and the second back film 151b; or, the entire padding layer 153 is stacked between the conductive layer 152b and the second back film 151b.

[0113] The support structure 153 serves as a support between the display section 121 and the bonding section 123, ensuring the spacing between them and thus guaranteeing the bending radius of the bent section 122. Understandably, due to bending stress, if the bending radius of the display panel 12 is too small, the film layer of the bent section 122 is prone to cracking or peeling. By supporting the display section 121 and the bonding section 123 with the support structure 15, the bending radius of the display panel 12 can be guaranteed, reducing bending stress and lowering the risk of cracking and film peeling.

[0114] The material of the padding layer 153 can be selected arbitrarily as needed. For example, the padding layer 153 can be cushioning foam, which can also have a cushioning and shock-absorbing function, buffering the stress acting on the display panel 12 and preventing damage to the display panel 12 under external force. In other examples, the padding layer 153 can be made of polyethylene terephthalate (PET), polyimide, or acrylic material.

[0115] When the padding layer 153 is made of a non-adhesive material, the padding layer 153 can be connected to the conductive layer 152b and the second back film 151b by adhesive to fix the padding layer 153 and help fix the shape of the bent display panel 12 and the back film layer 151.

[0116] When the padding layer 153 is made of an adhesive material, such as pressure-sensitive adhesive, the pressure-sensitive adhesive can be placed between the second back film 151b and the conductive layer 152b. In this way, the padding layer 153 has the properties of an adhesive layer and can play a role in bonding and fixing. Thus, the padding layer 153 can help fix the shape of the bent display panel 12 and the back film layer 151, and ensure the stability of the display module 10.

[0117] Please continue reading. Figure 5 The support structure 15 includes a first top surface 15a and a first bottom surface 15b facing each other, with the first top surface 15a facing the display portion 121. When the support structure 15 includes a first back film 151a, a composite film layer 152, a padding layer 153, and a second back film 151b stacked sequentially, the first top surface 15a of the support structure 15 can be formed on the surface of the first back film 151a facing the display portion 121, and the first bottom surface 15b of the support structure 15 can be formed on the surface of the second back film 151b facing the bonding portion 123.

[0118] The display module 10 also includes a driver chip 16, which can be used to implement the driving control function of the display module 10. For example, the driver chip 16 can control the generation and display process of images on the display panel 12. The driver chip 16 is electrically connected to the bonding part 123, and the driver chip 16 is located on the side of the bonding part 123 facing away from the display part 121. In this way, the traces of the display panel 12 can also be bent to the back side of the display panel 12, which facilitates the electrical connection between the display panel 12 and the circuit board 40 through the bonding part 123. This not only reduces the difficulty of electrical connection between the display panel 12 and the circuit board 40, but also helps to reduce the width of the bezel 22 of the display panel 12, thereby helping to improve the screen ratio of the display panel 12.

[0119] Please see Figure 3The side of the driver chip 16 facing away from the bonding portion 123 can be spaced apart from the housing, thus suspending the driver chip 16. This effectively reduces the pressure exerted on the driver chip 16 by the housing when the electronic device is subjected to impact. Alternatively, a buffer structure 24 can be provided between the driver chip 16 and the housing. The buffer structure 24 can absorb part of the impact force, reducing the pressure exerted on the driver chip 16 by the housing and protecting the driver chip 16. For example, the buffer structure 24 can be buffer foam, which can be adhered to the mid-frame 23.

[0120] In some embodiments, see Figure 5 A protective adhesive layer 17 is provided on the outer periphery of the driver chip 16. The protective adhesive layer 17 separates the driver chip 16 from the peripheral components, protecting the driver chip 16 from damage by the surrounding components. In addition, the protective adhesive layer 17 can also fix the driver chip 16 to the bonding part 123, enhancing the installation stability of the driver chip 16.

[0121] Continue reading Figure 5 The display module 10 also includes a protective structure 18, which covers the side of the bonding portion 123 facing away from the display portion 121. The protective structure 18 and the bonding portion 123 form a receiving space 19, in which the driver chip 16 is housed. The protective structure 18 can protect the driver chip 16 and reduce the possibility of damage to the driver chip 16 caused by external structures (such as the middle frame 23) of the receiving space 19.

[0122] The protective structure 18 may include a first insulating layer, a shielding layer and a second insulating layer stacked together, wherein the shielding layer may be disposed between the first insulating layer and the second insulating layer.

[0123] The shielding layer serves to shield signals, effectively reducing or eliminating electromagnetic interference between the driver chip 16 and other electronic components. The shielding layer can be made of at least one of the following materials: metal, conductive cloth, conductive adhesive, carbon fiber, and graphite. The first and second insulating layers provide insulation, preventing electrical connection between the shielding layer and the bonding portion 123. The first and second insulating layers can be made of at least one of the following materials: PET and PI. For example, both the first and second insulating layers can be made of Mylar sheet.

[0124] Please see Figure 6 , Figure 6 This is a schematic diagram illustrating the interaction between the driver chip 16 and the foam layer 190 in some embodiments of this application. Figure 1 On the side of the display module 10 facing away from the display surface 120, there is a device area 101. The device area 101 is provided with electronic components such as capacitors, resistors, and circuits. The electronic components in the device area 101 can be used to realize functions such as screen adjustment and touch control of the display module 10.

[0125] Currently, the trend is to achieve thinner and lighter electronic devices 100 by stacking and thinning the light-transmitting cover plate 11 of the display module 10. However, when the display module 10 is squeezed or collided, the driving chip 16 is prone to breakage under stress, which can cause the display panel 12 to go black and affect its use.

[0126] Please see Figure 6 and Figure 7 , Figure 7 This is a schematic diagram illustrating the interaction between the driver chip 16 and the foam layer 190 in some embodiments of this application. Figure 2 .in, Figure 6 The shaded area in the image represents foam layer 190. Figure 7 The shaded area in the image represents foam layer 190. Figure 7 The dotted area in the diagram represents the driver chip 16. A foam layer 190 is provided on the outer periphery of the driver chip 16 or on the side of the driver chip 16 facing the middle frame 23 to provide support and buffer against external impacts, but the buffering effect is not ideal.

[0127] See Figure 8 , Figure 8 This is a schematic diagram illustrating the interaction between the driver chip 16 and the metal protective shell 191 in some embodiments of this application. Figure 8 The dotted area in the diagram represents the driver chip 16. By providing a metal protective shell 191 on the side of the bonding portion 123 of the display panel 12 facing away from the display portion 121, the driver chip 16 is encapsulated between the metal protective shell 191 and the display panel 12. However, this increases the overall weight of the display module 10, which is not conducive to achieving a lightweight electronic device 100.

[0128] To address the aforementioned technical problems, this application provides a display module 10. Please refer to [link to relevant documentation]. Figure 9 and Figure 10 , Figure 9 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 1 , Figure 10 According to Figure 9 The diagram shows the orthographic projection of the cavity 150 and the driver chip 16 onto the display surface 120. In this embodiment, the support structure 15 is provided with the cavity 150, and at least a portion of the orthographic projection of the driver chip 16 onto the display surface 120 lies within the orthographic projection of the cavity 150 onto the display surface 120. Figure 10The dashed area represents the orthographic projection of cavity 150 onto display surface 120, and the shaded area represents the orthographic projection of driver chip 16 onto display surface 120. The orthographic projection of driver chip 16 onto display surface 120 can be either the orthographic projection of driver chip 16 onto the surface on which display surface 120 is located, or the orthographic projection of cavity 150 onto display surface 120 can be either the orthographic projection of cavity 150 onto the surface on which display surface 120 is located.

[0129] For example, a portion of the orthographic projection of the driver chip 16 on the display surface 120 lies within the orthographic projection of the cavity 150 on the display surface 120; or, the entire orthographic projection of the driver chip 16 on the display surface 120 lies within the orthographic projection of the cavity 150 on the display surface 120.

[0130] The cavity 150 in the support structure 15 can serve as a buffer space, providing a good cushioning effect. It should be understood that when the display module 10 is subjected to pressure or impact, the buffer space can absorb some of the impact force, reducing the stress acting on the driver chip 16, thereby protecting the driver chip 16. This prevents the driver chip 16 from easily breaking or wearing down, reducing the possibility of the display panel 12 experiencing a black screen due to damage to the driver chip 16, thus ensuring the normal operation of the display module 10. Furthermore, by providing a cavity 150 in the support structure 15 for cushioning, not only is the cushioning effect good, but it also reduces the weight of the display module 10, which is beneficial for the lightweight design of the electronic device 100.

[0131] Furthermore, since the orthographic projection of the driver chip 16 on the display surface 120 is entirely within the orthographic projection of the cavity 150 on the display surface 120, the driver chip 16 can be prevented from being scratched or worn by the edges of the cavity 150 when the cavity 150 is deformed, thus ensuring the normal function of the driver chip 16.

[0132] In some embodiments, refer to Figure 10 The minimum distance between the edge of the orthographic projection of the cavity 150 on the display surface 120 and the edge of the orthographic projection of the driver chip 16 on the display surface 120 is greater than or equal to 0.15 mm.

[0133] For example, the orthographic projection of the driver chip 16 onto the display surface 120 can be rectangular, and the orthographic projection of the cavity 150 onto the display surface 120 can also be rectangular. In the length direction of the driver chip 16, the minimum distance L1 between the edge of the orthographic projection of the cavity 150 onto the display surface 120 and the edge of the orthographic projection of the driver chip 16 onto the display surface 120 is greater than or equal to 0.15 mm, and L1 can be 0.15 mm, 0.2 mm, 0.25 mm, or 0.3 mm, etc.; in the width direction of the driver chip 16, the minimum distance L2 between the edge of the orthographic projection of the cavity 150 onto the display surface 120 and the edge of the orthographic projection of the driver chip 16 onto the display surface 120 is greater than or equal to 0.15 mm, and L2 can be 0.15 mm, 0.2 mm, 0.25 mm, or 0.3 mm, etc.

[0134] Of course, the orthographic projection of the driver chip 16 on the display surface 120 can be any shape other than a rectangle, and the orthographic projection of the cavity 150 on the display surface 120 can also be any shape other than a rectangle. The shape of the orthographic projection of the cavity 150 on the display surface 120 can be the same as the shape of the driver chip 16, or the shape of the orthographic projection of the cavity 150 on the display surface 120 can be different from the shape of the driver chip 16. As long as the minimum distance between the edge of the orthographic projection of the cavity 150 on the display surface 120 and the edge of the orthographic projection of the driver chip 16 on the display surface 120 is greater than or equal to 0.15mm.

[0135] It is worth noting that when the support structure 15 deforms due to impact, the cavity 150 will also deform accordingly. The edge of the cavity 150 will gradually approach the driver chip 16 due to deformation, and the sharp edges of the cavity 150 may scratch or wear down the driver chip 16. Therefore, by ensuring that the minimum distance between the edge of the cavity 150's orthogonal projection on the display surface 120 and the edge of the driver chip 16's orthogonal projection on the display surface 120 is greater than or equal to 0.15mm, the cavity 150 and driver chip 16 can be separated even when the cavity 150 is deformed. This better prevents the sharp edges of the cavity 150 from scratching or wearing down the driver chip 16, ensuring the normal function of the driver chip 16.

[0136] In other embodiments, see Figure 9 In the direction from the display part 121 to the binding part 123, the cross-sectional area of ​​the cavity 150 can remain unchanged. The cross-section of the cavity 150 refers to the surface cut by a plane perpendicular to the arrangement direction of the display part 121 and the binding part 123 on the cavity 150.

[0137] For example, the cavity 150 can be cylindrical or prismatic, and in the direction from the display part 121 to the binding part 123, the cross-section of the cavity 150 can be circular, elliptical, triangular, rectangular or rhomboid, etc.

[0138] In the direction from the display section 121 to the bonding section 123, the cross-sectional area of ​​the cavity 150 is always greater than the cross-sectional area of ​​the driver chip 16. When the display module 10 is impacted, the cavity 150 can better protect the driver chip 16, and the cavity 150 will not squeeze or wear the driver chip 16 due to deformation.

[0139] In some embodiments, see Figure 11 , Figure 11 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 2 In the direction from the display part 121 to the binding part 123, the cross-sectional area of ​​the cavity 150 can also gradually increase. The sidewall of the cavity 150 can be a smoothly transitioned surface, allowing the cross-sectional area of ​​the cavity 150 to increase gradually and gently; or, the sidewall of the cavity 150 can include a stepped surface, allowing the cross-sectional area of ​​the cavity 150 to increase abruptly.

[0140] For example, the cavity 150 may be frustum-shaped, and its cross-section in the direction from the display portion 121 to the binding portion 123 may be polygonal. For instance, the cross-section of the cavity 150 may be rectangular.

[0141] It is understandable that the closer the cavity 150 is to the driver chip 16, the larger the cross-sectional area of ​​the cavity 150. Correspondingly, the distance between the edge of the orthographic projection of the cavity 150 on the display surface 120 and the edge of the orthographic projection of the driver chip 16 on the display surface 120 is also larger. This can better protect the driver chip 16. When the support structure 15 is deformed by impact force, the larger gap between the edge of the cavity 150 and the driver chip 16 can better avoid the sharp edges of the cavity 150 scratching or wearing the driver chip 16, so as to ensure the normal function of the driver chip 16.

[0142] Furthermore, the cross-sectional area of ​​the cavity 150 near the display section 121 can be smaller than the cross-sectional area of ​​the driver chip 16, while the cross-sectional area of ​​the cavity 150 near the bonding section 123 can be larger than the cross-sectional area of ​​the driver chip 16. In this way, the cross-sectional area of ​​the cavity 150 gradually increases in the direction from the display section 121 to the bonding section 123. While ensuring a large distance between the edge of the cavity 150 and the driver chip 16, the volume of the cavity 150 cut out in the support structure 15 is also small, thus ensuring the structural strength of the support structure 15.

[0143] Furthermore, the volume of the cavity 150 near the light-transmitting cover 11 is smaller, and the structural strength of the support structure 15 is higher, thereby improving the support strength of the support structure 15 for the light-transmitting cover 11 and the display unit 121.

[0144] When the support structure 15 includes multiple support layers stacked together, a cavity 150 is formed in at least one support layer. When the support structure 15 includes a first back membrane 151a, a buffer layer 152a, a conductive layer 152b, a padding layer 153, and a second back membrane 151b stacked sequentially, the cavity 150 is formed on at least one of the first back membrane 151a, the buffer layer 152a, the conductive layer 152b, the padding layer 153, and the second back membrane 151b. This allows for flexibility in selecting the location of the cavity 150 based on needs and the characteristics of each support layer.

[0145] In some embodiments, the cavity 150 penetrates at least one of the first top surface 15a and the first bottom surface 15b of the support structure 15. For example, the cavity 150 may penetrate the first top surface 15a; or, the cavity 150 may penetrate the first bottom surface 15b; or, the cavity 150 may penetrate both the first top surface 15a and the first bottom surface 15b simultaneously. In this way, the cavity 150 not only provides a buffering effect, reducing the stress acting on the driver chip 16, but also allows for easy fabrication by creating the cavity 150 within both the first top surface 15a and the first bottom surface 15b.

[0146] In some embodiments, the cavity 150 extends through the first top surface 15a, that is, at least a portion of the cavity 150 is formed in the first back membrane 151a.

[0147] See Figure 12 , Figure 12 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 3 The cavity 150 can be formed on the first back membrane 151a.

[0148] The cavity 150 may also be partially formed on the first back membrane 151a, and other portions of the cavity 150 may be formed on at least one of the buffer layer 152a, the conductive layer 152b, and the padding layer 153.

[0149] For example, see Figure 13 , Figure 13 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 4 Both the first back membrane 151a and the buffer layer 152a have perforated areas that together form the cavity 150. Alternatively, see [reference needed]. Figure 14 , Figure 14 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 5 The first back membrane 151a, the buffer layer 152a, and the conductive layer 152b all have perforated areas that together form the cavity 150. Alternatively, see [reference needed]. Figure 15 , Figure 15 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 6 The cavity 150 is formed by hollow areas on the first back film 151a, the buffer layer 152a, the conductive layer 152b, and the padding layer 153. Other combination methods will not be listed here.

[0150] In some embodiments, the cavity 150 extends through the first bottom surface 15b, that is, at least a portion of the cavity 150 is formed in the second back membrane 151b.

[0151] See Figure 16 , Figure 16 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 7 Cavity 150 can be formed on the second back membrane 151b.

[0152] The cavity 150 may also be partially formed on the second back membrane 151b, and other portions of the cavity 150 may be formed on at least one of the buffer layer 152a, the conductive layer 152b, and the padding layer 153.

[0153] For example, see Figure 17 , Figure 17 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 8 Both the second backing membrane 151b and the padding layer 153 have perforated areas that together form the cavity 150. Alternatively, see [reference needed]. Figure 18 , Figure 18 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 9 The first backing film 151a, the padding layer 153, and the conductive layer 152b all have perforated areas that together form the cavity 150. Alternatively, see [reference needed]. Figure 19 , Figure 19 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 10 The second back film 151b, the padding layer 153, the conductive layer 152b, and the buffer layer 152a all have perforated areas that together form the cavity 150. Other combination methods will not be listed here.

[0154] In some embodiments, the cavity 150 extends through both the first top surface 15a and the first bottom surface 15b, that is, at least a portion of the cavity 150 is formed in the first back membrane 151a and at least a portion of the cavity 150 is formed in the second back membrane 151b.

[0155] See Figure 20 , Figure 20 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 10 First, hollow areas can be opened on both the first back film 151a and the second back film 151b to form cavities 150.

[0156] Both the first back film 151a and the second back film 151b have hollowed-out areas to form part of the cavity 150, and the other part of the cavity 150 is formed in at least one of the buffer layer 152a, the conductive layer 152b and the padding layer 153.

[0157] For example, hollow areas are formed in the first back film 151a, the buffer layer 152a, and the second back film 151b to form cavities 150; or, hollow areas are formed in the first back film 151a, the conductive layer 152b, and the second back film 151b to form cavities 150; or, hollow areas are formed in the first back film 151a, the padding layer 153, and the second back film 151b to form cavities 150. Alternatively, see [reference needed]. Figure 21 , Figure 21 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 10 Second, the first back film 151a, the buffer layer 152a, the conductive layer 152b, the padding layer 153, and the second back film 151b all have perforated areas to form cavities 150. Other combination methods will not be listed here.

[0158] In some other embodiments, the first top surface 15a and the first bottom surface 15b are spaced apart from the inner wall surface of the cavity 150. It should be understood that the cavity 150 does not penetrate the first top surface 15a and the first bottom surface 15b. The cavity 150 can be formed in the support layer inside the support structure 15, and then the multiple support layers of the support structure 15 are assembled. The support layer where the first top surface 15a and the first bottom surface 15b are located still has high structural strength and can provide high support for the display part 121 and the binding part 123.

[0159] For example, a cavity 150 can be formed by forming a hollow region on at least one of the buffer layer 152a, the conductive layer 152b, and the padding layer 153. In this way, at least a portion of the cavity 150 is formed on the composite film layer 152; or, at least a portion of the cavity 150 is formed on the padding layer 153.

[0160] Since the conductive layer 152b is usually a metal layer and is difficult to transmit light, opening a hollow area in the conductive layer 152b can not only have a buffering effect, but also facilitate the transmission of light.

[0161] Even after the hollow area is opened in the padding layer 153, the padding layer 153 can still ensure the support effect between the display part 121 and the binding part 123, ensure the bending radius of the display panel 12, reduce bending stress, and also help fix the shape of the bent display panel 12 and the back film layer 151.

[0162] In this way, the cavity 150 is formed on at least one of the buffer layer 152a, the conductive layer 152b and the padding layer 153. This not only enables the cavity 150 to buffer the impact force acting on the display module 10 and reduce the stress acting on the driver chip 16, but also facilitates light transmission. Furthermore, it ensures the supporting effect of the padding layer 153, the first back film 151a and the second back film 151b on the display panel 12, thereby ensuring the structural strength of the display panel 12.

[0163] For example, see Figure 9 A cavity 150 is formed by creating a hollow area in the padding layer 153; or, a cavity 150 is formed by creating a hollow area in the buffer layer 152a; or, see [reference needed] Figure 22 , Figure 22 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 10 Third, a hollow area is formed on the conductive layer 152b to create a cavity 150; or, see [reference needed]. Figure 23 , Figure 23 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 10 Fourth, both the buffer layer 152a and the conductive layer 152b have hollowed-out areas to form a cavity 150; or, see [reference needed]. Figure 24 , Figure 24 This is a schematic diagram of a partial cross-sectional structure of the display module 10 in some embodiments of this application. Figure 10 Fifth, hollow areas are formed in the buffer layer 152a, the conductive layer 152b, and the padding layer 153 to form a cavity 150. Other combination methods will not be listed here.

[0164] In order to objectively evaluate the buffering effect of the cavity 150, a ball drop test can be performed on the display module 10 to simulate the impact of human body pressing or other external forces on the display module 10, and a simulated stress test can be performed on the driver chip 16 hit by the ball.

[0165] Specifically, the ball-dropping experiment of the display module 10 can be performed by dropping balls of a specified mass from different heights onto the light-transmitting cover plate 11 of the display module 10; or, balls of different masses can be dropped from a specified height onto the light-transmitting cover plate 11 of the display module 10 to simulate the impact of different magnitudes on the display module 10. It should be noted that the dropped ball can land on the area of ​​the light-transmitting cover plate 11 opposite to the driving chip 16.

[0166] Please see Figure 25 , Figure 25 According to Figure 5The stress cloud diagram A of the driver chip 16 and the schematic diagram of the middle frame 23 when the display module 10 is subjected to a ball drop test are shown. When the support structure 15 of the display module 10 does not have a cavity 150, the maximum strain on the driver chip 16 hit by the ball reaches more than 4600.

[0167] Please see Figure 26 , Figure 26 According to Figure 9 The stress cloud diagram B of the driver chip 16 and the schematic diagram of the middle frame 23 when the display module 10 is subjected to a drop ball test are shown. When the cavity 150 is opened on the support structure 15 of the display module 10 and the cavity 150 is opened on the padding layer 153, the maximum strain on the driver chip 16 hit by the drop ball is reduced to below 3500.

[0168] Please see Figure 27 , Figure 27 According to Figure 22 The stress cloud diagram C of the driver chip 16 and the schematic diagram of the middle frame 23 during the drop ball test of the display module 10 are shown. When the cavity 150 is opened on the support structure 15 of the display module 10 and the cavity 150 is opened on the conductive layer 152b, the maximum strain on the driver chip 16 hit by the drop ball is reduced to below 4200.

[0169] Please see Figure 28 , Figure 28 According to Figure 23 The stress cloud diagram D of the driver chip 16 and the schematic diagram of the middle frame 23 during the drop ball test of the display module 10 are shown. When the cavity 150 is opened on the support structure 15 of the display module 10, and the cavity 150 is opened on the buffer layer 152a and the conductive layer 152b, the maximum strain on the driver chip 16 hit by the drop ball is reduced to below 4500.

[0170] It should be noted that the stress cloud diagrams of the aforementioned driver chip 16 are all projected onto the middle frame 23, and the projection position of the stress cloud diagram is the projection position of the driver chip 16 on the middle frame 23.

[0171] By comparison, it can be found that, compared with the case without the cavity 150 for energy absorption, after the cavity 150 is opened on the support structure 15, the maximum stress on the drive chip 16 is significantly reduced, and the range of stress on the drive chip 16 is also significantly reduced, indicating that the buffering effect of the cavity 150 is excellent.

[0172] In some other embodiments, the support structure 15 may also be a single-layer structure, with the first top surface 15a and the first bottom surface 15b being two opposite surfaces of the support structure 15, and the cavity 150 penetrating at least one of the first top surface 15a and the first bottom surface 15b of the support structure 15. In this way, the cavity 150 not only provides a buffering effect, reducing the stress acting on the driver chip 16, but also allows for easy fabrication by creating the cavity 150 within the first top surface 15a and the first bottom surface 15b.

[0173] In the arrangement direction of the first top surface 15a and the first bottom surface 15b, both the first top surface 15a and the first bottom surface 15b are spaced apart from the inner wall surface of the cavity 150. In this way, the cavity 150 is formed inside the support structure 15, and the cavity 150 does not penetrate the first top surface 15a and the first bottom surface 15b. The parts where the first top surface 15a and the first bottom surface 15b are located still have high structural strength, which can provide high support for the display part 121 and the binding part 123.

[0174] For example, the support structure 15 can be manufactured by integral injection molding, which can be achieved by pouring molten metal or other materials into a mold, and then allowing it to cool and solidify to form a support structure 15 with a cavity 150. The above-described processing method of the support structure 15 with a cavity 150 is merely exemplary and does not represent a limitation of this application.

[0175] In summary, by applying the display module 10 of this application embodiment to the electronic device 100, the layers such as the light-transmitting cover 11 can be thinned, increasing space for other structures of the electronic device 100 and reducing the overall weight of the electronic device 100, thus contributing to the thinning and lightening of the electronic device 100. When the electronic device 100 is squeezed or impacted, the display module 10 can absorb part of the impact force through the cavity 150 of the support structure 15 to protect the driver chip 16, thereby giving the display module 10 high reliability.

[0176] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0177] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A display module, characterized in that, include: A display panel includes a display part, a bending part, and a binding part. The display part includes a display surface. The binding part is located on the side of the display part opposite to the display surface. The bending part connects the display part and the binding part. A driver chip is electrically connected to the bonding portion, and the driver chip is located on the side of the bonding portion opposite to the display portion; A support structure is at least partially stacked between the display portion and the bonding portion. The support structure has a cavity, and at least a portion of the orthographic projection of the driving chip on the display surface is located within the orthographic projection of the cavity on the display surface.

2. The display module according to claim 1, characterized in that, The orthographic projection of the driving chip on the display surface is entirely within the orthographic projection of the cavity on the display surface.

3. The display module according to claim 2, characterized in that, The minimum distance between the edge of the cavity's orthographic projection on the display surface and the edge of the driver chip's orthographic projection on the display surface is greater than or equal to 0.15 mm.

4. The display module according to any one of claims 1-3, characterized in that, The cross-sectional area of ​​the cavity gradually increases in the direction from the display portion to the binding portion.

5. The display module according to any one of claims 1-3, characterized in that, The cross-sectional area of ​​the cavity remains unchanged in the direction from the display portion to the binding portion.

6. The display module according to any one of claims 1-5, characterized in that, The support structure includes a first top surface and a first bottom surface facing away from each other, with the first top surface facing the display unit; The cavity penetrates at least one of the first top surface and the first bottom surface.

7. The display module according to any one of claims 1-5, characterized in that, The support structure includes a first top surface and a first bottom surface facing away from each other, with the first top surface facing the display unit; In the arrangement direction of the first top surface and the first bottom surface, both the first top surface and the first bottom surface are spaced apart from the inner wall surface of the cavity.

8. The display module according to any one of claims 1-7, characterized in that, The support structure includes multiple support layers stacked together, and the cavity is formed in at least one of the support layers.

9. The display module according to claim 8, characterized in that, The plurality of support layers include a back film layer, a composite film layer, and a padding layer stacked together. The back film layer includes a first back film and a second back film. The first back film is attached to the side of the display portion facing away from the display surface, and the second back film is attached to the side of the bonding portion facing the display portion. At least a portion of the composite film layer is stacked between the first back film and the second back film. At least a portion of the padding layer is stacked between the composite film layer and the second back film.

10. The display module according to claim 9, characterized in that, At least a portion of the cavity is formed in the first back membrane, and / or at least a portion of the cavity is formed in the second back membrane.

11. The display module according to claim 9 or 10, characterized in that, The composite film layer includes a buffer layer and a conductive layer stacked together. The buffer layer is disposed on the side of the first back film facing away from the display portion, and the conductive layer is disposed on the side of the buffer layer facing away from the first back film.

12. The display module according to claim 11, characterized in that, At least a portion of the cavity is formed in the buffer layer, and / or at least a portion of the cavity is formed in the conductive layer.

13. The display module according to any one of claims 9-12, characterized in that, At least a portion of the cavity is formed in the padding layer.

14. The display module according to any one of claims 1-13, characterized in that, At least a portion of the outer periphery of the driver chip is provided with a protective adhesive layer.

15. The display module according to any one of claims 1-14, characterized in that, It includes a light-transmitting cover plate, which is stacked on the side of the display unit facing away from the binding part.

16. The display module according to claim 15, characterized in that, The thickness of the light-transmitting cover is less than or equal to 0.6 mm.

17. The display module according to any one of claims 1-16, characterized in that, It also includes a protective structure, which covers the side of the bonding portion facing away from the display portion, and the driver chip is housed within the accommodating space formed by the bonding portion and the protective structure.

18. An electronic device, characterized in that, include: The display module is the display module according to any one of claims 1-17; The housing, on which the display module is disposed.

19. The electronic device according to claim 18, characterized in that, A buffer structure is provided between the housing and the driver chip.

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