A charging socket with good heat dissipation
By introducing a combination structure of heat dissipation cavity, heat conduction component and cooling component into the charging socket, the heat dissipation problem during high-power charging is solved, achieving efficient heat dissipation and cooling, and improving the heat dissipation capacity and service life of the device.
Patent Information
- Application Number
- CN202522241730.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-23
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-10-23
AI Technical Summary
Traditional charging sockets have insufficient heat dissipation efficiency during high-power charging, resulting in increased temperature, which affects charging efficiency and device lifespan.
It adopts a combined structure of heat dissipation cavity, heat conduction component, and cooling element, including heat conduction silicone sleeve and TEC semiconductor cooling chip, forming a composite mode of active cooling and forced heat dissipation. The heat of the terminal is conducted out through the heat conduction component and cooled by the cooling element.
It improves heat dissipation efficiency, adapts to high-power charging demands, extends device lifespan, and reduces the impact of temperature on charging efficiency.
Smart Images
Figure CN224683450U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of new energy charging socket technology, and in particular to a charging socket with good heat dissipation. Background Technology
[0002] With the increasing prevalence of charging gun sockets for high-power new energy vehicles, the heat dissipation problem of charging sockets has become increasingly prominent. When traditional charging sockets operate under high load for extended periods, the excessive current generates a large amount of heat in the terminals and surrounding components, leading to temperature increases that affect charging efficiency and device lifespan.
[0003] Currently, the industry mainly improves heat dissipation by adding heat sinks and optimizing the thermal conductivity of materials, but these methods are difficult to match the ever-increasing charging power. Utility Model Content
[0004] In order to improve the heat dissipation efficiency of the charging socket to meet the heat dissipation requirements of high-power charging devices and avoid affecting charging efficiency and device life due to excessive temperature, this application provides a charging socket with good heat dissipation.
[0005] The charging socket with good heat dissipation provided in this application adopts the following technical solution: A charging socket with good heat dissipation includes a housing, a socket for inserting a charging gun, a terminal fixedly disposed in the socket, a heat dissipation cavity on the housing, the terminal passing through the heat dissipation cavity, a heat-conducting element fixedly disposed in the heat dissipation cavity, the heat-conducting element extending to the outside of the housing, and a cooling element installed on the outside of the housing for cooling the heat-conducting element.
[0006] By adopting the above technical solution, during charging, the terminals serve as electrical connections and the medium for energy transmission. The passage of a large amount of electrical energy easily generates heat, causing the terminals to heat up. The heat is transferred to the heat-conducting components in the heat dissipation cavity, and the heat-conducting components conduct the heat out of the housing. Then, the cooling elements cool down the heat-conducting components. Compared with the traditional method that relies solely on heat sinks or materials for heat conduction, this method can quickly dissipate the heat from the terminals and surrounding components, improve heat dissipation efficiency, and meet the needs of high-power charging.
[0007] Preferably, the heat-conducting component is made of heat-dissipating ceramic material.
[0008] By adopting the above technical solution, the heat dissipation ceramic has good thermal conductivity and high temperature resistance, can efficiently receive and conduct heat transferred by the terminals, and does not experience performance degradation under long-term high temperature environment, ensuring thermal conductivity stability and extending the service life of the equipment.
[0009] Preferably, the heat-conducting component has a sleeve hole, through which the terminal passes and is fixed.
[0010] By adopting the above technical solution, the terminal passes through the sleeve hole and is fixed, increasing the heat absorption area of the heat-conducting component on the terminal, so that the heat generated by the terminal is more fully transferred to the heat-conducting component, reducing thermal resistance and improving heat transfer efficiency.
[0011] Preferably, a thermally conductive silicone sleeve is provided between the sleeve hole and the terminal, the outer wall of the thermally conductive silicone sleeve contacts and abuts against the inner wall of the sleeve hole, and the inner wall of the thermally conductive silicone sleeve contacts and abuts against the outer wall of the terminal.
[0012] By adopting the above technical solution, firstly, the thermally conductive silicone sleeve has good thermal conductivity; secondly, the thermally conductive silicone sleeve fills the gap between the sleeve hole and the terminal, making the sleeve hole and the terminal more tightly connected, further reducing thermal resistance and improving heat transfer effect; thirdly, the thermally conductive silicone sleeve has a certain elasticity, which can buffer the vibration between the terminal and the thermally conductive component and the thermal expansion and contraction of the terminal, thereby protecting the sleeve hole; fourthly, the sleeve hole is sealed, thereby sealing the inner end of the socket.
[0013] Preferably, the cooling element includes a cooling fan and a TEC semiconductor cooling chip. The cooling fan is fixed outside the housing, and the TEC semiconductor cooling chip is sandwiched between the cooling fan and the heat-conducting element. The cold side of the TEC semiconductor cooling chip faces the heat-conducting element, and the hot side of the TEC semiconductor cooling chip faces the cooling fan.
[0014] By adopting the above technical solution, the cold side of the TEC semiconductor cooling chip can actively absorb heat from the heat-conducting component, reduce the temperature of the heat-conducting component, and thus accelerate the heat dissipation of the terminal; the heat absorbed by the hot side is quickly dissipated through the cooling fan, forming a composite heat dissipation mode of active cooling and forced heat dissipation, which further improves the heat dissipation capacity and is especially suitable for ultra-high power new energy charging scenarios.
[0015] Preferably, the TEC semiconductor cooling chip is provided with thermal insulation foam on its exterior. The thermal insulation foam is arranged around the edge of the TEC semiconductor cooling chip and is held by a cooling fan and a heat-conducting component.
[0016] By adopting the above technical solution, the heat insulation foam blocks the heat exchange between the cold and hot sides of the TEC semiconductor cooling chip, reduces the loss of cooling capacity, ensures the cooling efficiency of the cold side, and at the same time prevents the heat from the hot side from being transferred back to the heat-conducting component, thus ensuring the working effect of the TEC semiconductor cooling chip.
[0017] Preferably, the cooling fan is a detachable structure and is fixed to the housing by bolts.
[0018] By adopting the above technical solution, the detachable structure facilitates disassembly and replacement when the cooling fan malfunctions or requires maintenance, improving the ease of equipment maintenance and reducing subsequent use and maintenance costs.
[0019] Preferably, the cooling fan has an integrally formed mounting sleeve, the housing has a threaded hole, the bolt includes a screw, a screw cap, and a spring, the screw cap is integrally formed at the end of the screw, the middle of the screw passes through the mounting sleeve, the end of the screw away from the screw cap is threadedly connected to the threaded hole, the spring is sleeved on the screw, one end of the spring abuts against and is fixedly connected to the screw, and the other end of the spring abuts against the mounting sleeve.
[0020] By adopting the above technical solution, the spring generates elastic preload when the bolt is tightened, which makes the cooling fan and the housing fit together tightly, preventing the TEC semiconductor cooling chip from being damaged by excessive pressure from the cooling fan; at the same time, the spring helps to buffer the vibration generated by the cooling fan during operation, reduce noise, avoid long-term vibration causing the bolts to loosen, and improve installation stability.
[0021] In summary, this application includes at least one of the following beneficial technical effects: 1. By setting heat dissipation cavity, heat conduction component, cooling component, sleeve hole and heat conduction silicone sleeve around the socket terminal, the heat generated by the terminal is transferred to the heat conduction component through the heat conduction silicone sleeve. Then, the heat conduction component is forced to be ventilated and cooled by the cooling fan. Compared with the traditional heat dissipation method, the heat of the terminal and surrounding components can be dissipated quickly, improving heat dissipation efficiency and adapting to the high power charging requirements. 2. By setting up a cooling fan, a TEC semiconductor cooling chip, and thermal insulation foam, the cold side of the TEC semiconductor cooling chip actively absorbs heat from the heat-conducting components, accelerating the heat dissipation from the terminals. The heat from the hot side is quickly dissipated by the cooling fan, forming a composite heat dissipation mode of active cooling and forced heat dissipation, which further enhances the heat dissipation capacity. The thermal insulation foam blocks the heat exchange between the cold and hot sides of the TEC semiconductor cooling chip, reduces cooling loss, and prevents the heat from the hot side from being transferred back to the heat-conducting components, ensuring the cooling and heat dissipation effect. It is suitable for ultra-high power new energy charging scenarios. 3. By setting up an installation sleeve, threaded hole, screw, screw cap, and spring, the bolts allow for the detachable installation of the cooling fan through the cooperation of the installation sleeve and the threaded hole, which facilitates later maintenance and replacement. At the same time, the spring generates elastic preload when the bolt is tightened, which ensures that the TEC semiconductor cooling chip is in close contact with the heat-conducting component, avoids excessive pressure from the cooling fan that could damage the TEC semiconductor cooling chip, and also buffers the vibration during fan operation, preventing long-term vibration from causing the bolts to loosen, thus improving the overall installation stability. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of a well-ventilated charging socket provided in the embodiments of this application.
[0023] Figure 2 yes Figure 1 Enlarged view of part A in the middle.
[0024] Figure 3 This is a cross-sectional structural diagram of a charging socket with good heat dissipation provided in the embodiments of this application.
[0025] Figure 4 This is an exploded structural diagram of a charging socket with good heat dissipation provided in the embodiments of this application.
[0026] Explanation of reference numerals in the attached drawings: 1. Housing; 11. Insertion hole; 12. Terminal; 13. Heat dissipation cavity; 14. Threaded hole; 15. Extension; 2. Thermal conductive component; 21. Sleeve hole; 22. Thermally conductive silicone sleeve; 23. Inner ring; 24. Outer ring; 25. Connecting part; 3. Cooling fan; 31. Mounting sleeve; 4. TEC semiconductor cooling chip; 41. Thermal insulation foam; 5. Bolt; 51. Screw; 52. Screw cap; 53. Spring. Detailed Implementation
[0027] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.
[0028] This application discloses a charging socket with good heat dissipation. (Refer to...) Figure 1 and Figure 3 The device includes a housing 1, with two sockets 11 on the front for inserting the DC power supply of a new energy charging gun. Each socket 11 has a horizontally fixed terminal 12. A heat dissipation cavity 13 is provided on the housing 1. In this embodiment, the housing 1 has an integrally formed extension 15 facing away from the sockets 11. Two heat dissipation cavities 13 are arranged side-by-side on the extension 15, corresponding one-to-one with the terminals 12, with each terminal 12 passing through its corresponding heat dissipation cavity 13.
[0029] Reference Figure 3 A heat-conducting component 2, made of heat-dissipating ceramic, is fixedly installed inside the heat dissipation cavity 13. The heat-conducting component 2 extends outside the housing 1, and a cooling element is installed outside the housing 1 to cool the heat-conducting component 2. During charging, the terminal 12 serves as the electrical connection and energy transmission medium. The passage of a large amount of electrical energy easily generates heat, causing the terminal 12 to heat up. The heat is transferred from the heat dissipation cavity 13 to the heat-conducting component 2, which then conducts the heat out of the housing 1, where it is cooled by the cooling element.
[0030] To improve the thermal conductivity of the heat-conducting component 2 to the terminal 12, refer to Figure 3The heat-conducting component 2 has a sleeve hole 21, through which the terminal 12 passes and is fixed. In this embodiment, the heat-conducting component 2 includes an inner sleeve ring 23, an outer sleeve ring 24, and a connecting portion 25. The inner sleeve ring 23 is located inside the heat dissipation cavity 13, and its outer wall fits against the inner wall of the heat dissipation cavity 13. The sleeve hole 21 is the inner hole of the inner sleeve ring 23. The outer sleeve ring 24 is sleeved and fixed outside the extension portion 15 and fits against the outer wall of the extension portion 15. The connecting portion 25 passes through the extension portion 15, with one side extending into the heat dissipation cavity 13 of the extension portion 15 and integrally formed with the inner sleeve ring 23. The other side of the connecting portion 25 extends outside the extension portion 15 and integrally formed with the outer sleeve ring 24. A thermally conductive silicone sleeve 22 is provided between the sleeve hole 21 and the terminal 12. The outer wall of the thermally conductive silicone sleeve 22 contacts and abuts against the inner wall of the sleeve hole 21, and the inner wall of the thermally conductive silicone sleeve 22 contacts and abuts against the outer wall of the terminal 12.
[0031] Reference Figure 3 The thermally conductive silicone sleeve 22 has good thermal conductivity. It fills the gap between the sleeve hole 21 and the terminal 12, making the contact between them tighter. The sleeve 22 also has a certain degree of elasticity, which can buffer vibrations between the terminal 12 and the heat-conducting component 2, as well as the thermal expansion and contraction of the terminal 12, thus protecting both the heat-conducting component 2 and the terminal 12. The terminal 12 passes through the sleeve hole 21 and is fixed by the thermally conductive silicone sleeve 22, increasing the heat absorption area of the heat-conducting component 2 for the terminal 12. This allows the heat generated by the terminal 12 to be more fully transferred to the heat-conducting component 2, reducing thermal resistance and improving heat transfer efficiency.
[0032] To ensure effective heat dissipation for terminal 12, refer to Figure 3 and Figure 4 The cooling components include a cooling fan 3 and a TEC (Thermal Design Device) thermoelectric cooler 4. The cooling fan 3 is fixed to the outside of the housing 1. The TEC thermoelectric cooler 4 is sandwiched between the cooling fan 3 and the heat-conducting component 2. The cold side of the TEC thermoelectric cooler 4 faces the heat-conducting component 2 and is in close contact with the outer ring 24 of the heat-conducting component 2. The hot side of the TEC thermoelectric cooler 4 faces the cooling fan 3, and the cooling fan 3 guides airflow over the hot side of the TEC thermoelectric cooler 4. The TEC thermoelectric cooler 4 is provided with thermal insulation foam 41, which surrounds the edge of the TEC thermoelectric cooler 4 and is sandwiched by the cooling fan 3 and the heat-conducting component 2. The cold side of the TEC thermoelectric cooler 4 can actively absorb heat from the heat-conducting component 2, reducing the temperature of the heat-conducting component 2 and thus accelerating the heat dissipation from the terminal 12. The heat absorbed by the hot side is quickly dissipated through the cooling fan 3, forming a composite heat dissipation mode of active cooling and forced cooling, further improving the heat dissipation and cooling capacity. The thermal insulation foam 41 blocks the heat exchange between the cold and hot sides of the TEC thermoelectric cooler 4.
[0033] To facilitate disassembly and replacement in case of malfunction or maintenance of cooling fan 3, please refer to... Figure 1 and Figure 2 The cooling fan 3 employs a detachable mechanism, which is detachably mounted on the housing 1 via bolts 5. This facilitates disassembly and replacement when the cooling fan 3 malfunctions or requires maintenance. Specifically, the cooling fan 3 has four integrally formed mounting sleeves 31 at its four corners, and the housing 1 has threaded holes 14 corresponding to the mounting sleeves 31. There are four bolts 5, and the bolts 5, mounting sleeves 31, and threaded holes 14 correspond one-to-one. Each bolt 5 includes a screw 51, a screw cap 52, and a spring 53. The screw cap 52 is integrally formed at the end of the screw 51, and the middle of the screw 51 passes through the mounting sleeve 31. The end of the screw 51 away from the screw cap 52 is threadedly connected to the threaded hole 14. The spring 53 is sleeved on the screw 51, with one end of the spring 53 abutting against and fixedly connected to the screw 51, and the other end of the spring 53 abutting against the mounting sleeve 31. Spring 53 generates elastic preload when bolt 5 is tightened, which allows cooling fan 3 to be installed and combined with housing 1, so that TEC semiconductor cooling chip 4 and heat conduction component 2 are in close contact, and prevents excessive pressure from cooling fan 3 that could damage TEC semiconductor cooling chip 4.
[0034] The implementation principle of a well-heat-dissipating charging socket according to this application embodiment is as follows: When the charging socket is working, the terminal 12 heats up, and the heat is efficiently transferred to the heat-conducting component 2 through the thermally conductive silicone sleeve 22. The heat-conducting component 2 (heat-dissipating ceramic) then conducts the heat to the outside of the housing 1. The cold surface of the TEC semiconductor cooling chip 4 actively absorbs the heat from the heat-conducting component 2, further reducing the temperature of the heat-conducting component 2 and accelerating the heat dissipation from the terminal 12. At the same time, the heat from the hot surface of the TEC semiconductor cooling chip 4 is forcibly dissipated by the cooling fan 3, forming a composite heat dissipation mechanism of active cooling and forced cooling. In this way, the heat dissipation efficiency of the charging socket is improved to meet the heat dissipation requirements of high-power charging devices and avoid the impact of excessive temperature on charging efficiency and device lifespan.
[0035] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A charging socket with good heat dissipation, comprising a housing (1), wherein the housing (1) has a socket (11) for inserting a charging gun, and a terminal (12) is fixedly disposed in the socket (11), characterized in that: A heat dissipation cavity (13) is provided on the housing (1), and the terminal (12) passes through the heat dissipation cavity (13). A heat-conducting component (2) is fixedly provided in the heat dissipation cavity (13), and the heat-conducting component (2) extends to the outside of the housing (1). A cooling element is installed outside the housing (1), and the cooling element is used to cool the heat-conducting component (2).
2. The charging socket with good heat dissipation according to claim 1, characterized in that: The heat-conducting component (2) is made of heat-dissipating ceramic material.
3. A charging socket with good heat dissipation according to claim 1, characterized in that: The heat-conducting component (2) has a sleeve hole (21) and the terminal (12) passes through the sleeve hole (21) and is fixed to the sleeve hole (21).
4. A charging socket with good heat dissipation according to claim 3, characterized in that: A thermally conductive silicone sleeve (22) is provided between the sleeve hole (21) and the terminal (12). The outer wall of the thermally conductive silicone sleeve (22) contacts and abuts against the inner wall of the sleeve hole (21), and the inner wall of the thermally conductive silicone sleeve (22) contacts and abuts against the outer wall of the terminal (12).
5. A charging socket with good heat dissipation according to claim 1, characterized in that: The cooling element includes a cooling fan (3) and a TEC semiconductor cooling chip (4). The cooling fan (3) is fixed outside the housing (1). The TEC semiconductor cooling chip (4) is sandwiched between the cooling fan (3) and the heat-conducting element (2). The cold side of the TEC semiconductor cooling chip (4) faces the heat-conducting element (2), and the hot side of the TEC semiconductor cooling chip (4) faces the cooling fan (3).
6. A charging socket with good heat dissipation according to claim 5, characterized in that: The TEC semiconductor cooling chip (4) is provided with heat insulation foam (41) on the outside. The heat insulation foam (41) is arranged around the edge of the TEC semiconductor cooling chip (4). The heat insulation foam (41) is held together by the cooling fan (3) and the heat-conducting component (2).
7. A charging socket with good heat dissipation according to claim 5, characterized in that: The cooling fan (3) is a detachable structure and is fixed to the housing (1) by bolts (5).
8. A charging socket with good heat dissipation according to claim 7, characterized in that: The cooling fan (3) has an integrally formed mounting sleeve (31), and the housing (1) has a threaded hole (14). The bolt (5) includes a screw (51), a screw cap (52), and a spring (53). The screw cap (52) is integrally formed at the end of the screw (51). The middle part of the screw (51) passes through the mounting sleeve (31). The end of the screw (51) away from the screw cap (52) is threadedly connected to the threaded hole (14). The spring (53) is sleeved on the screw (51). One end of the spring (53) abuts against and is fixedly connected to the screw (51), and the other end of the spring (53) abuts against the mounting sleeve (31).