Special gas filling device for butterfly package semiconductor laser

Abstract

The utility model discloses a special gas filling device of butterfly package semiconductor laser, solved the problem of big, high cost of semiconductor laser special gas filling consumption in the prior art. The utility model discloses a control module still includes at least one extraction and filling gas subassembly, and the vacuum pump for extracting vacuum and the storage tank for filling gas are connected on the extraction and filling gas subassembly, and the drive assembly for controlling the opening and closing of extraction and filling gas subassembly is also connected on the extraction and filling gas subassembly, and the lower part of extraction and filling gas subassembly is equipped with the base. The utility model adopts the integrated design of vacuum extraction and gas filling, and the laser inner chamber is arranged in the extraction and filling gas subassembly, and the size is compact and full -seal design, can effectively reduce the special gas consumption, and control cost. Meanwhile, the heat conduction characteristic of xenon can stabilize the temperature in the cavity, the laser wavelength temperature drift amount reduces, and the laser radar detection precision improves. The process efficiency is high, the whole extraction and filling sealing process time -consumption is short, and the efficiency is improved, and the demand of mass production can be satisfied.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to a special gas filling device for a butterfly-shaped packaged semiconductor laser. Background Technology

[0002] The intelligent mobility industry is developing rapidly, and high-performance semiconductor lasers are core components of various high-energy solid-state, fiber, and gas lasers. Butterfly-packaged semiconductor lasers, as the core light source for all-solid-state lidar, possess characteristics such as small size, light weight, high electro-optical conversion efficiency, long lifespan, direct current drive, narrow spectrum, low intensity noise, and good coherence, making them ideal light sources for lidar, fiber optic sensing, and other fields. However, semiconductor lasers also have drawbacks—the laser wavelength is affected by temperature changes, and chip oxidation and moisture corrosion can easily damage the chip, significantly impacting high-precision backend applications and limiting their further application as a pump light source in materials processing.

[0003] To address this issue, lasers are typically protected using sealing devices and temperature controllers, while ensuring wavelength stability. However, as downstream applications demand increasingly higher precision, certain specialized components require the introduction of specific gases to provide different protective functions, such as drying, heat dissipation, insulation, and oxidation prevention. These specialized gases include helium, neon, argon, krypton, xenon, radon, and mixtures of different gases in specific proportions. Because some of these specialized gases are extremely valuable, the gas consumption during the filling process is substantial, resulting in high costs.

[0004] There are three major problems with butterfly-packaged semiconductor lasers in application: poor laser wavelength stability: the laser wavelength is significantly affected by temperature. For every 1°C change in temperature, the wavelength drift can reach 0.3-0.5nm, resulting in a decrease in lidar detection accuracy (error increases by 5%-10%); chip damage: residual oxygen and moisture in the packaging cavity can cause laser chip oxidation (oxidation rate of about 0.1μm / year) and electrode corrosion, shortening the device life by 30%-50%; low utilization efficiency of special gases: to solve the above problems, existing technologies require filling the packaging cavity with inert gases (such as helium or xenon). However, xenon is a high-value inert gas, and existing filling methods have two major drawbacks: the filling device does not have an integrated sealing design, the vacuum is not thorough (the vacuum degree can only reach 1×10^-2 Pa), and the residual air in the cavity mixes with the xenon, requiring an additional 20%-30% xenon to ensure purity, resulting in high gas consumption.

[0005] In summary, existing technologies cannot simultaneously meet the protection requirements of butterfly-shaped packaged lasers, xenon gas utilization efficiency, and cost control, necessitating an efficient xenon gas filling device. Summary of the Invention

[0006] To address the shortcomings in the aforementioned background technology, this utility model proposes a special gas filling device for a butterfly-shaped packaged semiconductor laser, which solves the problems of high consumption and high cost in the existing technology for filling special gases into semiconductor lasers.

[0007] The technical solution of this utility model is implemented as follows: a special gas filling device for a butterfly-shaped packaged semiconductor laser includes a control module and at least one gas pumping and filling component. The gas pumping and filling component is connected to a vacuum pump for evacuating and a storage tank for filling gas. The gas pumping and filling component is also connected to a drive component for controlling the opening or sealing and closing of the gas pumping and filling component. The lower part of the gas pumping and filling component is provided with a base.

[0008] More preferably, the air-inflation assembly includes an air-inflation box, a support member is slidably disposed inside the air-inflation box, and a sealing connection plate is provided on the support member to seal with the air-inflation box.

[0009] More preferably, the air-filling box is provided with an air-filling chamber that cooperates with the support member, and the lower part of the air-filling box is provided with an inlet and outlet that cooperate with the vacuum pump and the storage tank respectively.

[0010] More preferably, the gas filling box is provided with a sealing gas valve for sealing, and a sealing nitrogen tank is connected to the sealing gas valve.

[0011] More preferably, the support member includes a support plate with a mounting groove.

[0012] More preferably, the sealing connection plate is provided with an annular sealing protrusion, which is sealed and engaged with an annular groove provided on the inflation / extension box.

[0013] More preferably, the drive assembly includes a pneumatic telescopic bar, the telescopic part of which is connected to a sealing connection plate.

[0014] More preferably, the upper part of the base is provided with an inclined top plate, the inclination angle of the top plate being A, where A is 15~45°.

[0015] More preferably, the vacuum pump is provided with a pipeline, and the vacuum pump is connected to the gas pumping assembly through the pipeline.

[0016] More preferably, the storage tank is a helium storage tank, a neon storage tank, an argon storage tank, a krypton storage tank, a xenon storage tank, or a radon storage tank, and the storage tank is connected to the gas filling and pumping assembly via pipeline two.

[0017] The beneficial effects of this utility model are as follows: This utility model adopts an integrated design of vacuuming and gas filling, and sets up an inner cavity for placing the laser within the vacuuming and filling component. The design is reasonable, compact, and fully sealed, effectively reducing the consumption of special gases and controlling costs. Xenon gas consumption is significantly reduced, with a gas consumption lower than existing technologies. The xenon gas leakage rate is ≤1%, significantly reducing the xenon gas consumption per device and lowering the cost per device. Device protection is significantly improved, and device lifespan is extended. Simultaneously, the thermal conductivity of xenon gas can stabilize the cavity temperature, reducing laser wavelength temperature drift and improving lidar detection accuracy. The process efficiency is high, with a short vacuuming, filling, and sealing process compared to existing technologies, meeting mass production requirements. It has strong compatibility, adapting to butterfly-shaped packaged devices of different sizes, and can meet the needs of different application scenarios such as heat dissipation and insulation by adjusting the xenon gas pressure, ensuring high reliability. Attached Figure Description

[0018] To more clearly illustrate the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the inflation / deflation assembly. Figure 3 This is a cross-sectional view of the inflation / deflation assembly.

[0020] In the diagram, 1. Base, 1-1. Top plate, 1-2. Pipe hole, 2. Control switch, 3. Pressure gauge, 4. Air pumping box, 4-1. Air pumping chamber, 4-2. Annular groove, 5. Sealing connection plate, 5-1. Sealing protrusion, 6. Telescopic part, 7. Telescopic cylinder, 8. Air pump, 9. Storage tank, 10. Vacuum valve, 11. Vacuum pump, 12. Support plate, 12-1. Mounting groove. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figure 1As shown in Embodiment 1, a special gas filling device for a butterfly-shaped packaged semiconductor laser includes a control module and at least one gas filling / vacuuming assembly. Preferably, three gas filling / vacuuming assemblies can be arranged side by side, enabling the processing of multiple butterfly-shaped semiconductor lasers at once. A vacuum pump 11 for vacuuming and a gas storage tank 9 for filling are connected to the gas filling / vacuuming assembly. A drive assembly for controlling the opening or sealing of the gas filling / vacuuming assembly is also connected to the gas filling / vacuuming assembly. A base 1 is provided at the lower part of the gas filling / vacuuming assembly. This filling device features an integrated design for vacuuming and gas filling, a reasonable design for the laser's internal cavity, a compact size, and a fully sealed design, effectively reducing special gas consumption and controlling costs.

[0023] The packaging process for a butterfly-shaped semiconductor laser using this device is as follows: Parallel sealing is one of the commonly used hermetic sealing methods. A high-frequency inverter power supply is used to perform impedance welding on the top cover of the butterfly-shaped packaged semiconductor laser. During the sealing welding process, the X-side of the top cover is first sealed, followed by sealing the Y-side to 95%. A 5% gap is left for filling with a special gas. Then, a special gas pumping / filling device is placed inside. This filling device features an integrated vacuuming and gas filling design, a rationally designed laser cavity, a compact size, and a fully sealed design, effectively reducing special gas consumption and controlling costs. Pressing the button opens the inner cavity of the filling device, and the butterfly semiconductor device is placed inside for vacuuming. After vacuuming, a special gas of the appropriate intensity is filled into the cavity, which can be observed from pressure gauge 3. While waiting for the special gas filling to complete, the Y-side is sealed within 15 seconds, leaving a 5% gap, until the top cover is completely sealed. Butterfly-packaged semiconductor lasers are susceptible to wavelength variations due to temperature changes, chip oxidation, and moisture corrosion, all of which can damage the chip. By filling the laser cavity with a special gas element, various protective effects can be effectively provided, such as drying, heat dissipation, heat preservation, and oxidation prevention, thereby achieving stable output for the entire semiconductor laser. like Figure 2 and Figure 3As shown in Embodiment 2, a special gas filling device for a butterfly-shaped packaged semiconductor laser includes a gas filling and filling assembly comprising a gas filling and filling box 4, a support member slidably disposed within the gas filling and filling box 4, and a sealing connecting plate 5 on the support member that seals with the gas filling and filling box 4. The gas filling and filling box 4 has a gas filling and filling chamber 4-1 that cooperates with the support member, and the lower part of the gas filling and filling box 4 has inlet and outlet ports that respectively cooperate with a vacuum pump 11 and a storage tank 9. Preferably, the gas filling and filling box 4 is equipped with a pressure gauge 3 for measuring the pressure and vacuum level of the gas filling and filling chamber 4-1. The pressure gauge 3 is connected to a control module, preferably an existing PLC circuit control module, and a control switch 2 is disposed on a base 1. The gas filling and filling box 4 is equipped with a sealing gas valve for sealing, and a sealing nitrogen tank is connected to the sealing gas valve. The support member includes a support plate 12, and the support plate 12 has a mounting groove 12-1. Mounting slot 12-1 is used to place the butterfly-shaped packaged semiconductor laser. The sealing connecting plate 5 and the support plate 12 are connected as an integral structure. The sealing connecting plate 5 can drive the support plate 12 to move and achieve a sealing fit with the gas filling box 4, thereby achieving the sealing of the gas filling chamber 4-1 inside the gas filling box 4.

[0024] In this embodiment, the sealing connecting plate 5 is provided with an annular sealing protrusion 5-1, which is sealed and engaged with the annular groove 4-2 provided on the inflation / deflation box 4. The driving assembly includes a telescopic cylinder 7, and the telescopic part 6 of the telescopic cylinder 7 is connected to the sealing connecting plate 5. The sealing protrusion 5-1 engages with the annular groove 4-2, and a sealing rubber gasket can be provided in the annular groove 4-2 to further ensure the sealing effect. The telescopic cylinder 7 is a telescopic air cylinder, and an air pump 8 is connected to the telescopic cylinder. The telescopic part 6 and the sealing connecting plate 5 are connected as a whole by countersunk screws. The telescopic cylinder drives the sealing connecting plate 5 to slide along the inflation / deflation chamber 4-1 on the inflation / deflation box 4 through the telescopic part 6.

[0025] All other structures are the same as in Example 1.

[0026] like Figure 1As shown in Embodiment 3, a special gas filling device for a butterfly-shaped packaged semiconductor laser is provided. The upper part of the base 1 is provided with an inclined top plate 1-1, the inclination angle of which is A, where A is 15~45°, preferably 30°. The inclined base plate can ensure the sealing of the gas filling box 4 to a certain extent. The vacuum pump 11 is provided with a pipeline, which connects the vacuum pump 11 to the gas filling assembly. The storage tank 9 is a helium storage tank 9, a neon storage tank 9, an argon storage tank 9, a krypton storage tank 9, a xenon storage tank 9, or a radon storage tank 9, which is connected to the gas filling assembly via a pipeline. Preferably, the storage tank 9 is a xenon storage tank with a purity of 99.999%. The vacuum pump 11 is a rotary vane vacuum pump 11, and a vacuum valve 10 is provided on the pipeline. Both pipeline one and pipeline two are connected to the air filling and pumping assembly through the through holes 1-2 on the base 1 and the top plate 1-1. A flow controller is installed at the air outlet of the storage tank 9.

[0027] All other structures are the same as in Example 2.

[0028] Specifically, this device employs a combined process of step-by-step sealing, integrated pump-filling, and rapid sealing to achieve efficient xenon gas filling and sealing of butterfly-packaged semiconductor lasers. The steps are as follows: Step 1: Pre-treatment and Step-by-Step Sealing: The butterfly-shaped packaged semiconductor laser housing, including the laser chip, electrode leads, and top cover plate, is made of 4J42 Kovar alloy with a thickness of 0.2-0.3mm. Cleaning is performed using ethanol for 2-5 minutes to remove surface oil and impurities. Baking is then carried out using a vacuum-nitrogen-heating method, utilizing circulating ventilation to ensure the laser housing and top cover plate are dry and clean. Parallel sealing is performed using a high-frequency variable-frequency impedance welding power supply with a frequency of 40-60kHz, a welding current of 15-20A, and a welding pressure of 0.5-1.0MPa: First, complete the full sealing welding of the X side of the top cover plate (X side is along the length of the housing, 15-25mm in length), with a weld width controlled at 0.3-0.5mm. Next, seal the Y side of the top cover plate to 95% of its length (Y side is along the width of the housing, 10-18mm in length), leaving a 5% allowance. A gap of 0.5-0.9mm in length serves as the xenon gas inlet, and the weld quality must meet the requirements of no incomplete welding or porosity.

[0029] Step 2: Preparation of the Xenon Pumping / Filling Device: The dedicated xenon pumping / filling device includes the following core components: a sealed chamber made of 304 stainless steel with a volume of 500-800mL, and polished inner walls to reduce gas adsorption; a vacuum system including a rotary vane vacuum pump (ultimate vacuum ≤1×10^-3 Pa), a vacuum valve, and a vacuum pressure gauge (accuracy ±0.1Pa); a filling system including a xenon storage tank (purity 99.999%), a pressure regulating valve (adjustment range 0-0.5MPa), and a flow controller (accuracy ±1mL / min); a device fixing mechanism adaptable to different sized butterfly-shaped packaged devices (clamping force 5-10N to prevent device deformation); and a temperature control module to maintain the temperature inside the chamber at 25±2℃ to prevent temperature fluctuations from affecting the xenon pressure.

[0030] Step 3: Vacuuming and Xenon Gas Filling: Open the sealed cavity door, fix the butterfly device processed in Step 1 to the device fixing mechanism, close and lock the cavity door (ensuring the airtightness of the cavity); turn on the vacuum system and evacuate to a vacuum level ≤5×10^-3 Pa, maintain for 2-3 minutes to thoroughly remove air and moisture from the inside of the device and the sealed cavity; close the vacuum valve, turn on the gas filling system, and adjust the xenon gas pressure to 0.1-0.3MPa through the pressure regulating valve (select according to device requirements, 0.1-0.15MPa for heat dissipation scenarios, 0.2-0.3MPa for insulation scenarios), and fill the sealed cavity with xenon gas. At the same time, control the gas filling rate to 5-10mL / min through the flow controller to avoid sudden pressure rise that could damage the device; when the pressure in the sealed cavity stabilizes at the target value and remains stable for 1 minute, the xenon gas filling is considered complete.

[0031] Step 4: Rapid sealing: Within 8-15 seconds after xenon gas filling is completed, open the sealing chamber door (opening time ≤ 2 seconds) and remove the butterfly device; immediately move the device to the parallel sealing welding equipment and seal the 5% gap reserved on the Y side. The welding parameters are the same as in Step 1 to ensure that the weld is continuous and leak-free; after sealing, use a helium mass spectrometer leak detector to test the airtightness of the device. A leakage rate ≤ 1×10^-9 Pa・m³ / s is considered qualified.

[0032] Xenon consumption is significantly reduced. The integrated filling and pumping device (vacuum degree ≤5×10^-3 Pa) reduces gas consumption compared to existing technologies, with a xenon leakage rate ≤1%. The xenon consumption per device is reduced from 0.5mL to 0.2-0.3mL, resulting in lower per-device costs. Device protection is significantly improved, with intracavity xenon purity maintained above 99.99%, effectively isolating oxygen and moisture, reducing laser chip oxidation rate, and extending device lifespan. Simultaneously, xenon's thermal conductivity stabilizes intracavity temperature, reducing laser wavelength temperature drift and improving lidar detection accuracy. Process efficiency is high, with a short filling and sealing process, improving efficiency by 40%-60% compared to existing technologies, meeting mass production requirements. It boasts strong compatibility, adapting to different sized butterfly-shaped packaged devices, and can meet various application requirements such as heat dissipation and insulation by adjusting xenon pressure, ensuring high reliability. Furthermore, it should be noted that this utility model improves the equipment components and does not involve improvements to the circuit or control program. This utility model only controls the operation and shutdown of various electronic devices through a PLC control system. Since the PLC control system is a mature automatic control system in industry, this utility model will not elaborate on the circuit and control program content.

[0033] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A special gas filling device for a butterfly-shaped packaged semiconductor laser, comprising a control module, characterized in that, It also includes at least one gas pumping assembly, which is connected to a vacuum pump (11) for evacuating and a gas storage tank (9) for filling. The gas pumping assembly is also connected to a drive assembly for controlling the opening or sealing of the gas pumping assembly. The lower part of the gas pumping assembly is provided with a base (1).

2. The special gas filling device for a butterfly-shaped packaged semiconductor laser according to claim 1, characterized in that, The air-inflation assembly includes an air-inflation box (4), a support member is slidably provided inside the air-inflation box (4), and a sealing connection plate (5) is provided on the support member to seal with the air-inflation box (4).

3. The special gas filling device for a butterfly-shaped packaged semiconductor laser according to claim 2, characterized in that, The gas filling box (4) is provided with a gas filling chamber (4-1) that cooperates with the support member. The lower part of the gas filling box (4) is provided with an inlet and outlet that cooperate with the vacuum pump (11) and the storage tank (9) respectively.

4. The special gas filling device for a butterfly-shaped packaged semiconductor laser according to claim 2 or 3, characterized in that, The gas filling box (4) is equipped with a sealing gas valve for sealing, and a sealing nitrogen tank is connected to the sealing gas valve.

5. The special gas filling device for a butterfly-shaped packaged semiconductor laser according to claim 4, characterized in that, The support includes a support plate (12) with an installation groove (12-1) on it.

6. The special gas filling device for a butterfly-shaped packaged semiconductor laser according to claim 2, 3, or 5, characterized in that, The sealing connection plate (5) is provided with an annular sealing protrusion (5-1), which is sealed in conjunction with the annular groove (4-2) provided on the air filling box (4).

7. The special gas filling device for a butterfly-shaped packaged semiconductor laser according to claim 6, characterized in that, The drive assembly includes a telescopic cylinder (7), and the telescopic part (6) of the telescopic cylinder (7) is connected to the sealing connection plate (5).

8. The special gas filling device for a butterfly-shaped packaged semiconductor laser according to any one of claims 1 to 3, 5, and 7, characterized in that, The upper part of the base (1) is provided with an inclined top plate (1-1), and the inclination angle of the top plate (1-1) is A, where A is 15~45°.

9. The special gas filling device for a butterfly-shaped packaged semiconductor laser according to claim 8, characterized in that, The vacuum pump (11) is provided with a pipeline, and the vacuum pump (11) is connected to the gas pumping and filling assembly through the pipeline.

10. The special gas filling device for a butterfly-shaped packaged semiconductor laser according to any one of claims 1 to 3, 5, 7, and 9, characterized in that, The storage tank (9) is a helium storage tank, a neon storage tank, an argon storage tank, a krypton storage tank, a xenon storage tank, and a radon storage tank. The storage tank is connected to the gas filling and pumping assembly through pipeline two.

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