Variable frequency device

Abstract

The utility model is suitable for variable frequency technical field provides a kind of variable frequency equipment, above-mentioned variable frequency equipment includes first box, second box, power component and filter component, power component includes power device and radiator, and power device in power component is arranged in the inside of first box, and radiator is heat-conductively connected on the side surface of power device, filter component includes reactor module and capacitor module, and reactor module and capacitor module in filter component are all arranged in the inside of second box, then first box and second box are connected again, when installing, only need to consider the installation of frequency converter whole, do not need to install separately for each component in variable frequency equipment, make the installation of variable frequency equipment more convenient.

Description

Technical Field

[0001] This utility model belongs to the field of frequency conversion technology, and in particular relates to a frequency conversion device. Background Technology

[0002] A frequency converter is an electrical device that converts fixed-frequency alternating current (AC) into AC with adjustable frequency and voltage, thereby changing the power supply conditions of a motor and achieving precise motor control. To meet harmonic control requirements or achieve specific functions, a filter component is typically connected to the power unit of the frequency converter. However, in existing technology, the filter component and the power unit of the frequency converter are independent of each other. During installation, these components must be installed and fixed separately, resulting in a large footprint and inconvenient installation. Utility Model Content

[0003] The purpose of this utility model is to provide a frequency converter that solves the technical problems of large size and inconvenient installation of existing frequency converters.

[0004] This utility model is implemented as follows: a frequency converter is provided, which includes a first housing, a second housing, a power component, and a filter component. The power component includes a power device and a heat dissipation device. The power device is disposed in the first housing, and the heat dissipation device is thermally connected to the side of the power device. The filter component includes a reactor module and a first capacitor module. Both the reactor module and the first capacitor module are disposed in the second housing, and the first housing and the second housing are interconnected.

[0005] In one alternative embodiment, the power assembly further includes a mounting plate, a driver board, a control board, a power board, and a capacitor board, wherein the driver board is mounted above the mounting plate, the power board is mounted below the mounting plate, the control board is located to the side of the driver board, and the capacitor board is located below the control board.

[0006] In one optional embodiment, the power device further includes a power supply board and a connection terminal board, wherein the power supply board, the drive board, the control board and the connection terminal board are arranged in a straight line.

[0007] In one optional embodiment, a common-mode inductor is provided between the capacitor board and the control board, a second capacitor module is mounted on the lower surface of the capacitor board, and a relay board is provided on the side of the capacitor board.

[0008] In one alternative embodiment, the driving device is mounted on the upper surface of the driving board, and the power device is mounted on the lower surface of the power board.

[0009] In one alternative embodiment, the power device includes a rectifier IGBT module and an inverter IGBT module, which are installed side by side.

[0010] In one optional embodiment, the second housing has an air intake structure and an air outlet structure, and a heat dissipation duct is formed between the air intake structure and the air outlet structure. The reactor module and the capacitor module are both located inside the heat dissipation duct, and when the first housing and the second housing are connected, at least a portion of the heat dissipation device also extends into the interior of the heat dissipation duct.

[0011] In an optional embodiment, the second housing is provided with an air duct partition, which is used to divide the heat dissipation air duct into a first air duct and a second air duct. The heat dissipation device is located in the first air duct, and the reactor module is located in the second air duct.

[0012] In one optional embodiment, the capacitor module is disposed in the area of ​​the second housing near the air intake structure, the reactor module is located in the area of ​​the second housing near the air outlet structure, and the air duct baffle is located between the reactor module and the heat dissipation device.

[0013] In one optional embodiment, the opening of the first housing is provided with a first flange edge, and the opening of the second housing is provided with a second flange edge for abutting against the first flange edge, and the first flange edge and the second flange edge are connected by fasteners.

[0014] The technical advantages of this invention compared to existing technologies are as follows: By installing all power devices in the power assembly within the first housing and connecting heat dissipation devices to the sides of the power devices, and installing the reactor and capacitor modules in the filter assembly within the second housing, the first and second housings are then connected to form a frequency converter consisting of the power assembly and the filter assembly. Compared to existing frequency converters, this invention integrates the power devices and heat sinks within the first housing to form the power assembly, and integrates the reactor and capacitor modules within the second housing to form the filter assembly. Connecting the first and second housings creates a single integrated structure, reducing the overall size of the frequency converter. Furthermore, during installation, only the overall installation of the frequency converter needs to be considered; individual installation of each component is unnecessary, making the installation of the frequency converter more convenient. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of the frequency converter provided in this embodiment of the utility model;

[0017] Figure 2 This is an exploded structural diagram of the frequency converter provided in this embodiment of the utility model;

[0018] Figure 3 This is a cross-sectional view of the frequency converter provided in this embodiment of the utility model;

[0019] Figure 4 yes Figure 3 Enlarged structural diagram at point A;

[0020] Figure 5 This is a schematic diagram of the structure of the filter component used in this embodiment of the utility model;

[0021] Figure 6 This is an exploded view of the filter component used in this embodiment of the utility model;

[0022] Figure 7 This is a schematic diagram of the reactor module used in this embodiment of the utility model;

[0023] Figure 8 This is a schematic diagram of the capacitor module used in this embodiment of the utility model;

[0024] Figure 9 This is an exploded view of the capacitor module used in this embodiment of the utility model;

[0025] Figure 10 This is an exploded structural diagram of the power component used in the embodiment of this utility model.

[0026] Explanation of reference numerals in the attached figures:

[0027] 100. Variable frequency drive (VFD) equipment;

[0028] 10. Power components; 20. Filtering components;

[0029] 11. First enclosure; 12. Power devices; 121. Mounting plate; 122. Driver board; 123. Control board; 124. Power board; 125. Capacitor board; 126. Power supply board; 127. Terminal block; 128. Relay board; 13. Heat dissipation device; 14. Common mode inductor; 15. Second capacitor module; 16. Rectifier IGBT module; 17. Inverter IGBT module;

[0030] 21. Second housing; 211. Air intake structure; 212. Air exhaust structure; 213. Heat dissipation duct; 2131. First air duct; 2132. Second air duct; 214. Baffle; 22. Reactor module; 221. Main frame; 2211. First iron core; 2212. Second iron core; 222. First coil group; 223. Second coil group; 224. Fixing structure; 2241. Fixing plate; 2242. Support leg; 23. First capacitor module; 231. Mounting box; 232. Capacitor circuit board; 233. Capacitor group; 234. Heat dissipation port; 235. Dustproof component; 236. Insulating component; 237. Connection structure; 24. Air duct partition; 25. Airflow guiding structure; 251. Airflow guiding bend. Detailed Implementation

[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0032] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0034] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0035] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0036] Please refer to Figures 1 to 4 As shown in the embodiment of this utility model, a frequency converter is provided, including a first housing 11, a second housing 21, a power component 10, and a filter component 20. The power component 10 includes a power device 12 and a heat dissipation device 13. The power device 12 is disposed inside the first housing 11, and the heat dissipation device 13 is thermally connected to the side of the power device 12. The filter component 20 includes a reactor module 22 and a first capacitor module 23. Both the reactor module 22 and the first capacitor module 23 are disposed inside the second housing 21. The first housing 11 and the second housing 21 are interconnected to form a chassis structure.

[0037] Specifically, both the first enclosure 11 and the second enclosure 21 refer to shell-mounted components with a certain amount of space, typically composed of multiple parts or metal plates spliced ​​together. The first enclosure 11 and the second enclosure 21 can be connected by snap-fit ​​or fasteners to form a complete chassis structure.

[0038] Power device 12 refers to the main operating components in the frequency converter, which may include, but are not limited to, rectifier modules, inverter modules, bus capacitors, and relays. Heat dissipation device 13 refers to a component that can quickly dissipate heat; it may be a heat sink, heat pipe, or fan. Thermal conduction connection means that heat can be conducted between the heat dissipation device 13 and the power device 12. This can be achieved through direct contact or by using refrigerant in the piping. The heat dissipation device 13 may be thermally connected to only one of the power device 12 components that generates a large amount of heat, or it may be thermally connected to multiple components of the power device 12.

[0039] Reactor module 22 refers to a component that can suppress high-frequency harmonics. Reactor module 22 is a double-L reactor, which, together with the first capacitor module 23, forms an LCL filter. Reactor module 22 may have a first part for electrical connection to the rectifier side and a second part for electrical connection to the grid side. The first capacitor module 23 refers to the C capacitor in the LCL filter. The first capacitor module 23 typically utilizes the low impedance characteristic of capacitors to high-frequency currents to provide a low-impedance path for high-frequency harmonic currents, causing them to be "short-circuited" by the capacitor and not flow into the grid or load side. The first capacitor module 23 can be connected in parallel at the node where the rectifier-side reactor and the grid-side reactor are connected in series. Depending on the different grid-side rated voltages, the first capacitor module 23 can have different connection methods: for example, a delta connection or a star connection, which will not be elaborated further here.

[0040] The frequency converter provided in this embodiment of the invention integrates the power devices 12 of the power assembly 10 into a first housing 11, and heat dissipation devices 13 are thermally connected to the sides of the power devices 12. Simultaneously, the reactor module 22 and the first capacitor module 23 of the filter assembly 20 are installed in a second housing 21, forming the filter assembly 20. Finally, the first housing 11 and the second housing 21 are connected to form a complete frequency converter. Compared with existing frequency converters, this invention integrates the power devices 12 and heat dissipation devices into the first housing 11 to form the power assembly 10, and integrates the reactor module 22 and the first capacitor module 23 into the second housing 21 to form the filter assembly 20. Connecting the first housing 11 and the second housing 21 creates a single integrated structure for the power assembly 10 and the filter assembly 20, thus reducing the volume occupied by the frequency converter. When installing frequency converter equipment, only the installation of the frequency converter as a whole needs to be considered. There is no need to install each component of the frequency converter equipment separately, making the installation of frequency converter equipment more convenient.

[0041] In one embodiment, see Figure 10The power assembly 10 also includes a mounting plate 121, a drive board 122, a control board 123, a power board 124, and a capacitor board 125. The drive board 122 is mounted above the mounting plate 121, the power board 124 is mounted below the mounting plate 121, the control board 123 is located to the side of the drive board 122, and the capacitor board 125 is located below the control board 123. In this embodiment, since the power board 124 typically houses the power device 12, which is the main heat source in the power assembly 10, mounting the drive board 122 above the mounting plate 121 and the power board 124 below the mounting plate 121 facilitates direct contact between the power board 124 and the power device 12 on the power board 124 and the heat sink 13 or the fan / light cooling device. Meanwhile, the control board 123 is located to the side of the drive board 122, and a mounting plate 121 is spaced between the drive board 122 and the power board 124, so that both the drive board 122 and the control board 123 are positioned away from the power board 124. Furthermore, through the arrangement of the above-mentioned boards, under the premise of reasonable arrangement of strong and weak current circuits on each circuit board, the various components of the power assembly are more compactly integrated, the power assembly is smaller, and thus the overall volume occupied by the frequency converter is reduced.

[0042] In one embodiment, see Figure 10 The power device 12 also includes a power board 126 and a connection terminal board 127. The power board 126, the drive board 122, the control board 123 and the connection terminal board 127 are arranged in a straight line. In this embodiment, the power board 126, drive board 122, control board 123, and connection terminal board 127 are arranged in a straight line. The straight line arrangement means that each board is arranged in one direction, and there may be partial overlap or no overlap between adjacent boards. That is, the power board 126, drive board 122, control board 123, and connection terminal board 127 are arranged along their respective lengths in the first housing, and there is at least some non-overlap between them. This allows the power board 126, drive board 122, control board 123, and connection terminal board 127 to be maintained by opening the top cover of the first housing. The power board 126 and connection terminal board 127 are located at opposite ends of the first housing, which facilitates the wiring operation of the power board 126 and connection terminal board 127.

[0043] In one embodiment, see Figure 10 A common-mode inductor 14 is provided between the capacitor board 125 and the control board 123. A second capacitor module 15 is mounted on the lower surface of the capacitor board 125, and a relay board 128 is provided on the side of the capacitor board 125. Specifically, by providing a common-mode inductor 14 between the capacitor board 125 and the control board 123, and then mounting the second capacitor module 15 on the lower surface of the capacitor board 125, the component layout inside the first housing 11 is more reasonable and the heat dissipation effect is better.

[0044] In one embodiment, see Figure 10 The upper surface of the drive board 122 is equipped with drive devices, and the lower surface of the power board 124 is equipped with power devices. Specifically, by mounting drive devices on the upper surface of the drive board 122 and power devices on the lower surface of the power board 124, the main part of the power assembly 10 can be formed, making the device layout within the entire first housing 11 more reasonable and improving the space utilization rate inside the first housing 11.

[0045] In one embodiment, see Figure 10 The power device 12 includes a rectifier IGBT module 16 and an inverter IGBT module 17, which are installed side by side. In this way, by modularizing the rectifier and inverter devices separately before installation, the assembly operation of the power components can be simplified. At the same time, modularization can reduce the installation space and make the overall design more compact.

[0046] In one embodiment, see Figure 3The second housing 21 has an air intake structure 211 and an air outlet structure 212, forming a heat dissipation duct 213 between them. The reactor module 22 and the first capacitor module 23 are both located inside the heat dissipation duct 213. When the first housing 11 and the second housing 21 are connected, at least a portion of the heat dissipation device 13 also extends into the heat dissipation duct 213. Specifically, the air intake structure 211 and the air outlet structure 212 both refer to structures that allow air to pass through. The air intake structure 211 and the air outlet structure 212 can be a group of holes or openings, etc. To promote airflow within the heat dissipation duct 213, a fan can be installed in one of the air intake structure 211 and the air outlet structure 212, or fans can be installed in both. The heat dissipation duct 213 refers to a channel structure within the second housing 21 that allows airflow, and it connects the air intake structure 211 and the air outlet structure 212. In this embodiment, an air intake structure 211 and an air outlet structure 212 are provided on the second housing 21, forming a heat dissipation duct 213 between them. The reactor module 22 and the first capacitor module 23 can both be located inside the heat dissipation duct 213. Furthermore, after the first housing 11 and the second housing 21 are connected, at least a portion of the heat dissipation device 13 also extends into the heat dissipation duct 213. During inverter operation, air enters the heat dissipation duct 213 from the air intake structure 211 and exits from the air outlet structure 212 after flowing through the duct. This airflow carries away heat from the second housing 21, thereby achieving heat dissipation for the reactor module 22, the first capacitor module 23, and the heat dissipation device 13 located within the heat dissipation duct 213. This allows the inverter to achieve good heat dissipation even with high integration.

[0047] In an optional embodiment, please refer to Figure 5 The exhaust structure 212 includes an opening and a fan mounted at the opening, while the intake structure 211 includes multiple spaced-apart air intake holes. Specifically, the installation opening refers to an opening structure with a certain area. The fan is a component that can drive air to flow in a preset direction. In this embodiment, during operation, the fan's rotation can exhaust air from the second housing 21, allowing external air to enter the second housing 21 through the air intake holes under atmospheric pressure. Simultaneously, by positioning the exhaust structure 212 and intake structure 211 at opposite ends of the second housing 21, they can be arranged relative to each other, making airflow within the second housing 21 more convenient and smooth, increasing airflow speed, and thus improving heat dissipation efficiency.

[0048] In one embodiment, see Figure 2 and Figure 3 Both the first housing 11 and the second housing 21 have openings. The openings of the first housing 11 and the second housing 21 interlock. A first flange is provided at the opening of the first housing 11, and a second flange is provided at the opening of the second housing 21 for abutting against the first flange. The first and second flanges are connected by fasteners. Specifically, both the first and second flanges refer to plate-like structures with a certain area. The first flange can be integrally formed with the first housing 11, for example, by bending a portion of the opening of the first housing 11 to form the first flange. Similarly, the second flange can be integrally formed with the second housing 21, for example, by bending a portion of the opening of the second housing 21 to form the second flange. In this embodiment, by providing a first flange edge at the opening of the first housing 11 and a second flange edge at the opening of the second housing 21, the first flange edge and the second flange edge can abut against each other when the first housing 11 and the second housing 21 are fastened together, thereby increasing the contact surface between the first housing 11 and the second housing 21 and making the connection between the first housing 11 and the second housing 21 more stable.

[0049] In an optional embodiment, please refer to Figure 3 The first flange edge and the second flange edge can be connected by fasteners. For example, threaded holes are provided on the first flange edge and the second flange edge, and fasteners can be inserted into the threaded holes to achieve threaded connection between the first flange edge and the second flange edge, making the connection between the first housing 11 and the second housing 21 more secure.

[0050] In one embodiment, see Figure 2 and Figure 3 The second housing 21 is equipped with an air duct baffle 24, which divides the heat dissipation air duct 213 into a first air duct 2131 and a second air duct 2132. The heat dissipation device 13 is located in the first air duct 2131, and the reactor module 22 is located in the second air duct 2132. Specifically, the air duct baffle 24 refers to a plate-like structure with a certain area. The air duct baffle 24 can be connected to the inner wall of the second housing 21 by snap-fit, welding, or fasteners. In this embodiment, after air enters the interior of the first housing 11 through the air intake structure 211, it flows into the first air duct 2131 and the second air duct 2132 under the action of the air duct baffle 24. The airflow in the first air duct 2131 can dissipate heat from the heat dissipation device 13 and the power device 12 that is thermally connected to the heat sink, while the airflow in the second air duct 2132 can dissipate heat from the reactor. Furthermore, the heat generated by the heat dissipation device 13 can be prevented from dissipating to the reactor module 22 by the obstruction of the air duct baffle 24, so that the heat dissipation of the heat dissipation device 13 and the reactor module 22 are independent and do not interfere with each other.

[0051] In one embodiment, see Figure 3 The air duct baffle 24 has a first end and a second end that are arranged opposite to each other. The first end faces the air intake structure 211, and a flow guiding structure 25 is also provided at the first end of the air duct baffle 24 to guide the air in the heat dissipation air duct 213 so that the flow rate of the air entering the first air duct 2131 is greater than the flow rate of the air entering the second air duct 2132. Specifically, the first end and the second end are both ends of the air duct baffle 24, and the first end and the second end can be arranged opposite to each other along the gas flow direction. The flow guiding structure 25 refers to a structure or component that can change the air flow direction. In this embodiment, by providing a flow guiding structure 25 at the first end of the air duct partition 24, the flow guiding structure 25 can guide the air in the heat dissipation air duct 213 after the air enters the first housing 11, so that more airflow can enter the first air duct 2131. According to the amount of heat generated by the heat dissipation device 13 and the reactor, the air entering the first air duct 2131 and the air entering the second air duct 2132 are reasonably distributed. Under the premise of ensuring the heat dissipation effect of the heat dissipation device 13 and the reactor, the distribution of airflow is more reasonable.

[0052] In an optional embodiment, please refer to Figure 3 The first end of the air duct baffle 24 is spaced apart from the side wall of the first housing 11, so that the first air duct 2131 and the second air duct 2132 are connected in the area near the air intake structure 211. Simultaneously, the second end of the air duct baffle 24 is spaced apart from the side wall of the first housing 11, so that the first air duct 2131 and the second air duct 2132 are connected in the area near the air outlet structure 212. This allows the first air duct 2131 and the second air duct 2132 to share the air intake structure 211 and the air outlet structure 212. Air can enter the interior of the first housing 11 from the air intake structure 211 and, under the action of the air duct baffle 24, enter the first air duct 2131 and the second air duct 2132 respectively. After converging near the air outlet structure 212, they are discharged from the air outlet structure 212 to the outside of the first housing 11, making the airflow of the heat dissipation air duct 213 smoother and simplifying the structure of the first housing 11.

[0053] In one embodiment, see Figure 4 The airflow guiding structure 25 includes an airflow guiding bend 251 located at the first end, which is inclined away from the heat dissipation device 13. Specifically, the airflow guiding bend 251 refers to the structure formed by bending a portion of the air duct baffle 24. In this embodiment, by providing the airflow guiding bend 251 at the first end of the air duct baffle 24, and by providing the airflow guiding bend 251 inclined away from the heat dissipation device 13, more air can be guided into the first air duct 2131 when air flows through the airflow guiding bend 251, making the structure of the air duct baffle 24 simpler.

[0054] In one embodiment, see Figure 5 and Figure 6 The first capacitor module 23 is located inside the second housing 21 near the air intake structure 211, and the reactor module 22 is located inside the second housing 21 near the air outlet structure 212. A duct baffle 24 is located between the reactor module 22 and the heat dissipation device 13. In this embodiment, by placing the first capacitor module 23 inside the second housing 21 near the air intake structure 211, the layout of the components inside the first housing 11 is made more reasonable. Simultaneously, placing the duct baffle 24 between the reactor module 22 and the heat dissipation device 13 allows the duct baffle 24 to cover only a portion of the reactor module 22. This prevents heat generated by the heat dissipation device 13 from being transferred to the second duct 2132, and also allows heat generated by the first capacitor module 23 and part of the reactor module 22 to dissipate into the first duct 2131. This prevents the reactor module 22 from overheating locally and affecting its normal operation, making the inverter safer and more reliable to use.

[0055] In one embodiment, see Figure 7The reactor module 22 includes a main frame 221, a first coil group 222, and a second coil group 223. The main frame 221 has a first iron core portion 2211 and a second iron core portion 2212 that are insulated from each other. The first coil group 222 is wound on the first iron core portion 2211 to form a first part, and the second coil group 223 is wound on the second iron core portion 2212 to form a second part. Specifically, the main frame 221 refers to a frame structure with a certain volume, and the main frame 221 usually serves as the supporting skeleton of the reactor module 22. The first iron core 2211 and the second iron core 2212 are two different parts of the main frame 221. An insulating material can be provided between the first iron core 2211 and the second iron core 2212, allowing them to be connected as a whole while also insulating each other. The first iron core 2211, the second iron core 2212, and the insulating material can be integrally formed by die casting or secondary injection molding. Alternatively, the first iron core 2211, the second iron core 2212, and the insulating material can be formed separately and then combined to form an integral structure by methods such as gluing, welding, snap-fitting, or fastener connection. The first coil group 222 and the second coil group 223 are components formed by winding conductive wires in a specific order. In this embodiment, the first iron core 2211 and the second iron core 2212 are combined into a complete main frame 221, and an insulating material is provided between them to maintain their insulating connection. Then, the first coil group 222 and the second coil group 223 are wound onto the first iron core part 2211 and the second iron core part 2212 respectively, forming a structure in which the rectifier-side reactor and the grid-side reactor are integrated, thereby making the reactor module 22 easier to install.

[0056] In one specific embodiment, please refer to Figure 7 The number of first iron core sections 2211 and second iron core sections 2212 can be multiple. Each first iron core section 2211 is wound with a first coil group 222, and each second iron core section 2212 is wound with a second coil group 223. For example, the number of first iron core sections 2211 can be three, and each of the three first iron core sections 2211 is wound with a first coil group 222 to form three coils as a group, corresponding to the three-phase output on the rectifier side. At the same time, the number of second iron core sections 2212 can also be three, and each of the three second iron core sections 2212 is wound with a second coil group 223 to form three coils as a group, corresponding to the three-phase input on the grid side.

[0057] In one embodiment, see Figure 7The main frame 221 is provided with fixing structures 224, which are used to fix the reactor module 22 to the enclosure. Multiple fixing structures 224 are provided, spaced apart along the length of the main frame 221. A fixing structure 224 is a component or assembly that can connect two parts. The fixing structure 224 can achieve the connection between the main frame 221 and the enclosure through snap-fit, fastener connection, or plug-in. In this embodiment, by providing fixing structures 224 on the main frame 221, the main frame 221 can be fixed to the enclosure when the reactor module 22 needs to be installed and fixed. Furthermore, the multiple fixing structures 224, spaced apart along the length of the main frame 221, allow for fixing of the main frame 221 at multiple locations, making the fixation of the main frame 221 more secure.

[0058] In one embodiment, see Figure 7 The fixing structure 224 includes a fixing plate 2241 and support legs 2242 located at both ends of the fixing plate 2241. The fixing plate 2241 is connected to the main frame 221, and the two support legs 2242 are respectively connected to the bottom surface of the box. Specifically, the fixing plate 2241 refers to a plate-like structure with a certain length, which can be installed on the main frame 221 by welding, snap-fitting, or fastener connection. The support leg 2242 refers to a support component with a certain height. The support leg 2242 and the fixing plate 2241 can be an integral structure, for example, the support leg 2242 can be formed by bending the end of the fixing frame. The support leg 2242 and the fixing plate 2241 can also be separate structures, which can be connected to each other by welding, fastener connection, or snap-fitting. In this embodiment, the fixing plate 2241 can be installed on the main frame 221, and the support leg 2242 can be abutted against the inner surface of the box. Additionally, through holes can be provided on the support leg 2242, through which fasteners can be threaded to the housing after passing through the through holes, so as to press the support leg 2242 onto the housing, thereby achieving the final fixation of the main frame 221 and making the fixation of the main frame 221 more secure and convenient.

[0059] In one specific embodiment, please refer to Figure 7 The number of fixing structures 224 can be three, of which two fixing structures 224 can be set at both ends of the main frame 221 respectively, and the other fixing structure 224 is set between the first coil group 222 and the second coil group 223, so that the distribution of multiple fixing frames on the main frame 221 is more reasonable.

[0060] In one embodiment, see Figure 8 and Figure 9The first capacitor module 23 includes a mounting box 231, a capacitor circuit board 232, and capacitor groups 233. The capacitor circuit board 232 is disposed inside the mounting box 231 and fixed to the inner wall of the mounting box 231. The capacitor groups 233 are all electrically connected to the capacitor circuit board 232. Specifically, the mounting box 231 refers to a shell-shaped component with a certain accommodating space, and the shape of the mounting box 231 can be cuboid or columnar, etc. The capacitor circuit board 232 refers to a plate-shaped component with conductive lines on an insulating substrate. Components (such as capacitors) can be mounted on the capacitor circuit board 232, and the electrical connection and signal transmission between components are realized through the conductive lines. The capacitor group 233 is the C capacitor in the LCL filter. The capacitor group 233 can include a single capacitor or multiple capacitors, and can also include multiple capacitors and resistors, etc. By mounting capacitor bank 233 on capacitor circuit board 232, and placing both capacitor circuit board 232 and capacitor bank 233 within mounting box 231, while fixing capacitor circuit board 232 to the inner wall of mounting box 231, a separate first capacitor module 23 is formed by mounting capacitor bank 233 on capacitor circuit board 232 and placing both capacitor bank 232 and capacitor bank 233 within mounting box 231. This allows for selection of whether to install the first capacitor module 23 in the inverter depending on the application scenario. When the first capacitor module 23 needs to be installed, it can be installed close to the reactor, shortening the connection line between the first capacitor module 23 and the reactor. Furthermore, if the first capacitor module 23 malfunctions, only the individual first capacitor module 23 needs to be replaced, without replacing the entire power circuit board, making the replacement or repair of the first capacitor module 23 of the inverter faster.

[0061] In one embodiment, see Figure 8 and Figure 9The mounting box 231 has two heat dissipation vents 234, which are arranged opposite each other on both sides of the mounting box 231. Specifically, the heat dissipation vent 234 refers to an opening structure with a certain area on the side wall of the mounting box 231, and the shape of the heat dissipation vent 234 can be rectangular, circular, or polygonal. In this embodiment, by providing heat dissipation vents 234 on both sides of the mounting box 231 and arranging them opposite each other, the capacitor group 233 located inside the mounting box 231 can be exposed. The capacitor group 233 can contact the outside air through the heat dissipation vents 234, thereby dissipating heat from the capacitor group 233 and preventing the capacitor group 233 from affecting normal operation due to excessive temperature. Meanwhile, the two heat dissipation vents 234 are arranged opposite each other, so that air can easily enter the mounting box 231 from one of the heat dissipation vents 234 and exit from the other heat dissipation vent 234, thereby making the air flow in the mounting box 231 smoother and improving the overall heat dissipation effect of the capacitor module.

[0062] In an optional embodiment, please refer to Figure 8 and Figure 9 At least a portion of the capacitor bank 233 is located in the area between the two heat dissipation vents 234. By placing at least a portion of the capacitor bank 233 in the area between the two heat dissipation vents 234, when air flows between the two heat dissipation vents 234, it can flow through the location of the capacitor bank 233, and the air flow can carry away the heat generated by the capacitor bank 233, thereby improving the overall heat dissipation effect of the first capacitor module 23.

[0063] It should be noted that when the capacitor module is installed inside the enclosure, the capacitor module can be placed on the enclosure near the air intake structure 211, and one of the heat dissipation vents 234 on the mounting box 231 can be directed toward the air intake structure 211 of the enclosure. This allows the air entering the enclosure to pass smoothly through the entire mounting box 231.

[0064] In one embodiment, see Figure 9A dustproof component 235 is provided between the inner wall of the mounting box 231 and the outer surface of the capacitor assembly 233, and the dustproof component 235 surrounds the capacitor assembly 233. Specifically, the dustproof component 235 is a component that can block the intrusion of particulate pollutants such as dust and particulate matter. The dustproof component 235 can be dustproof cotton, rubber rings, or non-woven fabric, etc. In this embodiment, a dustproof component 235 is provided between the inner wall of the mounting box 231 and the outer surface of the capacitor assembly 233. Along the depth direction of the mounting box 231, the heat dissipation vent 234 and the cover plate can be arranged at intervals. At the same time, the dustproof component 235 is located in the area between the cover plate and the heat dissipation vent 234, and the capacitor circuit board 232 is located in the area between the dustproof component 235 and the cover plate, and the dustproof component 235 surrounds the entire capacitor assembly 233. Through the barrier of the dustproof component 235, external dust, particulate pollutants such as particulate matter are prevented from entering the location of the capacitor circuit board 232 through the heat dissipation vent 234.

[0065] In an optional embodiment, please refer to Figure 9 The dustproof component 235 is made of dustproof cotton. Using dustproof cotton for the dustproof component 235 can not only ensure the dustproof effect, but also easily fill the gap between the inner wall of the mounting box 231 and the outer surface of the capacitor group 233. At the same time, the dustproof surface is inexpensive, which also reduces the manufacturing cost.

[0066] In one embodiment, please refer to the figure and Figure 9 An insulating component 236 is provided on the area of ​​the capacitor bank 233 near the heat dissipation vent 234. The insulating component 236 isolates the capacitor bank 233 from other components. Specifically, the insulating component 236 is a component that provides isolation and insulation, and it is typically made of insulating material. In this embodiment, by providing the insulating component 236 on the area of ​​the capacitor bank 233 near the heat dissipation vent 234, the capacitor bank 233 can be electrically isolated from other components, thereby ensuring that the entire capacitor module meets safety regulations.

[0067] In an optional embodiment, please refer to Figure 9 The insulating component 236 includes insulating paper, which includes a fixing plate 2241 and a surrounding portion disposed around the fixing plate 2241. In this embodiment, by covering the top of the capacitor assembly 233 with the fixing plate 2241 and then wrapping the surrounding portion around the capacitor assembly 233, the insulating paper provides more comprehensive coverage of the area of ​​the capacitor assembly 233 near the heat dissipation port 234, thereby improving the insulating effect of the insulating paper.

[0068] In one embodiment, see Figure 8 and Figure 9The mounting box 231 is also provided with a connecting structure 237, which is used for detaching and connecting the mounting box 231 to the enclosure. Specifically, the connecting structure 237 refers to a component or structure that can connect two parts. In this embodiment, by providing the connecting structure 237 on the mounting box 231, the mounting box 231 can be detached and connected to the enclosure when the capacitor module is installed inside the enclosure, making the installation of the capacitor module more convenient and secure, and also making disassembly more convenient and quick.

[0069] In one embodiment, see Figure 9 The connecting structure 237 includes a connecting plate disposed on the mounting box 231, and the connecting plate is provided with mounting holes for fasteners to pass through. Specifically, the connecting plate refers to a plate-like structure with a certain area, and the connecting plate can be connected to the mounting box 231 by welding, snap-fitting, or fasteners. The connecting plate can also be integrally formed with the mounting box 231, for example, by bending a portion of the mounting box 231 to form the aforementioned connecting plate. The mounting hole refers to a through-hole structure with a certain area. In this embodiment, by using the connecting plate on the mounting box 231, which is provided with mounting holes for fasteners to pass through, the connecting piece can be pressed against the box body by fasteners passing through the mounting holes, thereby realizing the installation and fixation of the mounting box 231, making the installation of the capacitor module more convenient and secure, and also making the disassembly of the mounting box 231 more convenient.

[0070] The above description is merely a preferred embodiment of the present utility model, and only specifically describes the technical principles of the present utility model. These descriptions are only for explaining the principles of the present utility model and should not be construed as limiting the scope of protection of the present utility model in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model, as well as other specific embodiments of the present utility model that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present utility model.

Claims

1. A frequency converter, characterized in that, The system includes a first enclosure, a second enclosure, a power component, and a filter component. The power component includes a power device and a heat dissipation device. The power device is disposed in the first enclosure, and the heat dissipation device is thermally connected to the side of the power device. The filter component includes a reactor module and a first capacitor module. Both the reactor module and the first capacitor module are disposed in the second enclosure, and the first enclosure and the second enclosure are interconnected.

2. The frequency converter as described in claim 1, characterized in that, The power assembly further includes a mounting plate, a driver board, a control board, a power board, and a capacitor board. The driver board is mounted above the mounting plate, the power board is mounted below the mounting plate, the control board is located to the side of the driver board, and the capacitor board is located below the control board.

3. The frequency converter as described in claim 2, characterized in that, The power device also includes a power supply board and a connection terminal board, wherein the power supply board, the drive board, the control board and the connection terminal board are arranged in a straight line.

4. The frequency converter as described in claim 2, characterized in that, A common-mode inductor is provided between the capacitor board and the control board. A second capacitor module is installed on the lower surface of the capacitor board, and a relay board is provided on the side of the capacitor board.

5. The frequency converter as described in claim 2, characterized in that, The driving device is mounted on the upper surface of the driving board, and the power device is mounted on the lower surface of the power board.

6. The frequency converter as described in claim 5, characterized in that, The power device includes a rectifier IGBT module and an inverter IGBT module, which are installed side by side.

7. The frequency converter as described in claim 1, characterized in that, The second housing has an air intake structure and an air outlet structure, and a heat dissipation duct is formed between the air intake structure and the air outlet structure. The reactor module and the capacitor module are both located inside the heat dissipation duct. When the first housing and the second housing are connected, at least a portion of the heat dissipation device also extends into the interior of the heat dissipation duct.

8. The frequency converter as described in claim 7, characterized in that, The second housing is provided with an air duct partition, which is used to divide the heat dissipation air duct into a first air duct and a second air duct. The heat dissipation device is located in the first air duct, and the reactor module is located in the second air duct.

9. The frequency converter as described in claim 8, characterized in that, The capacitor module is located in the area of ​​the second enclosure near the air intake structure, the reactor module is located in the area of ​​the second enclosure near the air outlet structure, and the air duct baffle is located between the reactor module and the heat dissipation device.

10. The frequency converter as described in claim 1, characterized in that, The first housing has a first flange at its opening, and the second housing has a second flange at its opening for abutting against the first flange. The first flange and the second flange are connected by fasteners.

Images