Hybrid power supply inverter

Abstract

The utility model discloses a hybrid power supply inverter relates to inverter technical field, inverter mainboard, it is used for the direct current electric energy is changed to alternating current electric energy, heat conduction mechanism, it is used for the heat of inverter mainboard operation is oriented to the outside, the inverter mainboard will heat when using, the heat of inverter mainboard can be oriented metal protective housing through helium and heat conduction paste, again by metal protective housing oriented metal heat conduction fin, through waterproof fan to push the air circulation in the inside of shell, in this process, the heat of metal heat conduction fin and metal protective housing surface is taken away by air, realizes the heat dissipation, and the surface of waterproof fan does not need to set up dustproof isolation net, will not be blocked, and then makes it have longer service life, and the water vapor or dust that enters the inside of shell will be blocked by metal protective housing, will not influence the normal operation of inverter mainboard, has solved the hybrid power supply inverter of existing, will influence the problem of ventilation and heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of inverter technology, and in particular to a hybrid power supply inverter. Background Technology

[0002] With the development of new energy technologies and the increasing demand for emergency power supply, hybrid power supply inverters are composite power devices that integrate "multi-power management" and "DC-AC inverter core". Their core feature is that they can connect to multiple types of power sources (DC + AC) and achieve multi-power collaborative work and optimized energy utilization through intelligent control, ultimately outputting stable AC power to the load. They have been widely used in photovoltaic power supply systems, RV camping power supply, outdoor emergency power supply, and home backup power supply.

[0003] Currently, existing hybrid power inverters use vents at the ends of the casing and fans to dissipate heat from internal components. However, these vents also act as channels for external moisture and dust to enter the casing. Existing solutions include installing a filter at the vents to allow air to pass through while blocking dust and impurities, and waterproofing the internal components. However, installing a filter at the vents affects the fan's ventilation and heat dissipation efficiency. Furthermore, dust accumulates on the filter, causing it to become clogged, further reducing the fan's ventilation and heat dissipation efficiency, and in severe cases, leading to overheating and damage to the inverter. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a hybrid power supply inverter, which solves the problem that existing hybrid power supply inverters, by setting up a filter to prevent external impurities from entering the casing, affect ventilation and heat dissipation efficiency.

[0005] To achieve the above objectives, this utility model provides the following technical solution: Hybrid power supply inverter, including; Inverter mainboard, which is existing technology, is used to convert DC power into AC power; The heat conduction mechanism is used to conduct the heat generated by the inverter motherboard during operation to the outside. It includes a metal protective shell, which is fixedly connected to the inverter motherboard by adhesive. A hollow cavity is formed between the metal protective shell and the inverter motherboard. The hollow cavity is filled with helium, which has the effect of conducting heat. Waterproof fans, which are existing technology, are electrically connected to the inverter motherboard through flexible circuits. The flexible circuits pass through the metal protective shell and are used to promote air circulation and assist the heat conduction mechanism in dissipating heat from the inverter motherboard. The protective mechanism, which is existing technology, is used to protect and install waterproof fans, heat dissipation mechanisms, and inverter motherboards. It includes a housing made of metal.

[0006] Preferably, a thermal pad is attached between the inverter motherboard and the inner wall of the metal protective shell. The thermal pad is an existing technology, also known as a thermal pad, which is a flexible heat conduction medium used for heat dissipation of electronic devices. The thermal pad is attached between the main heat-generating components of the inverter motherboard and the metal protective shell, including insulated gate bipolar transistors, metal-oxide-semiconductor field-effect transistors and rectifier bridges / rectifier modules.

[0007] Preferably, at least two terminals are fixedly connected to one end of the housing. The terminals are existing technology and are used to connect the power supply line. The terminals are electrically connected to the inverter motherboard through a flexible wire that passes through the metal protective housing.

[0008] Preferably, the metal protective shell is located inside the outer shell, and several metal heat-conducting fins are fixedly connected to the outer surface of the metal protective shell by welding. The metal heat-conducting fins are used to increase the contact area between the metal protective shell and the air, improve the heat exchange efficiency, and assist in heat dissipation.

[0009] Preferred: The waterproof fan is fixedly connected to the inner wall of one end of the housing with screws. The housing has a ventilation opening at the position where the waterproof fan is installed. A steel wire mesh is fixedly connected to the surface of the ventilation opening to prevent the fan blades from getting into people's hands.

[0010] Preferably, a ventilation hole is provided on the side of the outer casing away from the waterproof fan. The ventilation hole is used for air circulation. When the waterproof fan is turned on, it blows the outside air into the inside of the outer casing and finally exhausts it from the ventilation hole. During this process, the air exchanges heat with the metal protective shell and the metal heat-conducting fins to achieve a heat dissipation effect.

[0011] Preferred: A power cord socket is fixedly connected to the side of the outer casing away from the waterproof fan. This is existing technology. The power cord socket is electrically connected to the inverter motherboard through a flexible circuit that runs through the metal protective casing. The surface of the metal protective casing has multiple through holes for flexible circuit routing. The parts of the flexible circuit that pass through the through holes are coated with sealant to prevent air leakage.

[0012] Preferably, the side wall of the housing has an installation window, and a mounting plate is fixedly connected to the installation window by screws. The mounting plate is fixedly connected to the inverter mainboard by screws.

[0013] Preferably, a partition plate is fixedly connected to the inner side of the housing near the waterproof fan. The partition plate prevents the wiring of the terminal block from coming into contact with the waterproof fan and avoids damage to the wiring by the waterproof fan.

[0014] Preferably, the connection between the inverter mainboard and the mounting plate is coated with sealant, and the connection between the mounting plate and the mounting window is affixed with a sealing gasket. The sealant and sealing gasket prevent external moisture from seeping in and affecting the inverter mainboard.

[0015] During operation, the inverter motherboard generates heat. This heat is directed through helium gas and thermal pads to the metal protective casing, then from the casing to the metal heat-conducting fins. A waterproof fan then circulates air within the casing, carrying away heat from the metal heat-conducting fins and the surface of the metal protective casing, thus achieving heat dissipation. The waterproof fan does not require a dustproof mesh and will not become clogged, extending its lifespan. Furthermore, any moisture or dust entering the casing is blocked by the metal protective casing, preventing it from affecting the normal operation of the inverter motherboard. This solves the problem in existing hybrid power supply inverters where filters prevent external impurities from entering the casing, thus affecting ventilation and heat dissipation efficiency. Attached Figure Description

[0016] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a structural diagram of the protective mechanism of this utility model; Figure 3 This is a partially exploded structural diagram of the present invention; Figure 4 This is an exploded structural diagram of the present invention.

[0018] Legend: 100, Protective mechanism; 101, Outer shell; 102, Middle partition; 103, Ventilation hole; 104, Mounting window; 105, Power cord socket; 106, Terminal block; 107, Mounting plate; 200, Waterproof fan; 300, Heat conduction mechanism; 301, Metal protective shell; 302, Metal heat conduction fins; 400, Inverter mainboard. Detailed Implementation

[0019] This application provides a hybrid power supply inverter, which effectively solves the problem that existing hybrid power supply inverters, by setting up a filter to prevent external impurities from entering the casing, affect ventilation and heat dissipation efficiency.

[0020] Example 1 Existing hybrid power inverters utilize vents at the ends of the casing, along with fans, to dissipate heat from internal components. However, these vents also act as channels for external moisture and dust to enter the casing. Current solutions involve installing a filter at the vents to allow airflow while blocking dust and impurities, and waterproofing the internal components. However, this filter also negatively impacts the fan's cooling efficiency. Furthermore, dust accumulation on the filter can clog it, further reducing cooling efficiency and potentially leading to inverter failure. To address the problem of heat buildup and damage in existing technologies, this utility model provides a hybrid power supply inverter. It incorporates a heat-conducting mechanism 300 to protect the inverter motherboard 400 from moisture and dust. Helium gas and thermal pads are filled between the motherboard 400 and the heat-conducting mechanism 300, and a waterproof fan 200 is used for heat dissipation, achieving sealed heat dissipation. The components inside the inverter motherboard 400 are not affected by moisture and dust. Open vents and air holes 103 can be provided to maximize the efficiency of the waterproof fan 200 and prevent blockage, thus solving the aforementioned problems.

[0021] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, it includes an inverter motherboard 400 for converting electrical energy, and a protective mechanism 100 for mounting and protecting the inverter motherboard 400. The surface of the protective mechanism 100 is also provided with a waterproof fan 200 for heat dissipation, and the interior of the protective mechanism 100 is provided with a heat conduction mechanism 300 for secondary protection and heat dissipation of the inverter motherboard 400.

[0022] like Figure 4 As shown, the inverter motherboard 400 is existing technology and is used to convert DC power into AC power. The heat conduction mechanism 300 is used to conduct the heat generated by the inverter motherboard 400 during operation to the outside. It includes a metal protective shell 301, which is fixedly connected to the inverter motherboard 400 by adhesive. A hollow cavity is formed between the metal protective shell 301 and the inverter motherboard 400. The hollow cavity is filled with helium, which has a heat conduction effect. like Figure 1 , Figure 3 and Figure 4 As shown, the waterproof fan 200 is existing technology. The waterproof fan 200 is electrically connected to the inverter motherboard 400 through a flexible circuit. The flexible circuit passes through the metal protective shell 301 and is used to promote air circulation and assist the heat conduction mechanism 300 in dissipating heat from the inverter motherboard 400. like Figure 1 and Figure 2As shown, the protective mechanism 100, which is prior art, is used to protect and install the waterproof fan 200, the heat conduction mechanism 300, and the inverter motherboard 400. It includes a housing 101, which is made of metal.

[0023] like Figure 4 As shown, a thermal pad is attached between the inverter motherboard 400 and the inner wall of the metal protective shell 301. The thermal pad is existing technology and is also known as a thermal pad. It is a flexible heat conduction medium used for heat dissipation of electronic devices. The thermal pad is attached between the metal protective shell 301 and the main heat-generating components of the inverter motherboard 400, including insulated gate bipolar transistors, metal-oxide-semiconductor field-effect transistors and rectifier bridges / rectifier modules.

[0024] like Figure 1 and Figure 4 As shown, at least two terminals 106 are fixedly connected to one end of the housing 101. The terminals 106 are existing technology and are used to connect power supply lines. The terminals 106 are electrically connected to the inverter motherboard 400 through flexible lines, and the flexible lines pass through the metal protective housing 301.

[0025] like Figure 3 and Figure 4 As shown, the metal protective shell 301 is located inside the outer shell 101. Several metal heat-conducting fins 302 are fixedly connected to the outer surface of the metal protective shell 301 by welding. The metal heat-conducting fins 302 are used to increase the contact area between the metal protective shell 301 and the air, increase the heat exchange efficiency, and assist in heat dissipation.

[0026] like Figure 3 and Figure 4 As shown, the waterproof fan 200 is fixedly connected to the inner wall of one end of the housing 101 by screws. The housing 101 has a ventilation opening at the position where the waterproof fan 200 is installed. A steel wire protective mesh is fixedly connected to the surface of the ventilation opening to prevent the fan blades of the waterproof fan 200 from getting into people's hands.

[0027] like Figure 2 As shown, a ventilation hole 103 is provided on the side of the outer casing 101 away from the waterproof fan 200. The ventilation hole 103 is used for air circulation. When the waterproof fan 200 is turned on, it blows the outside air into the interior of the outer casing 101 and finally exhausts it from the ventilation hole 103. During this process, the air will exchange heat with the metal protective shell 301 and the metal heat-conducting fins 302 to achieve the heat dissipation effect.

[0028] like Figure 2As shown, a power cord socket 105 is fixedly connected to the side of the outer casing 101 away from the waterproof fan 200. This is prior art. The power cord socket 105 is electrically connected to the inverter motherboard 400 through a flexible line passing through the metal protective casing 301. The surface of the metal protective casing 301 has multiple through holes for flexible line routing. The parts where the flexible line passes through the through holes are coated with sealant to prevent air leakage.

[0029] like Figure 2 and Figure 4 As shown, the side wall of the housing 101 has an installation window 104, and an installation plate 107 is fixedly connected to the installation window 104 by screws. The installation plate 107 is fixedly connected to the inverter main board 400 by screws.

[0030] like Figure 3 and Figure 4 As shown, a partition plate 102 is fixedly connected to the inner side of the housing 101 near the waterproof fan 200. The partition plate 102 prevents the wiring of the terminal 106 from contacting the waterproof fan 200 and prevents the wiring from being damaged by the waterproof fan 200.

[0031] like Figure 3 and Figure 4 As shown, the connection between the inverter mainboard 400 and the mounting plate 107 is coated with sealant, and the connection between the mounting plate 107 and the mounting window 104 is covered with a sealing gasket. The sealant and sealing gasket prevent external moisture from seeping in and affecting the inverter mainboard 400.

[0032] During use, the inverter motherboard 400 generates heat. The heat generated by the inverter motherboard 400 is directed to the metal protective shell 301 via helium gas and thermal pads, and then to the metal heat-conducting fins 302 via the metal protective shell 301. The waterproof fan 200 pushes air to circulate inside the outer shell 101. During this process, the air carries away the heat from the surface of the metal heat-conducting fins 302 and the metal protective shell 301, thus achieving heat dissipation. The surface of the waterproof fan 200 does not need to be covered with a dustproof isolation net and will not be blocked, thus giving it a longer service life. Furthermore, moisture or dust entering the outer shell 101 will be blocked by the metal protective shell 301 and will not affect the normal operation of the inverter motherboard 400.

[0033] In this application, the outer casing 101 serves as the first layer of protection. When the outer casing 101 is damaged by a heavy impact, the metal protective casing 301 can also provide a second layer of protection for the inverter motherboard 400, thus giving this application a high explosion-proof effect.

[0034] The above embodiments are merely examples for clearly illustrating the present invention and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of the present invention.

Claims

1. A hybrid power supply inverter, characterized in that, include; Inverter mainboard (400), which is used to convert DC power into AC power; A heat conduction mechanism (300) is used to conduct heat generated by the inverter motherboard (400) during operation to the outside. It includes a metal protective shell (301), which is fixedly connected to the inverter motherboard (400). A hollow cavity is formed between the metal protective shell (301) and the inverter motherboard (400), and the hollow cavity is filled with helium. A waterproof fan (200) is used to promote air circulation and assist the heat dissipation mechanism (300) in cooling the inverter mainboard (400); The protective mechanism (100) is used to protect and install the waterproof fan (200), the heat conduction mechanism (300) and the inverter mainboard (400), and includes a housing (101).

2. The hybrid power supply inverter as described in claim 1, characterized in that: A thermal pad is attached between the inverter motherboard (400) and the inner wall of the metal protective shell (301).

3. The hybrid power supply inverter as described in claim 1, characterized in that: Two terminals (106) are fixedly connected to one end of the housing (101).

4. The hybrid power supply inverter as described in claim 1, characterized in that: The metal protective shell (301) is located inside the outer shell (101), and metal heat-conducting fins (302) are fixedly connected to the outer surface of the metal protective shell (301).

5. The hybrid power supply inverter as described in claim 1, characterized in that: The waterproof fan (200) is fixedly connected to the inner wall of one end of the housing (101), and the housing (101) has a ventilation opening at the position where the waterproof fan (200) is installed.

6. The hybrid power supply inverter as described in claim 1, characterized in that: The outer casing (101) has a ventilation hole (103) on the side away from the waterproof fan (200).

7. The hybrid power supply inverter as described in claim 1, characterized in that: A power cord socket (105) is fixedly connected to the side of the housing (101) away from the waterproof fan (200).

8. The hybrid power supply inverter as described in claim 1, characterized in that: The side wall of the housing (101) is provided with an installation window (104), and an installation plate (107) is fixedly connected inside the installation window (104). The installation plate (107) is fixedly connected to the inverter main board (400).

9. The hybrid power supply inverter as described in claim 1, characterized in that: A partition plate (102) is fixedly connected to the inner side of the outer casing (101) near the waterproof fan (200).

10. The hybrid power supply inverter as described in claim 1, characterized in that: The connection between the inverter mainboard (400) and the mounting plate (107) is coated with sealant, and the connection between the mounting plate (107) and the mounting window (104) is covered with a sealing gasket.

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