A selectable sideband rejection mixer based on SIP packaging

Abstract

The utility model relates to a selectable sideband suppression mixer based on SIP encapsulation, and it is characterized by: including single-pole double-throw switch S1, its public port connects intermediate frequency input signal, namely IF signal, its first static contact a connects 4 ports of 90 degree bridge B1, its second static contact b connects 1 port of 90 degree bridge B1, 2, 3 ports of 90 degree bridge B1 are connected with 0 degree, 90 degree ports of IQ quadrature mixer T1 one to one respectively, the output end of IQ quadrature mixer T1 outputs radio frequency output signal, namely RF signal. The utility model has realized the function that the radio frequency signal after mixing can select upper and lower sidebands, and the two-one selection switch of absorption type has solved the requirement that one end of 90 degree bridge B1 two input ends connects input signal, and the other end connects load, all circuit devices of the utility model are located in single encapsulation, and the encapsulation has adopted the customization HTCC metal ceramic tube shell, the tube shell encapsulation can reach the air tightness level, the device is simple, convenient to use, and the reliability of product is improved.

Description

Technical Field

[0001] This utility model relates to the field of microwave system integration technology, and in particular to an optional sideband suppression mixer based on SIP packaging. Background Technology

[0002] Currently, IQ mixers are widely used microwave devices in microwave systems, often used in downconversion systems as image rejection mixers. They can also be used in upconversion systems as sideband rejection mixers. When used for upconversion, a bridge is added to the intermediate frequency port of the mixer, and the signal selection input to the bridge port can be selected for either the upper or lower RF sideband. Current circuit implementations involve multiple components, making the circuit relatively complex. SIP (System-in-Package) is based on HTCC multilayer board technology, using vertical interconnection of solder balls to stack multiple substrates. Its main features include: small size (reducing the size to 1 / 5 to 1 / 10 of traditional products for the same specifications); and comprehensive functionality (integrating mixing, filtering, amplification, AGC control, switching, digitally controlled attenuation, and other multi-functional, multi-channel circuits).

[0003] In current microwave systems, although sideband suppressor mixers have achieved basic upconversion and sideband selection functions, existing technical solutions have many shortcomings in practical applications, making it difficult to meet the development needs of high-precision and miniaturized microwave equipment. These problems include low circuit integration, large size and space occupation, high circuit assembly complexity, difficulty in ensuring reliability and consistency, weak environmental adaptability, and high maintenance costs. Utility Model Content

[0004] To address the problems of low integration, large size, poor performance stability, complex assembly, and weak environmental adaptability of existing sideband suppressor mixers, the purpose of this invention is to provide a SIP-based optional sideband suppressor mixer that integrates all functional components into a single HTCC metal-ceramic package, achieving miniaturization of circuit size, high performance stability, and ease of use, while meeting reliability requirements in harsh environments.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a SIP-packaged optional sideband suppression mixer, comprising a single-pole double-throw switch S1, whose common port is connected to the intermediate frequency input signal, i.e., the IF signal; its first stationary contact a is connected to port 4 of the 90° bridge B1; its second stationary contact b is connected to port 1 of the 90° bridge B1; the control signal input terminal of the single-pole double-throw switch S1 is connected to the output terminal of the driver; the input terminal of the driver is connected to the switch drive signal, i.e., the CTRL signal; ports 2 and 3 of the 90° bridge B1 are respectively connected to the 0° and 90° ports of the IQ quadrature mixer T1; the IQ quadrature mixer T1 receives the local oscillator signal, i.e., the Lo signal, amplified by the amplifier U1; and the output terminal of the IQ quadrature mixer T1 outputs the radio frequency output signal, i.e., the RF signal; the single-pole double-throw switch S1, the driver, the 90° bridge B1, the IQ quadrature mixer T1, and the amplifier U1 are integrated and packaged using SIP technology, and the package adopts an HTCC metal-ceramic housing.

[0006] The IQ quadrature mixer T1 is a wideband bare chip.

[0007] The single-pole double-throw switch S1 is an absorption-type two-to-one switch, and the frequency band of the absorption-type two-to-one switch is selected according to the intermediate frequency.

[0008] The saturated output power of the amplifier U1 is greater than or equal to 15dBm.

[0009] The 90° bridge B1 has no internal load, and the frequency band of the 90° bridge B1 is selected according to the intermediate frequency.

[0010] As can be seen from the above technical solution, the beneficial effects of this utility model are as follows: First, the single-pole double-throw switch S1 in this utility model adopts an absorption-type two-to-one switch. The two ports of the absorption-type two-to-one switch are connected to the two input terminals of the 90° bridge, and the output port of the 90° bridge B1 is connected to the I and Q paths of the IQ quadrature mixer T1, realizing the selectability of the upper and lower sidebands of the mixed RF signal. At the same time, the absorption-type two-to-one switch solves the requirement that one end of the two input terminals of the 90° bridge B1 is connected to the input signal and the other end is connected to the load; Second, all circuit components in this utility model Located in a single package, the package utilizes a customized HTCC metal-ceramic housing, which achieves hermeticity. Compared to conventional circuits that use 4 to 5 single-function components to achieve circuit functionality, resulting in larger circuit size and inconvenient component usage, the SIP package allows a single component to perform the same function. This component is simple, easy to use, and improves product reliability. By integrating all functional components into a single HTCC metal-ceramic package, the circuit achieves miniaturization, high performance stability, and ease of use, while also meeting reliability requirements in harsh environments. Attached Figure Description

[0011] Figure 1 This is the circuit schematic diagram of this utility model. Detailed Implementation

[0012] like Figure 1 As shown, a SIP-based optional sideband suppression mixer includes a single-pole double-throw switch S1, whose common port is connected to the intermediate frequency input signal (IF signal). Its first stationary contact a is connected to port 4 of a 90° bridge B1, and its second stationary contact b is connected to port 1 of the 90° bridge B1. The control signal input terminal of the single-pole double-throw switch S1 is connected to the output terminal of a driver. The input terminal of the driver is connected to a switch drive signal (CTRL signal). Ports 2 and 3 of the 90° bridge B1 are respectively connected to the 0° and 90° ports of an IQ quadrature mixer T1. The IQ quadrature mixer T1 receives the local oscillator signal (Lo signal) amplified by amplifier U1. The output terminal of the IQ quadrature mixer T1 outputs a radio frequency (RF) signal. The single-pole double-throw switch S1, the driver, the 90° bridge B1, the IQ quadrature mixer T1, and the amplifier U1 are integrated into a system package using SIP technology, and the package uses an HTCC metal-ceramic housing. The HTCC metal ceramic casing is a customized HTCC casing. The HTCC casing adopts a multi-layer co-fired ceramic substrate, and the internal interconnection circuit is formed by high-temperature co-firing process. The number of layers is designed to be 8 to 12 layers. The power layer, ground layer and signal layer can be flexibly allocated according to the circuit layout requirements, effectively reducing parasitic parameters.

[0013] The IQ quadrature mixer T1 is a wideband bare chip.

[0014] The single-pole double-throw switch S1 is an absorption-type two-to-one switch, and the frequency band of the absorption-type two-to-one switch is selected according to the intermediate frequency.

[0015] The saturated output power of the amplifier U1 is greater than or equal to 15dBm.

[0016] The 90° bridge B1 has no internal load, and the frequency band of the 90° bridge B1 is selected according to the intermediate frequency.

[0017] During operation, the IF signal is input to the single-pole double-throw switch S1, which is driven by the CTRL signal. The control signal is output to port 1 or port 4 of the 90° bridge B1, and output from port 2 or port 3 of the 90° bridge B1. The signal is then split into two quadrature signals with phases of 0° and 90° after passing through the 90° bridge B1. These signals are then output to the 0° and 90° ports of the IQ quadrature mixer T1 and mixed with the Lo signal to obtain the required RF signal.

[0018] In summary, the single-pole double-throw switch S1 in this invention employs an absorptive two-to-one switch. The two ports of the absorptive two-to-one switch are connected to the two input terminals of the 90° bridge B1, and the output port of the 90° bridge B1 is connected to the I and Q paths of the IQ quadrature mixer T1. This achieves selectability of the upper and lower sidebands of the mixed RF signal. Simultaneously, the absorptive two-to-one switch addresses the requirement that one end of the two input terminals of the 90° bridge B1 is connected to the input signal, and the other end to the load. All circuit components in this invention are housed in a single package using a customized HTCC metal-ceramic housing, achieving a hermetically tight seal. Compared to conventional circuits that use 4 to 5 single-function components, resulting in a large circuit size and inconvenient component usage, the SIP package allows a single component to perform the same function. This component is simple, easy to use, and improves product reliability. Integrating all functional components into a single HTCC metal-ceramic package achieves miniaturization of the circuit size, high performance stability, and ease of use, while also meeting reliability requirements in harsh environments.

[0019] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A SiP-based optional sideband suppression mixer, characterized in that: The system includes a single-pole double-throw switch S1, whose common port is connected to the intermediate frequency input signal (IF signal). Its first stationary contact a is connected to port 4 of the 90° bridge B1, and its second stationary contact b is connected to port 1 of the 90° bridge B1. The control signal input terminal of the single-pole double-throw switch S1 is connected to the output terminal of the driver. The input terminal of the driver is connected to the switch drive signal (CTRL signal). Ports 2 and 3 of the 90° bridge B1 are respectively connected to the 0° and 90° ports of the IQ quadrature mixer T1. The IQ quadrature mixer T1 receives the local oscillator signal (Lo signal) amplified by amplifier U1. The output terminal of the IQ quadrature mixer T1 outputs the radio frequency output signal (RF signal). The single-pole double-throw switch S1, the driver, the 90° bridge B1, the IQ quadrature mixer T1, and the amplifier U1 are integrated and packaged using SIP technology. The package uses an HTCC metal-ceramic housing.

2. The optional sideband suppression mixer based on SIP packaging according to claim 1, characterized in that: The IQ quadrature mixer T1 is a wideband bare chip.

3. The optional sideband suppression mixer based on SIP packaging according to claim 1, characterized in that: The single-pole double-throw switch S1 is an absorption-type two-to-one switch, and the frequency band of the absorption-type two-to-one switch is selected according to the intermediate frequency.

4. The optional sideband suppression mixer based on SIP packaging according to claim 1, characterized in that: The saturated output power of the amplifier U1 is greater than or equal to 15dBm.

5. The optional sideband suppression mixer based on SIP packaging according to claim 1, characterized in that: The 90° bridge B1 has no internal load, and the frequency band of the 90° bridge B1 is selected according to the intermediate frequency.

Images