A test device for subway vehicle-mounted signal modulation and demodulation board

Abstract

The utility model discloses a subway vehicle -mounted signal modulation and demodulation board's testing arrangement, including touch formula configuration screen, singlechip module, door state test module and door state indicating module, touch formula configuration screen is used to obtain the test instruction of user issue, singlechip module is used for receiving and according to test instruction sends test signal, door state test module is connected with singlechip module, vehicle -mounted signal modulation and demodulation board respectively, is used to with singlechip module sends test signal modulation as first FSK signal and sends vehicle -mounted signal modulation and demodulation board to vehicle -mounted signal modulation and demodulation board feedback's second FSK signal demodulation as baseband signal and sends singlechip module, door state indicating module is connected with singlechip module, vehicle -mounted signal modulation and demodulation board respectively, is used to with display vehicle -mounted signal modulation and demodulation board carries out digital signal interaction, and shows test state. The utility model can realize the offline test of board spare, improves maintenance efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of subway board testing technology, specifically relating to a testing device for subway vehicle-mounted signal modulation and demodulation boards. Background Technology

[0002] Urban rail transit trains typically communicate with platforms via onboard antennas and station trackside antennas. As the lines age, the probability of failure increases for the onboard signal modem boards on subway APM (Automated People Mover) lines. The onboard signal modem board uses relay contacts of the train doors to sense their opening and closing. It then modulates the current door status and sends it to the onboard antenna. The station trackside antenna transmits the received door status to the platform screen door control system, causing the platform screen doors to open and close in tandem with the door status. Furthermore, the platform screen door opening and closing status is transmitted from the station trackside antenna to the onboard antenna. The onboard modem board receives the signal from the onboard antenna, demodulates it to obtain the platform screen door status signal, and sends it to the train control system. This system then controls the doors to reopen, enabling the train doors to open and close in tandem.

[0003] Currently, there are no dedicated testing methods for the repaired APM line vehicle signal modem boards. Verification can only be done through vehicle installation, which makes the repair results unconvincing and poses certain risks for online use. Moreover, the vehicle installation test requires the use of equipment such as oscilloscopes, analog signal acquisition instruments, and multiple power supplies, and requires at least two repair personnel to spend approximately 8 hours on the test. Utility Model Content

[0004] To overcome one or more of the above-mentioned technical defects, this utility model provides a testing device for subway vehicle-mounted signal modem boards, which enables offline testing of the boards, reduces the labor and time costs of board testing, improves maintenance efficiency and quality, and ensures the operational quality of the subway.

[0005] To solve the above problems, this utility model is implemented according to the following technical solution: A testing device for a subway vehicle-mounted signal modem includes a touch-screen configuration panel, a microcontroller module, a door status testing module, and a door status indication module. The touch-screen configuration panel is used to acquire test commands issued by the user, and the microcontroller module is used to receive and send test signals according to the test commands. The gate state test module is connected to the microcontroller module and the vehicle-mounted signal modem board, respectively. It is used to modulate the test signal sent by the microcontroller module into a first FSK signal and send it to the vehicle-mounted signal modem board, and to demodulate the second FSK signal fed back by the vehicle-mounted signal modem board into a baseband signal and send it to the microcontroller module. The door status indicator module is connected to the microcontroller module and the vehicle signal modem board respectively, and is used to interact with the vehicle signal modem board for digital signal and display the test status.

[0006] Furthermore, the gate state test module includes an FSK modulation unit, which includes an FSK waveform driving circuit, an inverting operational amplifier circuit, and a transistor switching circuit. The input terminal of the FSK waveform driving circuit is connected to the microcontroller module, and the output terminal of the FSK waveform driving circuit is connected to the inverting operational amplifier circuit and the transistor switching circuit, respectively. The output terminal of the inverting operational amplifier circuit is connected to the transistor switching circuit, and the output terminal of the transistor switching circuit is connected to the vehicle signal modem board.

[0007] Furthermore, the gate state test module also includes an FSK demodulation unit, which includes a signal transmission transformer, a first operational amplifier isolation circuit, a second operational amplifier isolation circuit, and a NAND gate trigger circuit. The input terminal of the signal transmission transformer is connected to the vehicle signal modulation and demodulation board, and the output terminal of the signal transmission transformer is connected to the first operational amplifier isolation circuit and the second operational amplifier isolation circuit, respectively. The output terminals of the first operational amplifier isolation circuit and the second operational amplifier isolation circuit are both connected to the input terminal of the NAND gate trigger circuit, and the output terminal of the NAND gate trigger circuit is connected to the microcontroller module.

[0008] Furthermore, the first operational amplifier isolation circuit includes a first operational amplifier bandpass filter circuit, an 8.88k mechanical filter, a first operational amplifier two-stage amplifier circuit, and a first optocoupler isolation circuit connected in sequence. The second operational amplifier isolation circuit includes a second operational amplifier bandpass filter circuit, a 5.92k mechanical filter, a second operational amplifier two-stage amplifier circuit, and a second optocoupler isolation circuit connected in sequence. The input terminals of the first operational amplifier bandpass filter circuit and the second operational amplifier bandpass filter circuit are both connected to the signal transmission transformer. The output terminals of the first optocoupler isolation circuit and the second optocoupler isolation circuit are both connected to the input terminal of the NAND gate trigger circuit.

[0009] Furthermore, the door status indication module includes a three-state door level conversion circuit, a door switch logic error prevention command circuit, a third optocoupler isolation circuit, a door indication circuit, a fourth optocoupler circuit, a shielded door indication circuit, and an on-board signal modem interface. The input terminal of the three-state door level conversion circuit is connected to the microcontroller module, and the output terminal of the three-state door level conversion circuit is connected to the third optocoupler isolation circuit through the door switch logic error prevention command circuit. The door indicator circuit is connected to the output of the third optocoupler isolation circuit and the interface of the vehicle signal modem board, respectively. The shielding door indicator circuit is connected to the microcontroller module via the fourth optocoupler isolation circuit, and also to the interface of the vehicle signal modem board.

[0010] Furthermore, it also includes a power conversion module for converting 24V power to ±15V power to power the test device, and converting 24V power to 5V to power the vehicle signal modem board.

[0011] Furthermore, it also includes a device housing, with the touch-screen configuration panel located on the front of the device housing, and the microcontroller module and door status test module located inside the device housing.

[0012] Compared with the prior art, the present invention has the following beneficial effects: This utility model discloses a testing device for a subway onboard signal modem board, including a touch-screen configuration panel, a microcontroller module, a door status testing module, and a door status indicator module. The touch-screen configuration panel is used to acquire test commands issued by the user. The microcontroller module is used to receive and send test signals according to the test commands. The door status testing module is connected to both the microcontroller module and the onboard signal modem board, and is used to send test signals from the microcontroller module to the onboard signal modem board, and to send door status signals fed back from the onboard signal modem board to the microcontroller module. The door status indicator module is connected to both the microcontroller module and the onboard signal modem board, and is used to display the test status. This device enables the simulation of trackside signals at stations, realizes offline testing of components, reduces the labor and time costs of component testing, improves maintenance efficiency and quality, and ensures the operational quality of the subway. Attached Figure Description

[0013] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings, wherein: Figure 1 This is a schematic diagram of the test device for the subway vehicle-mounted signal modulation and demodulation board described in Example 1; Figure 2 This is a circuit diagram showing the connection between the microcontroller module and the touch-screen configuration screen of the test device for the subway vehicle signal modulation and demodulation board described in Example 1. Figure 3 The circuit diagram of the FSK modulation unit of the test device for the subway vehicle signal modulation and demodulation board described in Example 1 is shown. Figure 4 The circuit diagram of the FSK demodulation unit of the test device for the subway vehicle signal modulation and demodulation board described in Example 1 is shown. Figure 5 The circuit of the door status indicator module of the test device for the subway on-board signal modem board described in Example 1. Figure 1 ; Figure 6 The circuit of the door status indicator module of the test device for the subway on-board signal modem board described in Example 1. Figure 2 ; Figure 7 The circuit of the door status indicator module of the test device for the subway on-board signal modem board described in Example 1. Figure 3 ; Figure 8 This is a schematic diagram of the onboard signal modem interface 470 of the test device for the subway onboard signal modem board described in Example 1; Figure 9 This is a circuit diagram of the power conversion module of the test device for the subway vehicle-mounted signal modulation and demodulation board described in Example 1; Figure 10 This is a schematic diagram of the power supply module of the test device for the subway on-board signal modem board described in Example 1. Figure 1 ; Figure 11 This is a schematic diagram of the power supply module of the test device for the subway on-board signal modem board described in Example 1. Figure 2 ; Figure 12 This is a schematic diagram of the power supply module of the test device for the subway on-board signal modem board described in Example 1. Figure 3 ; Figure 13 This is a schematic diagram of the power supply module of the test device for the subway on-board signal modem board described in Example 1. Figure 4 ; Marker explanation: 1. Touchscreen configuration panel; 2. Microcontroller module; 3. Gate state test module; 310. FSK modulation unit; 311. FSK waveform driving circuit; 312. Inverting operational amplifier circuit; 313. Transistor switching circuit; 320. FSK demodulation unit; 321. Signal transmission transformer; 322. First operational amplifier isolation circuit; 322-1. First operational amplifier bandpass filter circuit; 322-2. 8.88k mechanical filter; 322-3. First operational amplifier secondary amplifier circuit; 322-4. First optocoupler isolation circuit; 323. Second operational amplifier isolation circuit; 323-1. Second operational amplifier bandpass filter circuit; 323-2. 5.92k mechanical filter; 323-3. Second operational amplifier secondary amplifier circuit; 323-4. Second optocoupler isolation circuit; 324. NAND gate trigger circuit; 4. Door status indicator module; 410. Three-state door level conversion circuit; 420. Door switch logic error prevention instruction circuit; 430. Third optocoupler isolation circuit; 440. Door indicator circuit; 450. Fourth optocoupler circuit; 460. Platform screen door indicator circuit; 470. Vehicle signal modem interface; 5. Vehicle-mounted signal modem board; 6. RS232 circuit. Detailed Implementation

[0014] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0015] Example 1 This embodiment discloses a testing device for a subway vehicle-mounted signal modem board, such as... Figure 1 and Figure 2 The system includes a touch-screen configuration panel 1, a microcontroller module 2, a door status test module 3, and a door status indicator module 4. The touch-screen configuration panel 1 is used to acquire test commands issued by the user. The microcontroller module 2 is used to receive and send test signals according to the test commands. The door status test module 3 is connected to both the microcontroller module 2 and the vehicle-mounted signal modem 5. It modulates the test signal sent by the microcontroller module 2 into a first FSK carrier signal and sends it to the vehicle-mounted signal modem 5. It also demodulates the second FSK carrier signal fed back by the vehicle-mounted signal modem 5 into a baseband signal and sends it to the microcontroller module 2. The door status indicator module 4 is connected to both the microcontroller module 2 and the vehicle-mounted signal modem 5. It interacts with the vehicle-mounted signal modem 5 using digital signals and displays the test status. Specifically, the touch-screen configuration panel 1 is connected to the microcontroller module 2 via an RS232 circuit 6. In this embodiment, the microcontroller module 2 uses an STM32F407 microcontroller.

[0016] In this embodiment, the device also includes a housing, with a touch-screen configuration panel 1 disposed on the front of the housing, and a microcontroller module 2 and a door status test module 3 disposed inside the housing.

[0017] Specifically, the gate state test module 3 includes an FSK modulation unit 310 and an FSK demodulation unit 320. In this embodiment, as... Figure 3The FSK modulation unit 310 includes an FSK waveform driving circuit 311, an inverting operational amplifier circuit 312, and a transistor switching circuit 313. The input terminal of the FSK waveform driving circuit 311 is connected to the microcontroller module 2. The output terminal of the FSK waveform driving circuit 311 is connected to the inverting operational amplifier circuit 312 and the transistor switching circuit 313, respectively. The output terminal of the inverting operational amplifier circuit 312 is connected to the transistor switching circuit 313. The output terminal of the transistor switching circuit 313 is connected to the vehicle signal modulation and demodulation board 5.

[0018] The baseband signal output by the microcontroller module 2 is initially processed by the FSK waveform driving circuit 311 and superimposed with the fundamental periodic signal to form an FSK carrier signal. The FSK carrier signal is connected to the transistor switching circuit 313 and the direct-connected transistor switching circuit 313 through the inverting operational amplifier circuit 312 respectively, forming two inverted signals that are sent to the transistor switching circuit 313 and then to the vehicle signal modulation and demodulation board under test.

[0019] In this embodiment, as Figure 4 The FSK demodulation unit 320 includes a signal transmission transformer 321, a first operational amplifier isolation circuit 322, a second operational amplifier isolation circuit 323, and a NAND gate trigger circuit 324. The input terminal of the signal transmission transformer 321 is connected to the vehicle signal modulation and demodulation board 5. The output terminal of the signal transmission transformer 321 is connected to the first operational amplifier isolation circuit 322 and the second operational amplifier isolation circuit 323, respectively. The output terminals of the first operational amplifier isolation circuit 322 and the second operational amplifier isolation circuit 323 are both connected to the input terminal of the NAND gate trigger circuit 324. The output terminal of the NAND gate trigger circuit 324 is connected to the microcontroller module 2.

[0020] Specifically, the first operational amplifier isolation circuit 322 includes a first operational amplifier bandpass filter circuit 322-1, an 8.88k mechanical filter 322-2, a first operational amplifier secondary amplifier circuit 322-3, and a first optocoupler isolation circuit 322-4 connected in sequence; the second operational amplifier isolation circuit 323 includes a second operational amplifier bandpass filter circuit 323-1, a 5.92k mechanical filter 323-2, a second operational amplifier secondary amplifier circuit 323-3, and a second optocoupler isolation circuit 323-4 connected in sequence. The input terminals of the first operational amplifier bandpass filter circuit 322-1 and the second operational amplifier bandpass filter circuit 323-1 are both connected to the signal transmission transformer 321, and the output terminals of the first optocoupler isolation circuit 322-4 and the second optocoupler isolation circuit 323-4 are both connected to the input terminal of the NAND gate trigger circuit 324.

[0021] The FSK carrier signal from the vehicle-mounted signal modem board is isolated and coupled by the signal transmission transformer 321. After isolation and coupling, the signal simultaneously enters the first operational amplifier bandpass filter circuit 322-1 and the second operational amplifier bandpass filter circuit 323-1 for signal frequency filtering, providing preliminary screening and amplification for accurate filtering by the subsequent mechanical filter. The bandpass-amplified signal is then precisely filtered by the 8.88kHz mechanical filter 322-2 and the 5.92kHz mechanical filter 323-2, ensuring that the signal error is retained at ±20Hz. The mechanical filters utilize the principle of frequency resonance to prevent other frequencies from passing through, thus completing the initial decoding of the FSK carrier signal at the mechanical filter.

[0022] The initially decoded signal enters the first operational amplifier stage 2 amplification circuit 322-3 and the second operational amplifier stage 2 amplification circuit 323-3. The signal is amplified again, and the waveform switching between on and off becomes more pronounced. The optocoupler isolation circuit uses capacitors to block the signal, allowing only the frequency-varying signal to pass through, while the preceding inherent frequency signal is turned on. Because the subsequent stage of the optocoupler circuit has electrolytic capacitors for filtering, the waveform signal with its on and off changes has a certain continuity, resulting in a longer conduction length at the same output frequency. The optocoupler isolation circuit can achieve conduction to ground if a fixed frequency signal is present, and pull up to a high level if no fixed frequency signal is present, thus converting the FSK carrier frequency signal into a high or low level signal.

[0023] The first optocoupler isolation circuit 322-4 and the second optocoupler isolation circuit 323-4 respectively output two signals with high and low levels and complementary inversion. The two signals are simultaneously input to the NAND gate trigger circuit 324 to obtain the baseband signal for signal verification and decoding.

[0024] In this embodiment, as Figure 5-7 The door status indicator module 4 includes a three-state door level conversion circuit 410, a door switch logic error prevention command circuit 420, a third optocoupler isolation circuit 430, a door indicator circuit 440, a fourth optocoupler circuit 450, a shielded door indicator circuit 460, and an on-board signal modem interface 470. The input terminal of the three-state door level conversion circuit 410 is connected to the microcontroller module 2, and the output terminal of the three-state door level conversion circuit 410 is connected to the third optocoupler isolation circuit 430 through the door switch logic error prevention command circuit 420. The door indicator circuit 440 is connected to the output terminal of the third optocoupler isolation circuit 430 and the on-board signal modem interface 470, respectively. The shielded door indicator circuit 460 is connected to the microcontroller module 2 through the fourth optocoupler isolation circuit 450 and to the on-board signal modem interface 470. Specifically, the door indicator circuit includes door indicator lights LED1-LED4, and the shielded door indicator circuit includes shielded door indicator lights LED5-LED8. Both the door indicator lights and the shielded door indicator lights are located on the front of the device housing. Figure 8This is a schematic diagram of the interface 470 for the vehicle signal modem board.

[0025] The microcontroller module 2 determines the status of the corresponding output door based on the received baseband signal. The status signal is sent to the tri-state gate level conversion circuit 410 via the I / O port of the microcontroller module 2 to realize the level conversion between 3.3V and 5V. Since the vehicle signal modem board has logic that it cannot reopen the door when it is opened, in order to avoid the vehicle signal modem board receiving incorrect commands due to output logic errors, the output terminal of the tri-state gate level conversion circuit 410 is equipped with a door opening logic error prevention command circuit 420. The status signal is output to the door indicator circuit 440 via the door opening logic error prevention command circuit 420 and the third optocoupler isolation circuit 430, illuminating the door indicator lights LED1-LED4 and sending a door command digital signal to the board under test.

[0026] After receiving the door instruction digital signal, the vehicle signal modem board synchronously changes the issued FSK carrier signal and the platform screen door opening and closing status digital signal. The FSK demodulation unit 320 processes the FSK carrier signal. The platform screen door indicator circuit receives and enables the platform screen door indicator LEDs 5-8 according to the platform screen door opening and closing status digital signal, and feeds back the platform screen door opening and closing status digital signal to the microcontroller module 2 through the fourth optocoupler isolation circuit 450.

[0027] In this embodiment, a power conversion module and a power supply module are also included, such as Figure 9 The power conversion module is used to convert 24V power to ±15V power and 24V power to 5V power, such as... Figure 10-13 The power supply module is connected to the power conversion module, the microcontroller module 2, the door status test module 3, the door status indicator module 4, and the vehicle signal modem interface 470, respectively, to provide working power to each module and the vehicle signal modem.

[0028] In this embodiment, a USB program download port and a JTAG program download port are also included, which are disposed on the device housing. The USB program download port is connected to the touch screen configuration screen and is used to download the configuration screen program; the JTAG program download port is connected to the microcontroller module and is used to download the microcontroller module program.

[0029] The following explanation is based on the specific implementation process: During the vehicle door-platform screen door linkage test, the user inputs test commands via the touch-screen configuration panel. The microcontroller module, based on the test commands, sends a first FSK carrier signal, including door opening / closing status information, to the vehicle-mounted signal modem board via the FSK modulation unit, and illuminates the door indicator light in the door status indicator module. The vehicle-mounted signal modem board receives and feeds back a second FSK carrier signal, also including door opening / closing status information. The FSK demodulation unit demodulates the signal and sends the demodulated signal to the microcontroller module. The platform screen door indicator circuit receives the digital signal indicating the platform screen door's opening / closing status from the vehicle-mounted signal modem board, illuminates the platform screen door indicator light, and feeds back the digital signal to the microcontroller module via the fourth optocoupler isolation circuit.

[0030] During the platform screen door-vehicle door linkage test, the user activates the platform screen door switch on the vehicle signal modem board, sending a digital signal indicating the platform screen door switch status and a third FSK carrier signal containing vehicle door switch status information. The FSK demodulation unit demodulates the third FSK carrier signal and sends the demodulated signal to the microcontroller module. The microcontroller module then illuminates the vehicle door indicator light in the door status indicator module. The platform screen door indicator circuit receives the digital signal indicating the platform screen door switch status from the vehicle signal modem board, illuminates the platform screen door indicator light, and feeds back the digital signal indicating the platform screen door switch status to the microcontroller module through a fourth optocoupler isolation circuit.

[0031] This invention enables the simulation of trackside signals at stations and facilitates offline testing of circuit boards. It solves the problems of complex online testing processes and the need for substantial manpower and resources after maintenance of onboard modem boards in APM lines. This reduces the manpower and time costs of circuit board testing, improves maintenance efficiency and quality, enhances the reliability of subway electronic circuit board maintenance, and ensures the operational quality of the subway.

[0032] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A testing device for a subway vehicle-mounted signal modem board, characterized in that, It includes a touch-screen configuration panel, a microcontroller module, a door status test module, and a door status indicator module. The touch-screen configuration panel is used to acquire test commands issued by the user, and the microcontroller module is used to receive and send test signals according to the test commands. The gate state test module is connected to the microcontroller module and the vehicle-mounted signal modem board, respectively. It is used to modulate the test signal sent by the microcontroller module into a first FSK signal and send it to the vehicle-mounted signal modem board, and to demodulate the second FSK signal fed back by the vehicle-mounted signal modem board into a baseband signal and send it to the microcontroller module. The door status indicator module is connected to the microcontroller module and the vehicle signal modem board respectively, and is used to interact with the vehicle signal modem board for digital signal and display the test status.

2. The testing device for the subway vehicle-mounted signal modulation and demodulation board according to claim 1, characterized in that, The gate state test module includes an FSK modulation unit, which includes an FSK waveform driving circuit, an inverting operational amplifier circuit, and a transistor switching circuit. The input terminal of the FSK waveform driving circuit is connected to the microcontroller module, and the output terminal of the FSK waveform driving circuit is connected to the inverting operational amplifier circuit and the transistor switching circuit, respectively. The output terminal of the inverting operational amplifier circuit is connected to the transistor switching circuit, and the output terminal of the transistor switching circuit is connected to the vehicle signal modem board.

3. The testing device for the subway vehicle-mounted signal modulation and demodulation board according to claim 2, characterized in that, The gate state test module also includes an FSK demodulation unit, which includes a signal transmission transformer, a first operational amplifier isolation circuit, a second operational amplifier isolation circuit, and a NAND gate trigger circuit. The input terminal of the signal transmission transformer is connected to the vehicle signal modulation and demodulation board, and the output terminal of the signal transmission transformer is connected to the first operational amplifier isolation circuit and the second operational amplifier isolation circuit, respectively. The output terminals of the first operational amplifier isolation circuit and the second operational amplifier isolation circuit are both connected to the input terminal of the NAND gate trigger circuit, and the output terminal of the NAND gate trigger circuit is connected to the microcontroller module.

4. The testing device for the subway vehicle-mounted signal modulation and demodulation board according to claim 3, characterized in that, The first operational amplifier isolation circuit includes a first operational amplifier bandpass filter circuit, an 8.88k mechanical filter, a first operational amplifier two-stage amplifier circuit, and a first optocoupler isolation circuit connected in sequence. The second operational amplifier isolation circuit includes a second operational amplifier bandpass filter circuit, a 5.92k mechanical filter, a second operational amplifier two-stage amplifier circuit, and a second optocoupler isolation circuit connected in sequence. The input terminals of the first operational amplifier bandpass filter circuit and the second operational amplifier bandpass filter circuit are both connected to the signal transmission transformer. The output terminals of the first optocoupler isolation circuit and the second optocoupler isolation circuit are both connected to the input terminal of the NAND gate trigger circuit.

5. The testing device for the subway vehicle-mounted signal modulation and demodulation board according to claim 4, characterized in that, The door status indication module includes a three-state door level conversion circuit, a door switch logic error prevention command circuit, a third optocoupler isolation circuit, a door indicator circuit, a fourth optocoupler circuit, a shielded door indicator circuit, and an interface for an on-board signal modem. The input of the three-state door level conversion circuit is connected to the microcontroller module, and the output of the three-state door level conversion circuit is connected to the third optocoupler isolation circuit through the door switch logic error prevention command circuit. The door indicator circuit is connected to the output of the third optocoupler isolation circuit and the interface of the vehicle signal modem board, respectively. The shielding door indicator circuit is connected to the microcontroller module via the fourth optocoupler isolation circuit, and also to the interface of the vehicle signal modem board.

6. The testing device for the subway vehicle-mounted signal modulation and demodulation board according to claim 1, characterized in that, It also includes a power conversion module for converting 24V power to ±15V power to power the test device, and for converting 24V power to 5V power to power the vehicle signal modem board.

7. The testing device for the subway vehicle-mounted signal modulation and demodulation board according to claim 1, characterized in that, It also includes a device housing, with the touch-screen configuration panel located on the front of the device housing, and the microcontroller module and the door status test module located inside the device housing.

Images