Heat dissipation device, energy storage converter and energy storage system
By setting air guide plates and through holes on the air duct cover of the energy storage converter, the air volume is guided to be evenly distributed, which solves the problem of uneven temperature of IGBT modules and improves the heat dissipation effect and performance of the energy storage converter.
Patent Information
- Application Number
- CN202521983210.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-15
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-09-15
AI Technical Summary
The temperature of the IGBT modules in existing energy storage converters is uneven, leading to performance degradation.
A heat dissipation device is designed, which guides the airflow evenly by setting air guide plates and through holes on the air duct cover, thereby improving the cooling effect of the IGBT module in the middle position, and uses a backward-inclined centrifugal fan for heat dissipation.
This achieves balanced heat dissipation of the IGBT module, ensuring the stability and efficiency of the energy storage converter performance.
Smart Images
Figure CN224684591U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of energy storage system technology, and in particular to a heat dissipation device, an energy storage converter, and an energy storage system. Background Technology
[0002] The energy storage converter is the core power electronic device in an energy storage system, primarily responsible for bidirectional energy conversion between AC and DC power. Current technologies generally employ air-cooled radiators for heat dissipation, often using a top-intake, bottom-exhaust cooling scheme. Due to the characteristics of centrifugal fans, the airflow at the edges of the duct is significantly greater than in the center. Taking a three-phase IGBT module (A / B / C) as an example, because the B-phase IGBT module is located in the middle of the duct, its temperature rise is generally about 10K higher than that of the A / C phase IGBT modules. This uneven temperature distribution among the three phases severely impacts the performance of the energy storage converter. Utility Model Content
[0003] This invention provides a heat dissipation device, an energy storage converter, and an energy storage system to solve the defect in the prior art where uneven internal temperature of the energy storage converter affects its performance.
[0004] This utility model provides a heat dissipation device, including: Heat dissipation equipment; A duct cover plate is connected to the heat dissipation device and forms a duct that communicates with the heat dissipation device. The duct cover plate has a first through hole and at least one second through hole. The first through hole is located away from the heat dissipation device, and the second through hole is located close to the heat dissipation device. The first through hole and the second through hole are respectively adapted to communicate with the corresponding IGBT module. An air guide plate is disposed on the air duct cover and located outside the second through hole, for guiding airflow into the second through hole.
[0005] According to the heat dissipation device provided by this utility model, multiple air guide plates are provided, and the air guide plates are located on the outer side of the second through hole near the first through hole.
[0006] According to the heat dissipation device provided by this utility model, two air guide plates are provided, and the two air guide plates are staggered and arranged on the outside of the second through hole.
[0007] According to the heat dissipation device provided by this utility model, the air guide plate includes: The first air guide plate is disposed on a portion of the edge of one side wall of the second through hole, and the other portion of the edge of one side wall of the second through hole forms a ventilation gap with the first air guide plate; The second air guide plate is symmetrically arranged with respect to the first air guide plate about the center of the second through hole.
[0008] The heat dissipation device provided by this utility model further includes: Air duct top plate; The duct enclosure, together with the duct top plate and the duct cover plate, forms a duct box for accommodating the heat dissipation equipment.
[0009] According to the heat dissipation device provided by this utility model, the heat dissipation device includes: a backward-curved centrifugal fan.
[0010] This utility model also provides an energy storage converter, including: the heat dissipation device of this utility model.
[0011] The energy storage converter provided by this utility model also includes: Multiple IGBT modules are configured corresponding to the first or second through-hole.
[0012] According to the energy storage converter provided by this utility model, the IGBT module includes: First IGBT module; Second IGBT module; The third IGBT module is disposed between the first IGBT module and the second IGBT module; Two first through holes are provided, one of which corresponds to the first IGBT module and the other corresponds to the second IGBT module; one second through hole is provided, which corresponds to the third IGBT module.
[0013] This utility model also provides an energy storage system, including: the heat dissipation device of this utility model, or the energy storage converter of this utility model.
[0014] This utility model provides a heat dissipation device, comprising: a heat dissipation unit, an air duct cover, and an air guide plate. The air duct cover is connected to the heat dissipation unit, forming an air duct communicating with the heat dissipation unit. The air duct cover has a first through hole and at least one second through hole. The first through hole is located away from the heat dissipation unit, and the second through hole is located close to the heat dissipation unit. The first through hole and the second through hole are respectively adapted to communicate with the corresponding IGBT module. The air guide plate is disposed on the air duct cover and located outside the second through hole, for guiding airflow into the second through hole. This utility model provides a heat dissipation device that, by setting the air guide plate, guides airflow from outside the second through hole into the second through hole, thereby increasing the airflow into the second through hole, thus enhancing the cooling effect of the IGBT module located in the middle, achieving balanced heat dissipation of the IGBT module, and ensuring stable performance of the energy storage converter.
[0015] Furthermore, the energy storage converter provided by this utility model has the same advantages as described above because it includes the heat dissipation device in the above embodiments of this utility model.
[0016] Furthermore, the energy storage system provided by this utility model has the same advantages as described above because it includes the heat dissipation device or energy storage converter in the above embodiments of this utility model. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the overall structure of the heat dissipation device provided in one embodiment of the present invention.
[0019] Figure 2 This is a schematic diagram of the structure of the air duct cover, the first air guide plate and the second air guide plate provided in one embodiment of the present invention.
[0020] Figure label: 1: Heat dissipation equipment; 2: Air duct cover plate; 21: First through hole; 22: Second through hole; 31: First air guide plate; 32: Second air guide plate; 4: Air duct top plate; 5: Air duct enclosure plate; 61: First IGBT module; 62: Second IGBT module; 63: Third IGBT module. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0022] In the description of this embodiment, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this embodiment and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this embodiment.
[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this embodiment, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0024] In this embodiment, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," "link," and "fix" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.
[0025] In this embodiment of the utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0026] The following is combined with Figures 1-2 This invention describes a heat dissipation device. The heat dissipation device includes: a heat dissipation unit 1, an air duct cover 2, and an air guide plate.
[0027] The duct cover 2 is connected to the heat dissipation device 1, forming an air duct that communicates with the heat dissipation device 1. The duct cover 2 has a first through hole 21 and at least one second through hole 22. The first through hole 21 is located away from the heat dissipation device 1, and the second through hole 22 is located close to the heat dissipation device 1. The first through hole 21 and the second through hole 22 are respectively adapted to communicate with the corresponding IGBT module. A guide plate is provided on the duct cover 2 and located outside the second through hole 22 to guide airflow into the second through hole 22.
[0028] Specifically, the heat dissipation device 1 provides cooling for the energy storage converter. In this embodiment, wind power is used for cooling. Therefore, a duct for cooling airflow is formed downstream of the heat dissipation device 1 through the duct cover plate 2. A first through hole 21 and a second through hole 22 are machined on the duct cover plate 2 to deliver the cooling air to the corresponding IGBT module (Insulated Gate Bipolar Transistor; hereinafter referred to as IGBT module) for heat dissipation.
[0029] Cooling air from the heat dissipation device 1 dissipates heat from the corresponding IGBT modules through the first through-hole 21 or the second through-hole 22. Since the heat dissipation device 1 often uses a centrifugal fan, the centrifugal blades rotate with a higher linear velocity at their edges, resulting in a larger airflow. Therefore, the airflow near the edge of the centrifugal blades is greater, leading to better cooling of the IGBT modules at the edges and poorer cooling for those in the middle. This invention addresses this by placing a second through-hole 22 near the geometric center of the heat dissipation device 1 and a first through-hole 21 away from the geometric center. A guide vane is placed on the outside of the second through-hole 22 to guide the airflow into it, thereby increasing the airflow into the second through-hole 22 and enhancing the cooling effect on the IGBT modules in the middle. This achieves balanced heat dissipation for the IGBT modules and ensures stable performance of the energy storage converter.
[0030] This utility model provides a heat dissipation device, comprising: a heat dissipation device 1, an air duct cover 2, and an air guide plate. The air duct cover 2 is connected to the heat dissipation device 1, forming an air duct communicating with the heat dissipation device 1. The air duct cover 2 has a first through hole 21 and at least one second through hole 22. The first through hole 21 is located away from the heat dissipation device 1, and the second through hole 22 is located close to the heat dissipation device 1. The first through hole 21 and the second through hole 22 are respectively adapted to communicate with the corresponding IGBT module. The air guide plate is disposed on the air duct cover 2 and located outside the second through hole 22, for guiding airflow into the second through hole 22. The heat dissipation device provided by this utility model, by setting the air guide plate, guides the airflow outside the second through hole 22 into the second through hole 22, thereby increasing the airflow into the second through hole 22, thereby enhancing the cooling effect of the IGBT module located in the middle, achieving balanced heat dissipation of the IGBT module, and ensuring stable performance of the energy storage converter.
[0031] In one embodiment of this utility model, multiple air guide plates are provided, and the air guide plates are located on the outer side of the second through hole 22 near the first through hole 21. Specifically, the second through hole 22 is located directly below the heat dissipation device 1. According to the centrifugal fan exhaust principle described above, the air volume near the first through hole 21 is greater. Therefore, the air guide plates are located on the outer side of the second through hole 22 near the first through hole 21, thereby guiding the cooling air outside the second through hole 22 into the second through hole 22, enhancing the cooling effect and achieving balanced heat dissipation.
[0032] In one embodiment of this utility model, two air guide plates are provided, and the two air guide plates are staggered on the outside of the second through hole 22. In this embodiment, multiple IGBT modules are arranged in a "I" shape. Taking three IGBT modules as an example, the first through holes 21 corresponding to the IGBT modules on the left and right sides are not provided with air guide plates, and only the second through hole 22 corresponding to the middle IGBT module is provided with an air guide plate; and, one air guide plate is provided on each of the left and right sides of the second through hole 22, and the two air guide plates are staggered on both sides of the second through hole 22.
[0033] In one embodiment of this utility model, the air guide plate includes a first air guide plate 31 and a second air guide plate 32. The first air guide plate 31 is disposed on a portion of the edge of one sidewall of the second through hole 22, and the other portion of the edge of the sidewall of the second through hole 22 forms a ventilation gap with the first air guide plate 31; the second air guide plate 32 is symmetrically arranged with the first air guide plate 31 about the center of the second through hole 22. In this embodiment, the first air guide plate 31 and the second air guide plate 32 are staggered, that is, the size of the first air guide plate 31 is smaller than the sidewall of the second through hole 22, and it is disposed on the edge of the second through hole 22, so that the air guide plate cannot completely cover the sidewall of the second through hole 22 to form a ventilation gap, while the second air guide plate 32 is symmetrically arranged with the center of the first air guide plate 31, and the center of symmetry is the geometric center of the second through hole 22. With the first air guide plate 31 and the second air guide plate 32 arranged as described above, cooling air can be guided into the second through hole 22 on the one hand, and cooling air can be allowed to pass through in the horizontal direction on the other hand. The first air guide plate 31 and the second air guide plate 32 are staggered in the horizontal direction, forming a semi-open air guide plate design, which can guide the transverse air through the second through hole 22, thereby increasing the air intake of the second through hole 22.
[0034] Specifically, the first air guide plate 31 and the second air guide plate 32 can be set vertically or obliquely on the air duct cover plate 2. The oblique angle design can guide more cooling air into the second through hole 22, resulting in better cooling effect. The angle of the first air guide plate 31 and the second air guide plate 32 can be adjusted according to the actual situation to achieve balanced heat dissipation of each IGBT module.
[0035] In one embodiment of this utility model, the heat dissipation device further includes: a top duct plate 4 and a duct enclosure plate 5. The duct enclosure plate 5, together with the top duct plate 4 and the duct cover plate 2, forms a duct box for accommodating the heat dissipation device 1. Specifically, the top duct plate 4 is located at the top, the duct cover plate 2 is located at the bottom, and four duct enclosure plates 5 are used to form a cuboid duct box. The heat dissipation device 1 is disposed inside the duct box, serving to accommodate the duct cover plate 2 and forming an air duct inside.
[0036] In one embodiment of this utility model, the heat dissipation device 1 includes a backward-curved centrifugal fan. Of course, other types of centrifugal fans can also be used depending on the actual situation.
[0037] This utility model provides an energy storage converter. The energy storage converter includes the heat dissipation device described in the above embodiments of this utility model.
[0038] The energy storage converter provided by this utility model has the same advantages as described above because it includes the heat dissipation device in the above embodiments of this utility model.
[0039] In one embodiment of the present invention, the energy storage converter further includes: a plurality of IGBT modules, which are correspondingly arranged with the first through hole 21 or the second through hole 22; the heat dissipation device 1 performs air cooling heat dissipation on the IGBT modules through the corresponding first through hole 21 or the second through hole 22.
[0040] In one embodiment of this utility model, the IGBT module includes: a first IGBT module 61, a second IGBT module 62, and a third IGBT module 63. The third IGBT module 63 is disposed between the first IGBT module 61 and the second IGBT module 62; two first through holes 21 are provided, one corresponding to the first IGBT module 61 and the other corresponding to the second IGBT module 62; one second through hole 22 is provided, corresponding to the third IGBT module 63. In this embodiment, three IGBT modules and three through holes are provided.
[0041] This invention also provides an energy storage system. The energy storage system includes: the heat dissipation device described in the above embodiments of this invention, or the energy storage converter described in the above embodiments of this invention.
[0042] The energy storage system provided by this utility model has the same advantages as described above because it includes the heat dissipation device or energy storage converter in the above embodiments of this utility model.
[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A heat dissipating device, characterized by, Comprising: a heat dissipation device (1); an air duct cover plate (2) connected with the heat dissipation device (1) and forming an air duct in communication with the heat dissipation device (1), the air duct cover plate (2) being provided with a first through hole (21) and at least one second through hole (22), the first through hole (21) being arranged away from the heat dissipation device (1), the second through hole (22) being arranged close to the heat dissipation device (1), the first through hole (21) and the second through hole (22) being adapted to communicate with corresponding IGBT modules respectively; an air deflector arranged on the air duct cover plate (2) and located outside the second through hole (22) for guiding air volume into the second through hole (22).
2. The heat dissipating device according to claim 1, wherein The air deflector is provided in multiple, and the air deflector is located outside the second through hole (22) close to the first through hole (21).
3. The heat dissipating device according to claim 2, wherein The air deflector is provided in two, and the two air deflectors are staggered arranged outside the second through hole (22).
4. The heat dissipating device according to claim 3, wherein The air deflector comprises: a first air deflector (31) arranged on part of the edge of one side wall of the second through hole (22), the other part of the edge of one side wall of the second through hole (22) forming a ventilation gap with the first air deflector (31); a second air deflector (32), the second air deflector (32) and the first air deflector (31) are symmetrically arranged about the center of the second through hole (22).
5. The heat dissipating device according to any one of claims 1 to 4, wherein Further comprising: an air duct top plate (4); an air duct surrounding plate (5) which, together with the air duct top plate (4) and the air duct cover plate (2), forms an air duct box for accommodating the heat dissipation device (1).
6. The heat dissipating device according to any one of claims 1 to 4, wherein The heat dissipation device (1) comprises a backward inclined centrifugal fan.
7. An energy storage converter, characterized by Comprising: The heat dissipation device of any one of claims 1 to 6.
8. The energy storage converter of claim 7, wherein, Further comprising: a plurality of IGBT modules arranged corresponding to the first through hole (21) or the second through hole (22).
9. The energy storage converter of claim 8, wherein, The IGBT module comprises: a first IGBT module (61); a second IGBT module (62); a third IGBT module (63) arranged between the first IGBT module (61) and the second IGBT module (62); The first through hole (21) is provided in two, one of the first through holes (21) is arranged corresponding to the first IGBT module (61), and the other first through hole (21) is arranged corresponding to the second IGBT module (62); the second through hole (22) is provided in one, and the second through hole (22) is arranged corresponding to the third IGBT module (63).
10. An energy storage system characterized by, Comprising: The heat dissipation device of any one of claims 1 to 6, or the energy storage converter of any one of claims 7 to 9.