A waterproof reverse-sticking LED packaging structure

Abstract

The utility model relates to LED packaging technical field discloses a waterproof reverse pasting type LED packaging structure, including the substrate, the substrate outside fixedly connected with a plurality of pole piece, the LED chip main part is installed to the substrate inside, the LED chip main body outside is provided with the packaging assembly, the seal assembly is provided with to the substrate top. In the utility model, through setting the clamping slot on the substrate, and utilizing a T type section's glue layer clamping block to fix the glue layer, like the dovetail in the carpenter, it has formed a firm physical interlock between the glue layer and the substrate, has reached an exceptionally firm, can resist stress tearing waterproof sealing effect, compared with prior art, the packaging glue only relies on the scheme of chemical adhesion and is attached to the smooth substrate surface, solves its because long -term thermal expansion and contraction and material aging, the edge of glue layer will certainly produce the peeling, the technical pain point of warping, has prevented the formation of water vapor penetration channel.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and in particular to a waterproof reverse-mount LED packaging structure. Background Technology

[0002] Currently, in applications requiring high-level protection, such as outdoor displays and landscape lighting, reverse-mount LED packaging structures have become an important technological direction. This type of structure places the electrical connection points of the LED chip on the back of the PCB substrate, with the light-emitting surface facing the front. Subsequently, manufacturers pour a layer of transparent encapsulating adhesive over the entire front of the substrate to encapsulate the LED, achieving the initial purpose of waterproofing and dustproofing.

[0003] However, in actual long-term use, this front-side encapsulating adhesive is typically made of polyurethane or silicone polymers. The substrate it adheres to is often an FR-4 epoxy board or a metal substrate. These two materials have vastly different physical properties, especially their coefficients of thermal expansion (CTE), which are completely mismatched. When LED devices experience day-night temperature differences, seasonal changes, or their own heat generation and cooling cycles outdoors, the encapsulating adhesive layer and the substrate will expand and contract at different rates.

[0004] This repeated, inconsistent deformation creates a persistent, tearing-like shear stress at the interface where the two materials meet, especially at the edges of the encapsulant. Initially, this stress is supported by the chemical adhesive force of the encapsulant itself. However, over time, after thousands of temperature cycles, this adhesive force, like a repeatedly bent wire, will fatigue and age. Eventually, the edges of the encapsulant will inevitably peel off slightly from the substrate, forming gaps that are difficult to detect with the naked eye. Once these gaps appear, they become excellent channels for moisture and corrosive substances to invade, rendering the entire waterproof design ineffective and severely impacting the long-term reliability and lifespan of the product.

[0005] To address the above issues, a waterproof reverse-mount LED packaging structure is proposed. Utility Model Content

[0006] To overcome the above deficiencies, this utility model provides a waterproof reverse-mount LED packaging structure, which aims to improve the problem in the prior art where the thermal expansion coefficients of the encapsulating adhesive and the substrate are mismatched. Under long-term hot and cold cycles, the edges of the encapsulating adhesive, which relies solely on chemical bonding, are prone to stress peeling and cracking, which in turn forms water vapor penetration channels, ultimately leading to a decrease in the waterproof performance of the structure or even failure.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a waterproof reverse-mount LED packaging structure, including a substrate, a plurality of electrode sheets fixedly connected to the outside of the substrate, an LED chip body installed inside the substrate, a packaging component disposed on the outside of the LED chip body, and a sealing component disposed on the top of the substrate;

[0008] The packaging assembly includes a slot, the inner wall of which is formed inside the substrate. A glue layer block is provided on the inner wall of the slot. A glue layer is fixedly connected to the top of the glue layer block. A reflector is installed on the outer side of the glue layer. The outer side of the LED chip body is disposed inside the glue layer block.

[0009] As a further description of the above technical solution:

[0010] The sealing assembly includes multiple studs, the studs are fixedly connected to the inside of the base plate on the outside, a lead screw is threadedly connected to the inside of the studs, an annular plate is rotatably connected to the outside of the lead screw, two sealing rings are fixedly connected to the bottom of the annular plate, a sealing cover is fixedly connected to the inner wall of the annular plate, and a lead screw is fixedly connected to the outside of the annular plate.

[0011] As a further description of the above technical solution:

[0012] The bottom of the reflector is located on the top of the substrate.

[0013] As a further description of the above technical solution:

[0014] The bottom of the sealing ring contacts the top of the substrate.

[0015] As a further description of the above technical solution:

[0016] The cross-section of one end of the adhesive layer card block is T-shaped.

[0017] As a further description of the above technical solution:

[0018] The outer side of the reflector is disposed on the inner wall of the sealing cover.

[0019] As a further description of the above technical solution:

[0020] The bottom of the sealing cover is in contact with the top of the substrate.

[0021] As a further description of the above technical solution:

[0022] The substrate has pin slots inside.

[0023] This utility model has the following beneficial effects:

[0024] 1. In this utility model, by opening a slot on the substrate and using a T-shaped adhesive layer clip to fix the adhesive layer, similar to a dovetail joint in woodworking, a strong physical interlock is formed between the adhesive layer and the substrate, achieving an exceptionally strong waterproof seal that can resist stress tearing. Compared with the existing technology, where the encapsulating adhesive only relies on chemical bonding to adhere to the surface of a flat substrate, this solves the technical problem that the adhesive layer edge will inevitably peel off and lift due to long-term thermal expansion and contraction and material aging, thus preventing the formation of water vapor penetration channels.

[0025] 2. In this utility model, by rotating the lead screw fixed to the outside of the annular plate, it engages with the stud pre-installed inside the substrate. Tightening the lead screw generates strong axial pressure, pressing the annular plate and the sealing cover downwards as a whole. This pressure fully compresses the bottom sealing ring, forming a tight, gapless waterproof sealing layer with the top of the substrate. At the same time, the bottom of the sealing cover also contacts the top of the substrate, completely compacting the elastic sealing ring and forming a seamless, highly reliable airtight and watertight layer with the substrate. Simultaneously, it ensures that the bottom of the sealing cover fits tightly with the substrate, creating a fully enclosed, controlled, and extremely robust mechanical hard-seal protective cavity, completely isolating the internal core packaged components from external moisture, dust, and other environmental factors. Attached Figure Description

[0026] Figure 1 This is a perspective view of a waterproof reverse-mount LED packaging structure proposed in this utility model;

[0027] Figure 2 This is a schematic diagram of the sealing cover of a waterproof reverse-adhesive LED packaging structure proposed in this utility model;

[0028] Figure 3 This is a schematic diagram of the reflector structure of a waterproof reverse-adhesive LED packaging structure proposed in this utility model;

[0029] Figure 4 This is a schematic diagram of the LED chip body of a waterproof reverse-mount LED packaging structure proposed in this utility model.

[0030] Legend:

[0031] 1. Substrate; 2. Electrode; 3. Lead slot; 4. Card slot; 5. LED chip body; 6. Adhesive layer card block; 7. Reflector; 8. Sealing cover; 9. Annular plate; 10. Lead screw; 11. Sealing ring; 12. Stud; 13. Adhesive layer. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Reference Figures 1-3 The present invention provides an embodiment of a waterproof reverse-mount LED packaging structure, comprising a substrate 1, a plurality of electrode sheets 2 fixedly connected to the outside of the substrate 1, an LED chip body 5 installed inside the substrate 1, a packaging component disposed on the outside of the LED chip body 5, and a sealing component disposed on the top of the substrate 1.

[0034] The packaging assembly includes a slot 4, the inner wall of which is formed inside the substrate 1. A glue layer block 6 is provided on the inner wall of the slot 4. A glue layer 13 is fixedly connected to the top of the glue layer block 6. A reflector 7 is installed on the outside of the glue layer 13. The outer side of the LED chip body 5 is disposed inside the glue layer block 6.

[0035] Specifically, substrate 1 serves as the basic support platform and physical barrier for the entire structure, while LED chip body 5 serves as the protected core light-emitting unit. Its electrical energy is introduced from the external circuit through electrode 2 fixed on the outside of substrate 1. In order to achieve reliable encapsulation of LED chip body 5, slot 4 provides a physically anchored groove structure inside substrate 1. Adhesive layer block 6 is embedded in this slot 4 to form a stable locking base. Adhesive layer 13 is fixed on adhesive layer block 6 to completely cover LED chip body 5, forming a physically interlocked and robust sealing layer. Reflector 7 is installed on the outside of adhesive layer 13 to effectively converge and optimize light output.

[0036] Reference Figures 1-3 The sealing assembly includes multiple studs 12. The studs 12 are fixedly connected to the inside of the base plate 1 on the outside. A lead screw 10 is threadedly connected to the inside of the studs 12. An annular plate 9 is rotatably connected to the outside of the lead screw 10. Two sealing rings 11 are fixedly connected to the bottom of the annular plate 9. A sealing cover 8 is fixedly connected to the inner wall of the annular plate 9. The lead screw 10 is fixedly connected to the outside of the annular plate 9.

[0037] Specifically, multiple studs 12 are used to provide a stable threaded anchor point inside the substrate 1, the lead screw 10 is used to generate strong axial pressure through rotational engagement, the annular plate 9 is used to bear the pressure and transmit it evenly, the sealing cover 8 fixed to its inner wall is used to construct a robust external protective cavity, and the two sealing rings 11 located at the bottom of the annular plate 9 are used to be fully compressed under this pressure, ultimately forming a tight and seamless waterproof sealing layer.

[0038] Reference Figures 1-3 The bottom of the reflector 7 is set on the top of the substrate 1, the bottom of the sealing ring 11 is in contact with the top of the substrate 1, one end of the adhesive layer clip 6 has a T-shaped cross section, the outer side of the reflector 7 is set on the inner wall of the sealing cover 8, the bottom of the sealing cover 8 is in contact with the top of the substrate 1, and the substrate 1 has a pin groove 3 inside.

[0039] Specifically, the T-shaped cross-section of the adhesive layer clip 6 provides a strong physical anchoring effect, ensuring a firm bond with the substrate 1; the reflector 7 is used to stably sit on top of the substrate 1 to ensure the accuracy of its optical position; the sealing cover 8 is used to completely house the reflector 7 within its inner wall, while its bottom also contacts the top of the substrate 1, thereby creating a closed protective space; and the sealing ring 11 is ultimately used to form a core sealing interface that achieves waterproofing through a tight fit with the substrate 1, and the pin slot 3 is used to provide a precise receiving and guiding channel for the electrical pins of the LED.

[0040] Working principle: First, the LED chip body 5 is installed inside the substrate 1. During installation, its conductive electrode 2 can be directly mounted to the circuit board from the reverse side without bending. This places the electrode 2 on the outside of the substrate 1, which itself forms a robust physical barrier, completely isolating the core light-emitting unit from the electrical connection points, fundamentally eliminating the possibility of moisture eroding the circuit from the front.

[0041] In order to seal the LED chip body 5, a slot 4 is formed around the chip on the substrate 1. A T-shaped adhesive layer block 6 is placed in the slot 4. The adhesive layer 13 is fixedly connected to the adhesive layer block 6. After the adhesive is potted and cured, the adhesive layer 13 forms a strong physical interlock with the slot 4 of the substrate 1 through the adhesive layer block 6. The reflector 7 is placed on the outside of the adhesive layer 13 and sits on the top of the substrate 1 to optimize the light output.

[0042] An assembly with an annular plate 9 and a sealing cover 8 is placed on top of the substrate 1, completely covering the core reflector 7 and the adhesive layer 13. Two sealing rings 11 are fixed to the bottom of the annular plate 9.

[0043] By rotating the lead screw 10 fixed to the outside of the annular plate 9, it engages with the stud 12 pre-installed inside the substrate 1. Tightening the lead screw 10 generates strong axial pressure, pressing the annular plate 9 and the sealing cover 8 downwards as a whole. This pressure fully compresses the bottom sealing ring 11, forming a tight and gapless waterproof sealing layer with the top of the substrate 1. At the same time, the bottom of the sealing cover 8 also contacts the top of the substrate 1, forming all-round protection.

[0044] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A waterproof reverse-mount LED packaging structure, comprising a substrate (1), characterized in that: Multiple electrode plates (2) are fixedly connected to the outside of the substrate (1), an LED chip body (5) is installed inside the substrate (1), an encapsulation component is provided on the outside of the LED chip body (5), and a sealing component is provided on the top of the substrate (1). The encapsulation assembly includes a slot (4), the inner wall of which is opened inside the substrate (1), a glue layer block (6) is provided on the inner wall of the slot (4), a glue layer (13) is fixedly connected to the top of the glue layer block (6), a reflector (7) is installed on the outer side of the glue layer (13), and the outer side of the LED chip body (5) is disposed inside the glue layer block (6).

2. The waterproof reverse-mount LED packaging structure according to claim 1, characterized in that: The sealing assembly includes a plurality of studs (12), the studs (12) are fixedly connected to the outside of the base plate (1), a lead screw (10) is threaded inside the studs (12), an annular plate (9) is rotatably connected to the outside of the lead screw (10), two sealing rings (11) are fixedly connected to the bottom of the annular plate (9), a sealing cover (8) is fixedly connected to the inner wall of the annular plate (9), and the lead screw (10) is fixedly connected to the outside of the annular plate (9).

3. The waterproof reverse-mount LED packaging structure according to claim 1, characterized in that: The bottom of the reflector (7) is disposed on the top of the substrate (1).

4. The waterproof reverse-mount LED packaging structure according to claim 2, characterized in that: The bottom of the sealing ring (11) is in contact with the top of the substrate (1).

5. The waterproof reverse-mount LED packaging structure according to claim 1, characterized in that: The cross-section of one end of the adhesive layer card block (6) is T-shaped.

6. The waterproof reverse-mount LED packaging structure according to claim 2, characterized in that: The reflector (7) is disposed on the outer side of the inner wall of the sealing cover (8).

7. A waterproof reverse-mount LED packaging structure according to claim 2, characterized in that: The bottom of the sealing cover (8) is in contact with the top of the substrate (1).

8. The waterproof reverse-mount LED packaging structure according to claim 1, characterized in that: The substrate (1) has a pin slot (3) inside.

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