A tape carrier package structure

Abstract

The utility model discloses a kind of with component board level packaging structure, and packaging structure includes glass substrate, bonding material layer, insulating material layer, bare chip, component, wire, plastic encapsulation layer, wiring layer, back adhesive film, globular solder;Packaging method includes the installation of bare chip and component on insulating material layer;After product plastic encapsulation, re-wiring layer;After debonding, paste back adhesive film, then ball mounting and cutting.In the application, by using packaging technology, in board level 2D packaging, component and other forms of Die can be sealed in Pkg, the function of component is introduced to RDL by the way of wire, compared with prior art, ensure the diversity of product, simultaneously meet the corresponding resistance value requirement and the requirement of multiple form Die sealing by placing different kinds of components;And component is integrated in Pkg, then Pkg and thickness of product can be greatly reduced, so that product miniaturization, light and thin.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a board-level packaging structure with components. Background Technology

[0002] Currently, chip packaging structures are relatively simple, mainly consisting of the chip, internal RDL circuitry, and EMC, without related components. This makes it impossible to meet customer requirements for capacitance, resistance, and various die packaging methods. The inability to meet customer requirements for capacitance and resistance is mainly reflected in the inability to form a complete circuit module within a single package (Pkg) to achieve specific functions (such as signal processing, power management, and communication). Existing technologies can only mount components on the spherical surface of the package Pkg. External component mounting requires reserving space for components or mounting components on the back of the ball, which imposes requirements on the ball height. Therefore, the overall product thickness or the overall Pkg becomes larger.

[0003] Therefore, it is necessary to develop a board-level packaging structure with components to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to design a board-level packaging structure with components in order to solve the above problems.

[0005] This utility model achieves the above objectives through the following technical solutions: A board-level package structure with components includes: Glass substrate; Bonding material layer; the bonding material layer is coated on the upper surface of the glass substrate; Insulating material layer; the insulating material layer is coated on the upper surface of the bonding material layer; At least one nude film; Components; both bare chips and components are fixedly mounted on an insulating material layer; Wire; the first end of the wire is connected to the component, and the second end of the wire is set upward at the same height as the protrusion on the bare die; Molding layer; molding layer encapsulates the die, die bumps, components, and wiring.

[0006] Furthermore, the component board-level package structure also includes a wiring layer. After the bumps of the die and the top of the wires are ground on the top of the molding compound, the wiring layer is mounted on the top of the molding compound and connected to the bumps of the die and the top of the wires.

[0007] Furthermore, after removing the glass substrate, bonding material layer, and insulating material layer, an adhesive film is pasted onto the bottom of the molding compound.

[0008] Furthermore, multiple spherical solder balls are implanted on top of the wiring layer.

[0009] Preferably, the copper terminals of the vertical components of the wire are provided.

[0010] As another preferred option, when there are at least two dies, the at least two dies are connected by leads.

[0011] The beneficial effects of this utility model are as follows: In this application, by utilizing packaging technology, components and other types of dies can be encapsulated within the Pkg in board-level 2D packaging. The functionality of the components is brought out onto the RDL through wire bonding. Compared with existing technologies, this ensures product diversity and simultaneously meets the corresponding resistance and capacitance requirements and the requirements of multiple types of die encapsulation by placing different types of components (various types of capacitors, resistors, etc.). Furthermore, integrating components within the Pkg can significantly reduce the product's Pkg and thickness, resulting in miniaturized and thinner products. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of step S1 in a packaging method with a component board-level package structure; Figure 2 This is a schematic diagram of step S2 in a packaging method with a component board-level package structure; Figure 3 This is a schematic diagram of step S3 in a packaging method with a component board-level package structure; where A is a cross-sectional view and B is a top view. Figure 4 This is a schematic diagram of step S4 in a packaging method with a component board-level package structure; where A is a cross-sectional view and B is a top view. Figure 5 This is a schematic diagram of step S5 in a packaging method with a component board-level package structure; where A is a sectional view and B is a top view. Figure 6 This is a schematic diagram of step S6 in a packaging method with a component board-level package structure; where A is a sectional view and B is a top view. Figure 7 This is a schematic diagram of step S7 in a packaging method with a component board-level package structure; where A is a sectional view and B is a top view. Figure 8 This is a schematic diagram of another embodiment; where A is a sectional view and B is a top view.

[0013] Legend: 1. Glass substrate, 2. Bonding material layer, 3. Insulating material layer, 4. First die, 5. Second die, 6. Lead, 7. Component, 8. Wire, 9. Molding layer, 10. Wiring layer, 11. Ball solder, 12. Adhesive film. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0015] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0016] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0017] In the description of this utility model, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0018] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0019] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0020] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0021] Example 1 like Figure 1-5As shown, a board-level package structure with components includes: Glass substrate 1; Bonding material layer 2; Bonding material layer 2 is coated on the upper surface of glass substrate 1; Insulating material layer 3; Insulating material layer 3 is coated on the upper surface of bonding material layer 2; Two bare dies; the two bare dies are connected by a lead wire 6. The two bare dies are: a first bare die 4 located below and a second bare die 5 located above, with the second bare die 5 placed above the first bare die 4. Component 7; Both bare chips and component 7 are fixedly mounted on insulating material layer 3; Wire 8; the first end of wire 8 is connected to component 7, and the second end of wire 8 is set upward at the same height as the protrusion of the bare die; wire 8 is set perpendicular to the copper terminal of component 7; Molding layer 9; Molding layer 9 encapsulates the bare die, the bumps on the bare die, the components 7, and the wires 8; Wiring layer 10; After grinding the bumps of the bare die and the top of the wire 8 on the top of the molding layer 9, the wiring layer 10 is mounted on the top of the molding layer 9 and connected to the bumps of the bare die and the top of the wire 8. like Figure 6 As shown, after removing the glass substrate 1, bonding material layer 2 and insulating material layer 3, an adhesive film 12 is pasted on the bottom of the molding layer 9.

[0022] like Figure 7 As shown, multiple spherical solder balls 11 are implanted on the top of the wiring layer 10.

[0023] Example 2 like Figure 8 As shown, unlike Example 1, there is only one bare die in this example.

[0024] In the fabrication of Example 1: A packaging method with a component board-level package structure includes the following steps: S1, such as Figure 1 As shown, a bonding material layer 2 is formed by coating a bonding material onto a glass substrate 1; the bonding material is laser debonding adhesive. S2, such as Figure 2 As shown, an insulating material layer 3 is formed by coating an insulating material onto the surface of the bonding material; the insulating material is polyimide. S3, such as Figure 3 As shown, two dies and component 7 are fixedly mounted on the insulating material layer 3, and wire bonding is performed on the copper terminals of component 7 using a wire bonding machine; die-to-die interconnection wire bonding is performed between the two chips. S4, such as Figure 4 As shown, the bare die, the bumps on the bare die, component 7, and wire 8 are molded, and after molding, grinding is used to expose the pillars and wire 8. S5, such as Figure 5 As shown, a redistribution layer 10 (RDL) is formed on the bumps and the surface of the wire 8 of the polished die; the redistribution layer 10 includes physical vapor deposition (PVD Ti / Cu), photoresist coating, exposure, development, electroplating, photoresist removal, etching and polishing in sequence. S6, such as Figure 6 As shown, on the product with completed redistribution layer 10 (RDL), after debonding the glass carrier and cleaning the temporary insulating material, the adhesive film 12 is pasted on the same side. S7, such as Figure 7 As shown, the product with the adhesive backing film 12 pasted on is then ball-planted and cut into individual units.

[0025] like Figure 8 As shown, when manufacturing Example 2, there is only one bare die, and there is no need to connect the two bare dies.

[0026] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

Claims

1. A board-level package structure with components, characterized in that, include: Glass substrate; Bonding material layer; A bonding material layer is coated on the upper surface of the glass substrate; Insulating material layer; An insulating material layer is coated on the upper surface of the bonding material layer; At least one nude film; Components; both bare chips and components are fixedly mounted on an insulating material layer; Wire; the first end of the wire is connected to the component, and the second end of the wire is set upward at the same height as the protrusion on the bare die; Molding layer; molding layer encapsulates the die, die bumps, components, and wiring.

2. The component-based board-level packaging structure according to claim 1, characterized in that, The component board-level package structure also includes a wiring layer. After the bumps of the die and the top of the wires are ground on the top of the molding compound, the wiring layer is mounted on the top of the molding compound and connected to the bumps of the die and the top of the wires.

3. The component-based board-level packaging structure according to claim 2, characterized in that, After removing the glass substrate, bonding material layer and insulating material layer, an adhesive film is pasted onto the bottom of the molding compound.

4. The component-based board-level packaging structure according to claim 3, characterized in that, Multiple spherical solder balls are implanted on top of the wiring layer.

5. A board-level packaging structure with components according to claim 1, characterized in that, Copper terminal arrangement for vertical components in wires.

6. A board-level packaging structure with components according to claim 1, characterized in that, When there are at least two dies, the at least two dies are connected by leads.

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