An air conditioning system based on semiconductor refrigeration heating technology

CN224694660UActive Publication Date: 2026-08-28NANJING LENGYUAN MATRIX TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202521130750.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-06-04
Publication Date
2026-08-28
Estimated Expiration
2035-06-04

AI Technical Summary

Technical Problem

[0003]针对上述问题，本发明提供一种集成化、高精度、低能耗的半导体空调系统，解决现有技术中功能单一、精度不足及能效低下的缺陷

Benefits of technology

[0012]1、实现双向换热与多功能集成的功能：半导体制冷片双向工作，结合加热、加湿模块，实现“制冷加除湿”、“制热加加湿”等多模式切换；

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Abstract

The utility model discloses an air conditioning system based on semiconductor refrigeration heating technology, including double air duct structure, semiconductor refrigeration piece bidirectional working module and heating and humidification integrated module, wherein: double air duct structure includes air duct no.
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