PCB substrate baking jig

Abstract

The utility model discloses a kind of PCB substrate baking fixture, it is related to PCB processing technical field, it includes supporting plate and apron;Apron is covered in the upper surface of supporting plate;The upper surface of supporting plate is provided with sunken recess groove;Recess groove bottom is provided with the vent hole through the lower surface of supporting plate;The lower surface of supporting plate is provided with wind deflector;Wind deflector is covered in the vent hole of the lower surface of supporting plate in height direction, and wind deflector has air inlet and outlet in horizontal direction.The utility model provides a kind of PCB substrate baking fixture by setting wind deflector to the hollow part of fixture, while realizing ventilation, avoid hot blast direct blow PCB substrate, avoid that PCB substrate is warped seriously and stress release is insufficient.

Description

Technical Field

[0001] This utility model relates to the field of PCB processing technology, and in particular to a PCB substrate baking fixture. Background Technology

[0002] In the PCB (Printed Circuit Board) manufacturing process, baking is one of the most crucial core processes, widely used in key steps such as solder resist curing, substrate pretreatment, and post-component soldering curing. This process typically requires placing the PCB substrate in a high-temperature environment and heating it continuously for several minutes to several hours to stabilize material properties or ensure seamless process transitions. However, the inherent material properties and structural characteristics of the PCB substrate itself cause it to face severe deformation problems during high-temperature baking, becoming a key bottleneck restricting product yield and performance.

[0003] Currently, the fixtures used for baking PCB substrates in existing technologies are generally recessed platforms with open bottoms, into which the PCB substrate is embedded for baking. However, the baking oven is equipped with an exhaust fan, which blows air into the oven, causing hot air to directly contact the PCB substrate through the bottom openings of the fixture. This direct exposure of the PCB substrate to hot air can lead to excessively rapid drying in certain areas, resulting in severe warping and insufficient stress release. Utility Model Content

[0004] To address the technical problems of warping and insufficient stress relief caused by direct hot air blowing on PCB substrates in existing technologies, this utility model provides a PCB substrate baking fixture. By setting a wind shield at the cutout of the fixture, ventilation is achieved while preventing hot air from blowing directly on the PCB substrate.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: This utility model provides a PCB substrate baking fixture, including a tray and a cover plate; the cover plate covers the upper surface of the tray; a recessed groove is formed on the upper surface of the tray; a vent hole is formed at the bottom of the groove, penetrating the lower surface of the tray; a wind deflector is provided on the lower surface of the tray; the wind deflector covers the vent hole on the lower surface of the tray in the height direction, and the wind deflector has an air inlet and outlet in the horizontal direction.

[0006] The PCB substrate baking fixture provided by this utility model preferably includes a wind deflector comprising a base plate, a first side plate, and a second side plate, wherein: the base plate is disposed parallel to the lower surface of the support plate; the bottom sides of the first side plate and the bottom sides of the second side plate are respectively connected to opposite sides of the base plate along the ventilation direction of the wind deflector; the top sides of the first side plate and the top sides of the second side plate are connected to the lower surface of the support plate; the base plate, the first side plate, the second side plate, and the lower surface of the support plate are interconnected to form a ventilation duct with ventilation openings at both ends.

[0007] The PCB substrate baking fixture provided by this utility model preferably includes a ventilation baffle in the wind shield; ventilation baffles are provided at both ends of the ventilation duct; the ventilation baffle includes a first baffle and a second baffle; the first baffle and the second baffle are arranged at intervals in the ventilation direction and have an overlapping area in the ventilation direction.

[0008] The above technical solution has the following advantages or beneficial effects: This utility model provides a PCB substrate baking fixture, relating to the field of PCB processing technology, which includes a tray and a cover plate; the cover plate covers the upper surface of the tray; a recessed groove is formed on the upper surface of the tray; a vent hole penetrating the lower surface of the tray is formed at the bottom of the groove; a wind deflector is provided on the lower surface of the tray; the wind deflector covers the vent hole on the lower surface of the tray in the height direction, and has air inlets and outlets in the horizontal direction. This utility model provides a PCB substrate baking fixture that, by setting a wind deflector at the hollowed-out part of the fixture, achieves ventilation while preventing hot air from directly blowing onto the PCB substrate, thus avoiding severe warping of the PCB substrate and insufficient stress release. Attached Figure Description

[0009] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0010] Figure 1 This is an overall structural diagram of a PCB substrate baking fixture provided in Embodiment 1 of this utility model; Figure 2 This is a structural diagram of a windshield for a PCB substrate baking fixture provided in Embodiment 1 of this utility model; Figure 1-2 Includes: 1. support plate; 11. groove; 12. vent hole; 2. cover plate; 3. windshield; 31. base plate; 32. first side plate; 33. second side plate; 34. first baffle; 35. second baffle. Detailed Implementation

[0011] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0012] Example 1: like Figure 1-2 As shown: This utility model provides a PCB substrate baking fixture, including a tray 1 and a cover plate 2; the cover plate 2 covers the upper surface of the tray 1; a recessed groove 11 is provided on the upper surface of the tray 1; a vent hole 12 is provided at the bottom of the groove 11, which passes through the lower surface of the tray 1; a wind shield 3 is provided on the lower surface of the tray 1; the wind shield 3 covers the vent hole 12 on the lower surface of the tray 1 in the height direction, and the wind shield 3 has an air inlet and outlet in the horizontal direction.

[0013] When using the PCB substrate baking fixture provided by this utility model to bake the PCB substrate, the PCB substrate is first placed in the groove 11, which corresponds to the outline of the PCB substrate. Different models and sizes of PCB substrates correspond to different grooves 11. Then, the cover plate 2 is placed on top, which can cover the entire groove 11, so that the upper surface of the PCB substrate can be covered by the cover plate 2 to prevent the PCB substrate from deforming due to heat. The cover plate 2 is connected to the support plate 1 by bolts. Specifically, screw holes are opened around the support plate 1, and bolts are set at the corresponding positions on the cover plate 2. After the above process, the upper and lower surfaces of the PCB substrate can be pressed and fixed, and its periphery is also limited by the groove 11. Then, it can be sent into the baking oven for baking. During the baking process, the hot air blown inside the oven will be blocked by the baffle 3 when it blows towards the vent 12 from the front, so that the hot air cannot directly blow onto the PCB substrate through the vent 12. At the same time, the baffle 3 has air inlets and outlets on both sides in the horizontal direction, so the hot air can enter the interior of the baffle 3 from the side and contact the PCB substrate through the vent 12 to heat the PCB substrate.

[0014] The PCB substrate baking fixture provided by this utility model avoids hot air blowing directly onto the PCB substrate by setting a wind deflector 3, which reduces the heating rate of the PCB substrate and makes the heating rate of each part more uniform. This effectively avoids the problem of warping or insufficient stress release caused by the PCB substrate due to excessively rapid or uneven heating.

[0015] As a specific implementation of the windshield 3, in a preferred embodiment of this example, the windshield 3 includes a base plate 31, a first side plate 32, and a second side plate 33, wherein: the base plate 31 is disposed parallel to the lower surface of the support plate 1; the bottom sides of the first side plate 32 and the second side plate 33 are respectively connected to opposite sides of the base plate 31 along the ventilation direction of the windshield 3; the top sides of the first side plate 32 and the second side plate 33 are connected to the lower surface of the support plate 1; the base plate 31, the first side plate 32, the second side plate 33, and the lower surface of the support plate 1 are interconnected to form a ventilation duct with ventilation openings at both ends.

[0016] The wind deflector 3 is actually a ventilation duct formed by connecting the base plate 31, the first side plate 32, and the second side plate 33 in sequence. It blocks the side facing the lower surface of the support plate 1 to prevent hot air from blowing directly on it. At the same time, inlets and outlets for ventilation are provided on both sides. The above structure can both allow hot air to enter the wind deflector 3 and prevent hot air from blowing directly on the PCB substrate, causing it to heat up too quickly.

[0017] At a certain angle, hot air can enter obliquely through the side inlet and outlet of the wind deflector 3, potentially blowing directly onto the PCB substrate. To prevent hot air from blowing obliquely into the interior of the wind deflector 3, in a preferred embodiment, the wind deflector 3 further includes ventilation baffles; ventilation baffles are provided at both ends of the ventilation duct; the ventilation baffles include a first baffle 34 and a second baffle 35; the first baffle 34 and the second baffle 35 are spaced apart in the ventilation direction and have an overlapping area in the ventilation direction. The first baffle 34 and the second baffle 35 are spaced apart and overlapped, so that after the hot air is decelerated by the first baffle 34 and the second baffle 35, it cannot blow directly into the interior of the wind deflector 3, thus preventing lateral hot air from blowing directly into the interior of the wind deflector 3.

[0018] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the application filed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not claimed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the appended claims.

[0019] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A PCB substrate baking fixture, characterized in that, It includes a tray and a cover plate; the cover plate covers the upper surface of the tray; the upper surface of the tray has a recessed groove; the bottom of the groove has a vent hole that extends through the lower surface of the tray; the lower surface of the tray is provided with a windproof cover; the windproof cover covers the vent hole on the lower surface of the tray in the height direction, and the windproof cover has an air inlet and outlet in the horizontal direction.

2. The PCB substrate baking fixture according to claim 1, characterized in that, The windshield includes a base plate, a first side plate, and a second side plate, wherein: the base plate is disposed parallel to the lower surface of the support plate; the bottom sides of the first side plate and the bottom sides of the second side plate are respectively connected to opposite sides of the base plate along the ventilation direction of the windshield; the top sides of the first side plate and the top sides of the second side plate are connected to the lower surface of the support plate; the base plate, the first side plate, the second side plate, and the lower surface of the support plate are interconnected to form a ventilation duct with ventilation openings at both ends.

3. The PCB substrate baking fixture according to claim 2, characterized in that, The windshield also includes ventilation baffles; the ventilation baffles are provided at both ends of the ventilation duct; the ventilation baffles include a first baffle and a second baffle; the first baffle and the second baffle are arranged at intervals in the ventilation direction and have overlapping areas in the ventilation direction.

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