A multi-node integrated host farm chassis device

Abstract

The application provides a multi-node integrated host farm case device, which comprises a 6U case, six host bays are vertically arranged in the case, at least one of the host bays is provided with a host, a partition is arranged in the middle of the host bay, the host bay is divided into a first bay and a second bay which are communicated with each other, a mainboard of the host is arranged in the first bay, wherein, a power supply and a display card are arranged in the second bay, the power supply is electrically connected to the mainboard and the display card, the display card is electrically connected to the mainboard, and the end of the first bay and the second bay is provided with a ventilation window which is communicated with the outside. Through the vertical integration of the multi-host bay structure and the tapered cold air channel design, high-density deployment and directional heat dissipation are realized, and the device has the advantages of improving space utilization, optimizing heat dissipation efficiency and reducing operation and maintenance cost.

Description

Technical Field

[0001] This application relates to the field of server chassis technology, and in particular to a multi-node integrated host farm chassis device. Background Technology

[0002] Currently, data center server deployments commonly employ a single-host, independent installation approach. This traditional deployment model suffers from numerous technical bottlenecks. In terms of space utilization, standard server racks are limited by the size of a single server chassis, resulting in a limited number of compute nodes that can be deployed per unit space, severely restricting the space utilization efficiency of data centers. Regarding system cabling, each independent host requires its own power cable, network cable, and display interface, increasing the complexity of cable management and significantly raising maintenance costs. In terms of equipment maintenance, distributed deployment necessitates disassembling and reassembling the entire device or even the entire rack for troubleshooting and component replacement, greatly reducing maintenance efficiency.

[0003] In terms of energy management, traditional deployment methods involve independent operation of each host power supply and cooling system, making unified monitoring and optimized adjustment of energy consumption difficult. In terms of cooling system design, airflow from multiple independent devices interferes with each other, increasing the load on the data center cooling system, which not only increases energy consumption but also affects overall heat dissipation. Furthermore, using multiple standard chassis leads to redundant configurations of casing materials, power supplies, and interface boards, resulting in high overall system costs. Therefore, this invention proposes a multi-node integrated host farm chassis device to address the potential problems in existing technologies at least in terms of bay space. Utility Model Content

[0004] In view of the aforementioned problems, this application is made in order to provide a multi-node integrated host farm chassis device that overcomes or at least partially solves the aforementioned problems, and has the advantages of improving space utilization, optimizing heat dissipation efficiency and reducing operation and maintenance costs.

[0005] A multi-node integrated host farm chassis device, comprising:

[0006] The 6U chassis has six vertically arranged host bays; at least one host bay is equipped with a host computer; a partition is provided in the middle of the host bay to divide the host bay into a first bay and a second bay that are interconnected; the host motherboard is located in the first bay; the power supply and graphics card are located in the second bay; the power supply is electrically connected to the motherboard and the graphics card, and the graphics card is electrically connected to the motherboard; both the first bay and the second bay have ventilation windows at their ends that connect to the outside.

[0007] Furthermore, the main unit bay is mounted inside the 6U chassis via guide rails. A mesh structure is provided at the ventilation window locations.

[0008] Furthermore, the graphics card is electrically connected to the motherboard's graphics card interface via an extended data cable, or the second compartment is equipped with a graphics card adapter, the graphics card is plugged into the graphics card adapter, and the graphics card adapter is electrically connected to the motherboard's graphics card interface via an extended data cable.

[0009] Furthermore, the 6U chassis has a first mounting ear vertically arranged on the outside; the mounting ear has several first waist holes vertically arranged; and a handle is provided in the middle of the mounting ear.

[0010] Furthermore, this application also proposes an air-guiding cooling duct device, the technical solution of which is as follows: it includes an air-guiding assembly; the air-guiding assembly includes second mounting ears symmetrically arranged on both sides of the air-guiding cavity; each second mounting ear has at least two transverse second waist holes and at least one longitudinal third waist hole arranged vertically; the air-guiding cavity is connected to the first mounting ear of the 6U chassis or the bracket of the cabinet through the second waist holes and / or the third waist holes, as well as screws, so that the opening of the air-guiding cavity faces the ventilation window and the ground air outlet of the 6U chassis, forming a semi-enclosed cooling air channel; the cavity shape of the air-guiding cavity is at a preset angle, so that the cooling air channel forms a gradually narrowing directional air duct.

[0011] Furthermore, the flow guide cavity is provided with an orientation-adjustable suppression fin; wherein the suppression fin is hinged to the flow guide cavity and faces the chassis.

[0012] Furthermore, the flow guiding cavity is made of a magnetic metal; and a magnet is hinged to the upper end of the suppression fin.

[0013] Furthermore, the cavity of the guide chamber is inclined at an angle of 30°-75°, forming a gradually narrowing directional air duct.

[0014] Furthermore, the cavity is tilted at a 45° angle.

[0015] This application has the following advantages:

[0016] In the embodiments of this application, a 6U chassis is used, which has six vertically arranged host bays; at least one host bay is equipped with a host; a partition is provided in the middle of the host bay, dividing the host bay into a first bay and a second bay that are interconnected; the host motherboard is located in the first bay; the power supply and graphics card are located in the second bay; the power supply is electrically connected to the motherboard and the graphics card, and the graphics card is electrically connected to the motherboard; both the first bay and the second bay have ventilation windows at their ends that communicate with the outside. By vertically integrating a multi-host bay structure and a tapered air cooling channel design, high-density deployment and directional heat dissipation are achieved, which has the advantages of improving space utilization, optimizing heat dissipation efficiency, and reducing operation and maintenance costs. Attached Figure Description

[0017] To more clearly illustrate the technical solution of this application, the drawings used in the description of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a multi-node integrated host farm chassis device provided in one embodiment of this application;

[0019] Figure 2 This is a schematic diagram of the structure inside the first host compartment of a multi-node integrated host farm chassis device provided in an embodiment of this application;

[0020] Figure 3 This is a schematic diagram of the structure inside the second host compartment of a multi-node integrated host farm chassis device provided in one embodiment of this application;

[0021] Figure 4 This is a schematic diagram of the air guide assembly of a multi-node integrated host farm chassis device according to an embodiment of this application;

[0022] Figure 5 This is a schematic diagram of the structure of a multi-node integrated host farm chassis device with suppression fins inside the air guide assembly provided in one embodiment of this application;

[0023] Figure 6 This is a schematic diagram of the structure of a multi-node integrated host farm chassis device with magnetic plates on the suppression fins, according to an embodiment of this application;

[0024] Figure 7 for Figure 6 Enlarged view of cabin A in China.

[0025] In the attached diagram: 101, 6U chassis; 102, first mounting ear; 103, first waist hole; 104, handle; 201, main unit bay; 202, mesh structure; 203, ventilation window; 204, motherboard; 205, power supply; 206, graphics card; 207, graphics card adapter; 208, partition; 301, airflow guide cavity; 302, second mounting ear; 303, second waist hole; 304, third waist hole; 305, suppression fins; 306, magnetic plate. Detailed Implementation

[0026] To make the objectives, features, and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are one type of embodiment of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0027] Reference Figures 1 to 3 This application illustrates a multi-node integrated host farm chassis device, comprising: a 6U chassis 101 with six host bays 201 vertically arranged inside; at least one host bay 201 is equipped with a host; a partition 208 is provided in the middle of the host bay 201, dividing the bay into a first bay and a second bay that are interconnected; a motherboard 204 is disposed in the first bay, and a power supply 205 and a graphics card 206 are disposed in the second bay; the power supply 205 is electrically connected to the motherboard 204 and the graphics card 206; ventilation windows 203 communicating with the outside are provided at the ends of the first bay and the second bay.

[0028] The 6U chassis 101 refers to a chassis structure with a height of six rack units conforming to the EIA-310 standard. It can be implemented using an aluminum alloy frame and steel plates, providing standardized installation space for multi-node deployments. The main unit bay 201 refers to an independent chamber inside the chassis used to house the main unit. It can be formed by stamping partitions, with a vertical arrangement design improving space utilization. The partition 208 refers to the internal partitioning components of the bay, which can be implemented using metal plates with a perforated structure, isolating the motherboard 204 from high-power components while maintaining airflow. The ventilation window 203 refers to the opening area at the end of the bay, where dust filters or airflow guide grilles can be installed to create directional airflow channels and reduce equipment temperature.

[0029] The separate compartment layout of the motherboard 204, power supply 205, and graphics card 206 avoids electromagnetic interference. The perforated structure of the partition 208 allows cool air to enter through the ventilation window 203 and pass through both compartments. When the external cooling system blows air, the airflow flows sequentially through the motherboard 204 heatsink in the first compartment and the graphics card 206 heatsink in the second compartment, forming a series heat exchange path. The centralized placement of the power supply 205 in the second compartment shortens the power supply line, and the connection of each host node through a unified cable tray reduces cable crossings. The ventilation windows 203 are symmetrically located at both ends of the compartment, and together with the rack-level airflow design, they achieve separation of hot and cold airflow, avoiding localized high temperatures caused by airflow recirculation. This solution solves the problem of traditional independent hosts requiring separate cooling fans and power supply 205 modules, while this solution reduces redundant components by sharing the ventilation window 203 and centralized power supply. In existing technologies, the installation of the motherboard 204 and graphics card 206 in the same compartment easily leads to heat accumulation; this solution's separate compartment design provides high-power components with independent heat dissipation space. Traditional deployment methods require each host to be individually fixed; this solution's rail-mounted compartment structure supports quick plug-and-play maintenance.

[0030] Through the above technical solutions, this application achieves a compact multi-node deployment, increasing the capacity of a standard rack to six times that of traditional methods. The compartmentalized layout optimizes the heat dissipation path, avoiding the heat accumulation effect between the motherboard 204 and the graphics card 206. Centralized management of the power supply 205 and graphics card 206 simplifies cable routing, allowing maintenance to be performed only on the faulty compartment. The ventilation window 203 works in conjunction with the rack's airflow, reducing cooling system energy consumption by more than 20%.

[0031] This application further proposes that the main unit compartment 201 is installed inside the 6U chassis 101 via guide rails (not shown in the figure), and a mesh structure 202 is provided at the ventilation window 203 position.

[0032] The guide rails serve as linear support structures to support and guide the movement of the compartments. They can be implemented using sliding rails or roller tracks, allowing the compartments to be pulled out along a preset path. The mesh structure 202 is a porous filter layer covering the ventilation window 203, which can be implemented using metal wire mesh or plastic mesh. Its pore distribution controls airflow direction and prevents foreign objects from entering. The guide rails are fixed to both sides inside the chassis, engaging with slots or rollers on the compartment sidewalls to form a sliding connection. When maintenance or replacement of the main unit is required, the compartment can be pulled out along the guide rails, avoiding the need to disassemble the entire chassis structure. The mesh structure 202 at the ventilation window 203 covers the outside of the opening, forming a filtration barrier through evenly distributed mesh holes. This reduces turbulence and intercepts dust and other impurities as airflow passes through. The installation method of the guide rails allows multiple compartments to be aligned within a limited space, avoiding wasted space due to misalignment. The pore density of the mesh structure 202 can be adjusted according to heat dissipation requirements. For example, a larger pore ratio can be used in high-temperature areas to enhance ventilation efficiency, while a denser mesh can be used in areas prone to contamination to improve protection capabilities.

[0033] Compared to existing technologies, traditional chassis typically use bolts to secure compartments, requiring individual disconnection of connectors during disassembly, leading to low maintenance efficiency. Existing ventilation structures are mostly open designs, lacking airflow guidance and foreign object protection, easily causing uneven heat dissipation and equipment contamination. This solution, through the combination of guide rails and a mesh structure 202, optimizes airflow management while enabling rapid assembly and disassembly. It solves the problem of low compartment installation space utilization, allowing multiple mainframe nodes to be maintained independently within a compact layout; it reduces the decrease in heat dissipation efficiency caused by turbulent airflow, and the mesh structure 202 creates directional airflow and reduces the risk of equipment contamination.

[0034] The aforementioned graphics card 206 is electrically connected to the graphics card 206 interface of the motherboard 204 via an extended data cable, or the second compartment is equipped with a graphics card adapter 207, the graphics card 206 is plugged into the graphics card adapter 207, and the graphics card adapter 207 is electrically connected to the graphics card 206 interface of the motherboard 204 via an extended data cable.

[0035] The extended data cable refers to a flexible cable with signal transmission capabilities, which can be implemented using a high-density shielded cable. Its length can be adjusted according to the spacing between the compartments, allowing the graphics card 206 and the motherboard 204 to be arranged in separate compartments. The graphics card adapter interface 207 is a plug-in connector fixed to the second compartment. It can be implemented using a standard host Ie interface or a customized interface, and is used to carry the graphics card 206 and establish an indirect connection with the motherboard 204.

[0036] In the first embodiment, the graphics card 206 is directly connected to the motherboard 204 via an extended data cable. The cable extends through a pre-reserved channel in the partition 208 to the second compartment, allowing the graphics card 206 to be independently installed in the area where the power supply 205 is located. In the second embodiment, the graphics card adapter 207 is pre-fixed to the side wall of the second compartment. After the graphics card 206 is vertically inserted into the adapter, the adapter connects to the motherboard 204 via a cable, forming a modular plug-and-play structure. Both methods achieve partitioned layout of the motherboard 204 and the graphics card 206 through physical isolation. The cable length can adapt to different chassis sizes, and the rigid fixing structure of the adapter prevents loosening.

[0037] Compared to existing technologies, traditional PCs directly install the graphics card 206 into the motherboard 204 slot, resulting in cables being concentrated in one compartment, requiring complete disassembly for maintenance. This solution achieves cross-compartment connection through extended cables or adapters, eliminating cable stacking. Maintenance only requires disassembling the graphics card 206 or the adapter module, without moving the motherboard 204. This solves the complex wiring problem caused by the connection between the graphics card 206 and motherboard 204 in multi-node integrated PCs, reduces heat dissipation obstruction caused by cable crossings, and enables independent maintenance of the graphics card 206. The adapter structure provides quick plug-and-play functionality, shortening the replacement time for faulty components, and the flexibility of the extended cables can adapt to different chassis internal space layouts.

[0038] This application further proposes a mounting ear with a waist-shaped hole structure vertically arranged on the outside of the chassis, and a handle 104 in the middle of the mounting ear. The first mounting ear 102 is a vertical metal structure fixed to the outside of the chassis for connecting and fixing the chassis to the cabinet. It can be made of sheet metal, stamped and welded or riveted to the side wall of the chassis, with a thickness of 1.5-3mm to balance strength and weight. The first waist-shaped hole 103 is an elongated oval through hole arranged along the length of the mounting ear. It can be formed by stamping or laser cutting, with a length of 30-50mm to provide a range for fine-tuning the lateral position, and a width matching the diameter of a standard screw for locking. The handle 104 is a gripping structure that is recessed inward or protruding outward in the middle of the mounting ear. In this application, an outward protruding gripping structure is preferred. Specifically, a U-shaped groove can be formed on the mounting ear body by stamping, or an additional metal strip can be welded as a handle. Its width can be 80-120mm to fit the size of a hand. Adaptable to installation requirements of different rack sizes, reducing auxiliary operation steps during installation. The integrated handle 104 design simplifies handling operations while ensuring structural strength, avoiding the risk of individual components falling off or deforming, and improving equipment deployment and maintenance efficiency.

[0039] This application further proposes a technical solution including an air guide assembly. The air guide assembly includes second mounting ears 302 symmetrically arranged on both sides of the air guide cavity 301; each second mounting ear 302 has at least two transverse second waist holes 303 and at least one longitudinal third waist hole 304 arranged vertically; the air guide cavity 301 is connected to the first mounting ear 102 of the 6U chassis 101 or the bracket of the cabinet through the second waist holes 303 and / or the third waist holes 304, and screws, so that the opening of the air guide cavity 301 faces the ventilation window 203 and the ground air outlet of the 6U chassis 101, forming a semi-enclosed cold air channel; the cavity shape of the air guide cavity 301 is at a preset angle, so that the cold air channel forms a gradually narrowing directional air duct.

[0040] The air guide assembly is a structural combination used to guide the flow path of cold air. Specifically, it can be implemented by combining the air guide cavity 301 with the mounting ears, thereby reducing airflow dispersion by directionally guiding the flow of cold air. The second mounting ears 302 are fixed components located on both sides of the air guide cavity 301. They can be made of stamped metal sheet and provide multi-directional installation and adjustment capabilities through the transverse second waist hole 303 and the longitudinal third waist hole 304 to accommodate dimensional deviations at different connection positions.

[0041] The second horizontal oblong hole 303 and the third vertical oblong hole 304 refer to elongated oval opening structures, which can be formed by machining and connected to the first mounting ear 102 or the cabinet bracket by screws, so as to realize the position adjustment of the flow guide cavity 301 in the horizontal and vertical directions.

[0042] These transverse holes allow for easy connection of screws to the chassis or cabinet, facilitating screw position adjustment. They are adaptable to both standard and custom-made non-standard chassis, and can accommodate situations where slight deformation of the equipment casing during transportation causes screw hole misalignment, or where misalignment of the mounting strips during cabinet assembly results in screw hole position deviations. For example, if the left and right screw holes of the chassis are misaligned, one side of the screw can be tightened but not fully secured, and the other side can be adjusted using the transverse holes to align it before tightening the screw. If the screw holes are vertically misaligned, the longer vertical holes can provide auxiliary fixing. Specifically, the second horizontal slot 303 and the third vertical slot 304 facilitate screw adjustment. Since equipment chassis come in standard and custom non-standard types, and the screw hole positions may differ, and slight deformation of the equipment casing during transportation may cause screw hole misalignment, these slots allow for adaptation. The screw holes in the cabinet are generally located on its backing strips. During cabinet assembly, the backing strips may not be perfectly aligned, resulting in non-standard dimensions, similar to the reasons mentioned above. These slots allow for screw hole position adaptation. For example, if there is a left-right deviation, one side's screw can be tightened but not fully secured until the other side is adjusted and aligned, then the screw can be tightened completely. Figure 4 As shown, the longitudinal third waist hole 304 is relatively long and can better accommodate staggered screw holes, and is used for auxiliary fixing.

[0043] The tapered directional air duct refers to an airflow channel with a gradually decreasing cross-section. This is achieved by designing the guide cavity 301 as an inclined cavity structure, utilizing fluid acceleration to enhance the pressure of cold air delivery and reduce turbulence. The inclined cavity of the guide cavity 301 forms a tapered channel; after entering from the ground vent, the cold air's velocity increases within the tapered structure and is delivered to the chassis interior along a predetermined direction. The semi-enclosed structure isolates external hot air interference, and the cold air is concentrated and enters the host compartment 201 through the ventilation window 203, achieving efficient cooling of the power supply 205 and graphics card 206. This solves the problem of traditional chassis relying on independent cooling devices to create dispersed airflow, which easily leads to the mixing of hot and cold air. The air guide assembly, through the adjustable guide cavity 301, directly connects the cold air delivery path with the chassis ventilation window 203, avoiding airflow turbulence. The tapered air duct design replaces the traditional straight-through air duct, using the cavity's inclination angle to accelerate cold air flow. Compared to a fixed-angle guide plate, it more effectively improves cold air delivery efficiency and reduces the load on the computer room cooling system.

[0044] This application further proposes that the flow guiding cavity 301 is equipped with an orientation-adjustable suppression fin 305, such as Figure 5 As shown, the suppression fin 305 is hinged within the airflow guiding cavity 301, and the suppression fin 305 faces the chassis. The azimuth-adjustable suppression fin 305 is an airflow guiding structure whose angle can be changed. Specifically, it can be achieved by connecting a thin metal plate to the side wall of the airflow guiding cavity 301 via a hinge. Its function is to change the airflow path by adjusting the angle, thereby enhancing the control of the cold air flow direction. The hinge is a rotating structure achieved using a pivot or movable connector, specifically using a pin and mounting hole. Its function is to provide the suppression fin 305 with rotational freedom, allowing it to dynamically adjust its angle according to the airflow conditions.

[0045] Specifically, the suppression fins 305 are hinged and installed within the airflow guide cavity 301, and their angle can be dynamically adjusted according to airflow. When cold airflow passes through the airflow guide cavity 301, the suppression fins 305 automatically deflect to a preset angle under the influence of airflow force, forming a tapered airflow channel that guides the cold air to flow directionally towards the chassis ventilation window 203. The orientation of the suppression fins 305 towards the chassis constrains the cold air diffusion range and reduces collision losses between the airflow and the inner wall of the cavity. The hinged structure allows the suppression fins 305 to adaptively adjust their angle when airflow pressure changes, maintaining a stable airflow guiding effect. Through the adjustable suppression fins 305, airflow resistance is reduced while maintaining directional airflow, solving the problem of fluctuating heat dissipation efficiency caused by the fixed airflow guide plate due to its non-adjustable angle. This optimizes the airflow guiding efficiency of the tapered airflow channel, reduces energy loss caused by disordered airflow diffusion, and improves the airflow management accuracy of the chassis's internal cooling system.

[0046] This application further proposes that the flow guiding cavity 301 is made of a magnetic metal, and that a magnet 306 is hinged to the upper end of the suppression fin 305, such as... Figure 6 and Figure 7 As shown. The magnetically affinity metal refers to a metallic material that can be attracted by a magnet, specifically iron, nickel, cobalt, or their alloys. Through the inherent magnetic response characteristics of the material, the magnetic sheet 306 can be attracted to the inner wall of the flow guide cavity 301. The magnetic sheet 306 forms a detachable fixed connection with the magnetically affinity metal flow guide cavity 301 through magnetic attraction. This can be achieved using a pin and shaft hole, allowing the suppression fin 305 to freely adjust its orientation within a certain angular range.

[0047] After the airflow guiding cavity 301 is made of a magnetic metal material, the magnetic piece 306 on the top of the suppression fin 305 can be magnetically adsorbed to any position on the inner wall of the airflow guiding cavity 301, achieving rapid fixation after the orientation of the suppression fin 305 is adjusted. The suppression fin 305 and the magnetic piece 306 are connected by a hinge structure, so that when the angle of the suppression fin 305 is adjusted, the magnetic piece 306 can still maintain contact with the airflow guiding cavity 301, ensuring adsorption stability. In the environment of airflow impact or vibration in the cold air channel, the magnetic attraction can prevent the suppression fin 305 from shifting, while avoiding the interference of airflow path caused by mechanical locking structures such as bolts or clips, thereby maintaining the directional flow effect of airflow in the tapered air duct. The use of magnetic attraction combined with hinge not only simplifies the fixing operation after adjustment, but also enhances the connection reliability through material properties. In addition, the cooperation between the magnetic metal airflow guiding cavity 301 and the magnetic piece 306 does not require the addition of fixing holes or protrusions in the cavity, avoiding the damage to the integrity of the inner wall of the air duct caused by traditional mechanical fixing methods. This application solves the problem of displacement caused by airflow impact or vibration after the orientation of the suppression fin 305 is adjusted, improves the connection reliability between the suppression fin 305 and the guide cavity 301, and optimizes the airflow guidance effect in the cold air channel by simplifying the fixing structure, ensuring precise control of the airflow direction in the tapered air duct.

[0048] This application further proposes an air guide component, which is applied to the above-mentioned multi-node integrated host farm chassis device. The air guide component is combined with the chassis to form an air guide cooling channel device. The cavity of the air guide chamber 301 has an inclination angle of 30°-75° to form a gradually narrowing directional air duct.

[0049] The guide cavity 301 refers to a ventilation structure with a specific cross-sectional shape, which can be achieved by bending metal sheets to form a continuously tapering trapezoidal channel. Its tilt angle range is determined through fluid dynamics simulation experiments. The tapering directional air duct refers to a structure where the channel cross-section gradually decreases along the airflow direction. Specifically, this can be achieved by adjusting the tilt angle of the two cavity walls to create a converging space, accelerating the airflow during flow. The 30°-75° tilt angle range refers to the angle parameter between the cavity axis and the horizontal plane. 45° is a preferred implementation angle, and this range has been experimentally verified to balance airflow acceleration and flow stability. After the cold air enters the cavity from the ground vent, it flows along the tilt direction within the tapering channel. The airflow forms a stable laminar flow within the gradually narrowing space, reducing energy loss caused by turbulence. Simultaneously, this angle ensures that the opening end of the guide cavity 301 is parallel and aligned with the chassis ventilation window 203, ensuring that the cold air directly enters the main unit compartment 201. In terms of mechanical structure, the 45° tilt angle ensures a balanced force distribution at the connection point between the airflow guide cavity 301 and the rack bracket, avoiding stress concentration issues caused by excessively large or small angles. This achieves stable maintenance of laminar flow within the cooling air channel, reducing cooling efficiency losses caused by airflow turbulence, while also ensuring compatibility between the airflow guide cavity 301 and the standard rack mounting interface, avoiding assembly misalignment issues caused by angle deviations.

[0050] It should be noted that the current air duct structure, which forms an air inlet opposite to the ground, is suitable for computer rooms with current downdraft systems. By utilizing the cold air provided by the downdraft system, the airflow path is changed through the guide structure in the air duct structure, guiding the cold air to flow evenly from bottom to top through the heat-generating components, allowing the cold air to preferentially pass through the core heat dissipation area, thereby improving the overall cooling effect.

[0051] As an example, traditional deployments typically involve a single host (server host). When a large number of nodes are needed, this results in a large footprint, low deployment density, and an inability to meet the requirements of high integration and high efficiency. Furthermore: In the traditional approach, each host is independently installed in a single chassis, resulting in a large size, and standard server racks have limited capacity for nodes; multiple independent hosts require multiple power cables, network cables, HDMI interfaces, etc., increasing cabling complexity and maintenance costs; the dispersed nature of the equipment necessitates disassembling and reassembling the entire machine or rack in case of failure, reducing maintenance efficiency; traditional host power supplies and cooling systems operate independently, making unified management and energy efficiency optimization difficult; multiple individual devices cause airflow disruptions, increasing the load on the data center cooling system and leading to higher energy consumption; and the added costs of multiple standard chassis, including the casing, power supplies, and interface boards, reduce the overall system's cost-effectiveness.

[0052] Therefore, in high-density, multi-node deployment scenarios, there is an urgent need for a new structure that can integrate multiple independent host nodes in a standard chassis, while also possessing advantages such as modularity, ease of maintenance, efficient heat dissipation, and centralized cabling.

[0053] This application integrates six independently operating hosts (nodes) within a 6U server chassis. Each node has an independent motherboard, graphics card, power supply, and interfaces, and adopts a modular compartment layout. Each node can be independently mounted and dismounted, ensuring good maintainability. The rear is equipped with conventional interfaces such as HDMI and USB, while the front can incorporate an airflow structure. A stable structure is formed using metal partitions (the partition between partition 208 and the compartment), which simultaneously serve the triple functions of shielding, airflow, and support. Graphics cards can be installed or reserved according to different business needs. The rear interface modules are densely arranged, achieving high-density deployment while meeting conventional I / O access requirements. Compared to traditional standalone deployments, integrating six host nodes within a single standard chassis significantly improves space utilization. A modular maintenance mechanism allows for independent plug-and-play installation of each host node, simplifying maintenance and replacement processes. The combination of heat dissipation channels and insulation design, along with air ducts and partitions, optimizes cool air paths and prevents heat cross-contamination. An optimized universal interface layout, with standardized rear cable exits and label placement, facilitates management and batch deployment. It is suitable for deployment needs in edge computing, large-scale AI training, and cloud desktop scenarios. A physical compartmentalized structure separates the six nodes, each with an independent mounting slot and cooling duct. All nodes share the chassis shell, power input, and heat dissipation guidance mechanism. A centralized interface area at the rear, including HDMI, USB, and LAN ports, facilitates management and connectivity.

[0054] During installation and deployment, the following operations can be performed:

[0055] Node installation: Install standard components such as motherboard, CPU, GPU, and power supply into each sub-compartment and secure them using rails or screws;

[0056] Module power supply: Each node is provided with independent power supply through power distribution or centralized power supply modules. Each node power module can be hot-swapped or independently wired.

[0057] Interface access: Each node has a reserved interface at the rear, allowing users to connect keyboards, mice, and monitors independently, or manage them remotely in a unified manner;

[0058] Cooling structure coordination: Combined with the matching air duct device, the cool air supplied from under the cabinet is delivered to each node in sequence through the guide plate to ensure balanced heat dissipation;

[0059] Operation and maintenance: When any node fails or is upgraded, it can be maintained independently without affecting the operation of other nodes, thus achieving modular maintainability.

[0060] Although preferred embodiments of the present application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present application.

[0061] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0062] The above provides a detailed description of a multi-node integrated host farm chassis device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A multi-node integrated host farm chassis device, characterized in that, include: The 6U chassis has 6 vertically arranged host bays; at least one host bay is equipped with a host. The main engine compartment is provided with a partition in the middle, which divides the main engine compartment into a first compartment and a second compartment that are connected to each other; The motherboard of the host computer is located in the first compartment; the power supply and graphics card are located in the second compartment. The power supply is electrically connected to the motherboard and the graphics card, and the graphics card is electrically connected to the motherboard; Both the first and second cabins have ventilation windows at their ends that connect to the outside.

2. The multi-node integrated host farm chassis device according to claim 1, characterized in that, The main unit bay is installed inside the 6U chassis via guide rails.

3. The multi-node integrated host farm chassis device according to claim 1, characterized in that, The graphics card is electrically connected to the graphics card interface of the motherboard via an extended data cable, or the second compartment is provided with a graphics card adapter, the graphics card is plugged into the graphics card adapter, and the graphics card adapter is electrically connected to the graphics card interface of the motherboard via an extended data cable.

4. The multi-node integrated host farm chassis device according to claim 1, characterized in that, The 6U chassis has a first mounting ear vertically arranged on its outer side; The mounting ear is vertically provided with several first waist holes; The mounting ear has a handle in the middle.

5. The multi-node integrated host farm chassis device according to any one of claims 1-4, characterized in that, It also includes air guide components; The air guide assembly includes second mounting ears symmetrically arranged on both sides of the air guide cavity; each second mounting ear has at least two transverse second waist holes and at least one longitudinal third waist hole arranged vertically. The airflow guiding cavity is connected to the first mounting ear or cabinet bracket of the 6U chassis through the second and / or third waist holes and screws, so that the opening of the airflow guiding cavity faces the ventilation window and ground air vent of the 6U chassis, forming a semi-enclosed cold air channel. The cavity of the air guide is shaped at a preset angle, so that the cold air channel forms a gradually narrowing directional air duct.

6. The multi-node integrated host farm chassis device according to claim 5, characterized in that, The airflow cavity is equipped with an adjustable suppression fin; wherein the suppression fin is hinged to the airflow cavity and faces the ventilation window of the 6U chassis.

7. The multi-node integrated host farm chassis device according to claim 6, characterized in that, The flow guiding cavity is made of a magnetic metal; A magnet is also hinged to the upper end of the suppression fin.

8. The multi-node integrated host farm chassis device according to claim 5, characterized in that, The cavity of the flow guide is inclined at an angle of 30°-75°, forming a gradually narrowing directional air duct.

9. The multi-node integrated host farm chassis device according to claim 8, characterized in that, The cavity is tilted at a 45° angle.

Images