Conductive foam and electrode spring combination structure suitable for smart hardware

CN224698168UActive Publication Date: 2026-08-28KUNSHAN JIUWANGYUAN ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202522575920.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-04
Publication Date
2026-08-28
Estimated Expiration
2035-12-04

AI Technical Summary

Technical Problem

然而,现有的导电泡棉和电极弹片在组合使用时,存在组合结构不稳定、接触电阻较大、安装不便等问题,影响了智能硬件的性能和可靠性,为此我们提出适用于智能硬件的导电泡棉与电极弹片组合结构

Benefits of technology

1、通过卡槽定位和导电胶层粘接的方式,使导电泡棉本体与电极弹片本体紧密结合,提高了组合结构的稳定性,避免了在使用过程中出现松动或移位的问题。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a suitable for intelligent hardware's conductive bubble cotton and electrode spring combination structure in the field of intelligent hardware technology, including conductive bubble cotton body and electrode spring body, the one side of conductive bubble cotton body is provided with the clamping groove, the clamping groove is compatible with electrode spring body, the electrode spring body part embeds in the clamping groove, the outer surface of electrode spring body and the inner wall of clamping groove are fixed through conductive glue layer and are bonded, the shape of clamping groove and the shape of electrode spring body match, the depth of clamping groove is 1 / 3 2 / 3 of conductive bubble cotton body width, one end of electrode spring body is provided with the contact part, through the mode of clamping groove positioning and conductive glue layer bonding, make conductive bubble cotton body and electrode spring body close combination, improved the stability of combination structure, avoided the problem that appears loose or displacement in the use process.
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