A fiber optic array and a high-reliability optical engine
Patent Information
- Application Number
- CN202521936548.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-09
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2035-09-09
AI Technical Summary
[0002]在军工等应用场景中，对产品要求高可靠性，比如常见的光引擎，光引擎其结构如图1、图2所示，该光引擎包括：光纤阵列、陶瓷板、PCB板、光芯片以及电芯片，光纤阵列的盖板先采用紫外胶与陶瓷板相粘接，然后光纤阵列的两个侧面与陶瓷板之间再采用黑胶相粘接，通常所采用的光纤阵列包括：盖板、基板以及夹在盖板与基板之间的光纤，盖板的两个侧面与基板的两个侧面分别平齐，即为盖板和基板等宽，比如：盖板宽度为3.8mm，基板宽度为3.8mm，盖板材质可以为玻璃，陶瓷板再固定在PCB板上，陶瓷板上在对应光纤阵列反射面的位置固定与光纤阵列相耦合的光芯片，光纤阵列的反射面可以为42.5°，陶瓷板上固定与光芯片电连接的电芯片，陶瓷具有热膨胀系数低不易变形和导热高等优点，同时紫外胶和黑胶与陶瓷粘接力很强，但是紫外胶和黑胶与光纤阵列的粘接力不强，特别是军工等强振动、大冲击、超高温场景下，由于黑胶所形成的一个腔的两个侧面是两个0°面，所以光纤阵列容易从陶瓷板上脱落
[0005]本实用新型的有益效果是：当该类型光纤阵列应用于光引擎中，并在盖板采用紫外胶与陶瓷板相粘接，以及光纤阵列的两个侧面与陶瓷板之间均采用黑胶相粘接，且黑胶覆盖着光纤阵列侧面上的凹槽并进入凹槽内时，光纤阵列每侧的黑胶与光纤阵列之间形成卡扣结构，黑胶可以扣住光纤阵列，从而牢牢固定住光纤阵列，使得即使在军工等强振动、大冲击、超高温（高温下胶水软化粘接力下降）场景下，光纤阵列也无法从陶瓷板上脱落，大大提高产品可靠性。
Smart Images
Figure CN224708256U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical engine technology, specifically to an optical fiber array and a high-reliability optical engine. Background Technology
[0002] In military and other applications, high reliability is required for products, such as common optical engines. The structure of an optical engine is as follows: Figure 1 , Figure 2 As shown, the optical engine includes: a fiber optic array, a ceramic plate, a PCB board, an optical chip, and an electrical chip. The cover plate of the fiber optic array is first bonded to the ceramic plate using UV adhesive, and then the two sides of the fiber optic array are bonded to the ceramic plate using black adhesive. A typical fiber optic array includes: a cover plate, a substrate, and optical fibers sandwiched between the cover plate and the substrate. The two sides of the cover plate are flush with the two sides of the substrate, meaning the cover plate and substrate have the same width. For example, the cover plate width is 3.8mm, and the substrate width is 3.8mm. The cover plate can be made of glass, and the ceramic plate is then fixed to the PCB. On the ceramic plate, optical chips coupled to the optical fiber array are fixed at the corresponding positions of the optical fiber array's reflective surface. The reflective surface of the optical fiber array can be 42.5°. Electrical chips electrically connected to the optical chips are fixed on the ceramic plate. Ceramic has the advantages of low thermal expansion coefficient, resistance to deformation, and high thermal conductivity. At the same time, the UV adhesive and black adhesive have strong adhesion to the ceramic, but the adhesion between the UV adhesive and black adhesive and the optical fiber array is not strong, especially in military and other high vibration, high impact, and ultra-high temperature scenarios. Because the two sides of the cavity formed by the black adhesive are two 0° surfaces, the optical fiber array is easy to detach from the ceramic plate. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide an optical fiber array and a high-reliability optical engine to overcome the shortcomings of the prior art.
[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: An optical fiber array includes: a cover plate, a substrate, and an optical fiber sandwiched between the cover plate and the substrate, wherein at least one of the two sides of the optical fiber array has a groove on a corresponding black adhesive-covered area.
[0005] The beneficial effects of this utility model are as follows: When this type of fiber optic array is applied to an optical engine, and the cover plate is bonded to the ceramic plate with ultraviolet adhesive, and both sides of the fiber optic array are bonded to the ceramic plate with black adhesive, and the black adhesive covers the grooves on the sides of the fiber optic array and enters the grooves, a snap-fit structure is formed between the black adhesive on each side of the fiber optic array and the fiber optic array. The black adhesive can hold the fiber optic array in place, thereby firmly fixing the fiber optic array. Even in scenarios such as military applications with strong vibration, large impact, and ultra-high temperature (the adhesive softens and the bonding strength decreases at high temperatures), the fiber optic array cannot fall off the ceramic plate, greatly improving product reliability.
[0006] Based on the above technical solution, the present invention can be further improved as follows.
[0007] Furthermore, grooves are provided on both sides of the cover plate in the corresponding black adhesive coverage areas.
[0008] The further beneficial effects of the above are as follows: when the black adhesive covers the grooves on both sides of the fiber array and enters the grooves respectively, a snap-fit structure is formed between the black adhesive on each side of the fiber array and the fiber array. The black adhesive can hold the fiber array in place, thereby firmly fixing the fiber array. Even in scenarios with strong vibration, large impact, and ultra-high temperature (the adhesive softens and the bonding strength decreases at high temperatures) such as military applications, the fiber array cannot fall off the ceramic plate, greatly improving product reliability.
[0009] Furthermore, grooves are provided on the two sides of the substrate in the corresponding areas covered by black adhesive.
[0010] The further beneficial effects of the above are as follows: when the black adhesive covers the grooves on both sides of the fiber array and enters the grooves respectively, a snap-fit structure is formed between the black adhesive on each side of the fiber array and the fiber array. The black adhesive can hold the fiber array in place, thereby firmly fixing the fiber array. Even in scenarios with strong vibration, large impact, and ultra-high temperature (the adhesive softens and the bonding strength decreases at high temperatures) such as military applications, the fiber array cannot fall off the ceramic plate, greatly improving product reliability.
[0011] Furthermore, grooves are provided on both sides of the cover plate and the substrate in the corresponding black adhesive coverage area.
[0012] The further beneficial effects of the above are as follows: when the black adhesive covers the grooves on both sides of the fiber array and enters into multiple grooves respectively, a snap-fit structure is formed between the black adhesive on each side of the fiber array and the fiber array. The black adhesive can hold the fiber array in place, thereby firmly fixing the fiber array. Even in scenarios with strong vibration, large impact, and ultra-high temperature (the adhesive softens and the bonding strength decreases at high temperatures) such as military applications, the fiber array cannot fall off the ceramic plate, greatly improving product reliability.
[0013] Furthermore, the depth of the groove is 0.1mm ± 0.05mm, and the groove is a V-shaped groove.
[0014] Furthermore, the cover plate has a first chamfer of C0.1mm to 0.2mm on each of its two sides on the surface in contact with the substrate, and a groove is formed at the first chamfer after the cover plate and the substrate are combined.
[0015] The further beneficial effects of the above are as follows: when the black adhesive covers the grooves on both sides of the fiber array and enters the grooves respectively, a snap-fit structure is formed between the black adhesive on each side of the fiber array and the fiber array. The black adhesive can hold the fiber array in place, thereby firmly fixing the fiber array. Even in scenarios with strong vibration, large impact, and ultra-high temperature (the adhesive softens and the bonding strength decreases at high temperatures) such as military applications, the fiber array cannot fall off the ceramic plate, greatly improving product reliability.
[0016] Furthermore, on the surface of the substrate that contacts the cover plate, there are second chamfers of C0.1mm to 0.2mm on both sides, and after the cover plate and the substrate are combined, a groove is formed at the second chamfer.
[0017] The further beneficial effects of the above are as follows: when the black adhesive covers the grooves on both sides of the fiber array and enters the grooves respectively, a snap-fit structure is formed between the black adhesive on each side of the fiber array and the fiber array. The black adhesive can hold the fiber array in place, thereby firmly fixing the fiber array. Even in scenarios with strong vibration, large impact, and ultra-high temperature (the adhesive softens and the bonding strength decreases at high temperatures) such as military applications, the fiber array cannot fall off the ceramic plate, greatly improving product reliability.
[0018] Furthermore, the cover plate has a first chamfer of C0.1mm to 0.2mm on each side edge on the surface in contact with the substrate, and the substrate has a second chamfer of C0.1mm to 0.2mm on each side edge on the surface in contact with the cover plate. After the cover plate and the substrate are combined, the first chamfer and the second chamfer together form a groove.
[0019] The further beneficial effects of the above are as follows: when the black adhesive covers the grooves on both sides of the fiber array and enters the grooves respectively, a snap-fit structure is formed between the black adhesive on each side of the fiber array and the fiber array. The black adhesive can hold the fiber array in place, thereby firmly fixing the fiber array. Even in scenarios with strong vibration, large impact, and ultra-high temperature (the adhesive softens and the bonding strength decreases at high temperatures) such as military applications, the fiber array cannot fall off the ceramic plate, greatly improving product reliability.
[0020] Furthermore, the two sides of the fiber array have frosted areas in the regions covered by black glue.
[0021] The further beneficial effects of adopting the above are: the frosted area refers to the side of the cover plate and / or substrate having fine pits, which increases the adhesive strength and further prevents the fiber array from falling off.
[0022] Based on the above technical solution, this utility model also provides a high-reliability optical engine, including: a PCB board, a ceramic board, and an optical fiber array. The ceramic board is fixed on the PCB board. The cover plate in the optical fiber array is bonded to the side of the ceramic board away from the PCB board with ultraviolet glue. The two sides of the optical fiber array are bonded to the ceramic board with black glue. The black glue covers the grooves on the sides of the optical fiber array and enters the grooves.
[0023] The further beneficial effects of the above are as follows: when the black adhesive covers the groove on the side of the fiber array and enters the groove, a snap-fit structure is formed between the black adhesive on each side of the fiber array and the fiber array. The black adhesive can hold the fiber array in place, thereby firmly fixing the fiber array. This ensures that even in scenarios with strong vibration, large impact, and ultra-high temperature (the adhesive softens and the bonding strength decreases at high temperatures) such as military applications, the fiber array cannot fall off the ceramic plate, greatly improving product reliability.
[0024] Furthermore, an optical chip coupled to the optical fiber array is fixed on the ceramic plate at the position corresponding to the reflective surface of the optical fiber array, and an electrical chip electrically connected to the optical chip is fixed on the ceramic plate. Attached Figure Description
[0025] Figure 1 This is a structural diagram of a light engine in existing technology; Figure 2 A cross-sectional view of a light engine in existing technology; Figure 3 This is a structural diagram of the fiber optic array in this utility model; Figure 4 This is a structural diagram of the first type of fiber optic array in this utility model; Figure 5 This is a structural diagram of the second type of fiber optic array in this utility model; Figure 6 This is a structural diagram of the third type of fiber optic array in this utility model; Figure 7 This is a structural diagram of the fourth type of fiber optic array in this utility model; Figure 8 This is a structural diagram of the fifth type of fiber optic array in this utility model; Figure 9 This is a structural diagram of the sixth type of fiber optic array in this utility model; Figure 10 This is a structural diagram of the high-reliability optical engine of this utility model; Figure 11 A cross-sectional view of the first type of fiber array used in a high-reliability optical engine; Figure 12 for Figure 11 Exploded view; Figure 13 A cross-sectional view of a second type of fiber array used in a high-reliability optical engine; Figure 14 for Figure 13 Exploded view; Figure 15 A cross-sectional view of a third type of fiber array used in a high-reliability optical engine; Figure 16 for Figure 15 Exploded view; Figure 17 A cross-sectional view of a fourth type of fiber array used in a high-reliability optical engine; Figure 18 for Figure 17 Exploded view; Figure 19 A cross-sectional view of the fifth type of fiber array used in the high-reliability optical engine; Figure 20 for Figure 19 Exploded view; Figure 21 A cross-sectional view of the sixth type of fiber array used in the high-reliability optical engine; Figure 22 for Figure 20 Exploded view.
[0026] The attached diagram lists the components represented by each number as follows: 1. Fiber optic array; 110. Cover plate; 111. First chamfer; 120. Substrate; 121. Second chamfer; 130. Fiber optic cable; 140. Groove; 2. PCB board; 3. Ceramic plate; 4. UV adhesive; 5. Black adhesive; 6. Optical chip; 7. Electrical chip. Detailed Implementation
[0027] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.
[0028] Example 1 like Figures 3-9 , Figures 11-22 As shown, an optical fiber array includes: a cover plate 110, a substrate 120, and optical fibers 130. Optical fibers 130 are evenly distributed in each V-groove on the substrate 120. The cover plate 110 is fixed to the substrate 120, and the optical fibers 130 are clamped by the cooperation between the cover plate 110 and the substrate 120. At least one of the two sides of the optical fiber array 1 has a groove 140 in the corresponding black glue 5 covered area. The groove 140 can be a straight groove or a curved groove. The side of the optical fiber array 1 can have one groove 140, two grooves 140, or three grooves 140, etc.
[0029] When this type of fiber optic array is applied to an optical engine, and the cover plate 110 is bonded to the ceramic plate 3 with UV adhesive 4, and the two sides of the fiber optic array 1 are bonded to the ceramic plate 3 with black adhesive 5, and the black adhesive 5 covers the groove 140 on the side of the fiber optic array 1 and enters the groove 140, a snap-fit structure is formed between the black adhesive 5 on each side of the fiber optic array 1 and the fiber optic array 1. The black adhesive 5 can hold the fiber optic array 1 in place, thus firmly fixing the fiber optic array 1. Even in military and other scenarios with strong vibration, large impact, and ultra-high temperature (the adhesive softens and the bonding strength decreases at high temperatures), the fiber optic array 1 cannot fall off the ceramic plate 3, greatly improving product reliability.
[0030] Example 2 like Figure 4 , Figure 11 , Figure 12 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: On one of the two sides of the cover plate 110, a groove 140 is provided corresponding to the area covered by the black glue 5. On the other side of the two sides of the cover plate 110, a groove 140 is also provided corresponding to the area covered by the black glue 5. The depth of the groove 140 is 0.1mm±0.05mm. The groove 140 is preferably a V-shaped groove. Of course, in actual application, other shapes of grooves, such as rectangular grooves, are not excluded.
[0031] Example 3 like Figure 5 , Figure 13 , Figure 14 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: On one of the two sides of the substrate 120, a groove 140 is provided corresponding to the area covered by the black adhesive 5. On the other side of the two sides of the cover plate 110, a groove 140 is also provided corresponding to the area covered by the black adhesive 5. The depth of the groove 140 is 0.1mm ± 0.05mm. The groove 140 is preferably a V-shaped groove. Of course, in actual application, it is not excluded to use other shapes of grooves, such as rectangular grooves.
[0032] Example 4 like Figure 6 , Figure 15 , Figure 16 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: A groove 140 is provided on one of the two sides of the cover plate 110 corresponding to the area covered by the black adhesive 5. A groove 140 is also provided on the other side of the cover plate 110 corresponding to the area covered by the black adhesive 5. A groove 140 is provided on one of the two sides of the substrate 120 corresponding to the area covered by the black adhesive 5. A groove 140 is also provided on the other side of the cover plate 110 corresponding to the area covered by the black adhesive 5. The depth of the groove 140 is 0.1mm ± 0.05mm. The groove 140 is preferably a V-shaped groove. Of course, in actual application, other shapes of grooves, such as rectangular grooves, are not excluded.
[0033] Example 5 like Figure 7 , Figure 17 , Figure 18 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The cover plate 110 has a first chamfer 111 with a diameter of 0.1 mm to 0.2 mm on each side edge on the surface that contacts the substrate 120. After the cover plate 110 and the substrate 120 are combined, a groove 140 is formed at the first chamfer 111.
[0034] Example 6 like Figure 8 , Figure 19 , Figure 20 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The substrate 120 has a second chamfer 121 with a diameter of 0.1 mm to 0.2 mm on each side edge on the surface that contacts the cover plate 110. After the cover plate 110 and the substrate 120 are combined, a groove 140 is formed at the second chamfer 121.
[0035] Example 7 like Figure 9 , Figure 21 , Figure 22 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The cover plate 110 has a first chamfer 111 with a diameter of 0.1 mm to 0.2 mm on each side edge on the surface of the cover plate 110 that contacts the substrate 120. The substrate 120 has a second chamfer 121 with a diameter of 0.1 mm to 0.2 mm on each side edge on the surface of the substrate 120 that contacts the cover plate 110. When the cover plate 110 and the substrate 120 are combined, the first chamfer 111 and the second chamfer 121 together form a groove 140.
[0036] Example 8 like Figures 3-9 , Figures 11-22As shown, this embodiment is a further improvement on any one of embodiments 1 to 7, as detailed below: The fiber array 1 has a frosted area on both sides of the area covered by black glue 5. The frosted area refers to the side of the cover plate 110 and / or the substrate 120 having fine pits, which increases the adhesive strength and further prevents the fiber array 1 from falling off.
[0037] Example 9 like Figures 3 to 22 As shown, a high-reliability optical engine includes: a PCB board 2, a ceramic board 3, and an optical fiber array 1 as described in any of embodiments 1 to 8. The ceramic board 3 is fixed on the PCB board 2. The cover plate 110 in the optical fiber array 1 is bonded to the side of the ceramic board 3 away from the PCB board 2 using ultraviolet adhesive 4. Both sides of the optical fiber array 1 are bonded to the ceramic board 3 using black adhesive 5. The black adhesive 5 covers the groove 140 on the side of the optical fiber array 1 and enters the groove 140.
[0038] When the black adhesive 5 covers the groove 140 on the side of the fiber array 1 and enters the groove 140, a snap-fit structure is formed between the black adhesive 5 on each side of the fiber array 1 and the fiber array 1. The black adhesive 5 can hold the fiber array 1 in place, thus firmly fixing the fiber array 1. Even in scenarios such as military applications with strong vibration, large impact, and ultra-high temperature (the adhesive softens and the bonding strength decreases at high temperatures), the fiber array 1 cannot fall off the ceramic plate 3, greatly improving product reliability.
[0039] An optical chip 6 coupled to the optical fiber array 1 is fixed on the ceramic plate 3 at the position corresponding to the reflective surface of the optical fiber array 1, and an electrical chip 7 electrically connected to the optical chip 6 is fixed on the ceramic plate 3.
[0040] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. A fiber array comprising: The cover plate (110), the substrate (120) and the optical fiber (130) sandwiched between the cover plate (110) and the substrate (120) are characterized in that at least one of the two sides of the optical fiber array (1) has a groove (140) in the corresponding black glue (5) covered area.
2. The fiber optic array according to claim 1, characterized in that, The cover plate (110) has grooves (140) on its two sides corresponding to the black glue (5) covered areas.
3. The fiber optic array according to claim 1, characterized in that, The substrate (120) has grooves (140) on its two sides corresponding to the black glue (5) covered areas.
4. The fiber optic array according to claim 1, characterized in that, The cover plate (110) and the substrate (120) have grooves (140) on their two sides corresponding to the black glue (5) covered areas.
5. A fiber optic array according to any one of claims 1 to 4, characterized in that, The groove (140) has a depth of 0.1mm ± 0.05mm and is a V-shaped groove.
6. The fiber optic array according to claim 1, characterized in that, The cover plate (110) has a first chamfer (111) with a diameter of 0.1 mm to 0.2 mm on each side edge on the surface that contacts the substrate (120). After the cover plate (110) and the substrate (120) are combined, a groove (140) is formed at the first chamfer (111).
7. The fiber optic array according to claim 1, characterized in that, The substrate (120) has a second chamfer (121) with a diameter of 0.1 mm to 0.2 mm on each side edge on the surface that contacts the cover plate (110). After the cover plate (110) and the substrate (120) are combined, a groove (140) is formed at the second chamfer (121).
8. The fiber optic array according to claim 1, characterized in that, The cover plate (110) has a first chamfer (111) with a diameter of 0.1 mm to 0.2 mm on each side edge on the surface that contacts the substrate (120). The substrate (120) has a second chamfer (121) with a diameter of 0.1 mm to 0.2 mm on each side on the surface that contacts the cover plate (110). When the cover plate (110) and the substrate (120) are combined, the first chamfer (111) and the second chamfer (121) together form a groove (140).
9. The fiber optic array according to claim 1, characterized in that, The fiber array (1) has frosted areas on both sides of the area covered by black glue (5).
10. A high-reliability optical engine, characterized in that, include: The PCB board (2), ceramic board (3) and fiber array (1) as described in any one of claims 1 to 9, wherein the ceramic board (3) is fixed on the PCB board (2), the cover plate (110) in the fiber array (1) is bonded to the ceramic board (3) away from the PCB board (2) with UV adhesive (4), and the two sides of the fiber array (1) are bonded to the ceramic board (3) with black adhesive (5), the black adhesive (5) covering the groove (140) on the side of the fiber array (1) and entering the groove (140).