Substrate processing device

Abstract

This invention provides a substrate processing apparatus capable of suppressing the enlargement of devices and handling various types of substrate processing apparatuses. The substrate processing apparatus (1) includes: a first rotating holding unit (312) that holds a substrate (W) and rotates it about a vertical axis (321); a plurality of nozzles (331) capable of individually spraying processing liquid; and a nozzle delivery unit (340) that picks up any one of the plurality of nozzles (331) and delivers the picked-up nozzle (331) to a first spraying position (314) whereby processing liquid can be sprayed toward the periphery of the substrate (W) held by the first rotating holding unit (312).

Description

Technical Field

[0001] This disclosure relates to a substrate processing apparatus. Background Technology

[0002] Patent Document 1 discloses a substrate processing apparatus comprising: a rotation holding section that holds and rotates a substrate; and a supply section configured to supply processing liquid from a nozzle located on the surface side of the substrate to the periphery of the surface.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2019 / 138911 Utility Model Content

[0006] Problems to be solved by utility models

[0007] This disclosure provides a method that can suppress the enlargement of devices and is applicable to multiple types of devices.

[0008] Solution for solving the problem

[0009] The substrate processing apparatus according to the first aspect of the present invention includes: a first rotating holding unit that holds a substrate and rotates it about a vertical axis; a plurality of nozzles that can individually spray a processing liquid; and a nozzle delivery unit that picks up any one of the plurality of nozzles and delivers the picked-up nozzle to a first spraying position that can spray the processing liquid toward the periphery of the substrate held by the first rotating holding unit.

[0010] A second aspect of the present invention provides a substrate processing apparatus according to the first aspect described above. Preferably, the substrate processing apparatus further includes a second rotating holding portion, which is arranged alongside the first rotating holding portion along a first arrangement direction intersecting the vertical axis, for holding the substrate and rotating it. The plurality of nozzles are respectively disposed in a plurality of standby positions, which are arranged along a second arrangement direction intersecting the vertical axis and the first arrangement direction. The nozzle delivery portion picks up any one of the plurality of nozzles at the corresponding standby position and is capable of delivering the picked-up nozzle to any one of the first ejection position and a second ejection position that can eject processing liquid toward the periphery of the substrate held by the second rotating holding portion.

[0011] A third aspect of the present invention provides a substrate processing apparatus according to the aforementioned second aspect, preferably wherein the nozzle delivery unit comprises: a base movable along the first arrangement direction; an arm connected to the base in a manner rotatable about a vertical axis; a nozzle holding unit disposed at the end of the arm for holding any one of the plurality of nozzles; a first driving unit for rotating the arm about a vertical axis; and a second driving unit for moving the base along the first arrangement direction.

[0012] A fourth aspect of this invention provides a substrate processing apparatus according to the aforementioned third aspect, preferably wherein the plurality of nozzles open downwards and are respectively disposed in the plurality of standby positions, and the opening directions of the plurality of nozzles are different from each other, so that the difference in the opening directions of the nozzles disposed in the first ejection position is reduced among the plurality of nozzles.

[0013] The fifth aspect of this invention provides a substrate processing apparatus according to any one of the first to fourth aspects, preferably wherein the plurality of nozzles are nozzles for spraying processing liquid toward the periphery of the substrate.

[0014] A sixth aspect of the present invention provides a substrate processing apparatus according to any one of the second to fourth aspects described above. Preferably, the substrate processing apparatus further comprises: a first peripheral removal unit that supplies a processing liquid capable of removing a coating to a peripheral portion of the substrate held by the first rotating holding unit using a first removal nozzle different from the plurality of nozzles; and a second peripheral removal unit that supplies a processing liquid capable of removing a coating to a peripheral portion of the substrate held by the second rotating holding unit using a second removal nozzle different from the plurality of nozzles and the first removal nozzle.

[0015] A seventh aspect of the present invention provides a substrate processing apparatus according to the aforementioned sixth aspect, preferably wherein the first peripheral removal portion is arranged alongside the first rotating holding portion along the first arrangement direction, and the second peripheral removal portion is arranged alongside the second rotating holding portion along the first arrangement direction.

[0016] The eighth aspect of this utility model provides a substrate processing apparatus according to any one of the second to fourth aspects described above. Preferably, the plurality of nozzles open downwards, and the plurality of standby positions each have a standby tank for supplying cleaning fluid from the corresponding nozzle downwards. For the standby tank, the cleaning fluid is supplied to a storage portion that opens upwards, such that the cleaning fluid overflowing to the side while the liquid surface is raised upwards contacts the corresponding nozzle, and the raised liquid surface is gradually lowered so that the cleaning fluid moves away from the nozzle.

[0017] The ninth aspect of this utility model provides a substrate processing apparatus according to the aforementioned eighth aspect, preferably, the standby tank having: the storage section which opens upward; the supply section which supplies the cleaning liquid into the storage section; the guiding section which guides the cleaning liquid overflowing upward from the storage section to the side; and the discharge section which discharges the cleaning liquid from the bottom of the storage section.

[0018] The tenth aspect of this utility model provides a substrate processing apparatus according to any one of the first to fourth aspects described above. Preferably, the nozzle delivery unit delivers a picked-up nozzle to the first ejection position capable of supplying a first processing liquid to a peripheral portion of the surface of the substrate. The substrate processing apparatus further includes one or more back nozzles that supply a second processing liquid to the back side of the substrate held in the first rotating holding unit.

[0019] Effects of the utility model

[0020] According to this disclosure, it is possible to provide a device that can suppress the enlargement of the device and cope with multiple types of devices. Attached Figure Description

[0021] Figure 1 This is a top view schematically illustrating the structure of the substrate processing apparatus.

[0022] Figure 2 This is a top view illustrating the structure of an example liquid treatment device.

[0023] Figure 3 This is a side view of the structure of a nozzle delivery device as an example.

[0024] Figure 4 This is a diagram illustrating the opening directions of multiple nozzles at multiple standby positions.

[0025] Figure 5 (a) and Figure 5 (b) is a diagram illustrating the opening direction of the nozzle at the first ejection position.

[0026] Figure 6 This is a top view showing a modified example of a liquid treatment device.

[0027] Figure 7 (a) and Figure 7 (b) is a schematic cross-sectional view illustrating the structure of the standby slot.

[0028] Figure 8 This is a top view showing a modified example of a liquid treatment device.

[0029] Figure 9 This is a cross-sectional view illustrating the tip of the nozzle.

[0030] Figure 10 This is a 3D diagram illustrating the tool.

[0031] Figure 11 It is a cross-sectional view illustrating the actions of the tool.

[0032] Explanation of reference numerals in the attached figures

[0033] 1. Substrate processing apparatus; W, substrate; 312, first rotating holding unit; 331, nozzle; 340, nozzle conveying unit; 314, first ejection position; D1, first alignment direction; 321, vertical axis; 322, second rotating holding unit; 336, standby position; 324, second ejection position; D2, second alignment direction; 341, base; 342, arm; 343, nozzle holding unit; 344, first driving unit; 345, second driving unit; 350, first peripheral removal unit; 351, first removal nozzle; 360, second peripheral removal unit; 361, second removal nozzle; 370, standby slot; 371, storage unit; 372, supply unit; 373, guide unit; 374, discharge unit; 381, back nozzle. Detailed Implementation

[0034] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used to refer to the same elements or elements having the same function, and repeated descriptions are omitted.

[0035] [Substrate Processing Apparatus]

[0036] Figure 1 This is a schematic diagram illustrating the structure of a substrate processing apparatus. Figure 1 The substrate processing apparatus 1 shown is a system that performs at least a portion of the processing for manufacturing semiconductor devices on a semiconductor wafer, which is one example of a substrate. The substrate is a stacked substrate comprising a plurality of stacked semiconductor wafers.

[0037] like Figure 1 As shown, the substrate processing apparatus 1 includes a cassette station 2 and a processing station 3. The cassette station 2 transfers wafers W between multiple cassettes C, each containing multiple wafers W, and the processing station 3. For example, the cassette station 2 includes a cassette support stage 21, wafer transport devices 22 and 23, and a temporary receiving section 24. The cassette support stage 21 supports multiple cassettes C. The wafer transport devices 22 and 23 transport wafers W between each of the multiple cassettes C and the temporary receiving section 24. The temporary receiving section 24 temporarily receives the wafers W transported by the wafer transport devices 22 and 23.

[0038] Processing station 3 includes one or more liquid treatment units 31, one or more heat treatment units 32, and a wafer transport unit 33. The wafer transport unit 33 transports wafers W between a temporary receiving section 24, one or more liquid treatment units 31, and one or more heat treatment units 32. For example, the wafer transport unit 33 transports wafers W from the temporary receiving section 24 to one or more liquid treatment units 31 or one or more heat treatment units 32, and transports wafers W from one or more liquid treatment units 31 or one or more heat treatment units 32 to the temporary receiving section 24.

[0039] One or more liquid treatment apparatuses 31 supply processing liquid to the wafer W for liquid treatment. Liquid treatment includes supplying processing liquid to the periphery of the wafer W. One or more heat treatment apparatuses 32 perform heat treatment such as heating on the wafer W.

[0040] [Liquid Treatment Device]

[0041] The structure of the liquid treatment apparatus 31 is illustrated below. Figure 2 The liquid processing apparatus 300 shown is an example of the liquid processing apparatus 31, and is an apparatus for supplying processing liquid to the periphery of the wafer W. Examples of processing liquids include film-forming liquids for forming coatings, removal liquids for removing coatings, and rinsing liquids. In the case where the wafer W is a stacked type as described above, the processing liquid may also be a filling liquid that fills between multiple semiconductor wafers to strengthen the periphery of the wafer W.

[0042] For example, the liquid processing apparatus 300 includes a first rotating holding unit 312, a plurality of nozzles 331, and a nozzle delivery unit 340. The first rotating holding unit 312 holds the wafer W and rotates it about a vertical axis 311. The vertical axis 311 is an axis along a vertical direction perpendicular to the horizontal plane. For example, the first rotating holding unit 312 supports the horizontally arranged wafer W from below and holds it using vacuum adsorption or the like. The plurality of nozzles 331 can individually eject the processing liquid (first processing liquid). For example, regardless of whether other nozzles 331 are ejecting processing liquid, each of the plurality of nozzles 331 can individually switch between an ejection state of ejecting processing liquid and an ejection stop state of not ejecting processing liquid. The plurality of nozzles 331 may also include two or more nozzles 331 that eject different processing liquids. The nozzle delivery unit 340 picks up any one of the plurality of nozzles 331 and delivers the picked-up nozzle 331 to a first ejection position 314 (see reference) whereby the processing liquid can be ejected toward the periphery of the wafer W held by the first rotating holding unit 312. Figure 5 For example, the first ejection position 314 is a position where processing liquid can be supplied to the periphery of the surface (upper surface) of wafer W, for example, above or diagonally above the periphery of wafer W.

[0043] The liquid treatment device 300 configured in this way can suppress the size of the device and handle multiple types by making the nozzle delivery section 340 shared and using multiple nozzles 331 separately.

[0044] The liquid processing apparatus 300 may also include a second rotating holding unit 322. The second rotating holding unit 322 is arranged alongside the first rotating holding unit 312 along a first arrangement direction D1 that intersects (e.g., is orthogonal) the vertical axis 311, and is used to hold and rotate the wafer W. For example, the second rotating holding unit 322 supports the horizontally arranged wafer W from below and holds it using vacuum adsorption or the like. The second rotating holding unit 322 rotates the held wafer W about a vertical axis 321 parallel to the vertical axis 311.

[0045] Multiple nozzles 331 can also be respectively arranged in multiple standby positions 336 along a second arrangement direction D2 that intersects (e.g., orthogonally) the vertical axis 311 and the first arrangement direction D1. The nozzle delivery unit 340 picks up any one of the multiple nozzles 331 at the corresponding standby position 336. The nozzle delivery unit 340 can also deliver the picked-up nozzle 331 to any one of the following ejection positions: a first ejection position 314 and a second ejection position 324 that can eject processing liquid toward the periphery of the wafer W held by the second rotation holding unit 322. The second ejection position 324 is a position where processing liquid can be supplied to the periphery of the surface of the wafer W, for example, above or diagonally above the periphery of the wafer W.

[0046] The first rotary holding part 312 and the second rotary holding part 322 can share a plurality of nozzles 331, thus further suppressing the enlargement of the device. In addition, by arranging the plurality of nozzles 331 in a different direction than the arrangement direction of the first rotary holding part 312 and the second rotary holding part 322, it is possible to prevent the device from becoming longer in one direction.

[0047] As an example, the liquid processing apparatus 300 includes a first cup unit 310, a second cup unit 320, and multiple liquid supply systems 330. The first cup unit 310 includes the first rotating holding portion 312 and the first cup 313 described above. The first cup 313 houses the first rotating holding portion 312. The wafer W is held within the first rotating holding portion 312 in the first cup 313. The first cup 313 recovers any remaining portion of the processing liquid supplied to the first rotating holding portion 312 that has been ejected from the wafer W. The first cup 313 opens upwards, thus allowing the wafer W to be fed into the first cup 313 from above.

[0048] The second cup unit 320 is arranged alongside the first cup unit 310 along the first arrangement direction D1, and has the aforementioned second rotation holding portion 322 and second cup 323. The second cup 323 houses the second rotation holding portion 322. The wafer W is held within the second cup 323 and the second rotation holding portion 322. The second cup 323 recovers any remaining portion of the wafer W ejected from the processing liquid supplied to the second rotation holding portion 322. The second cup 323 opens upwards, thus allowing the wafer W to be fed into the second cup 323 from above.

[0049] Multiple liquid supply systems 330 each have the aforementioned multiple nozzles 331. For example, each of the multiple liquid supply systems 330 has a nozzle 331, a liquid delivery hose 333, a valve 334, and a hose guide 335. The nozzle 331 has a built-in conduit that forms part of the liquid delivery line for the processed liquid, and is arranged in a state along the first arrangement direction D1 to the corresponding hose guide 335. The nozzle 331 has a nozzle head 332 near one end. The nozzle head 332 protrudes downward and sprays the processed liquid guided by the conduit within the nozzle 331 (see reference). Figure 3 Hereinafter, the end near the nozzle head 332 of the nozzle 331 will be referred to as the "top end" and the other end as the "base end".

[0050] The liquid delivery hose 333 is connected to the base end of the nozzle 331. The inner cavity of the liquid delivery hose 333 is connected to the tubing inside the nozzle 331 to form a liquid delivery pipeline for the treated liquid. The valve 334 opens and closes the liquid delivery pipeline formed by the liquid delivery hose 333, switching between the aforementioned spraying state and spraying stop state. The hose guide 335 limits the range of movement of the liquid delivery hose 333 associated with the movement of the nozzle 331.

[0051] Multiple liquid supply systems 330 may also include two or more liquid supply systems 330 connected to supply sources of different processing liquids via liquid delivery hoses 333. With two or more liquid supply systems 330, two or more different processing liquids can be selectively supplied to the periphery of the wafer W.

[0052] like Figure 2 and Figure 3As shown, the nozzle delivery unit 340 includes, for example, a base 341, an arm 342, a nozzle holding unit 343, a first drive unit 344, and a second drive unit 345. The base 341 is movable along a first arrangement direction D1. The arm 342 is connected to the base 341 in a manner that allows rotation about a vertical axis 346 parallel to the vertical axis 311, and extends in a direction away from the vertical axis 346. The nozzle holding unit 343 is provided at the end of the arm 342 for holding any one of the plurality of nozzles 331. For example, the nozzle holding unit 343 holds the top portion (top and vicinity) of the plurality of nozzles 331 from above using vacuum suction or the like. The first drive unit 344 rotates the arm 342 about the vertical axis 346 parallel to the vertical axes 311 and 321. For example, the first drive unit 344 rotates the arm 342 using an electrically driven actuator. The second drive unit 345 moves the base 341 along the first arrangement direction D1. For example, the second drive unit 345 uses an electric linear actuator to move the base 341 along the first arrangement direction D1.

[0053] By combining a base 341 that can move along the first arrangement direction D1 and an arm 342 that can rotate around the vertical axis 346, the sharing of multiple nozzles 331 in the first rotation holding part 312 and the second rotation holding part 322 can be easily realized.

[0054] The nozzle delivery unit 340 may also have a third drive unit 347. The third drive unit 347 causes the base 341 to move up and down in the vertical direction. The third drive unit 347 causes the base 341 to move up and down, thereby enabling the nozzle head 332 of the nozzle 331 to enter the first cup 313 or the second rotating holding unit 322 from above.

[0055] like Figure 3 As shown, the multiple nozzles 331 can also each open downwards at an angle. Opening downwards at an angle is one example of opening downwards. For example, each nozzle head 332 of the multiple nozzles 331 can protrude downwards at an angle, with the tip of the nozzle head 332 opening downwards at an angle.

[0056] like Figure 4 As shown, the opening directions of the multiple nozzle heads 332 respectively disposed in multiple standby positions 336 may be different when viewed from above. Correspondingly, the orientations of the multiple standby slots 370 respectively disposed in multiple standby positions 336 may also be different when viewed from above. The opening directions of the multiple nozzle heads 332 are adjusted such that the difference in the opening directions of the nozzle heads 332 disposed in the first ejection position 314 or the second ejection position 324 is reduced among the multiple nozzle heads 332. For example... Figure 5 (a) indicates Figure 4 The lowest nozzle head 332 is positioned at the first ejection position 314. Figure 5(b) indicates Figure 4 The uppermost nozzle head 332 is positioned at the first ejection position 314. Figure 5 In the example shown, by making the opening direction of the nozzle head 332 different in multiple standby positions 336, the opening direction of the nozzle head 332 is made consistent in the first discharge position 314. This is because the rotation angle of the arm 342 until the nozzle head 332 is positioned in the first discharge position 314 is different because the positions of picking up the nozzle head 332 are different.

[0057] In this way, the opening directions of the multiple nozzle heads 332, which are respectively arranged in multiple standby positions 336, are different when viewed from above. According to this structure, the complexity of the nozzle delivery section 340 can be avoided, and the difference in the opening directions of the nozzle heads 332 when spraying treatment liquid among the multiple nozzle heads 332 can be reduced.

[0058] like Figure 6 As shown, the liquid treatment apparatus 300 may further include a first peripheral removal unit 350 and a second peripheral removal unit 360. The first peripheral removal unit 350 supplies a coating-removing processing liquid to the peripheral portion of the wafer W held in the first rotating holding unit 312 using a first removal nozzle 351, which is different from the plurality of nozzle heads 332. The second peripheral removal unit 360 supplies a coating-removing processing liquid to the peripheral portion of the wafer W held in the second rotating holding unit 322 using a second removal nozzle 361, which is different from the plurality of nozzle heads 332 and the first removal nozzle 351.

[0059] For example, the first peripheral removal unit 350 includes a first removal nozzle 351, a first liquid delivery line 352, a first valve 353, a first standby tank 354, and a first nozzle delivery unit 355. The first liquid delivery line 352 guides a processing liquid capable of removing the coating to the first removal nozzle 351. The first removal nozzle 351 ejects the processing liquid guided by the first liquid delivery line 352. The first valve 353 opens and closes the first liquid delivery line 352. This switches between a spraying state where processing liquid is ejected from the first removal nozzle 351 and a spraying stop state where processing liquid is not ejected from the first removal nozzle 351. The first nozzle delivery unit 355 delivers the first removal nozzle 351 between the periphery of the first cup 313 and within the first cup 313. The first standby tank 354 receives droplets falling from the first removal nozzle 351 around the first cup 313.

[0060] Similarly, the second peripheral removal unit 360 includes a second removal nozzle 361, a second liquid delivery line 362, a second valve 363, a second standby tank 364, and a second nozzle delivery unit 365. The second liquid delivery line 362 guides a processing liquid capable of removing the coating to the second removal nozzle 361. The second removal nozzle 361 ejects the processing liquid guided by the second liquid delivery line 362. The second valve 363 opens and closes the second liquid delivery line 362. This switches between a spraying state where processing liquid is ejected from the second removal nozzle 361 and a spraying stop state where processing liquid is not ejected from the second removal nozzle 361. The second nozzle delivery unit 365 delivers the second removal nozzle 361 between the area around and within the second cup 323. The second standby tank 364 receives droplets falling from the second removal nozzle 361 around the second cup 323.

[0061] Alternatively, the first peripheral removal section 350 may be arranged alongside the first rotating holding section 312 along the first arrangement direction D1, and the second peripheral removal section 360 may be arranged alongside the second rotating holding section 322 along the first arrangement direction D1. For example, the first removal nozzle 351, the first standby slot 354, and the first nozzle delivery section 355 may also be arranged alongside the first cup unit 310 along the first arrangement direction D1. The second removal nozzle 361, the second standby slot 364, and the second nozzle delivery section 365 may also be arranged alongside the second cup unit 320 along the first arrangement direction D1.

[0062] It is possible to easily prevent the first peripheral removal section 350 and the second peripheral removal section 360 from obstructing the delivery of the multiple nozzles 331. The first cup unit 310 and the second cup unit 320 may also be located between the first peripheral removal section 350 and the second peripheral removal section 360 in the first arrangement direction D1.

[0063] Multiple standby positions 336 may also each have a standby slot 370. The standby slot 370 receives cleaning fluid from below through a corresponding nozzle 331. The cleaning fluid may be, for example, an organic solvent such as a thinner.

[0064] like Figure 7 of (a), Figure 7 As shown in (b), for the standby tank 370, cleaning fluid CL is supplied to the upward-opening storage section 371, so that the cleaning fluid CL overflowing to the side while the liquid level is rising upwards comes into contact with the corresponding nozzle 331 (nozzle head 332). The standby tank 370 can also be configured such that the upward-rising liquid level gradually decreases, causing the cleaning fluid CL to move away from the nozzle 331. This can suppress liquid residue of cleaning fluid CL relative to the nozzle 331, and suppress the reduction in processing quality caused by liquid residue.

[0065] For example, the standby tank 370, in addition to the storage section 371, also includes a supply section 372, a guide section 373, and a discharge section 374. The storage section 371 opens upwards to store cleaning fluid. The supply section 372 supplies cleaning fluid CL into the storage section 371. For example, the supply section 372 includes a delivery line 375 for guiding the cleaning fluid CL into the storage section 371 and a valve 376 for opening and closing the delivery line 375. The guide section 373 guides the cleaning fluid CL overflowing upwards from the storage section 371 to the side. For example, the guide section 373 is partially formed on a slope around the storage section 371, decreasing in height as it moves away from the storage section 371. The discharge section 374 discharges the cleaning fluid CL from the bottom of the storage section 371. For example, the discharge section 374 includes a discharge line 377 for guiding the cleaning fluid CL from the bottom of the storage section 371 and a valve 378 for opening and closing the discharge line 377.

[0066] According to this structure, the flow rate of the cleaning fluid flowing from the delivery line 375 to the storage section 371 can be changed using valve 376. The flow rate of the cleaning fluid flowing from the storage section 371 to the discharge line 377 can be changed using valve 378. Changing the flow rate includes switching between zero and a flow rate greater than zero. Hereinafter, the state in which the flow rate of the cleaning fluid flowing from the delivery line 375 to the storage section 371 is greater than the flow rate of the cleaning fluid flowing from the storage section 371 to the discharge line 377 is referred to as "State 1". The state in which the flow rate of the cleaning fluid flowing from the storage section 371 to the discharge line 377 is greater than the flow rate of the cleaning fluid flowing from the delivery line 375 to the storage section 371 is referred to as "State 2".

[0067] In the first state, the cleaning fluid overflows upward from the storage section 371 and comes into contact with the nozzle 331 (nozzle head 332) (see reference). Figure 7 (a)). When the first state switches to the second state, the level of the cleaning fluid gradually decreases and moves away from the nozzle 331 (refer to...). Figure 7 (b) In this way, by causing the collected liquid to rise and contact the nozzle 331 without causing the cleaning fluid to scatter, and by causing the collected liquid to fall away from the nozzle 331, it is easy to suppress the liquid residue of the cleaning fluid relative to the nozzle 331.

[0068] like Figure 8 As shown, the liquid processing apparatus 300 may also include one or more back nozzles 381. Each of the one or more back nozzles 381 can supply processing liquid (second processing liquid) to the back side (lower surface) of the wafer W held in the first rotating holding portion 312. For example, the liquid processing apparatus 300 includes multiple back supply systems 380. The liquid processing apparatus 300 provides multiple back supply systems 380 for both the first cup unit 310 and the second cup unit 320.

[0069] As an example, the multiple back-side supply systems 380 include a back-side coating system 380A, a slant rinsing system 380B, and a back-side rinsing system 380C. The back-side coating system 380A has a pair of back-side nozzles 381A, a pair of support arms 382A, a liquid delivery line 383A, and a valve 384A. The pair of back-side nozzles 381A is an example of more than one back-side nozzle 381, which respectively sprays a processing liquid for film formation or filling towards the periphery of the back side of the wafer W. The pair of support arms 382A respectively support the pair of back-side nozzles 381A in a manner opposite to the periphery of the back side of the wafer W. The liquid delivery line 383A guides the processing liquid to the pair of back-side nozzles 381A. The valve 384A opens and closes the liquid delivery line 383A. This switches between a spraying state where processing liquid is sprayed from the pair of back-side nozzles 381A towards the back side of the periphery of the wafer W and a spraying stop state where no processing liquid is sprayed.

[0070] The inclined surface rinsing system 380B includes a pair of back nozzles 381B, a pair of support arms 382B, a liquid delivery line 383B, and a valve 384B. The pair of back nozzles 381B is an example of more than one back nozzle 381, each spraying rinsing fluid toward the peripheral portion of the back surface of the wafer W. The pair of support arms 382B each supports the pair of back nozzles 381B in a manner opposite to the peripheral portion of the back surface of the wafer W. The liquid delivery line 383B guides the rinsing fluid to the pair of back nozzles 381B. The valve 384B opens and closes the liquid delivery line 383B. This switches between a spraying state (rinsing fluid sprayed from the pair of back nozzles 381B toward the back surface of the peripheral portion of the wafer W) and a spraying stop state (no rinsing fluid sprayed).

[0071] The back-side flushing system 380C includes a pair of back-side nozzles 381C, a liquid delivery line 383C, and a valve 384C. The pair of back-side nozzles 381C is an example of more than one back-side nozzle 381, positioned closer to the vertical axis 311 than a pair of back-side nozzles 381B. The pair of back-side nozzles 381C spray flushing fluid towards the back side of the wafer W. For example, the distance from the vertical axis 311 to the pair of back-side nozzles 381C is smaller than the distance from the vertical axis 311 to the pair of back-side nozzles 381B. The liquid delivery line 383C guides flushing fluid to the pair of back-side nozzles 381C. The valve 384C opens and closes the liquid delivery line 383C. This switches between a state where flushing fluid is sprayed from the pair of back-side nozzles 381C towards the back side of the wafer W and a state where flushing fluid is not sprayed.

[0072] Figure 9 This is a cross-sectional view of the portion of nozzle 331 that has nozzle head 332. (Example) Figure 9 As shown, the nozzle head 332 can also be detachable. The nozzle head 332 is part of the nozzle 331, but for convenience, the nozzle 331 and the nozzle head 332 will be distinguished below.

[0073] For example, the base of the nozzle head 332 is inserted into the nozzle 331. An airtight gasket 337 is disposed between the outer peripheral surface of the nozzle head 332 and the inner peripheral surface of the nozzle 331. The gasket 337 is assembled to the nozzle head 332 and inserted into the nozzle 331 together with the nozzle head 332. When the nozzle head 332 is removed from the nozzle 331, such a gasket 337 may sometimes remain inside the nozzle 331.

[0074] Therefore, in order to remove the residual gasket 337 from the nozzle 331, the liquid treatment device 300 may also include... Figure 10 The tool 390 is shown. Tool 390 has a sleeve 391 and a pin 392. The sleeve 391 has a tip 393 that can be inserted into a washer 337 remaining in the nozzle 331. The pin 392 is inserted into the sleeve 391. If the pin 392 is inserted to its deepest point relative to the sleeve 391, then... Figure 11 As shown, pin 392 extends the tip 393 outward, pressing the tip 393 against the inner surface of washer 337. In this state, by pulling tool 390 out of nozzle 331, washer 337 and tip 393 can be easily removed from nozzle 331 together.

[0075] [Summarize]

[0076] The above disclosure includes the following structure.

[0077] (1) The substrate processing apparatus 1 includes: a first rotating holding part 312 that holds the substrate W and rotates it about a vertical axis 321; a plurality of nozzles 331 that can spray processing liquid individually; and a nozzle delivery part 340 that picks up any one of the plurality of nozzles 331 and delivers the picked-up nozzle 331 to a first spraying position 314 that can spray processing liquid toward the periphery of the substrate W held by the first rotating holding part 312.

[0078] By making the nozzle delivery section 340 shared and using multiple nozzles 331 separately, it is possible to suppress the size of the device and cope with multiple types.

[0079] (2) The substrate processing apparatus 1 according to (1) further includes a second rotation holding part 322, which is arranged alongside the first rotation holding part 312 along a first arrangement direction D1 intersecting the vertical axis 321, for holding the substrate W and rotating it. A plurality of nozzles 331 are respectively arranged in a plurality of standby positions 336 along a second arrangement direction D2 intersecting the vertical axis 321 and the first arrangement direction D1. The nozzle delivery part 340 picks up any one of the plurality of nozzles 331 at the corresponding standby position 336 and can deliver the picked-up nozzle 331 to any one of the first spray position 314 and the second spray position 324 which can spray the processing liquid toward the periphery of the substrate W held by the second rotation holding part 322.

[0080] The first rotary holding part 312 and the second rotary holding part 322 can share a plurality of nozzles 331, thus further suppressing the enlargement of the device. In addition, by arranging the plurality of nozzles 331 in a different direction than the arrangement direction of the first rotary holding part 312 and the second rotary holding part 322, it is possible to prevent the device from becoming longer in one direction.

[0081] (3) The substrate processing apparatus 1 according to (2) wherein the nozzle delivery unit 340 includes: a base 341 which is movable along a first arrangement direction D1; an arm 342 which is connected to the base 341 in a manner that allows rotation about a vertical axis 321; a nozzle holding unit 343 which is disposed at the end of the arm 342 for holding any one of a plurality of nozzles 331; a first drive unit 344 which rotates the arm 342 about the vertical axis 321; and a second drive unit 345 which moves the base 341 along the first arrangement direction D1.

[0082] By combining a base 341 that can move along the first arrangement direction D1 and an arm 342 that can rotate around the vertical axis 321, the sharing of multiple nozzles 331 in the first rotation holding part 312 and the second rotation holding part 322 can be easily realized.

[0083] (4) According to the substrate processing apparatus 1 described in (3), the plurality of nozzles 331 open downwards and are respectively arranged in the plurality of standby positions 336. The opening directions of the plurality of nozzles 331 are different from each other, so that the difference in the opening direction of the nozzles 331 in the state of the first ejection position 314 is reduced among the plurality of nozzles 331.

[0084] This avoids complicating the structure of the nozzle delivery unit 340 and reduces the difference in the opening direction of the nozzles 331 when spraying treatment liquid among multiple nozzles 331, thereby improving the stability of the treatment quality.

[0085] (5) The substrate processing apparatus 1 according to any one of (1) to (4), wherein the plurality of nozzles are nozzles for spraying processing liquid toward the periphery of the substrate.

[0086] (6) The substrate processing apparatus 1 according to any one of (2) to (5), wherein the substrate processing apparatus 1 further comprises: a first peripheral removal unit 350, which supplies a processing liquid capable of removing the coating to the peripheral portion of the substrate W held by the first rotating holding unit 312 by means of a first removal nozzle 351 different from the plurality of nozzles 331; and a second peripheral removal unit 360, which supplies a processing liquid capable of removing the coating to the peripheral portion of the substrate W held by the second rotating holding unit 322 by means of a second removal nozzle 361 different from the plurality of nozzles 331 and the first removal nozzle 351.

[0087] It can handle a wider variety of species.

[0088] (7) The substrate processing apparatus 1 according to (6) wherein the first peripheral removal portion 350 is arranged alongside the first rotating holding portion 312 along the first arrangement direction D1, and the second peripheral removal portion 360 is arranged alongside the second rotating holding portion 322 along the first arrangement direction D1.

[0089] It is possible to easily prevent the first peripheral removal section 350 and the second peripheral removal section 360 from obstructing the delivery of the multiple nozzles 331.

[0090] (8) The substrate processing apparatus 1 according to any one of (2) to (7) wherein a plurality of nozzles 331 open downwards and a plurality of standby positions 336 each have a standby tank 370 for supplying cleaning fluid from the corresponding nozzles 331 downwards. For the standby tank 370, cleaning fluid is supplied to the storage section 371 that opens upwards, so that the cleaning fluid overflowing to the side when the liquid surface is raised upwards comes into contact with the corresponding nozzles 331, and the raised liquid surface is gradually lowered so that the cleaning fluid moves away from the nozzles 331.

[0091] It can suppress the liquid residue of cleaning fluid and prevent the reduction in treatment quality caused by liquid residue.

[0092] (9) The substrate processing apparatus 1 according to (8) wherein the standby tank 370 has: a storage section 371 that opens upward; a supply section 372 that supplies cleaning fluid into the storage section 371; a guide section 373 that guides the cleaning fluid overflowing upward from the storage section 371 to the side; and a discharge section 374 that discharges cleaning fluid from the bottom of the storage section 371.

[0093] It allows for easy control of the liquid level.

[0094] (10) The substrate processing apparatus 1 according to any one of (1) to (9), wherein the nozzle delivery unit 340 delivers the picked-up nozzle 331 to a first ejection position 314 capable of supplying the first processing liquid to the peripheral portion of the surface of the substrate W, and the substrate processing apparatus 1 further comprises one or more back nozzles 381 for supplying the second processing liquid to the back side of the substrate W held in the first rotating holding unit 312.

[0095] It can handle a wider variety of types.

[0096] The implementation methods have been described above, but this disclosure is not necessarily limited to the above-described implementation methods, and various modifications can be made without departing from its spirit.

Claims

1. A substrate processing apparatus, characterized in that, The substrate processing apparatus includes: The first rotating holding part holds the substrate and rotates it about the vertical axis. Multiple nozzles, each capable of individually spraying the treatment liquid; and The nozzle delivery unit picks up any one of the plurality of nozzles and delivers the picked-up nozzle to a first ejection position where the processing liquid can be ejected toward the periphery of the substrate held by the first rotating holding unit.

2. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus further includes a second rotating holding section, which is arranged alongside the first rotating holding section along a first arrangement direction intersecting the vertical axis, for holding the substrate and rotating it. The plurality of nozzles are respectively configured in a plurality of standby positions, and the plurality of standby positions are arranged along a second arrangement direction that intersects the vertical axis and the first arrangement direction. The nozzle delivery unit picks up any one of the plurality of nozzles at a corresponding standby position and can deliver the picked-up nozzle to either the first ejection position or the second ejection position, which can eject the processing liquid toward the periphery of the substrate held by the second rotation holding unit.

3. The substrate processing apparatus according to claim 2, characterized in that, The nozzle delivery section has: A base that is movable along the first arrangement direction; An arm, which is connected to the base in a manner that allows rotation about a vertical axis; A nozzle holding part, which is disposed at the end of the arm, is used to hold any one of the plurality of nozzles; A first drive unit, which rotates the arm about a vertical axis; and The second drive unit moves the base along the first arrangement direction.

4. The substrate processing apparatus according to claim 3, characterized in that, The plurality of nozzles each open at an angle downwards. The opening directions of the plurality of nozzles respectively configured in the plurality of standby positions are different from each other, so that the difference in the opening direction of the nozzles configured in the first ejection position is reduced among the plurality of nozzles.

5. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that, The plurality of nozzles are nozzles for spraying processing liquid toward the periphery of the substrate.

6. The substrate processing apparatus according to any one of claims 2 to 4, characterized in that, The substrate processing apparatus also includes: The first peripheral removal section supplies a processing liquid capable of removing the coating to the peripheral portion of the substrate held by the first rotating holding section using a first removal nozzle different from the plurality of nozzles. and The second peripheral removal section supplies a processing liquid capable of removing the coating to the peripheral portion of the substrate held by the second rotating holding section using a second removal nozzle, which is different from the plurality of nozzles and the first removal nozzle.

7. The substrate processing apparatus according to claim 6, characterized in that, The first peripheral removal portion is arranged alongside the first rotating holding portion along the first arrangement direction, and the second peripheral removal portion is arranged alongside the second rotating holding portion along the first arrangement direction.

8. The substrate processing apparatus according to any one of claims 2 to 4, characterized in that, The plurality of nozzles each open downwards. Each of the multiple standby positions has a standby tank from which cleaning fluid is supplied from a corresponding nozzle downwards. For the standby slot The cleaning fluid is supplied to the upward-opening storage section, causing the cleaning fluid to overflow to the side when the fluid level is raised upwards and come into contact with the corresponding nozzle. The upward-rising liquid level is gradually lowered, causing the cleaning fluid to move away from the nozzle.

9. The substrate processing apparatus according to claim 8, characterized in that, The standby slot has: The storage section opens upwards; A supply unit that supplies the cleaning solution to the storage unit; A guide section that guides the cleaning fluid overflowing upwards from the storage section to the side; and The discharge section discharges the cleaning fluid from the bottom of the storage section.

10. The substrate processing apparatus according to any one of claims 1 to 4, characterized in that, The nozzle delivery unit delivers the picked-up nozzle to the first ejection position capable of supplying the first processing liquid to the peripheral portion of the surface of the substrate. The substrate processing apparatus further includes one or more back nozzles for supplying a second processing liquid to the back side of the substrate held in the first rotating holding portion.

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