Substrates, semiconductor devices and electronic devices

Abstract

This disclosure relates to a substrate, a semiconductor device, and an electronic device. The substrate includes a substrate body with differential pair bumps and ground bumps, adjacent differential pair bumps being separated by the ground bumps. The distance from the differential pair bump closest to the edge of the substrate body to the edge of the substrate body is greater than the distance from the ground bump closest to the edge of the substrate body to the edge of the substrate body. Therefore, by separating adjacent differential pair bumps by the ground bumps, and by ensuring that the distance from the differential pair bump closest to the edge of the substrate body to the edge of the substrate body is greater than the distance from the ground bump closest to the edge of the substrate body to the edge of the substrate body, crosstalk between differential signals from adjacent differential pair bumps is reduced, thereby improving signal transmission quality.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor substrate technology, and more specifically, to a substrate, a semiconductor device, and an electronic device. Background Technology

[0002] In related technologies, differential pair bumps and ground bumps are provided in the substrate. The differential pair bumps closest to the edge of the substrate are not completely surrounded by the ground bumps, resulting in gaps at the edge. This causes significantly greater interference between adjacent differential signals than on the inner side, leading to a decrease in signal transmission quality. Utility Model Content

[0003] The purpose of this disclosure is to provide a substrate, semiconductor device, and electronic device that can reduce interference between adjacent differential signals at the edge of the substrate body and improve signal transmission quality, thereby at least partially solving the related technical problems.

[0004] To achieve the above objectives, according to a first aspect of the present disclosure, a substrate is provided, comprising: a substrate body, wherein the substrate body is provided with differential pair bumps and ground bumps, and adjacent differential pair bumps are separated by the ground bumps; Wherein, the distance from the differential pair bump closest to the edge of the substrate body to the edge of the substrate body is greater than the distance from the ground bump closest to the edge of the substrate body to the edge of the substrate body.

[0005] Optionally, both the differential pair bump and the ground bump are spherical.

[0006] Optionally, the differential pair bump closest to the edge of the substrate body is located inside the first reference line, wherein the first reference line is a straight line passing through the center of the grounding bump closest to the edge of the substrate body and parallel to the edge of the substrate body.

[0007] Optionally, the differential pair convex points include a first convex point and a second convex point, wherein the signal amplitudes of the first convex point and the second convex point are the same and their phases differ by 180°.

[0008] Optionally, among the differential pair bumps and the ground bumps closest to the edge of the substrate body, the distance y between the geometric center of the second bump and the geometric center of the ground bump is greater than 0 and less than or equal to the radius of the second bump.

[0009] Optionally, the distances from the differential pair bumps to the two adjacent ground bumps are equal in the first direction; In the first direction, the distances from the differential pair bumps to the two adjacent ground bumps are not equal; Wherein, the first direction is a direction parallel to the edge of the substrate body.

[0010] Optionally, the grounding bump closest to the edge of the substrate body is aligned with the differential pair bump in a second direction; wherein the second direction is perpendicular to the edge of the substrate body.

[0011] Optionally, the grounding bump next to the edge of the substrate body is aligned with the differential pair bump in a first direction; wherein the first direction is parallel to the edge of the substrate body.

[0012] According to a second aspect of this disclosure, a semiconductor device is provided, comprising the substrate described above.

[0013] According to a third aspect of this disclosure, an electronic device is provided, including the semiconductor device described above.

[0014] The above technical solution includes differential pair bumps and ground bumps in the substrate. Adjacent differential pair bumps are separated by ground bumps. The distance from the differential pair bump closest to the edge of the substrate body to the edge of the substrate body is greater than the distance from the ground bump closest to the edge of the substrate body to the edge of the substrate body. This reduces crosstalk between differential signals between adjacent differential pair bumps and improves signal transmission quality.

[0015] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the accompanying drawings...

[0017] Figure 1 This is a schematic diagram of the arrangement of differential pair bumps and ground bumps in a substrate in related technologies.

[0018] Figure 2 This is a schematic diagram of the first substrate arrangement provided in this application.

[0019] Figure 3 This is a schematic diagram of the second substrate arrangement provided in this application.

[0020] Figure 4 This is a diagram showing the crosstalk relationship between adjacent differential signals at the nearest edge of the substrate body when y takes different values, as provided in this application.

[0021] Explanation of reference numerals in the attached figures 1-Substrate body; 2-Differential pair bump; 21-First bump; 22-Second bump; 3-Ground bump. Detailed Implementation

[0022] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0023] In this disclosure, unless otherwise stated, directional terms such as "first direction" are used for reference. Figures 1 to 3 In the X direction, the "second direction" can be referenced. Figures 1 to 3 In the Y direction; "inner" and "outer" refer to the contours of the corresponding components themselves. The terms "first," "second," etc., used in this disclosure are for distinguishing one element from another and do not indicate sequence or importance. When the following description relates to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0024] In related technologies, such as Figure 1 As shown, differential pair vias and ground vias are provided in the substrate. Differential pair bumps 2 are provided in the differential pair vias, and ground bumps 3 are provided in the ground vias. The differential pair bumps 2 closest to the edge of the substrate are not completely surrounded by the ground bumps 3, forming a gap at the edge of the substrate. As a result, the interference between adjacent differential pair bumps 2 during signal transmission is significantly greater than that on the inner side, causing a decrease in signal transmission quality.

[0025] To achieve the above objectives, such as Figures 2 to 4 As shown, according to a first aspect of the present disclosure, a substrate is provided, comprising: a substrate body 1, wherein differential pair bumps 2 and ground bumps 3 are provided on the substrate body 1, and adjacent differential pair bumps 2 are separated by ground bumps 3; wherein the distance from the differential pair bump 2 closest to the edge of the substrate body 1 to the edge of the substrate body 1 is greater than the distance from the ground bump 3 closest to the edge of the substrate body 1 to the edge of the substrate body 1.

[0026] The above technical solution includes differential pair bumps 2 and ground bumps 3 in the substrate. Adjacent differential pair bumps 2 are separated by ground bumps 3. The distance from the differential pair bump 2 closest to the edge of the substrate body 1 to the edge of the substrate body 1 is greater than the distance from the nearest ground bump 3 to the edge of the substrate body 1. This reduces crosstalk between differential signals between adjacent differential pair bumps 2 and improves signal transmission quality.

[0027] It is understood that the aforementioned substrate can be a packaging substrate, which includes multiple layers of wiring layers, insulating layers, and solder mask layers. Each wiring layer is electrically connected vias. The wiring layers are used to transmit current and signals. The insulating layers are typically disposed between adjacent wiring layers to isolate the wiring layers and control signal impedance. The solder mask layers are typically disposed on both sides of the packaging substrate. Multiple differential pair vias and ground vias are arranged in an array on the substrate body 1. Differential pair bumps 2 are provided in the differential pair vias, and ground bumps 3 are provided in the ground vias. Adjacent differential pair bumps 2 are separated by ground bumps 3. Figure 2 As shown, the differential pair bumps 2 can be arranged on the substrate body 1 along the first direction X and the second direction Y in a preset array manner. The first direction X can be a straight line parallel to the edge of the substrate body 1, and the second direction Y can be a straight line perpendicular to the edge of the substrate body 1.

[0028] In some feasible implementations, both differential pair bump 2 and ground bump 3 are spherical, for example, both can be copper or solder balls, thus accommodating corresponding differential pair vias and ground vias to facilitate differential signal transmission and grounding around the differential signal. Furthermore, the spherical shape of differential pair bump 2 and ground bump 3 enhances symmetrical arrangement and suppresses common-mode noise.

[0029] Of course, the spherical structure of differential pair bump 2 and ground bump 3 is schematic. In other embodiments, differential pair bump 2 and ground bump 3 can also be cylindrical. For example, differential pair bump 2 and ground bump 3 can be set as copper pillars. In this case, the copper pillars of differential pair bump 2 and ground bump 3 can be composed of a copper pillar body, a blocking layer and a tin cap. They can also be adapted to corresponding differential pair vias and ground vias to facilitate differential signal transmission and to set ground around the differential signal.

[0030] In some feasible ways, such as Figure 2 As shown, the differential pair bump 2 closest to the edge of the substrate body 1 is located inside the first reference line A, where the first reference line A is a straight line passing through the center of the ground bump 3 closest to the edge of the substrate body 1 and parallel to the edge of the substrate body 1. For example, each differential pair bump 2 may include a first bump 21 and a second bump 22, where the signal amplitudes of the first bump 21 and the second bump 22 are the same and their phases differ by 180°. That is, as... Figure 2As shown, each differential pair bump 2 includes a first bump 21 for the positive phase P and a second bump 22 for the negative phase N. It is understood that, to ensure the quality of differential signal transmission, the positive phase P and negative phase N within the same differential pair bump 2 need to be symmetrical about the differential pair centerline, and the dimensions of the positive phase P and negative phase N must also be the same. This symmetrical arrangement of the positive phase P and negative phase N allows common-mode noise to cancel each other during differential signal transmission. The first bump 21 and the second bump 22 are spaced apart in the second direction. The second bump 22 is closer to the edge of the substrate body 1 than the first bump 21. At this time, the second bump 22 is located inside the first reference line A. The first reference line A is a straight line passing through the center of the outermost ground bump 3 and parallel to the first direction. The first direction can be referenced... Figure 2 In the X direction, the second direction can be referenced. Figure 2 In the Y direction, where the first direction and the second direction are perpendicular to each other, when the substrate body 1 is rectangular, the first direction and the second direction are the extension directions of the two intersecting sides of the rectangle, respectively. This allows the outermost differential pair bumps 2 to have multiple ground bumps 3 between them and the edge of the substrate body 1, thereby reducing crosstalk in the outermost differential signals and improving signal transmission quality.

[0031] It is understood that the differential pair bump 2 closest to the edge of the substrate body 1 is located inside the first reference line A. The first reference line A is a straight line that passes through the center of the ground bump 3 closest to the edge of the substrate body 1 and is parallel to the edge of the substrate body 1. The second bump 22 in the differential pair bump 2 can be moved toward the first bump 21 corresponding to the second bump 22 without changing the original position of the outermost ground bump 3, so that the second bump 22 is recessed, thereby making the differential pair bump 2 closest to the edge of the substrate body 1 located inside the first reference line A. Of course, the position of the outermost grounding bump 3 can also be moved outward toward the edge of the substrate body 1. In this case, the positions of the first bump 21 and the second bump 22 in the differential pair bump 2 of the transformer closest to the substrate body 1 are not changed. In this way, the differential pair bump 2 closest to the edge of the substrate body 1 can also be located inside the first reference line A, thereby reducing the crosstalk of differential signals between adjacent differential pair bumps 2 and improving the signal transmission quality.

[0032] In some feasible embodiments, among the differential pair bumps 2 and ground bumps 3 closest to the edge of the substrate body 1, the distance y between the geometric center of the second bump 22 and the geometric center of the ground bump 3 is greater than 0 and less than or equal to the radius of the second bump 22. Therefore, by limiting the distance between the geometric center of the second bump 22 and the geometric center of the ground bump 3, the differential signal transmission quality of two adjacent differential pair bumps 2 at the edge of the substrate body 1 can be improved.

[0033] For example, in the differential pair bump 2 and ground bump 3 closest to the edge of the substrate body 1, both the second bump 22 and the ground bump 3 can be copper balls with a diameter of 0.6 mm. In this case, the distance y between the geometric center of the second bump 22 in the differential pair bump 2 and the geometric center of the ground bump 3 satisfies: 0 < y ≤ 0.3 mm. Specifically, refer to... Figure 2 In the differential pair bump 2 and ground bump 3 closest to the edge of the substrate body 1, the second bump 22 in differential pair bump 2 and the ground bump 3 can both be spherical. The second bump 22 and the ground bump 3 can be copper balls or solder balls. In this embodiment, the second bump 22 and the ground bump 3 can both be copper balls with a diameter of 0.6 mm. The second bump 22 and the first bump 21 are combined to transmit differential signals. The ground bump 3 is connected to the ground layer of the substrate body 1. The distance between the geometric center of the second bump 22 in differential pair bump 2 and the geometric center of the ground bump 3 in the second direction is y. At this time, 0 < y ≤ 0.3 mm. Figure 4 It can be seen that within the range of 0 < y ≤ 0.3 mm, as y increases, the crosstalk between adjacent differential signals gradually decreases. It is understandable that in the range of 0 < y ≤ 0.3 mm, y can be any value between 0 and 3, for example, y can be 0.05 mm, 0.1 mm, 0.11 mm, 0.12 mm, 0.15 mm, 0.2 mm, 0.25 mm, etc., thus improving the differential signal transmission quality between two adjacent differential pair bumps 2 at the edge of the substrate body 1.

[0034] In some feasible embodiments, there are multiple ground bumps 3 closest to the edge of the substrate body 1 in the first direction. The ground bumps 3 can be spherical and multiple ground bumps 3 are spaced apart in the first direction. The geometric centers of the multiple ground bumps 3 in the first direction are collinear, thereby forming a ground shielding layer outside the differential pair bump 2 signal, reducing differential signal interference between adjacent differential pair bumps 2, and improving the transmission quality of differential signals.

[0035] It is understood that the embodiment in the first direction where the geometric centers of the ground bumps 3 are collinear is illustrative. In other embodiments, the number of ground bumps 3 on the substrate body 1 can be multiple. When the substrate body 1 is rectangular, the multiple ground bumps 3 are arranged in an array on the substrate body 1, that is, the multiple ground bumps 3 are arranged at preset distances in both the first and second directions. In the second direction, the distance between the ground bump 3 closest to the edge of the substrate body 1 and the next closest ground bump 3 can be greater than the distance between the next closest ground bump 3 and the adjacent inner ground bump 3. Thus, a shielding layer composed of multiple ground bumps 3 can be formed outside the differential pair bumps 2 closest to the edge of the substrate body 1 to improve the differential signal transmission quality of the differential pair bumps 2 at the edge of the substrate body 1.

[0036] Of course, in some feasible implementations, the distances from the differential pair bump 2 to the two adjacent ground bumps 3 in the first direction are equal, such as... Figure 2 As shown, the differential pair bumps 2 may include a first bump 21 and a second bump 22. The first bump 21 and the second bump 22 are spaced apart in the second direction. Ground bumps 3 are respectively provided on both sides of the differential pair bumps 2 in the first direction. That is, corresponding ground bumps 3 are provided on both sides of the first bump 21 and on both sides of the second bump 22. The distances from the first bump 21 to the two adjacent corresponding ground bumps 3 are equal, and the distances from the second bump 22 to the two adjacent corresponding ground bumps 3 are equal. This allows multiple differential pair bumps 2 to be arranged symmetrically, reducing signal interference between adjacent differential pair bumps 2 and ensuring the quality of differential signal transmission. It should be noted that the distance from the two differential pair bumps 2 on both sides of the ground bump 3 in the first direction to the ground bump 3 refers to the shortest distance from the geometric center of the two differential pair bumps 2 to the geometric center of the ground bump 3 in the first direction.

[0037] It is understood that the equivalence of the distances from the differential pair bump 2 to the two adjacent ground bumps 3 in the first direction is illustrative. In other embodiments, the distances from the differential pair bump 2 to the two adjacent ground bumps 3 in the first direction may be unequal or approximately equal.

[0038] Understandably, the substrate body 1 can be rectangular, and ground vias are arranged along the edges of the rectangular substrate body 1. In this case, the grounding bumps 3 provided in the grounding vias can form an annular shielding wall for the substrate body 1 to reduce signal crosstalk between external signals and differential pair vias. Multiple differential pair vias and multiple ground vias located in the middle of the rectangular substrate body 1 are arranged alternately along the first and second directions. Thus, the differential pair bumps 2 in each differential pair via located in the middle of the rectangular substrate body 1 are separated by the grounding bumps 3 in the multiple ground vias, thereby reducing crosstalk between adjacent differential pair bumps 2 and improving signal transmission quality.

[0039] In some feasible embodiments, the grounding bump 3 closest to the edge of the substrate body 1 is aligned with the differential pair bump 2 in a second direction; wherein the second direction is perpendicular to the edge of the substrate body 1. Figure 3As shown, multiple grounding bumps 3 closest to the edge of the substrate body 1 in the first direction can be spaced apart along the first direction. The number of differential pair bumps 2 adjacent to the grounding bumps 3 is also multiple and can be spaced apart along the first direction. The grounding bumps 3 closest to the edge of the substrate body 1 and the differential pair bumps 2 are aligned in the second direction. Specifically, the first bump 21 and the second bump 22 in the differential pair bumps 2 are spaced apart along the second direction. The grounding bumps 3 closest to the edge of the substrate body 1 and the corresponding second bumps 22 are aligned in the second direction, thereby forming a shielding layer on the outside of the differential pair bumps 2, reducing signal crosstalk between adjacent differential pair bumps 2, and improving the differential signal transmission quality.

[0040] In some feasible ways, such as Figure 3 As shown, the grounding bump 3 on the edge of the next adjacent substrate body 1 is aligned with the differential pair bump 2 in the first direction. The first bump 21 and the second bump 22 in the differential pair bump 2 are spaced apart along the second direction. The grounding bump 3 on the edge of the next adjacent substrate body 1 is aligned with the second bump 22 in the differential pair bump 2 in the first direction. At this time, the grounding bump 3 on the edge of the nearest adjacent substrate body 1 is aligned with the second bump 22 in the second direction, thereby forming a shielding layer around the first bump 21 and the second bump 22 in the differential pair bump 2, further reducing signal crosstalk between adjacent differential pair bumps 2 and improving the differential signal transmission quality.

[0041] According to a second aspect of this disclosure, a semiconductor device is provided, including the aforementioned substrate. The semiconductor device can be a GPU module or a CPU module. The GPU module includes the aforementioned substrate and electronic devices mounted on the substrate. The electronic devices may include a GPU chip, resistors, capacitors, and other functional chips. By providing the aforementioned substrate, the differential signal transmission quality on the substrate can be improved.

[0042] According to a third aspect of this disclosure, an electronic device is provided, including the aforementioned semiconductor device. It is understood that the electronic device may include, but is not limited to, personal computers, servers, computing devices, intelligent vehicles, etc. Furthermore, it is understood that the electronic device also possesses all the advantages of the aforementioned semiconductor device, which will not be elaborated upon here.

[0043] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0044] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0045] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A substrate, characterized in that, include: The substrate body has differential pair bumps and ground bumps, and adjacent differential pair bumps are separated by the ground bumps. Wherein, the distance from the differential pair bump closest to the edge of the substrate body to the edge of the substrate body is greater than the distance from the ground bump closest to the edge of the substrate body to the edge of the substrate body.

2. The substrate according to claim 1, characterized in that, Both the differential pair bump and the ground bump are spherical.

3. The substrate according to claim 1, characterized in that, The differential pair bump closest to the edge of the substrate body is located inside the first reference line, wherein the first reference line is a straight line passing through the center of the ground bump closest to the edge of the substrate body and parallel to the edge of the substrate body.

4. The substrate according to claim 1, characterized in that, The differential pair convex points include a first convex point and a second convex point, wherein the signal amplitudes of the first convex point and the second convex point are the same and their phases differ by 180°.

5. The substrate according to claim 4, characterized in that, Of the differential pair bumps and the ground bumps closest to the edge of the substrate body, the distance y between the geometric center of the second bump and the geometric center of the ground bump is greater than 0 and less than or equal to the radius of the second bump.

6. The substrate according to claim 4, characterized in that, In the first direction, the distances from the differential pair bumps to the two adjacent ground bumps are equal; or In the first direction, the distances from the differential pair bumps to the two adjacent ground bumps are not equal; Wherein, the first direction is a direction parallel to the edge of the substrate body.

7. The substrate according to claim 1, characterized in that, The grounding bump closest to the edge of the substrate body is aligned with the differential pair bump in a second direction; wherein the second direction is perpendicular to the edge of the substrate body.

8. The substrate according to claim 6, characterized in that, The grounding bump next to the edge of the substrate body is aligned with the differential pair bump in a first direction; wherein the first direction is parallel to the edge of the substrate body.

9. A semiconductor device, characterized in that, Includes the substrate described in any one of claims 1-8.

10. An electronic device, characterized in that, Includes the semiconductor device as described in claim 9.

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