A vacuum curing device for electronic composite material production

Abstract

The utility model provides a vacuum curing device for electronic composite material production belongs to electronic composite material production equipment technical field, including machine table, heating part and sealing cover. Among them, the machine table's table top is equipped with the elastic pressing plate for clamping diaphragm, one side of machine table is equipped with the third screw rod sliding table for driving elastic pressing plate moves along vertical direction, makes elastic pressing plate can be close to or far from the table top of machine table, the elastic pressing plate is set to circular arc board -like structure. By setting the elastic pressing plate of circular arc board -like structure, when the elastic pressing plate is close to the table top of machine table, makes diaphragm and base material adhere, the clamping surface that can be formed between elastic pressing plate and machine table gradually adheres from the middle to both sides, makes base material and diaphragm gradually adhere from the middle to both sides, in the process of adhering, the gas between base material and diaphragm can be gradually discharged to one side, avoid the bubble that appears because of exhaust is not complete when directly overall covering.

Description

Technical Field

[0001] This utility model belongs to the field of electronic composite material production equipment, specifically referring to a vacuum curing device for electronic composite material production. Background Technology

[0002] Electronic composite materials are made of two or more materials with different properties, usually with polymers, ceramics or metals as the matrix, and corresponding functional layers are attached to the surface of the matrix. The functional layers and the matrix layers are compounded by special processes, giving the material a variety of properties and unique application value in the electronics field. Vacuum curing of composite materials is an important material forming process. It uses a vacuum system to remove air between the materials, so that the composite of the materials will not produce bubbles.

[0003] Currently, the multilayer bonding of electronic composite materials involves creating a vacuum under the substrate and using negative pressure to bond the film to the substrate. However, when the bonding area of ​​the substrate is large, the negative pressure cannot reach the center of the bonding area, making it easy for air bubbles to form in the center of the substrate when bonding with the film, thus reducing the yield rate of the composite material. Utility Model Content

[0004] In view of the above situation and to overcome the defects of the prior art, this utility model provides a vacuum curing device for the production of electronic composite materials, which at least partially solves the above problems.

[0005] The technical solution adopted by this utility model is as follows: This utility model proposes a vacuum curing device for the production of electronic composite materials, comprising: A machine platform for supporting and fixing a substrate. The platform has two heating elements for heating the film. The heating elements are configured to move horizontally along the platform. A sealing cover is hinged to one side of the platform. The machine tool is provided with an elastic pressure plate for clamping the diaphragm above the table surface, and a third screw slide is provided on one side of the machine tool for driving the elastic pressure plate to move vertically, so that the elastic pressure plate can move closer to or further away from the table surface of the machine tool. The elastic pressure plate is configured as an arc plate structure, and the outer convex surface of the elastic pressure plate faces the table surface of the machine. When the elastic pressure plate moves closer to the table surface of the machine, a clamping surface that gradually fits from the middle to both sides can be formed between the elastic pressure plate and the machine, so that the substrate and the film gradually fit together. The machine table is equipped with two vacuum tubes, which are configured to slide along the middle of the machine table to both sides to extract air between the substrate and the film.

[0006] Furthermore, the elastic pressure plate is provided with an air tube, which is distributed in an S-shape on the concave surface of the elastic pressure plate. The elastic pressure plate is provided with a plurality of first air holes, which are distributed along the path of the air tube. The first air holes communicate with the interior of the air tube. The air tube includes a suction state and a supply state. When the air tube is in the suction state, the first air hole is under negative pressure, which fixes the diaphragm on the elastic pressure plate. When the air tube is in the supply state, the first air hole is under positive pressure, which causes the diaphragm to detach from the elastic pressure plate.

[0007] Furthermore, the cross-section of the vacuum tube is set as an elliptical structure, and the vacuum tube is provided with a plurality of second air holes, which are evenly distributed along the length direction of the vacuum tube.

[0008] Furthermore, the machine tool has two symmetrically arranged first lead screw slides on one side of the table surface, and the two first lead screw slides are configured to move in opposite directions or towards each other. The slider of the first lead screw slide is provided with a fixed frame, and one end of the vacuum tube is fixed on the fixed frame.

[0009] Furthermore, two second lead screw slides are provided on the other side of the machine table, and one end of each of the two heating components is fixed on the slider of the second lead screw slide.

[0010] Furthermore, the slider of the third lead screw slide is provided with a support frame, and multiple connecting rods are connected at the middle position of the elastic pressure plate. The multiple connecting rods are arranged along the width direction of the elastic pressure plate, and the top end of the connecting rod is slidably connected to the support frame. The sliding direction of the connecting rod is consistent with the driving direction of the third lead screw slide.

[0011] Furthermore, the support frame is connected to two mutually parallel limiting pressure rods, and the length direction of the limiting pressure rods is consistent with the length direction of the elastic pressure plate. The two ends of the elastic pressure plate in the length direction are in sliding contact with the limiting pressure rods.

[0012] Furthermore, a graphite plate is fixed to the bottom surface of the limiting pressure rod.

[0013] Furthermore, the machine tool is equipped with a vacuum pump, which includes two suction ends, and the two suction ends of the vacuum pump are respectively connected to the air pipe and the vacuum tube.

[0014] Furthermore, the machine is equipped with an air pump inside, and the air supply end of the air pump is connected to the air pipe for supplying air to the air pipe.

[0015] The beneficial effects of this utility model by adopting the above structure are as follows: 1. By setting up an elastic pressure plate with an arc-shaped plate structure, when the elastic pressure plate moves closer to the table surface of the machine, so that the film and the substrate are bonded together, a clamping surface can be formed between the elastic pressure plate and the machine table, which gradually bondes from the middle to both sides. This allows the substrate and the film to gradually bond from the middle to both sides. During the bonding process, the gas between the substrate and the film can be gradually discharged to one side, avoiding air bubbles caused by incomplete venting when directly covering the whole.

[0016] 2. By setting two vacuum tubes, which are located in the gap between the substrate and the film on both sides, as the substrate and the film are bonded, the two vacuum tubes move to both sides at the same speed as the bonding speed. The vacuum tubes are used to further extract the residual air at the bonding point of the substrate and the film, thereby further reducing the probability of air bubbles appearing when the substrate and the film are bonded. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a vacuum curing device for producing electronic composite materials according to an embodiment of the present invention; Figure 2 A schematic diagram showing the installation positions of the vacuum pump and air pump in a vacuum curing device for producing electronic composite materials, as proposed in an embodiment of this utility model. Figure 3 This is a schematic diagram showing the installation positions of the gas pipe and connecting rod in a vacuum curing device for producing electronic composite materials, as proposed in an embodiment of this utility model. Figure 4 This is a schematic diagram showing the location of the first pore in a vacuum curing device for producing electronic composite materials, as proposed in an embodiment of this utility model. Figure 5 This is a schematic diagram of the connection structure between the vacuum tube and the first lead screw slide in a vacuum curing device for producing electronic composite materials, as proposed in an embodiment of this utility model. Figure 6 for Figure 5 Enlarged view of point A in the middle; Figure 7 This is a schematic diagram of the bonding process between a diaphragm and a substrate in a vacuum curing apparatus for producing electronic composite materials, as proposed in an embodiment of this utility model.

[0018] The components include: 1. Machine base; 11. Mounting plate; 12. Vacuum pump; 13. Air pump; 2. Elastic pressure plate; 21. Air pipe; 22. Connecting rod; 201. First air hole; 3. Vacuum pipe; 301. Second air hole; 31. First lead screw slide; 32. Fixing frame; 4. Heating component; 41. Second lead screw slide; 5. Third lead screw slide; 51. Support frame; 52. Limiting pressure rod; 6. Sealing cover.

[0019] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0021] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] like Figure 1 As shown, this utility model proposes a vacuum curing device for the production of electronic composite materials, including a machine base 1, an elastic pressure plate 2, a vacuum tube 3, a heating component 4, and a sealing cover 6.

[0023] A mounting plate 11 is fixed on the top surface of the machine base 1. The mounting plate 11 has multiple parallel T-shaped grooves for mounting pneumatic clamps, which are used to fix the substrate on the mounting plate 11.

[0024] In an optional embodiment, the mounting plate 11 can be directly mounted on a vacuum adsorption worktable, which uses negative pressure suction to fix the substrate directly, without the need for additional pneumatic clamps.

[0025] The elastic pressure plate 2 is set above the table of the machine base 1. The film to be laminated with the substrate is fixed on the bottom surface of the elastic pressure plate 2. A third screw slide 5 is provided on one side of the machine base 1 to drive the elastic pressure plate 2 to move vertically, so that the elastic pressure plate 2 can move closer to or away from the table of the machine base 1. The elastic pressure plate 2 is driven to move closer to the table of the machine base 1 by the third screw slide 5 until the film on the bottom surface of the elastic pressure plate 2 is bonded to the substrate.

[0026] The heating element 4 is set above the table of the machine tool 1. The heating element 4 heats the film fixed on the bottom surface of the elastic pressure plate 2 to soften the film. The heating element 4 is configured to move horizontally along the table of the machine tool 1. When the film is heated and softened and adheres to the substrate, the heating element 4 is moved to one side of the table of the machine tool 1 to avoid obstructing the adhesion of the film.

[0027] In a specific embodiment, two second lead screw slides 41 are provided on the other side of the table of the machine platform 1. One end of each of the two heating components 4 is fixed on the slider of the second lead screw slide 41, and the heating components 4 are driven to move horizontally by the second lead screw slide 41.

[0028] In an optional embodiment, the heating element 4 includes an infrared heating tube that uses infrared radiation to heat the diaphragm.

[0029] Thus, the diaphragm is first fixed to the bottom surface of the elastic pressure plate 2, and then the substrate is fixed to the mounting plate 11. Before fixing, the positions of the diaphragm and the substrate are adjusted to make them correspond to each other. When the diaphragm moves vertically closer to the substrate for bonding, the bonding quality is ensured. Then, the heating component 4 is moved to the bottom of the diaphragm using the second lead screw slide 41 to heat the diaphragm and soften it. After the diaphragm softens, the second lead screw slide 41 moves the heating component 4 to one side of the table surface of the machine base 1. The elastic pressure plate 2 is driven to approach the table surface of the machine base 1 through the third lead screw slide 5 until the diaphragm on the bottom surface of the elastic pressure plate 2 is bonded to the substrate.

[0030] Combination Figure 2 , Figure 3 and Figure 7 As shown, the elastic pressure plate 2 is configured as an arc-shaped plate structure, and the outer convex surface of the elastic pressure plate 2 (i.e., the bottom surface of the elastic pressure plate 2) faces the table surface of the machine base 1. When the elastic pressure plate 2 moves closer to the table surface of the machine base 1 to bond the film and the substrate, a clamping surface can be formed between the elastic pressure plate 2 and the machine base 1, which gradually bond from the middle to both sides. This allows the substrate and the film to gradually bond from the middle to both sides. During the bonding process, the gas between the substrate and the film can be gradually discharged to one side, avoiding air bubbles due to incomplete venting when directly covering the whole. At the same time, during the bonding process, the elastic pressure plate 2 is gradually flattened. The flattened area of ​​the elastic pressure plate 2 is in a compressed and stored state, which allows the elastic pressure plate 2 to apply pressure to the film. If air bubbles are generated between the substrate and the film, the pressure applied by the elastic pressure plate 2 can expel the air bubbles outward. Furthermore, the pressure applied by the elastic pressure plate 2 can make the film and the substrate bond more firmly.

[0031] Thus, after the diaphragm softens, the elastic pressure plate 2 is driven by the third screw slide 5 to approach the table surface of the machine base 1 until the diaphragm on the bottom surface of the elastic pressure plate 2 is bonded to the substrate. As the third screw slide 5 drives the elastic pressure plate 2 to continue pressing down, a clamping surface that gradually bondes from the center to both sides can be formed between the elastic pressure plate 2 and the machine base 1, allowing the substrate and the diaphragm to gradually bond from the center to both sides, avoiding air bubbles due to incomplete venting when directly covering the whole. At the same time, during the bonding process, the flattened area of ​​the elastic pressure plate 2 is in a compressed and stored state, allowing the elastic pressure plate 2 to apply pressure to the diaphragm. If air bubbles are generated between the substrate and the diaphragm, the pressure applied by the elastic pressure plate 2 can expel the air bubbles outward, and the pressure applied by the elastic pressure plate 2 can make the diaphragm bond to the substrate more firmly. After the diaphragm and the substrate are completely bonded, the elastic pressure plate 2 applies pressure to the diaphragm and maintains it for a certain period of time. After the adhesive between the diaphragm and the substrate is completely cured, the elastic pressure plate 2 is moved upward.

[0032] Combination Figure 1 As shown, a sealing cover 6 is hinged to one side of the table of machine 1. Two vacuum tubes 3 are provided on the table of machine 1. Before the film and the substrate are bonded, the sealing cover 6 is closed. At this time, the table of machine 1 is sealed by the sealing cover 6. Then, the air inside the sealing cover 6 is extracted by the vacuum tubes 3, so that the inside of the sealing cover 6 is close to a vacuum state, which can further reduce the probability of air bubbles appearing when the film and the substrate are bonded. Furthermore, the two vacuum tubes 3 are configured to slide from the center of the machine table 1 to both sides. During the process of the substrate and the film gradually bonding from the center to both sides, the two vacuum tubes 3 are located in the gaps on both sides of the substrate and the film. As the substrate and the film are bonded, the two vacuum tubes 3 move to both sides, and the moving speed is the same as the bonding speed. The vacuum tubes 3 are used to further extract the residual air at the bonding point of the substrate and the film, thereby further reducing the probability of air bubbles appearing when the substrate and the film are bonded.

[0033] In a specific embodiment, two symmetrically arranged first lead screw slides 31 are provided on one side of the table surface of the machine 1, and the two first lead screw slides 31 are configured to move in opposite directions or towards each other. A fixed frame 32 is provided on the slider of the first lead screw slide 31, and one end of the vacuum tube 3 is fixed on the fixed frame 32. The vacuum tube 3 is driven to move by the first lead screw slide 31, and the stroke of the first lead screw slide 31 is greater than the bonding distance between the substrate and the film, so as to ensure that the vacuum tube 3 can follow the bonding line between the film and the substrate throughout the entire process.

[0034] Combination Figure 1 , Figure 3 and Figure 4As shown, the elastic pressure plate 2 is provided with an air tube 21, which is distributed in an S-shape on the concave surface of the elastic pressure plate 2. The elastic pressure plate 2 is provided with a plurality of first air holes 201, which are distributed along the path of the air tube 21 and are connected to the interior of the air tube 21. In a specific embodiment, a connecting hole is provided at the position corresponding to the trachea 21 and the first air hole 201, and the first air hole 201 is connected to the inside of the trachea 21 through the connecting hole.

[0035] When the air pipe 21 is in the air extraction state, the first air hole 201 is under negative pressure. The negative pressure suction force fixes the diaphragm on the elastic pressure plate 2. At the same time, the multiple evenly distributed first air holes 201 can form multiple fixing points. The diaphragm is evenly fixed by multiple fixing points, which reduces the shrinkage and deformation of the diaphragm during cooling and solidification and improves the bonding quality between the diaphragm and the substrate. When the air tube 21 is in the air supply state, the first air hole 201 is under positive pressure, which allows the diaphragm to detach from the elastic pressure plate 2, preventing the diaphragm from being dragged upward by the elastic pressure plate 2 when the elastic pressure plate 2 rises.

[0036] Combination Figure 5 , Figure 6 and Figure 7 As shown, the cross-section of the vacuum tube 3 is set to an elliptical structure, making the vacuum tube 3 flat and allowing it to be as close as possible to the bonding area between the diaphragm and the substrate.

[0037] Furthermore, the vacuum tube 3 is provided with a plurality of second air holes 301, which are evenly distributed along the length of the vacuum tube 3. The vacuum tube 3 uses the second air holes 301 to extract air, so that a negative pressure zone along its own length can be formed on the vacuum tube 3. When extracting air at the bonding point between the film and the substrate, the bonding line between the film and the substrate can be completely vacuumed.

[0038] Combination Figure 1 and Figure 3 As shown, the slider of the third lead screw slide 5 is provided with a support frame 51. Multiple connecting rods 22 are connected to the middle position of the elastic pressure plate 2. The multiple connecting rods 22 are arranged along the width direction of the elastic pressure plate 2. The top of the connecting rod 22 is slidably connected to the support frame 51, and the sliding direction of the connecting rod 22 is consistent with the driving direction of the third lead screw slide 5. The elastic pressure plate 2 is connected to the support frame 51 through the connecting rod 22. When the elastic pressure plate 2 is flattened from the middle to both sides, the middle position of the elastic pressure plate 2 moves closer to the support frame 51, and the connecting rod 22 can slide upward without affecting the deformation of the elastic pressure plate 2.

[0039] Furthermore, the support frame 51 is connected to two parallel limiting pressure rods 52, and the length direction of the limiting pressure rods 52 is consistent with the length direction of the elastic pressure plate 2. The two ends of the elastic pressure plate 2 in the length direction slide in contact with the limiting pressure rods 52. The limiting pressure rods 52 apply pressure to the elastic pressure plate 2, so that the elastic pressure plate 2 can be gradually pressed down from the middle to both sides until the elastic pressure plate 2 is flattened.

[0040] In an optional embodiment, a graphite plate is fixed to the bottom surface of the limiting pressure rod 52. When the two ends of the elastic pressure plate 2 slide along the bottom surface of the limiting pressure rod 52, they come into contact with the graphite plate, which can play a lubricating role, thereby reducing the wear of the elastic pressure plate 2.

[0041] Combination Figure 2 As shown, the machine tool 1 is equipped with a vacuum pump 12 inside. The vacuum pump 12 includes two suction ends, which are connected to the air pipe 21 and the vacuum pipe 3, respectively.

[0042] Furthermore, the machine 1 is also equipped with an air pump 13 inside, and the air supply end of the air pump 13 is connected to the air pipe 21 for supplying air to the air pipe 21.

[0043] It is understandable that the air pipe 21 is connected to the vacuum pump 12 and the air pump 13 through a three-way valve. The three-way valve is used to switch the air pipe 21 to be connected to the vacuum pump 12 or the air pump 13. When the air pipe 21 is connected to the vacuum pump 12, the vacuum pump 12 draws air from the first air hole 201 through the air pipe 21, so that the first air hole 201 is in a negative pressure state. When the air pipe 21 is connected to the air pump 13, the air pump 13 supplies air to the first air hole 201 through the air pipe 21, so that the first air hole 201 is in a positive pressure state.

[0044] The working principle of this utility model is as follows: First, the diaphragm is fixed to the bottom surface of the elastic pressure plate 2. Then, the substrate is fixed to the mounting plate 11. Before fixing, the positions of the diaphragm and the substrate are adjusted to ensure that they correspond to each other. When the diaphragm moves vertically closer to the substrate for bonding, the bonding quality is ensured. Then, the sealing cover 6 is closed. At this time, the table surface of the machine base 1 is sealed by the sealing cover 6. Then, the air inside the sealing cover 6 is extracted using the vacuum tube 3, making the sealing cover 6 close to a vacuum state. The heating component 4 is moved to below the diaphragm using the second lead screw slide 41 to heat the diaphragm and soften it. After the diaphragm softens, the elastic pressure plate 2 is driven towards the table surface of the machine base 1 by the third lead screw slide 5. As the elastic plate 2 and the substrate come closer together, the third screw slide 5 drives the elastic plate 2 to press down continuously. The elastic plate 2 and the machine base 1 can form a clamping surface that gradually comes together from the middle to both sides, so that the substrate and the film can gradually come together from the middle to both sides. This avoids air bubbles due to incomplete exhaust when directly covering the whole. At the same time, two vacuum tubes 3 are located in the gap between the substrate and the film on both sides. As the substrate and the film come together, the two vacuum tubes 3 move to both sides, and the moving speed is the same as the bonding speed. The vacuum tubes 3 are used to further extract the residual air at the bonding point of the substrate and the film, thereby further reducing the probability of air bubbles when the substrate and the film are bonded. During the bonding process, the area flattened by the elastic plate 2 is in a compressed and stored state, which allows the elastic plate 2 to apply pressure to the diaphragm. If air bubbles are generated between the substrate and the diaphragm, the pressure applied by the elastic plate 2 can expel the air bubbles. The pressure applied by the elastic plate 2 can make the diaphragm and the substrate bond more firmly. After the diaphragm and the substrate are completely bonded, the elastic plate 2 applies pressure to the diaphragm and maintains it for a certain period of time. After the adhesive between the diaphragm and the substrate is completely cured, the elastic plate 2 is moved upward.

[0045] In summary, by setting up an elastic pressure plate 2 with an arc-shaped plate structure, when the elastic pressure plate 2 moves closer to the table surface of the machine platform 1 to bond the film and the substrate, a clamping surface can be formed between the elastic pressure plate 2 and the machine platform 1 that gradually bonds from the middle to both sides. This allows the substrate and the film to gradually bond from the middle to both sides. During the bonding process, the gas between the substrate and the film can be gradually discharged to one side, avoiding air bubbles caused by incomplete venting when directly covering the whole. By setting two vacuum tubes 3, which are located in the gap between the substrate and the film on both sides, as the substrate and the film are bonded, the two vacuum tubes 3 move to both sides at the same speed as the bonding speed. The vacuum tubes 3 are used to further extract the residual air at the bonding point between the substrate and the film, thereby further reducing the probability of air bubbles appearing when the substrate and the film are bonded.

[0046] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0047] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A vacuum curing apparatus for the production of electronic composite materials, characterized in that, include: The machine platform (1) is used to support and fix the substrate. Two heating components (4) for heating the film are provided on the table surface of the machine platform (1). The heating components (4) are configured to be able to move horizontally along the table surface of the machine platform (1). A sealing cover (6) is hinged to one side of the table surface of the machine platform (1). Among them, an elastic pressure plate (2) for clamping the diaphragm is provided above the table surface of the machine (1), and a third screw slide (5) for driving the elastic pressure plate (2) to move vertically is provided on one side of the machine (1), so that the elastic pressure plate (2) can move closer to or further away from the table surface of the machine (1). The elastic pressure plate (2) is configured as an arc plate structure, and the outer convex surface of the elastic pressure plate (2) faces the table surface of the machine (1). When the elastic pressure plate (2) approaches the table surface of the machine (1), a clamping surface that gradually fits from the middle to both sides can be formed between the elastic pressure plate (2) and the machine (1), so that the substrate and the film gradually fit together. The machine (1) has two vacuum tubes (3) on its table surface. The two vacuum tubes (3) are configured to slide along the middle of the machine (1) table surface to both sides to extract air between the substrate and the film.

2. The vacuum curing apparatus for producing electronic composite materials according to claim 1, characterized in that: The elastic pressure plate (2) is provided with an air tube (21), which is S-shaped and distributed on the concave surface of the elastic pressure plate (2). The elastic pressure plate (2) is provided with a plurality of first air holes (201), which are distributed along the path of the air tube (21). The first air holes (201) are connected to the inside of the air tube (21). The air tube (21) includes a suction state and a supply state. When the air tube (21) is in the air extraction state, the first air hole (201) is under negative pressure, which fixes the diaphragm on the elastic pressure plate (2). When the air tube (21) is in the air supply state, the first air hole (201) is under positive pressure, which causes the diaphragm to detach from the elastic pressure plate (2).

3. The vacuum curing apparatus for producing electronic composite materials according to claim 1, characterized in that: The cross-section of the vacuum tube (3) is set as an elliptical structure, and the vacuum tube (3) is provided with a plurality of second air holes (301), which are evenly distributed along the length direction of the vacuum tube (3).

4. The vacuum curing apparatus for producing electronic composite materials according to claim 1, characterized in that: The machine tool (1) has two symmetrically arranged first lead screw slides (31) on one side of the table surface, and the two first lead screw slides (31) are configured to move in opposite directions or towards each other. The slider of the first lead screw slide (31) is provided with a fixed frame (32), and one end of the vacuum tube (3) is fixed on the fixed frame (32).

5. The vacuum curing apparatus for producing electronic composite materials according to claim 1, characterized in that: Two second lead screw slides (41) are provided on the other side of the table of the machine (1), and one end of each of the two heating components (4) is fixed on the slider of the second lead screw slide (41).

6. The vacuum curing apparatus for producing electronic composite materials according to claim 1, characterized in that: The slider of the third lead screw slide (5) is provided with a support frame (51). Multiple connecting rods (22) are connected at the middle position of the elastic pressure plate (2). The multiple connecting rods (22) are arranged along the width direction of the elastic pressure plate (2). The top end of the connecting rod (22) is slidably connected to the support frame (51), and the sliding direction of the connecting rod (22) is consistent with the driving direction of the third lead screw slide (5).

7. The vacuum curing apparatus for producing electronic composite materials according to claim 6, characterized in that: The support frame (51) is connected to two mutually parallel limiting pressure rods (52), and the length direction of the limiting pressure rods (52) is consistent with the length direction of the elastic pressure plate (2). The two ends of the elastic pressure plate (2) in the length direction are in sliding contact with the limiting pressure rods (52).

8. The vacuum curing apparatus for producing electronic composite materials according to claim 7, characterized in that: A graphite plate is fixed to the bottom surface of the limiting pressure rod (52).

9. The vacuum curing apparatus for producing electronic composite materials according to claim 2, characterized in that: The machine (1) is equipped with a vacuum pump (12), which includes two suction ends. The two suction ends of the vacuum pump (12) are respectively connected to the air pipe (21) and the vacuum pipe (3).

10. The vacuum curing apparatus for producing electronic composite materials according to claim 2, characterized in that: The machine (1) is also equipped with an air pump (13), the air supply end of which is connected to the air pipe (21) for supplying air to the air pipe (21).

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