A pollution cleaning piece and a pollution cleaning piece preparation device

Abstract

The utility model discloses a kind of pollutant cleaning element and pollutant cleaning element preparation device, applied to wafer cleaning field, the pollutant cleaning element includes the cleaning surface for being contacted with target action object;The cleaning surface of pollutant cleaning element is formed with micro-nano structure;The cleaning surface of pollutant cleaning element formed with micro-nano structure has super hydrophobicity.The utility model is contacted with the cleaning surface of target action object by pollutant cleaning element, it is set to be formed with micro-nano structure, on the one hand, the specific surface area of cleaning surface is strengthened, the capacity of pollutant cleaning element adsorption and capture pollutant is improved, make cleaning effect more excellent, on the other hand, the micro-nano structure that this pollutant cleaning element possesses has super hydrophobic effect, so that liquid drop can take away pollutant when rolling on surface, improve the self-cleaning of this pollutant cleaning element, to improve the recycling of this pollutant cleaning element.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning, and in particular to a contaminant cleaning component and a contaminant cleaning component preparation device. Background Technology

[0002] Taking molecular beam epitaxy (MBE) as an example, the cleanliness of the substrate surface affects the growth quality of semiconductor thin films. Traditional cleaning methods include wet chemical cleaning (RCA) and plasma cleaning. While wet cleaning effectively removes organic and inorganic contaminants, it may introduce chemical residues or increase surface roughness, while plasma cleaning may damage the substrate surface. Currently, there are also dry cleaning methods using tapes or adhesive films, such as using low-tack tapes to remove particulate contaminants from the substrate surface. However, residues remain after cleaning, resulting in unsatisfactory cleaning effects.

[0003] Therefore, how to provide a method that can efficiently and non-destructively remove nanoscale contaminants from the substrate surface, avoiding chemical residues and surface damage to the substrate, is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide a contaminant cleaning component that solves the problem in the prior art that when using low-adhesion tape to remove particulate contaminants from the substrate surface, residues remain after cleaning, resulting in unsatisfactory cleaning effects.

[0005] To solve the above-mentioned technical problems, the present invention provides a contaminant cleaning component, the contaminant cleaning component including a cleaning surface for contacting the target object;

[0006] The cleaning surface of the contaminant cleaning component has a micro-nano structure.

[0007] The cleaning surface of the contaminant cleaning component, which has the micro-nano structure, is superhydrophobic.

[0008] Optionally, the cleaning surface of the contaminant cleaning component is coated with a nanoscale adhesion layer;

[0009] The nanoscale adhesion layer is an alumina film or an aminopropyltriethoxysilane film.

[0010] Optionally, at least a portion of the thickness of the contaminant cleaning component on the side facing the cleaning surface is an elastic component;

[0011] The cleaning surface is formed on the surface of the elastic component;

[0012] The elastic component is a polydimethylsiloxane elastic component.

[0013] Optionally, the micro / nano structure is a micropillar array structure.

[0014] Optionally, the diameter of a single micropillar in the micropillar array structure is 1 micrometer to 10 micrometers;

[0015] The height of a single micropillar structure is between 5 micrometers and 50 micrometers.

[0016] Optionally, the contaminant cleaning component is a thin film component with a thickness of 0.5 mm to 2 mm.

[0017] Optionally, the contaminant cleaning component may also include a gripping part;

[0018] The gripping part is disposed on the surface of the contaminant cleaning component facing away from the cleaning surface.

[0019] Optionally, the contaminant cleaning component is a one-piece molded device.

[0020] This invention also provides a device for preparing contaminant cleaning components, including a processing surface for preparing micro / nano structures as described above;

[0021] The processed surface corresponds to the cleaning surface of the aforementioned contaminant cleaning component.

[0022] Optional, also includes:

[0023] Contaminant cleaning component outlet, curing component, and peeling component;

[0024] The discharge port of the contaminant cleaning component is provided corresponding to the processing surface to transfer the material for preparing the contaminant cleaning component to the processing surface;

[0025] The curing component is disposed corresponding to the processing surface to cure the contaminant cleaning material at the processing surface;

[0026] The peeling component is disposed corresponding to the processing surface to peel the contaminant cleaning component from the processing surface after the contaminant cleaning component is formed.

[0027] As can be seen, the contaminant cleaning component provided by this utility model includes a cleaning surface for contacting the target object; the cleaning surface of the contaminant cleaning component has a micro / nano structure; the cleaning surface of the contaminant cleaning component with the micro / nano structure has superhydrophobicity. By setting the cleaning surface of the contaminant cleaning component that contacts the target object to have a micro / nano structure, this utility model enhances the specific surface area of ​​the cleaning surface, improves the ability of the contaminant cleaning component to adsorb and capture contaminants, and makes the cleaning effect superior. Furthermore, the micro / nano structure of the contaminant cleaning component has a superhydrophobic effect, allowing droplets to carry away contaminants when rolling on the surface, improving the self-cleaning property of the contaminant cleaning component, thereby improving its recyclability.

[0028] In addition, this utility model also provides a pollutant cleaning component preparation device, which also has the above-mentioned beneficial effects. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0030] Figure 1 A schematic diagram of the structure of a contaminant cleaning component provided in an embodiment of this utility model;

[0031] Figure 2 This is a schematic diagram of the structure of a contaminant cleaning component adhering to a substrate during cleaning, provided by an embodiment of the present invention.

[0032] Figure 3 This is a schematic diagram of a contaminant cleaning component that separates from the substrate during substrate cleaning, according to an embodiment of the present invention.

[0033] Figure 4 This is a schematic diagram of another contaminant cleaning component provided in an embodiment of the present invention;

[0034] Figure 5 A schematic diagram of the structure of a pollutant cleaning component preparation device provided in this embodiment of the present invention, showing the casting of pollutant cleaning component preparation materials during the preparation of pollutant cleaning components;

[0035] Figure 6 A schematic diagram of the structure of a pollutant cleaning component preparation device provided in this embodiment of the present invention, showing the process of pouring the pollutant cleaning component preparation material and then spreading and solidifying the material.

[0036] Figure 7 A schematic diagram illustrating a structure for separating the prepared contaminant cleaning component from the preparation device, provided as an embodiment of this utility model;

[0037] The attached figures are labeled as follows:

[0038] 1-Substrate, 2-Processing surface, 10-Contaminant cleaning component, 11-Contaminant cleaning component preparation material, 12-Plain curing material, 20-Micro / nano structure, 30-Holding part. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0040] Example 1:

[0041] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of a contaminant cleaning component 10 provided in an embodiment of the present invention. The contaminant cleaning component 10 may include a cleaning surface for contacting the target object;

[0042] The cleaning surface of the contaminant cleaning component 10 has a micro-nano structure 20;

[0043] The cleaning surface of the contaminant cleaning component 10, which has a micro-nano structure 20, is superhydrophobic.

[0044] In this embodiment, a cleaning surface with micro / nano structures 20 is used to remove contaminants. The micro / nano structures 20 provide a large specific surface area to enhance cleaning capabilities, while the superhydrophobicity enables the cleaning device to achieve self-cleaning and reusability. It is mainly used to remove nanoscale contaminants, such as particles and organic residues, from the surface of large-size epitaxial substrates. Compared to existing traditional dry cleaning processes, such as cleaning the substrate surface using adhesive tape, this application uses micro / nano structures 20 to provide a large specific surface area to enhance cleaning capabilities, which can reduce contaminant residue on the substrate surface. Furthermore, the superhydrophobic cleaning surface enables the recycling of the contaminant cleaning device 10. The steps for cleaning the substrate with the contaminant cleaning device in this embodiment can be referred to... Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of the structure of a contaminant cleaning component adhering to a substrate during cleaning, provided by an embodiment of the present invention. Figure 3 This is a schematic diagram illustrating the structure of a contaminant cleaning component that separates from the substrate during cleaning, as provided in an embodiment of the present invention. The contaminant cleaning component is first attached to the substrate 1, as shown in the diagram. Figure 2 As shown, after the bonding process is completed, the contaminant-cleaning component is separated from substrate 1, as follows: Figure 3 As shown, where Figure 3 The direction indicated by the middle arrow is the direction in which the contaminant cleaning component is removed and separated from the substrate 1. In this embodiment, the corresponding attachment... Figure 1 In the middle, the area outlined by the dashed line represents the contaminant cleaning component 10.

[0045] In this embodiment, the contaminant cleaning component 10 can be configured as a thin film structure, a roller structure, or a strip structure, preferably made of flexible materials such as PDMS (polydimethylsiloxane), silicone rubber, or fluorinated elastomer. This embodiment does not limit the specific shape of the micro / nano structure 20; for example, it can be configured as a micro-column array structure, a micro-conical array structure, or other microstructures that can increase the specific surface area and have protrusions on the surface. Alternatively, this embodiment can also use a nano-adhesion layer on the cleaning surface, specifically a gecko-like bristle structure, to enhance the capture effect on nanoparticles. Furthermore, the cleaning surface is superhydrophobic, generally with a contact angle greater than 150°, allowing droplets to roll and carry away contaminants. This can be achieved through the micro / nano structure 20 itself or surface fluorination treatment. This embodiment can further configure the micro / nano structure 20 as a gradient distribution, i.e., densely distributed at the center and sparsely distributed at the edges, suitable for uniform cleaning of large-size substrates (i.e., substrates larger than 6 inches). In this embodiment, a vacuum adsorption channel can also be embedded inside the contaminant cleaning component 10 to improve the adhesion between the cleaning surface and the substrate 1. The cleaning surface is made superhydrophobic, allowing the cleaning component to be regenerated through rinsing with deionized water and drying, with a cleaning cycle of more than 10 times. In one feasible embodiment, the contaminant cleaning component 10 can be a polydimethylsiloxane film with a thickness of 1 mm. A micropillar array structure with a diameter of 5 μm and a height of 20 μm can be formed on the cleaning surface of the polydimethylsiloxane film. With appropriate cleaning processes, the contaminant removal rate of the substrate 1 surface can be greater than 98%, while the surface roughness change of the cleaned substrate 1 is less than 0.1 nm. In another feasible embodiment, the contaminant cleaning component 10 can be a silicone rubber cleaning component, and a microconical array structure with a bottom diameter of 8 μm and a top diameter of 1 μm can be formed on the cleaning surface of the silicone rubber cleaning component. In addition, vacuum adsorption assistance can be added to further improve the cleaning efficiency. In this embodiment, the diameter of the micro / nano structure 20 can be set to 1 μm to 50 μm, and the height-to-diameter ratio of the micro / nano structure 20 can be set to 0.5:1 to 5:1. In this embodiment, the peeling speed after the cleaning surface contacts the substrate 1 can be set to 1 mm / s to 2 mm / s.

[0046] Furthermore, in order to improve the cleaning effect of the contaminant cleaning component 10 on the substrate 1, especially to enhance the cleaning effect on small-diameter contaminants, the cleaning surface of the contaminant cleaning component 10 can be coated with a nanoscale adhesion layer.

[0047] The nanoscale adhesion layer is an alumina film or an aminopropyltriethoxysilane film.

[0048] In this embodiment, coating the cleaning surface with an alumina film or an aminopropyltriethoxysilane film can significantly enhance the capture ability of nanoscale contaminants, especially those with a particle size of less than 100 nanometers, making it suitable for cleaning ultra-precision substrates 1 such as quantum dots and superconducting thin films. In this embodiment, the thickness of the nanoscale adhesion layer can be set to 20 nanometers to 200 nanometers, and the nanoscale adhesion layer uniformly covers the surface of the micro-nano structure 20 to avoid clogging the gaps of the micro-nano structure 20. The coverage rate can be set in the range of 60% to 95%. Specifically, when using an alumina film layer, it can be made by atomic layer deposition, which has high surface energy and can enhance the physical adsorption of polar contaminants. The alumina film layer is resistant to plasma corrosion, compatible with in-situ cleaning of semiconductor production lines, and can decompose organic matter through ultraviolet-ozone treatment, further increasing the number of times the cleaned parts can be regenerated. If an aminopropyltriethoxysilane film layer is used, it is prepared by spin coating and curing, exposing amino functional groups, which can form hydrogen bonds / electrostatic interactions with contaminants. The aminopropyltriethoxysilane film layer has a stronger bonding ability to organic contaminants (such as photoresist residues), and the contact angle can be controlled between 10° and 80°. It can be used with a weak alkaline solution (a solution with a pH value in the range of 8-9) for rinsing, further increasing the number of times the cleaned parts can be regenerated. In this embodiment, titanium dioxide (photocatalytic self-cleaning) and polydopamine (biomimetic adhesion) films can also be used as nanoscale adhesion layers. In this embodiment, the nanoscale adhesion layer can cover only the top and sidewalls of the micro / nano structure 20, retaining the superhydrophobicity of the bottom of the cleaning surface, thus achieving dual-functional zoning of adhesion and hydrophobicity. The high adhesion zone at the top captures nanoparticles, while the hydrophobic zone at the bottom ensures droplet rolling and achieves self-cleaning capability. The roughness of the nanoscale adhesion layer further increases the actual surface area of ​​the micro / nano structure 20.

[0049] The preparation method in this embodiment is as follows:

[0050] I. APTES amino-modified PDMS micropillar surface:

[0051] A amino group (-NH2) is introduced onto the surface of PDMS micropillars by APTES (aminopropyltriethoxysilane), forming a positively charged polar surface. The amino group electrostatically repels negatively charged polar pollutants (such as oxide particles and organic acids), reducing pollutant adhesion. This structure has the following advantages: (1) APTES modification can directionally repel polar pollutants while retaining the physical adhesion ability of PDMS to non-polar particles. (2) Common pollutants such as silica and metal oxides (pH 2 to 4) are negatively charged under neutral conditions and repel -NH2. The specific parameters are as follows: APTES concentration is 2%-5% (v / v) ethanol solution to avoid overpolymerization, reaction time is set to 1 to 2 hours (room temperature) to ensure sufficient hydrolysis and condensation, PDMS pretreatment, oxygen plasma treatment (30s) to generate surface -Si-OH bonds to promote APTES bonding, and annealing at 110 degrees Celsius for 1 hour to enhance the covalent bond stability of APTES and PDMS.

[0052] II. Modification of Alumina Thin Films by Atomic Layer Deposition (ALD):

[0053] A 10-50 nm thick alumina film is deposited on the PDMS surface by ALD to fill the micropores (typically 50-200 nm in diameter) and form a dense barrier layer. The chemical inertness and high hardness of alumina can prevent the penetration of pollutants while maintaining the elasticity of PDMS (the overall flexibility is not affected due to the extremely thin film). PDMS itself is a low surface energy material. After alumina deposition, the surface energy increases, which enhances the van der Waals adsorption of pollutant particles. At the same time, the 10-50 nm thick alumina film is extremely thin, and the elastic deformation ability of the PDMS micropillars (which can be stretched to 150% strain) is almost unaffected, and the contact area can still be increased through deformation. This structure has the following advantages: (1) Pollutant barrier: The alumina film can seal the micropores on the PDMS surface and prevent pollutants (such as organic molecules or metal particles) from embedding. (2) Chemical stability: Alumina has acid and alkali resistance, which is suitable for complex polluted environments. Alumina can also protect amino groups and prolong the electrostatic repulsion effect. (3) Compatibility: The ALD process can be carried out at low temperatures (less than 100 degrees Celsius) without damaging the PDMS substrate. The specific preparation parameters are as follows: the ALD deposition temperature is between 80 and 100 degrees Celsius to avoid thermal deformation of the PDMS, the thickness of the alumina is set between 10 and 50 nanometers to balance barrier properties and flexibility, and the precursor TMA (trimethylaluminum) + water is used for the standard ALD process.

[0054] The two schemes mentioned above can also be combined to form a synergistic optimization scheme: (1) APTES first, then ALD: APTES is grafted onto the PDMS surface first, and then an alumina film is deposited. Alumina can protect the amino groups and prolong the electrostatic repulsion effect. At this time, the APTES modification improves the removal rate of polar pollutants by 40-60%, and the alumina film reduces the residue of non-polar pollutants by 50%. Moreover, the alumina film can extend the service life of PDMS from 5 times to more than 15 times. In this composite modification scheme, the 10 to 50 nanometer alumina film can not only retain the adhesion of PDMS micropillars, but also enhance the capture efficiency of specific pollutants through surface energy enhancement and APTES amino electrostatic regulation.

[0055] In this embodiment, contaminants with a particle size greater than 500 nanometers can be physically trapped by the gaps in the micro / nano structure 20, and contaminants with a particle size between 100 and 500 nanometers can be adsorbed by the van der Waals forces on the sidewalls of the micro / nano structure 20. Contaminants with a particle size less than 100 nanometers are removed by chemical bonding using the aforementioned nanoscale adhesion layer. This embodiment breaks through the limits of cleaning precision, removing metal particles as small as 2 nm. Furthermore, the lifecycle cost of coatings such as alumina is only 15% of that of wet cleaning, reducing the regeneration cost of the cleaned surface. In addition, the difference in the coefficient of thermal expansion between the alumina film and the aminopropyltriethoxysilane film used in this embodiment and the polydimethylsiloxane material is less than 10%, which can prevent coating cracking during peeling.

[0056] Furthermore, in order to improve the adaptive contact of the cleaning surface with the uneven structure of the substrate 1 and increase the effective contact area, at least a portion of the thickness of the contaminant cleaning component 10 on the side facing the cleaning surface can be set to be an elastic component.

[0057] A cleaning surface is formed on the surface of the elastic component;

[0058] The elastic component is a polydimethylsiloxane elastic component.

[0059] This embodiment, based on the superhydrophobic cleaning component of the micro / nano structure 20, further specifies that the contaminant cleaning component 10 includes an elastic component, and clarifies that this elastic component is polydimethylsiloxane (PDMS). In this embodiment, the PDMS elasticity can be configured to allow the micro / nano structure 20 to undergo 20% to 50% reversible deformation under pressure, increasing the contact area and preventing hard scratches. The aforementioned PDMS elastic component can be prepared by mixing a prepolymer and a curing agent in a mass ratio of 5:1 to 15:1. The aforementioned PDMS elastic component can withstand a temperature range of -50℃ to 200℃, is compatible with semiconductor process environments, and is inert to acids / alkalis / organic solvents, thus preventing degradation during the cleaning process.

[0060] In this embodiment, the elastic deformation of the PDMS elastic component can fill the micro-depressions on the surface of substrate 1, increasing the effective contact area. Furthermore, its elastic modulus is less than 5 MPa, resulting in low peel stress. This prevents damage to substrate 1 during peeling of the clean surface, extends the lifespan of the micro / nano structure 20, and reduces waste disposal costs. In this embodiment, the PDMS elastic component is integrated with the superhydrophobic surface of the micro / nano structure 20, and its elastic modulus is limited to 0.1 MPa. In specific applications, this can reduce the cleaning blind zone of a 10-micron stepped substrate, and the low surface energy of the PDMS material maintains the superhydrophobicity of the clean surface.

[0061] Furthermore, to improve the convenience and stability of the cleaning process for substrate 1, the following can be referenced: Figure 4 , Figure 4 This is a schematic diagram of another contaminant cleaning component provided in an embodiment of the present invention. The contaminant cleaning component 10 may also include a gripping portion 30;

[0062] The gripping part 30 is disposed on the surface of the contaminant cleaning part 10 facing away from the cleaning surface.

[0063] This embodiment improves operational convenience and cleaning process stability by adding a gripping part 30 structure based on ergonomic design. In this embodiment, the gripping part 30 is located on the side of the cleaning component facing away from the cleaning surface. It can be symmetrically arranged along the central axis of the cleaning surface to avoid torque imbalance during cleaning. The gripping part 30 can be a raised structure, for example, with a height of 5 mm to 20 mm, and a corrugated or anti-slip texture. Alternatively, the gripping part 30 can be an embedded structure, specifically with a 3 mm to 10 mm groove for gripping. In this embodiment, the gripping part 30 can be integrally molded with the cleaning component, or it can be detachably connected to the cleaning component via snaps, adhesives, or other means.

[0064] Furthermore, in this embodiment, the gripping portion 30 can be tilted at an angle of 15° to 30° to the cleaning surface to optimize the peeling direction between the cleaning component and the substrate 1 and reduce the contaminant residue rate. A nano-silver or copper oxide coating can also be applied to the surface of the gripping portion 30 to protect it from corrosion and damage. In this embodiment, a micro pressure sensor can also be integrated into the gripping portion 30 to adjust the pressing pressure based on feedback from the micro pressure sensor, thereby improving the removal effect of contaminants on the surface of the substrate 1.

[0065] Furthermore, in order to improve the stability of the cleaning component, the aforementioned contaminant cleaning component 10 can be configured as a one-piece molded device.

[0066] This embodiment significantly improves structural reliability and cleaning consistency by designing the contaminant cleaning component 10 as a one-piece molded device and eliminating assembly interfaces. Specifically, a compression molding process can be used to inject PDMS prepolymer into a micropillar array mold and cure it at 80 to 120°C. Alternatively, a photolithography / etching process can be used to directly fabricate the micro / nano structure 20 on the PDMS block material, reducing the risk of interface delamination. Furthermore, in this embodiment, rounded corners with a radius of 1 to 5 micrometers can be provided at the root of the micropillar structure to avoid stress concentration leading to fracture. Corrugated reinforcing ribs can also be provided along the thickness direction in the cleaning component to improve its bending stiffness.

[0067] The contaminant cleaning component 10 provided in this embodiment includes a cleaning surface for contacting a target object; the cleaning surface of the contaminant cleaning component 10 has a micro / nano structure 20 formed thereon; the cleaning surface of the contaminant cleaning component 10 with the micro / nano structure 20 has superhydrophobicity. By setting the cleaning surface of the contaminant cleaning component 10 in contact with the target object to have a micro / nano structure 20 formed thereon, this invention enhances the specific surface area of ​​the cleaning surface, improves the ability of the contaminant cleaning component 10 to adsorb and capture contaminants, resulting in superior cleaning performance. Furthermore, the superhydrophobic effect of the micro / nano structure 20 of the contaminant cleaning component 10 allows droplets to carry away contaminants when rolling on the surface, improving the self-cleaning ability of the contaminant cleaning component 10 and thus enhancing its recyclability.

[0068] Furthermore, by coating the cleaning surface with an alumina film or an aminopropyltriethoxysilane film, this embodiment of the invention can significantly enhance the capture capacity of nanoscale contaminants, especially those with a particle size of less than 100 nanometers, thereby improving the cleaning effect of the contaminant cleaning component 10 on the substrate 1. The elastic deformation of the PDMS elastic component can fill the micro-depressions on the surface of the substrate 1, increasing the effective contact area. Moreover, the low peel stress due to the low elastic modulus prevents damage to the substrate 1 during peeling of the cleaning surface, extending the service life of the micro / nano structure 20, and reducing recycling costs, thus improving environmental friendliness. The addition of a gripping part 30, based on ergonomic design, enhances operational convenience and cleaning process stability. By making the contaminant cleaning component 10 a one-piece molded device, the assembly interface is eliminated, significantly improving structural reliability and cleaning consistency.

[0069] Example 2:

[0070] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of a contaminant cleaning component provided in an embodiment of the present invention. The aforementioned micro / nano structure 20 is a micropillar array structure.

[0071] This embodiment, based on the superhydrophobic micro / nanostructure 20, further specifies that the micro / nanostructure 20 is a micropillar array structure. The regularly arranged micropillars achieve efficient contaminant capture and directional stripping, making it suitable for continuous dry cleaning processes on large-size substrates (substrates with a diameter greater than or equal to 200 mm). This embodiment does not limit the specific arrangement of the micropillar array; for example, the micropillar array can be arranged in a hexagonal close-packed or rectangular grid pattern, and the array density can be set to 10-1. 4 pcs / cm² to 10 7 The number of micropillars per cm² can be set to a diameter of 1 micrometer to 50 micrometers, preferably 2 micrometers to 10 micrometers. The height of the micropillars can be set to 5 micrometers to 100 micrometers, preferably 10 micrometers to 50 micrometers. The height-to-diameter ratio of the micropillars can be set to 0.5:1 to 10:1. Accordingly, this embodiment does not limit the specific structure of the top of the micropillars, and can be set to a planar, concave, or arc-shaped convex structure to further enhance the stability of pollutant adhesion.

[0072] In this embodiment, nanoscale secondary structures, such as nanorods or nanopores, with diameters ranging from 100 to 500 nanometers, can be added to the top of the micropillars to further increase the specific surface area of ​​the cleaned surface. In this embodiment, the array density at the substrate edge region can be set higher than at the center to compensate for edge effects during peeling, and the long axis of the micropillars can be aligned along the peeling direction to reduce peeling resistance. The micropillar array structure in this embodiment increases the effective contact area of ​​the cleaned surface, and the sidewalls of the micropillars provide additional adsorption sites. The arrayed micropillars ensure uniform peeling stress distribution, preventing localized contaminant residue. Furthermore, the periodic eddy current field generated by the micropillar array in this embodiment increases the probability of contaminant capture, improving cleaning efficiency.

[0073] Furthermore, in order to achieve the cleaning ability of the micropillar structure for small-diameter contaminants and improve the cleaning effect of substrate 1, the diameter of a single micropillar structure in the above-mentioned micropillar array structure can be set to 1 micrometer to 10 micrometers.

[0074] The height of a single micropillar structure ranges from 5 micrometers to 50 micrometers.

[0075] In this embodiment, the diameter of a single micropillar structure can be set to 1 to 3 micrometers, suitable for capturing pollutants with a particle size of 100 nanometers or less. Alternatively, the diameter can be set to 5 to 10 micrometers to improve the mechanical strength of the micropillar structure. The height of the micropillar structure can be set to 5 to 20 micrometers to ensure its flexibility and improve its adhesion to the substrate 1. Alternatively, the height can be set to 30 to 50 micrometers to increase the storage volume of pollutants on the sidewalls of the micropillar structure, thereby increasing the adsorption capacity of the pollutants. In this embodiment, the height-to-diameter ratio of the micropillar structure can be set to the range of 0.5:1 to 10:1. Specifically, a height-to-diameter ratio of 0.5:1 to 2:1 can be set to improve the collapse resistance of the micropillar structure. Alternatively, a height-to-diameter ratio of 5:1 to 10:1 can be set to improve the capillary adsorption effect of the micropillar structure on pollutants.

[0076] Furthermore, in order to ensure the structural stability of the cleaning component and its adhesion to the substrate 1, thereby ensuring the cleaning effect of the substrate 1, the aforementioned contaminant cleaning component 10 can be set as a thin film component with a thickness of 0.5 mm to 2 mm.

[0077] In this embodiment, by setting the contaminant cleaning component 10 as a thin film with a thickness of 0.5 mm to 2 mm, mechanical strength and flexible deformation capability are balanced, achieving efficient cleaning of large-size substrates (diameter greater than or equal to 200 mm). Specifically, setting the thickness of the thin film component to 0.5 mm to 1 mm ensures its high flexibility, enabling it to adapt to cleaning curved substrates 1, while setting the thickness to 1.5 mm to 2 mm ensures its high rigidity, achieving uniform pressing of flat substrates 1. Furthermore, in this embodiment, the ratio of the thickness of the thin film component to the height of the micropillar structure can be set within the range of 10:1 to 40:1 to ensure the structural stability of the cleaning component. The edges of the thin film component can also be beveled or rounded to avoid stress concentration when the cleaning surface peels off the substrate 1. In this embodiment, the thin film component can be configured as a multilayer composite structure. For example, the thin film component can be composed of a 0.5 mm PDMS film layer and a 0.1 mm PET (polyethylene terephthalate) reinforcing layer. The thin film component can also be configured as a structure in which the thickness changes from the center to the edge to compensate for the edge effect of the component.

[0078] The contaminant cleaning component 10 provided in this embodiment of the invention improves the effective contact area of ​​the cleaning surface through the micropillar array structure, and the sidewalls of the micropillars provide additional adsorption sites. The arrayed micropillars ensure uniform distribution of peeling stress, preventing localized contaminant residue. Furthermore, by setting the diameter of each micropillar in the micropillar array structure to 1 to 10 micrometers and the height of each micropillar structure to 5 to 50 micrometers, this embodiment of the invention achieves the cleaning ability of the micropillar structure for small-diameter contaminants, improving the cleaning effect of the substrate 1. By setting the contaminant cleaning component 10 as a thin film with a thickness of 0.5 to 2 millimeters, mechanical strength and flexible deformation capability are balanced, ensuring the structural stability of the cleaning component and its adhesion to the substrate 1, thereby guaranteeing the cleaning effect of the substrate 1.

[0079] In one feasible embodiment, the aforementioned contaminant cleaning component may specifically include a cleaning surface for contacting the target object;

[0080] The cleaning surface of the contaminant cleaning component has a micro-nano structure;

[0081] The cleaning surface of the contaminant cleaning component, which has a micro-nano structure, is superhydrophobic.

[0082] The cleaning surface of the contaminant cleaning component is coated with a nano-adhesion layer; the nano-adhesion layer is an alumina film or an aminopropyltriethoxysilane film.

[0083] At least a portion of the thickness of the contaminant cleaning component on the side facing the cleaning surface is an elastic member; the cleaning surface is formed on the surface of the elastic member; the elastic member is a polydimethylsiloxane elastic member;

[0084] The micro-nano structure is a micropillar array structure; the diameter of a single micropillar in the micropillar array structure is 1 micrometer to 10 micrometers, and the height of a single micropillar structure is 5 micrometers to 50 micrometers;

[0085] The contaminant cleaning component is a thin film-like part with a thickness of 0.5 mm to 2 mm;

[0086] The contaminant cleaning component also includes a gripping part; the gripping part is disposed on the surface of the contaminant cleaning component that faces away from the cleaning surface;

[0087] The contaminant cleaning component is a one-piece molded device.

[0088] The contaminant cleaning component mentioned above in this embodiment of the invention has the following advantages compared with existing wet cleaning, plasma cleaning, and other technologies: 1) The cleaning process requires no chemical reagents, avoiding chemical residues and making it more environmentally friendly. 2) The PDMS film has good adhesion and flexibility, effectively removing nanoscale particulate contaminants and also serving as a temporary protective layer for the substrate. 3) The unique micro-nano structure enhances the specific surface area, improving the PDMS film's ability to adsorb and capture contaminants, resulting in superior cleaning performance. Simultaneously, the film's micro-nano structure exhibits superhydrophobicity, allowing droplets to carry away contaminants as they roll on the surface, thus enabling better recycling. 4) It is low-cost and suitable for large-scale production. 5) The substrate surface roughness is low and undamaged after cleaning, making it suitable for high-precision MBE and other epitaxial processes for film growth.

[0089] The following describes the pollutant cleaning component preparation device provided in the embodiments of this utility model. The pollutant cleaning component preparation device described below can be referred to in correspondence with the pollutant cleaning component described above.

[0090] The pollutant cleaning component preparation apparatus provided in this embodiment of the present invention may include a processing surface 2 for preparing micro-nano structures as described above;

[0091] The processing surface 2 corresponds to the cleaning surface of the aforementioned contaminant cleaning component 10.

[0092] This embodiment achieves high-precision and high-efficiency replication of micropillar arrays or other micro / nano structures through a customized processing surface 2 design. The processing surface 2 is negatively matched with the micro / nano structure of the cleaning part, enabling a high degree of consistency in the fabricated micropillar array. This embodiment also utilizes vacuum adsorption to reduce demolding damage. The steps for fabricating the contaminant cleaning part 10 in this embodiment can be referred to... Figures 5 to 7 , Figure 5 A schematic diagram of the structure of a pollutant cleaning component preparation device provided in this embodiment of the present invention, showing the casting of pollutant cleaning component preparation materials during the preparation of pollutant cleaning components; Figure 6 A schematic diagram of the structure of a pollutant cleaning component preparation device provided in this embodiment of the present invention, showing the process of pouring the pollutant cleaning component preparation material and then spreading and solidifying the material. Figure 7 This is a schematic diagram illustrating a structure for separating the prepared contaminant cleaning component from the preparation device, as provided in an embodiment of this utility model. The contaminant cleaning component preparation material 11 is first poured onto the processing surface 2, such as... Figure 5 As shown, the poured material is then spread out and cured to obtain a spread-cured material 12, as shown. Figure 6 Finally, the prepared contaminant cleaning component 10 is separated from the preparation device, such as... Figure 7 As shown.

[0093] Furthermore, in order to improve the efficiency of preparing the contaminant cleaning component 10, the above-mentioned contaminant cleaning component preparation apparatus may further include:

[0094] Contaminant cleaning component outlet, curing component, and peeling component;

[0095] The discharge port of the contaminant cleaning part is set to correspond to the processing surface 2 so as to transfer the material 11 for preparing the contaminant cleaning part to the processing surface 2;

[0096] The curing component is set corresponding to the processing surface 2, and the material 11 is prepared by curing the contaminant cleaning component at the processing surface 2;

[0097] The peeling component is provided corresponding to the processing surface 2 so as to peel the contaminant cleaning component 10 from the processing surface 2 after the contaminant cleaning component 10 is formed.

[0098] This embodiment integrates the discharge port, curing component, and peeling component to form a fully automated contaminant cleaning component production line, realizing integrated preparation from raw material transportation and structural forming to finished product peeling.

[0099] Specifically, the steps for preparing and using the contaminant cleaning component according to this embodiment are as follows:

[0100] Step 1: Prepare a silicon wafer template with a micropore array structure (micropore diameter from 1 μm to 10 μm, height from 5 μm to 50 μm) using masking, photolithography, and etching, and place it on an absolutely flat horizontal surface. Mix PDMS prepolymer and curing agent in a certain proportion, and after degassing, obtain a PDMS mixture. Pour the mixture onto an absolutely flat sapphire wafer mold, allow it to spread naturally, and cure it at 80 degrees Celsius for 1 to 2 hours to form a PDMS film with a micropillar structure (thickness from 0.5 to 2 mm). After peeling, cut it to the required size.

[0101] Step 2: Place the epitaxial substrate on a level, clean workbench, ensuring the surface is free of obvious contamination and scratches. Gently press the PDMS film with the micropillar structure onto the surface of the epitaxial substrate, ensuring full contact between the two (a roller or pressing device can be used for assistance). Hold the pressure for 5 to 10 seconds to allow the PDMS film to fully adhere to the contaminants on the substrate surface.

[0102] Step 3: Slowly peel off the PDMS film at a speed of 1 to 2 mm / s to avoid rapid peeling that could leave contaminant residue. Repeat steps 2 and 3, pressing and peeling, 3-5 times until the substrate surface cleanliness meets the requirements.

[0103] Step 4: Immerse the used PDMS film in deionized water to remove surface contaminants. After drying, the PDMS film can be reused 5-10 times.

[0104] The contaminant cleaning component preparation apparatus provided in this embodiment includes a processing surface 2 for preparing the micro / nano structure described above, the processing surface 2 corresponding to the cleaning surface of the contaminant cleaning component 10. This embodiment achieves high-precision and high-efficiency replication of micropillar arrays or other micro / nano structures through a customized processing surface 2 design. Furthermore, this embodiment improves the efficiency of contaminant cleaning component 10 preparation by integrating a discharge port, a curing component, and a peeling component.

[0105] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0106] Furthermore, it should be noted that in this document, relationships such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprising," "including," or any other variations are intended to cover non-exclusive inclusion.

[0107] The above provides a detailed description of a contaminant cleaning component and a contaminant cleaning component preparation device provided by this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the structure and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A contaminant cleaning component, characterized in that, The contaminant cleaning component includes a cleaning surface for contact with the target object; The cleaning surface of the contaminant cleaning component has a micro-nano structure. The cleaning surface of the contaminant cleaning component, on which the micro-nano structure is formed, is superhydrophobic. At least a portion of the thickness of the contaminant cleaning component on the side facing the cleaning surface is an elastic member; the cleaning surface is formed on the surface of the elastic member; The cleaning surface of the contaminant cleaning component is coated with a nano-adhesive layer; the nano-adhesive layer is an alumina film or an aminopropyltriethoxysilane film.

2. The contaminant cleaning component according to claim 1, characterized in that, The elastic component is a polydimethylsiloxane elastic component.

3. The contaminant cleaning component according to claim 1, characterized in that, The micro / nano structure is a micropillar array structure.

4. The contaminant cleaning component according to claim 3, characterized in that, The diameter of a single micropillar in the micropillar array structure is 1 micrometer to 10 micrometers. The height of a single micropillar structure is between 5 micrometers and 50 micrometers.

5. The contaminant cleaning component according to claim 1, characterized in that, The contaminant cleaning component is a thin film-like part with a thickness of 0.5 mm to 2 mm.

6. The contaminant cleaning component according to claim 1, characterized in that, The contaminant cleaning component also includes a gripping part; The gripping part is disposed on the surface of the contaminant cleaning component facing away from the cleaning surface.

7. The contaminant cleaning component according to claim 1, characterized in that, The contaminant cleaning component is a one-piece molded device.

8. A contaminant cleaning component preparation apparatus, characterized in that, Includes a processing surface for preparing the micro / nano structure as described in any one of claims 1 to 7; The processed surface corresponds to the cleaning surface of the contaminant cleaning component as described in any one of claims 1 to 7; Also includes: Contaminant cleaning component outlet, curing component, and peeling component; The discharge port of the contaminant cleaning component is provided corresponding to the processing surface to transfer the material for preparing the contaminant cleaning component to the processing surface; The curing component is disposed corresponding to the processing surface to cure the contaminant cleaning material at the processing surface; The peeling component is disposed corresponding to the processing surface to peel the contaminant cleaning component from the processing surface after the contaminant cleaning component is formed.

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