Chip detection device with defective product collection function

Abstract

This invention provides a chip inspection device with a defective product collection function, including a collection frame with multiple internal partitions. A rotary motor is fixedly connected to one side of the collection frame, and a positioning gear ring is fixedly connected to the upper side of the rotary motor. A rotary support is fixedly connected to the power output end of the rotary motor. Multiple rotary joints are fixedly connected to one side of the rotary support, and a flip gear is fixedly connected to the movable end of each rotary joint. A micro switch is fixedly connected to one side of the flip gear. The rotary motor drives the rotary support to rotate, and the meshing relationship between the positioning gear ring and the flip gear causes the chip to automatically flip during rotation. When the rotary support rotates 180 degrees, the flip gear can rotate 360 ​​degrees, thereby enabling image inspection of both the front and back sides of the chip at different workstations. This allows for double-sided inspection to be completed in one go, improving inspection efficiency. At the same time, the chip's falling position can help determine the defective surface, facilitating classified collection.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a chip testing device with a defective product collection function. Background Technology

[0002] Chip visual inspection is a key technology based on optical imaging, image processing, and intelligent algorithms to automatically identify the appearance, size, and defects of semiconductor chips during the manufacturing process. This system captures images of the chip surface using a high-resolution industrial camera and utilizes customized light sources and special imaging techniques to clearly image defects at the micron or even sub-micron level. After preprocessing, feature extraction, and intelligent algorithm analysis, the image data can automatically determine and classify defect types, achieving high-efficiency and high-precision quality control.

[0003] A search revealed Chinese patent publication number CN217404177U, which discloses a chip visual inspection mechanism, including a support plate; a camera module mounted on the support plate; a laser bracket connected to the support plate, on which a laser ranging module is mounted; and a control module connected to the camera module and the laser ranging module. The laser ranging module is used to measure the chip in advance and transmit the distance signal to the control module. The control module converts the distance signal into a focal length signal and transmits it to the camera module. The camera module adjusts the focal length based on the focal length signal.

[0004] To address the problem that the aforementioned technologies can only detect one side of the chip and cannot detect defects on both sides, a chip inspection device with a defective product collection function is proposed. Utility Model Content

[0005] In view of this, the present invention aims to provide a chip inspection device with a defective product collection function to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial option.

[0006] The technical solution of this utility model embodiment is implemented as follows: A chip detection device with defective product collection function includes a collection frame with multiple partitions inside. A rotary motor is fixedly connected to one side of the collection frame. A positioning gear ring is fixedly connected to the upper side of the rotary motor. A rotary support is fixedly connected to the power output end of the rotary motor. Multiple rotary joints are fixedly connected to one side of the rotary support. A flip gear is fixedly connected to the movable end of the rotary joint. A micro switch is fixedly connected to one side of the flip gear. The flip gear and the positioning gear ring mesh with each other. Multiple clamping rods are slidably connected to one end of the flip gear.

[0007] In some embodiments, a double-ended lead screw is rotatably connected to one side of the flipping gear, a transmission gear is fixedly connected to one end of the double-ended lead screw, a drive motor is fixedly connected to the rear side of the collection frame, the gear at the power output end of the drive motor and the transmission gear mesh with each other, and the clamping rods on both sides are threaded to both ends of the double-ended lead screw.

[0008] In some embodiments, a detection bracket is fixedly connected to one side of the collection frame, and multiple detection cameras are fixedly connected above the detection bracket.

[0009] In some embodiments, a feeding conveyor belt and a discharging conveyor belt are fixedly connected to both sides of the collection frame.

[0010] In some embodiments, the support portions of the feeding conveyor belt and the unloading conveyor belt are respectively fixedly connected with extension support rods, and the support portion on one side of the feeding conveyor belt is fixedly connected with a feeding push rod.

[0011] In some embodiments, a discharge screw is rotatably connected to the rear side of the flipping gear, a transmission gear two is fixedly connected to one end of the discharge screw, and a drive motor two is fixedly connected to the rear side of the flipping gear. The gear at the power output end of the drive motor two meshes with the transmission gear two.

[0012] In some embodiments, a scissor lift assembly is rotatably connected to one side of the flip gear, and a drive slide is threadedly connected to one end of the discharge screw, with the drive slide rotatably connected to one end of the scissor lift assembly.

[0013] In some embodiments, a push plate is movably connected to the other end of the scissor lift assembly.

[0014] The present invention has the following advantages due to the adoption of the above technical solution:

[0015] 1. A chip inspection device with defect collection function, which drives a rotating bracket to rotate by a rotating motor, and uses the meshing relationship between a positioning gear ring and a flipping gear to make the chip automatically flip during rotation. When the rotating bracket rotates 180 degrees, the flipping gear can rotate 360 ​​degrees, thereby realizing image inspection of the front and back sides of the chip at different workstations. It can complete double-sided inspection at one time, improve inspection efficiency, and at the same time, the chip falling position can help to judge the defect surface, which is convenient for classification and collection.

[0016] 2. A chip inspection device with defect collection function, which triggers a micro switch by the chip, drives a motor to rotate a double-ended lead screw, causing the clamping rod to clamp the chip. If a defect is found during inspection, the double-ended lead screw reverses to release the chip, allowing it to fall into the collection frame. The device is responsive and reliable, which is conducive to the automated connection between inspection and sorting and improves the stability of processing.

[0017] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is the main view of the present invention.

[0020] Figure 2 This is a side view of the present invention.

[0021] Figure 3 This is a diagram of the mounting structure of the flipping gear of this utility model;

[0022] Figure 4 This is a structural diagram of the rear side of the flipping gear of this utility model;

[0023] Figure 5 This is a structural diagram of the front side of the flipping gear of this utility model.

[0024] Figure label:

[0025] 1. Collection box; 2. Feeding conveyor belt; 3. Discharging conveyor belt; 4. Feeding push rod; 5. Extension support rod; 6. Detection bracket; 7. Detection camera; 8. Rotary motor; 9. Positioning gear ring; 10. Rotating bracket; 11. Tilting gear; 12. Double-ended lead screw; 13. Drive motor one; 14. Transmission gear one; 15. Drive motor two; 16. Transmission gear two; 17. Clamping rod; 18. Micro switch; 19. Rotary joint; 20. Discharge lead screw; 21. Drive slide; 22. Scissor lift assembly; 23. Push plate. Detailed Implementation

[0026] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0027] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0028] Example 1:

[0029] like Figures 1-5 As shown, a chip detection device with defective product collection function includes a collection frame 1 with multiple partitions inside. A rotary motor 8 is fixedly connected to one side of the collection frame 1. A positioning gear ring 9 is fixedly connected to the upper side of the rotary motor 8. A rotary bracket 10 is fixedly connected to the power output end of the rotary motor 8. Multiple rotary joints 19 are fixedly connected to one side of the rotary bracket 10. A flip gear 11 is fixedly connected to the movable end of the rotary joint 19. A micro switch 18 is fixedly connected to one side of the flip gear 11. The flip gear 11 and the positioning gear ring 9 mesh with each other. Multiple clamping rods 17 are slidably connected to one end of the flip gear 11. A double-ended lead screw 12 is rotatably connected to one side of the flip gear 11. A transmission gear 14 is fixedly connected to one end of the double-ended lead screw 12. A drive motor 13 is fixedly connected to the rear side of the collection frame 1. The gear at the power output end of the drive motor 13 meshes with the transmission gear 14. The clamping rods 17 on both sides are threaded to the two ends of the double-ended lead screw 12.

[0030] In use, the chip is fed into the middle of the clamping rod 17 from one end. After the chip presses against the micro switch 18, the drive motor 13 drives the double-ended lead screw 12 to rotate through the transmission gear 14, causing the clamping rods 17 on both sides to move inward. This can hold the chip in place on both sides. Then, the rotary motor 8 drives the upper rotary bracket 10 to rotate, which can further drive the flip gear 11 to move. During the movement, the positioning gear ring 9 is used to make the flip gear 11 rotate. Preferably, when the rotary bracket 10 rotates 90 degrees, the flip gear 11 rotates 180 degrees, and when the rotary bracket 10 rotates 180 degrees, the flip gear 11 rotates 360 degrees.

[0031] This allows the rotating bracket 10 to rotate 180 degrees, enabling image recognition on both sides of the chip. When a defect is detected on either side, the double-ended lead screw 12 reverses and the clamping rod 17 releases, allowing the chip to fall into the collection frame 1. Because the detection positions for the front and back sides are different, the chip will fall at different locations after release. This difference in falling location can help determine which side of the chip had a problem during production.

[0032] In this embodiment, a detection bracket 6 is fixedly connected to one side of the collection frame 1, and multiple detection cameras 7 are fixedly connected above the detection bracket 6. Two detection cameras 7 are located on the side where the chip is fed into the rotating bracket 10 to detect the front of the chip, and on the side where the rotating bracket 10 is rotated 90 degrees to detect the back of the chip. The multiple detection cameras 7 are connected to an external computer via a data cable for control and image recognition using the computer. The existing recognition algorithm is used here and will not be described further.

[0033] In this embodiment, the collecting frame 1 is fixedly connected to the two sides by an upper conveyor belt 2 and an lower conveyor belt 3;

[0034] The support parts of the feeding conveyor belt 2 and the unloading conveyor belt 3 are respectively fixedly connected with extension support rods 5, and the support part of one side of the feeding conveyor belt 2 is fixedly connected with a feeding push rod 4;

[0035] The feeding conveyor belt 2 is used to input chips. When the chip is input to the position of the corresponding rotating bracket 10, the feeding push rod 4 can be activated to push the chip between the two clamping rods 17, while the extension support rod 5 can prevent the chip from falling.

[0036] In this embodiment: during use, the chip is fed into the middle of the clamping rod 17 from one end. Then, the drive motor 13 drives the double-ended lead screw 12 to rotate through the transmission gear 14, causing the clamping rods 17 on both sides to move inward. This can hold the chip on both sides. Then, the rotary motor 8 drives the upper rotary bracket 10 to rotate, which can further drive the flip gear 11 to move. During the movement, the positioning gear ring 9 is used to make the flip gear 11 rotate. Preferably, when the rotary bracket 10 rotates 90 degrees, the flip gear 11 rotates 180 degrees, and when the rotary bracket 10 rotates 180 degrees, the flip gear 11 rotates 360 degrees.

[0037] This allows the rotating bracket 10 to rotate 180 degrees, enabling image recognition on both sides of the chip. When a defect is detected on either side, the double-ended screw 12 reverses and the clamping rod 17 releases, allowing the chip to fall into the collection frame 1. Because the detection positions for the front and back sides are different, the chip will fall at different locations after release. This difference in falling location can help determine which side of the chip had a problem during production.

[0038] Two detection cameras 7 are located on the side where the chip is fed into the rotating bracket 10 to detect the front of the chip, and on the side where the rotating bracket 10 is rotated 90 degrees to detect the back of the chip. Multiple detection cameras 7 are connected to an external computer via a data cable for control and image recognition. The existing recognition algorithm is used here and will not be described further.

[0039] The feeding conveyor belt 2 is used to input chips. When the chip is input to the position of the corresponding rotating bracket 10, the feeding push rod 4 can be activated to push the chip between the two clamping rods 17, while the extension support rod 5 can prevent the chip from falling.

[0040] Example 2:

[0041] A chip inspection device with defective product collection function is provided in this embodiment, which is improved based on embodiment 1 as follows: Figures 1-5 As shown,

[0042] In this embodiment, a discharge screw 20 is rotatably connected to the rear side of the flipping gear 11, a transmission gear 26 is fixedly connected to one end of the discharge screw 20, and a drive motor 25 is fixedly connected to the rear side of the flipping gear 11. The gear at the power output end of the drive motor 25 and the transmission gear 26 mesh with each other.

[0043] The scissor lift assembly 22 is rotatably connected to one side of the flip gear 11. The discharge screw 20 is threadedly connected to a drive slide 21 at one end. The drive slide 21 is rotatably connected to one end of the scissor lift assembly 22. The push plate 23 is movably connected to the other end of the scissor lift assembly 22. One end of the scissor lift assembly 22 rotates while the other end slides inside the push plate 23.

[0044] The rotary joint 19 is an electric slip ring, which can supply power to drive motor 13 and drive motor 25 during rotation. When the discharge screw 20 rotates, it can drive the drive slide 21 on one side to move horizontally. At this time, it will drive the scissor lift assembly 22 to deform, thereby pushing out the push plate 23 located in front. This allows the inspected chips without shape defects to be pushed onto the unloading conveyor belt 3 for subsequent operations.

[0045] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A chip detection device with defective product collection function, comprising a collection frame (1) with multiple internal partitions, characterized in that: A rotary motor (8) is fixedly connected to one side of the collection box (1), a positioning gear ring (9) is fixedly connected to the upper side of the rotary motor (8), a rotary bracket (10) is fixedly connected to the power output end of the rotary motor (8), a plurality of rotary joints (19) are fixedly connected to one side of the rotary bracket (10), a flip gear (11) is fixedly connected to the movable end of the rotary joint (19), a micro switch (18) is fixedly connected to one side of the flip gear (11), the flip gear (11) and the positioning gear ring (9) mesh with each other, and a plurality of clamping rods (17) are slidably connected to one end of the flip gear (11).

2. The chip detection device with defective product collection function according to claim 1, characterized in that: The flipping gear (11) is rotatably connected to a double-ended lead screw (12) on one side. A transmission gear (14) is fixedly connected to one end of the double-ended lead screw (12). A drive motor (13) is fixedly connected to the rear side of the collection frame (1). The gear at the power output end of the drive motor (13) and the transmission gear (14) mesh with each other. The clamping rods (17) on both sides are threaded to both ends of the double-ended lead screw (12).

3. The chip detection device with defective product collection function according to claim 1, characterized in that: A detection bracket (6) is fixedly connected to one side of the collection frame (1), and multiple detection cameras (7) are fixedly connected above the detection bracket (6).

4. A chip detection device with defective product collection function according to claim 3, characterized in that: The collecting frame (1) is fixedly connected to the feeding conveyor belt (2) and the unloading conveyor belt (3) on both sides.

5. A chip detection device with defective product collection function according to claim 4, characterized in that: The support parts of the feeding conveyor belt (2) and the unloading conveyor belt (3) are respectively fixedly connected with extension support rods (5), and the support part on one side of the feeding conveyor belt (2) is fixedly connected with a feeding push rod (4).

6. A chip detection device with defective product collection function according to claim 2, characterized in that: The rear side of the flip gear (11) is rotatably connected to the discharge screw (20), and one end of the discharge screw (20) is fixedly connected to the transmission gear two (16). The rear side of the flip gear (11) is fixedly connected to the drive motor two (15), and the gear at the power output end of the drive motor two (15) and the transmission gear two (16) mesh with each other.

7. A chip detection device with defective product collection function according to claim 6, characterized in that: The scissor lift assembly (22) is rotatably connected to one side of the flip gear (11), and the discharge screw (20) is threadedly connected to one end of the drive slide (21), which is rotatably connected to one end of the scissor lift assembly (22).

8. A chip detection device with defective product collection function according to claim 7, characterized in that: The other end of the scissor lift assembly (22) is movably connected to a push plate (23).

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