Lifting and clapping device, alignment conveying device and optical detection equipment

Abstract

The application relates to the technical field of circuit board processing, in particular to a jacking and clapping device, a positioning and conveying device and an optical detection equipment. The jacking and clapping device comprises a jacking mechanism and a positioning mechanism. The jacking mechanism comprises a universal ball and a first lifting device, and the first lifting device is used for driving the universal ball to perform lifting movement. The positioning mechanism comprises interval-distributed positioning reference pieces and a clapping assembly. The first lifting device drives the universal ball to ascend to support the circuit board to be jacked up between the positioning reference pieces and the clapping assembly. The clapping assembly pushes the circuit board to move towards the positioning reference pieces, so that one side edge of the circuit board is in contact with the positioning reference pieces. The application can reduce or avoid surface scratches or damage of the circuit board, and can effectively prevent the circuit board from being curled or deformed under stress.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, and more specifically, to a lifting and tapping device, an alignment and conveying device, and an optical inspection equipment. Background Technology

[0002] In online automated optical inspection (AIO) equipment, a clapping mechanism is used to align circuit boards (e.g., printed circuit boards) for accurate inspection. However, current clapping mechanisms have limitations when handling circuit boards of varying thicknesses. For thicker circuit boards, the clapping action may scratch or damage the board surface; while for thinner circuit boards, the clapping action may not be effective, causing the board to curl or become inaccurately positioned. This affects subsequent camera image capture and analysis, leading to misjudgments or incomplete analysis. Utility Model Content

[0003] The purpose of this application is to provide a lifting and tapping device, an alignment and conveying device, and an optical inspection equipment, in order to solve the technical problem in the related art that the tapping mechanism cannot adapt to circuit boards of different thicknesses, resulting in scratches on thick boards and inaccurate positioning or curling of thin boards, thereby affecting the accuracy of subsequent inspections.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows: This application provides a lifting clapper device, including: a lifting mechanism and an alignment mechanism; The lifting mechanism includes a swivel ball and a first lifting device, wherein the first lifting device is used to drive the swivel ball to perform lifting and lowering movements. The alignment mechanism includes alignment reference elements and a clapper assembly that are spaced apart; The first lifting device drives the omnidirectional ball to rise and support the circuit board to be lifted between the alignment reference and the clapper assembly. The clapper assembly pushes the circuit board toward the alignment reference, so that one side of the circuit board comes into contact with the alignment reference.

[0005] In some implementations, the clapper assembly includes a linear module, a clapper piece, and a material sensor, with the material sensor mounted on the clapper piece. The moving part of the linear module is connected to the clapper piece, and when the material sensor detects that the circuit board lifted by the omnidirectional ball has risen to a set position, the moving part of the linear module drives the clapper piece to move in a linear motion.

[0006] In some implementations, the lifting mechanism further includes a cue stick, a first guide assembly, a first buffer, and a lifting base; the first guide assembly and the first buffer are respectively disposed below the cue stick; The cue stick is equipped with a plurality of omnidirectional balls spaced apart along the length of the cue stick, and the first lifting device is connected to the cue stick to drive the cue stick to perform lifting and lowering movements; The first lifting device is installed on the lifting base, and the first guide assembly includes a first guide post and a first linear bearing, with the first linear bearing sleeved on the first guide post; One of the first guide column and the first linear bearing is fixedly connected to the lifting base, and the other is fixedly connected to the ball rod; At least one of the lifting base and the cue stick is fixedly connected to the first buffer.

[0007] In some implementations, the alignment mechanism further includes a positioning sensor mounted on the alignment reference member; the positioning sensor is used to detect whether one side of the circuit board is in contact with the alignment reference member.

[0008] This application provides a positioning conveying device, including a conveying mechanism and a lifting plate device as described in any of the above implementations; the conveying mechanism is used to convey the circuit board to the lifting plate device.

[0009] In some implementations, the conveying mechanism includes a conveying component and a stop assembly, the conveying component includes a plurality of spaced conveying rollers, and the stop assembly is disposed on the output side of the conveying mechanism; The omnidirectional ball is located between two adjacent conveying rollers. The first lifting device drives the omnidirectional ball to rise and protrude from the top surface of the conveying roller, so that the circuit board is detached from the support of the conveying roller. The alignment reference and the clapper assembly are located at opposite ends of the conveying roller along its length.

[0010] In some implementations, the conveying mechanism further includes a first support plate disposed between two adjacent conveying rollers; the first support plate has a guide slope on the side near the input side of the conveying mechanism.

[0011] In some implementations, the first support plate has a clearance through hole; when the first lifting device drives the omnidirectional ball to rise, the omnidirectional ball can pass through the clearance through hole and contact the circuit board.

[0012] In some implementations, the stop assembly includes a plurality of first stops spaced apart along the length of the conveyor roller; The alignment mechanism also includes a positioning sensor, which is mounted on the alignment reference component; Specifically, when the first stop bar is in the raised state, the top of the first stop bar is higher than the top surface of the conveying roller to intercept the circuit board; when the positioning sensor detects that the circuit board is in place, the first stop bar moves downward; when the first stop bar is in the lowered state, the top of the first stop bar is lower than the top surface of the conveying roller to allow the circuit board to pass.

[0013] In some implementations, the stop rod assembly further includes a second lifting device, a stop rod base plate, and a stop rod sensor. The second lifting device is located below the conveying roller, the first stop rod is fixed on the stop rod base plate, and the output end of the second lifting device is connected to the stop rod base plate to drive the stop rod base plate to move up and down. When the stop sensor detects that the circuit board being transported by the conveying assembly is blocked by the first stop, it triggers the lifting mechanism to perform a lifting motion.

[0014] In some implementations, the stop assembly further includes a second guide assembly, a second buffer, and a stop base; the second guide assembly and the second buffer are respectively disposed below the stop base plate; The second guide assembly includes a second guide post and a second linear bearing, wherein the second linear bearing is sleeved on the second guide post; One of the second guide post and the second linear bearing is fixedly connected to the stop rod base, and the other is fixedly connected to the stop rod base plate; At least one of the stop bar base plate and the stop bar base is fixedly connected to the second buffer.

[0015] This application provides an optical inspection device, including: the alignment and conveying device described in any of the above implementations.

[0016] The main advantages of the lifting plate device, alignment conveying device, and optical inspection equipment provided in this application are as follows: This application utilizes a lifting mechanism with a first lifting device and a omnidirectional ball joint to raise the circuit board. At this point, the bottom of the circuit board is supported by the omnidirectional ball joint. Since the omnidirectional ball joint allows for 360° low-resistance rolling, when the clapping assembly pushes the circuit board towards the alignment reference, the circuit board moves under the support of the omnidirectional ball joint, significantly reducing friction between the two and minimizing or preventing scratches or damage to the circuit board surface. When the clapping assembly pushes a thinner circuit board towards the alignment reference, the entire bottom of the circuit board is stably supported by the omnidirectional ball joint, effectively preventing the circuit board from curling or deforming under stress. This facilitates the alignment of the alignment reference with the thinner circuit board, thereby ensuring the accuracy of subsequent camera imaging and analysis. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the alignment and conveying device provided in the embodiments of this application; Figure 2 yes Figure 1 A magnified schematic diagram of the local structure at point A; Figure 3 This is a schematic diagram of the alignment and conveying device provided in the embodiments of this application from another perspective; Figure 4 This is a structural schematic diagram of the alignment and conveying device provided in the embodiments of this application from another perspective; Figure 5 yes Figure 4 A magnified view of the structure at point B in the middle; Figure 6 This is a structural schematic diagram of the alignment and conveying device provided in the embodiments of this application from another perspective; Figure 7 This is a schematic diagram of the structure of the first support plate located between two adjacent conveyor rollers according to an embodiment of this application; Figure 8 This is a schematic diagram of the lifting mechanism provided in the embodiments of this application; Figure 9 yes Figure 8 A magnified schematic diagram of the local structure at point C; Figure 10 This is another schematic diagram of the lifting mechanism provided in the embodiments of this application; Figure 11 This is a schematic diagram of the structure of the stop bar assembly provided in the embodiments of this application; Figure 12 yes Figure 11 A magnified schematic diagram of the local structure at point D; Figure 13 This is a schematic diagram of the stop bar assembly provided in an embodiment of this application from another perspective; Figure 14 This is a schematic diagram of the structure of the stop sensor provided in this application embodiment, which is disposed below the first support plate; Figure 15 This is a schematic diagram of the structure of the clapper assembly provided in the embodiments of this application; Figure 16 yes Figure 1 A magnified schematic diagram of the structure at point E in the middle.

[0019] Explanation of key figure labels: 101. Conveying assembly; 102. Baffle assembly; 103. Input side; 104. Output side; 105. Universal ball; 106. Alignment reference component; 107. Clapper assembly; 108. Conveying roller; 109. Synchronous pulley; 110. Synchronous belt; 111. First support plate; 112. Guide ramp; 113. First lifting device; 114. Cue stick; 115. Rolling ball; 116. Ball seat; 117. First connecting seat; 118. Lifting base; 119. First buffer. ; 120, First guide post; 121, First linear bearing; 122, Clearance through hole; 123, First stop bar; 124, Second lifting device; 125, Stop bar base plate; 126, Stop bar sensor; 127, Frame; 128, Stop bar base; 129, Second buffer; 130, Second guide post; 131, Second linear bearing; 132, Linear module; 133, Patching plate; 134, Material sensor; 135, Arc-shaped clearance groove; 136, Position sensor. Detailed Implementation

[0020] In related technologies, the clapping mechanism has shortcomings when handling circuit boards of different thicknesses. For thicker circuit boards, the clapping action of the mechanism may scratch or damage the surface of the circuit board. For thinner circuit boards, the clapping action of the mechanism may not be able to push them effectively, causing the circuit board to curl or fail to be accurately positioned, thus affecting the subsequent image acquisition and analysis by the camera, resulting in misjudgment or incomplete analysis.

[0021] Therefore, this application provides a lifting clapper device, a positioning and conveying device, and an optical inspection device to solve the problems in the related technology.

[0022] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0023] See Figure 1 As shown in the figure, this application provides an alignment conveying device, including a conveying mechanism and a lifting plate device; the conveying mechanism is used to convey circuit boards to the lifting plate device; the conveying mechanism can continuously provide circuit boards that need to be aligned to the lifting plate device.

[0024] The lifting and aligning device provided in this application includes a lifting mechanism and an alignment mechanism. The lifting mechanism includes a universal ball joint 105 and a first lifting device 113, which drives the universal ball joint 105 to move up and down. The alignment mechanism includes alignment reference members 106 spaced apart and a aligning plate assembly 107. The first lifting device 113 drives the universal ball joint 105 to rise, supporting the circuit board to be lifted between the alignment reference member 106 and the aligning plate assembly 107. The aligning plate assembly 107 pushes the circuit board towards the alignment reference member 106, causing one side of the circuit board to contact the alignment reference member 106. It should be noted that the lifting and aligning device provided in this application is not limited to alignment conveying devices, but can also be used in other devices or equipment that require alignment of circuit boards.

[0025] The lifting and clapping device provided in this embodiment uses a lifting mechanism to raise the circuit board, moving it away from the conveying assembly 101. At this time, the bottom of the circuit board is supported by the universal ball joint 105. Since the universal ball joint 105 can achieve 360° low-resistance rolling, when the clapping assembly 107 pushes the circuit board towards the alignment reference 106, the circuit board moves under the support of the universal ball joint 105, thereby greatly reducing the friction between the two and reducing or avoiding scratches or damage to the surface of the circuit board. When the clapping assembly 107 pushes the thinner circuit board towards the alignment reference 106, the entire bottom of the circuit board is stably supported by the universal ball joint 105, effectively preventing the circuit board from curling or deforming under force. This facilitates the alignment of the alignment reference 106 with the thinner circuit board, thereby ensuring the accuracy of subsequent camera image capture and analysis.

[0026] In some embodiments, the conveying mechanism includes a conveying assembly 101 and a stop assembly 102. The conveying assembly 101 is used to convey circuit boards, and the stop assembly 102 is disposed on the output side 104 of the conveying mechanism. The stop assembly 102 is used to intercept or allow the circuit boards conveyed by the conveying assembly 101 to pass. A lifting mechanism is used to lift the circuit boards intercepted by the stop assembly 102 so that the circuit boards leave the conveying assembly 101. For example, the lifting mechanism has a plurality of universal balls 105. When the first lifting device causes the universal balls to move up and down, the universal balls can allow the circuit boards to leave the conveying assembly 101.

[0027] In some embodiments, the circuit board conveyed by the conveying assembly 101 may be a printed circuit board (PCB), a flexible printed circuit (FPC), a rigid-flex board, a high-density interconnect (HDI), an integrated circuit substrate, a metal substrate, a glass substrate, or a ceramic substrate, etc. Furthermore, depending on its function and structure, the circuit board may be classified as a single-layer circuit board or a multi-layer circuit board structure. It is understood that the alignment conveying device is not limited to aligning circuit boards but can also align other materials. The conveying assembly 101 has an opposing input side 103 and an output side 104. The circuit board enters from the input side 103 and exits from the output side 104. The stop assembly 102 enables the circuit board to briefly pause on the conveying assembly 101 to achieve alignment. The alignment reference 106 remains stationary, while the circuit board moves toward the alignment reference 106 under the action of the clapping assembly 107, so that one side of the circuit board comes into contact with the alignment reference, thus achieving the alignment of the circuit board and facilitating subsequent photography.

[0028] Combination Figure 2 and Figure 3 As shown, in some embodiments, the conveying assembly 101 includes a plurality of conveying rollers 108 and a first motor. The plurality of conveying rollers 108 are spaced apart and can be linked together by a synchronous belt 110 and a synchronous pulley 109, or by a sprocket and a chain, or by gears. One of the conveying rollers 108 is driven by the output shaft of the first motor via a chain, gear, or synchronous belt 110. This facilitates synchronous rotation among the plurality of conveying rollers 108. The plurality of conveying rollers 108 are arranged in parallel. The direction from the input side 103 to the output side 104 is perpendicular to the length direction of the conveying rollers 108. For example, the first motor can be a servo motor.

[0029] Combination Figures 2 to 7As shown, in some embodiments, the conveying mechanism further includes a first support plate 111, which is disposed between two adjacent conveying rollers 108. The first support plate 111 can support the circuit board, preventing thinner circuit boards from sagging or curling up. The upper surface of the first support plate 111 can be lower than the highest point of the conveying rollers 108, and there is a set distance between them, as long as the first support plate 111 does not affect the conveying of the circuit board by the conveying rollers 108. The length direction of the first support plate 111 can be parallel to the length direction of the conveying rollers 108. For example, the alignment conveying device also includes a frame 127, on which the first support plate 111 can be fixed. The input side of the first support plate 111 near the input side 103 can have a chamfered structure, forming a guide slope 112 to facilitate the conveying of the circuit board and reduce the possibility of the circuit board obstructing the first support plate 111.

[0030] Combination Figures 8 to 11As shown, in some embodiments, the lifting mechanism includes a ball bar 114 with multiple spaced universal balls 105 mounted on it. A first lifting device 113 is connected to the ball bar 114 to drive it in a lifting motion, thus enabling the multiple universal balls 105 to provide stable support for the circuit board. For example, the ball bar 114 is located between two adjacent conveyor rollers 108. Positioning the ball bar 114 between adjacent conveyor rollers 108 allows the support points of the universal balls 105 to be closely distributed below the circuit board. This utilization of the gaps in the conveying mechanism itself makes the alignment conveying device more compact, requiring less additional space. Furthermore, the arrangement of the ball bar 114 and universal balls 105 between the conveyor rollers 108 allows the alignment conveying device to better adapt to circuit boards of different widths and thicknesses. The lifting mechanism includes multiple ball rods 114, which are spaced apart. A first lifting device 113 controls the synchronous lifting and lowering of the multiple ball rods 114, ensuring that the circuit board receives uniform and stable support when lifted. This prevents the circuit board from tilting or becoming uneven during lifting, thereby improving the accuracy of the alignment reference. The universal ball joint 105 may include a rolling ball 115 and a ball seat 116. The rolling ball 115 is rotatably mounted in a ball groove in the ball seat 116. The ball seat 116 can be fixed to the ball rod 114 by screws or welding. The length direction of the ball rod 114 is parallel to the length direction of the conveying roller 108. The multiple ball rods 114 are spaced apart along the conveying direction of the conveying mechanism, i.e., from the input side 103 to the output side 104. Multiple universal balls 105 on each ball rod 114 are spaced apart along the length direction of the ball rod 114. The lifting mechanism also includes a first connecting seat 117, the end of a ball rod 114 is fixedly connected to the first connecting seat 117, and multiple ball rods 114 are fixedly connected to the first connecting seat 117, thus forming a first lifting frame with the ball rods 114 and the first connecting seat 117; and a first lifting device 113 drives the first lifting frame to move up and down. The lifting mechanism also includes a lifting base 118, on which the first lifting device 113 can be installed, and the lifting base 118 can be installed on the frame 127, using the lifting base 118 for support. There can be two first lifting devices 113, which are spaced apart in the conveying direction and spaced apart in the length direction of the ball rod 114. For example, they can be arranged diagonally, which can ensure the stability of the lifting of the first lifting frame.

[0031] It is understood that in some other possible embodiments, the length direction of the ball rod 114 may also be perpendicular to the length direction of the conveyor roller 108 or the angle between the two may be acute.

[0032] Combination Figures 8 to 11As shown, in some embodiments, the lifting mechanism further includes a first guide assembly and a first buffer 119; the first guide assembly and the first buffer 119 are respectively disposed below the cue stick 114. The first guide assembly is used to guide the lifting and lowering movement of the cue stick 114. The first guide assembly can precisely guide the lifting and lowering movement of the cue stick 114 to ensure that multiple cue sticks 114 maintain a vertical and synchronous movement trajectory during the lifting and lowering process, without swaying or tilting. The first buffer 119 can absorb the impact force of the cue stick 114 at the end of the movement. For example, the first guide assembly includes a first guide post 120 and a first linear bearing 121; the first linear bearing 121 can be fixed on the lifting base 118, while the first guide post 120 is fixedly connected to the first connecting seat 117, the first linear bearing 121 is sleeved on the first guide post 120, and the first guide post 120 and the first linear bearing 121 are slidably connected. The number of first guide assemblies can be four, and the number of first buffers 119 can be four, thus realizing the smooth lifting and lowering of the omnidirectional ball 105. The first buffer 119 can be installed on the lifting base 118. When the first connecting seat 117 descends to a preset position, the first buffer 119 contacts the first connecting seat 117 to cushion the first connecting seat 117. The first buffer 119 may include at least one of a spring, a hydraulic rod, and an elastic body. The first lifting device 113 may be a cylinder, a hydraulic cylinder, or an electric cylinder.

[0033] It is understood that in some other possible embodiments, the first buffer 119 may also be mounted on the first connecting seat 117, the first guide post 120 may be fixed on the lifting base 118, and the first linear bearing 121 may be fixed on the first connecting seat 117.

[0034] See Figure 7 As shown, in some embodiments, the first support plate 111 has clearance through holes 122; the omnidirectional ball 105 is inserted into the clearance through hole 122 so that the omnidirectional ball 105 on the ball rod 114 can contact the circuit board. The design of the clearance through hole 122 ensures that the omnidirectional ball 105 will not interfere with the first support plate 111 during the lifting process; it ensures that the omnidirectional ball 105 can move freely and smoothly up and down without affecting the smoothness of the lifting due to friction or jamming. For example, the number of clearance through holes 122 on each first support plate 111 is equal to the number of omnidirectional balls 105 on each ball rod 114.

[0035] Combination Figures 11 to 13As shown, in some embodiments, the baffle assembly 102 includes a first baffle 123. When the first baffle 123 is raised, it can intercept the circuit board on the conveying assembly 101, temporarily preventing the circuit board from continuing to be conveyed along the conveying direction; when the first baffle 123 is lowered, it can allow the circuit board on the conveying assembly 101 to pass. For example, there can be multiple first baffles 123, distributed at intervals along the length of the conveying roller 108. It is understood that the first baffles 123 can also be replaced by baffles.

[0036] Combination Figures 11 to 14 As shown, in some embodiments, the baffle assembly 102 further includes a second lifting device 124, a baffle base plate 125, and a baffle sensor 126. The second lifting device 124 is located below the conveying roller 108, and the first baffle 123 is fixed on the baffle base plate 125. The output end of the second lifting device 124 is connected to the baffle base plate 125, driving the baffle base plate 125 to rise and fall. When the baffle sensor 126 detects that the circuit board conveyed by the conveying assembly 101 is intercepted by the first baffle 123, it triggers the lifting mechanism to perform a lifting movement to lift the circuit board intercepted by the baffle assembly 102. The baffle sensor 126 can detect the circuit board's positioning in real time and accurately; when the baffle sensor 126 detects the circuit board, the circuit board can be lifted by the lifting mechanism. For example, a plurality of first stop bars 123 are fixed on the stop bar base plate 125, and the plurality of first stop bars 123 are spaced apart along the length direction of the stop bar base plate 125. The second lifting device 124 is used to cause the stop bar base plate 125 to move up and down when the stop bar sensor 126 detects the circuit board being conveyed by the conveying assembly 101, so that the first stop bars 123 are raised. The stop bar assembly 102 also includes a stop bar base 128, which enables modular installation of the stop bar assembly 102. The stop bar base 128 can be fixed on the frame 127. The length direction of the stop bar base plate 125 is parallel to the length direction of the conveying roller 108. The stop bar sensor 126 can be mounted on the first support plate 111, and the stop bar sensor 126 is located on the output side; the number of stop bar sensors 126 can be multiple, and the multiple stop bar sensors 126 are distributed along the length direction of the conveying roller 108, which can improve the accuracy of circuit board detection and can also adapt to circuit boards of different sizes. The stop lever sensor 126 can be a photoelectric sensor, a proximity sensor, or a laser displacement sensor. The second lifting device 124 can be a pneumatic cylinder, a hydraulic cylinder, or an electric cylinder; the second lifting device 124 can realize the lifting and lowering movement of the stop lever base plate 125, thereby realizing the lifting and lowering movement of the first stop lever 123; when the second lifting device 124 can be a pneumatic cylinder, a hydraulic cylinder, or an electric cylinder, the output end of the second lifting device 124 can be the piston rod of the pneumatic cylinder, the piston rod of the hydraulic cylinder, or the piston rod of the electric cylinder.

[0037] Combination Figures 11 to 13As shown, in some embodiments, the stop bar assembly 102 further includes a second guide assembly and a second buffer 129; the second guide assembly and the second buffer 129 are respectively disposed below the stop bar base plate 125. The second guide assembly is used to guide the lifting and lowering movement of the stop bar base plate 125. The second guide assembly can precisely guide the lifting and lowering movement of the first stop bars 123 to ensure that the multiple first stop bars 123 always maintain a vertical and synchronous movement trajectory during the lifting and lowering process, without swaying or tilting. The second buffer 129 can absorb the impact force of the stop bar base plate 125 at the end of the movement. For example, the second guide assembly includes a second guide post 130 and a second linear bearing 131. The second linear bearing 131 can be fixed to the stop rod base 128, while the second guide post 130 is fixedly connected to the stop rod base plate 125. The second linear bearing 131 is sleeved on the second guide post 130, and the second guide post 130 and the second linear bearing 131 are slidably connected. Multiple second guide assemblies and multiple second buffers 129 can be distributed along the length direction of the stop rod base plate 125, thus enabling the translation and lifting of the stop rod base plate 125. The second buffer 129 can be installed on the stop rod base 128. When the stop rod base plate 125 descends to a preset position, the second buffer 129 contacts the stop rod base plate 125 to buffer the stop rod base plate 125. The second buffer 129 can include at least one of a spring, a hydraulic rod, and an elastomer.

[0038] It is understood that in some other possible embodiments, the second buffer 129 may also be mounted on the stop base 128, the second guide post 130 may be fixed on the stop base 128, and the second linear bearing 131 may be fixed on the stop base plate 125.

[0039] See Figure 15As shown, in some embodiments, the clapping assembly 107 includes a linear module 132, a clapping component 133, and a material sensor 134. The material sensor 134 is mounted on the clapping component 133, enabling real-time detection of whether the circuit board has been accurately lifted to the set position by the lifting mechanism. The moving part of the linear module 132 is connected to the clapping component 133. When the material sensor 134 detects that the circuit board lifted by the omnidirectional ball has risen to the set position, the moving part of the linear module 132 drives the clapping component 133 to move linearly. Thus, the linear module 132 is only activated after the circuit board reaches this set position, pushing the clapping component 133 for alignment. This ensures that the clapping action always occurs at the optimal time, avoiding alignment failure caused by clapping too early or too late, and greatly improving alignment accuracy and reliability. For example, the linear module 132 can be an electric linear guide rail, and the moving part of the linear module 132 can be the slider of the electric linear guide rail. The clapper plate 133 is fixed to the slider of the electric linear guide rail, thus connecting the moving part of the linear module 132 with the clapper plate 133. The clapper plate 133 can be a plate-like structure, with its length direction perpendicular to the length direction of the conveyor roller 108. The material sensor 134 can be a photoelectric sensor, a proximity sensor, or a laser displacement sensor, etc. The number of material sensors 134 can be one or more. When there are multiple material sensors 134, they are spaced apart along the length direction of the clapper plate 133, which improves the adaptability of circuit board detection and allows for the adaptation of circuit boards of different sizes. The guide rail of the electric linear guide rail can be fixed to the frame 127. The clapping assembly 107 can be located at one end of the conveyor roller 108 along its length, while the alignment reference 106 can be located at the other end of the conveyor roller 108 along its length. The alignment reference 106 can be fixed to the frame 127, thus improving the accuracy of circuit board alignment. The clapping component 133 is located above the conveyor roller 108, and the clapping component 133 has an arc-shaped clearance groove 135 that is adapted to the conveyor roller 108 to avoid interference between the clapping component 133 and the conveyor roller 108; this allows the clapping component 133 to contact the side of the circuit board. When the circuit board is pushed towards the alignment reference 106, its side can fit against the surface of the alignment reference 106, ensuring high alignment accuracy and providing a reliable physical reference for subsequent camera inspection. It is understood that the linear module 132 can also be replaced by other forms to replace the electric linear guide. For example, the linear module 132 may include a servo motor, a lead screw and a linear guide; the output shaft of the servo motor drives the lead screw to rotate, and the lead screw and the slider of the linear guide are driven by a thread.

[0040] See Figure 16As shown, in some embodiments, the alignment mechanism further includes a positioning sensor 136, which is mounted on the alignment reference member 106. The positioning sensor 136 is used to detect whether one side of the circuit board is in contact with the alignment reference member 106, thus facilitating subsequent conveying after the circuit board is aligned. For example, after the first stop 123 is raised, its top end is higher than the top surface of the conveyor roller 108 to intercept the circuit board conveyed by the conveying assembly 101 when the positioning sensor 136 detects that the circuit board is in place. When the first stop 123 is lowered, its top end is lower than the top surface of the conveyor roller 108 to allow the circuit board conveyed by the conveying assembly 101 to pass. This way, the first stop 123 in the stop assembly 102 only descends after the circuit board is pushed to the side where the alignment reference 106 is located, facilitating the continued conveying of the aligned circuit board along the conveying direction. The alignment reference 106 can be a plate-like structure, with its length direction perpendicular to the length direction of the conveying roller 108. The alignment sensor 136 can be a photoelectric sensor, proximity sensor, or laser displacement sensor, etc. The number of alignment sensors 136 can be one or more. When there are multiple alignment sensors 136, they are spaced apart along the length direction of the tapping plate 133, which improves the adaptability of circuit board detection and allows for the adaptation of circuit boards of different sizes. The alignment reference components 106 are all located above the conveyor rollers 108. Each alignment reference component 106 has an arc-shaped clearance groove 135 that matches the conveyor rollers 108 to avoid interference. This allows the alignment reference component 106 to contact the side of the circuit board. When the circuit board is pushed towards the alignment reference component 106, its side can closely adhere to the surface of the reference component, ensuring high alignment accuracy and providing a reliable physical reference for subsequent camera inspection. The clapping component 133, material sensor 134, alignment sensor 136, and alignment reference component 106 are all located near the output side 104 of the conveying mechanism and away from the input side 103. This ensures that the circuit board can immediately enter the alignment process as it leaves the conveying mechanism. This layout makes the entire process compact and continuous, avoiding potential positional deviations caused by long-distance transport after alignment.

[0041] In some embodiments, the alignment conveying device further includes a controller. The first lifting device 113, the second lifting device 124, the stop sensor 126, the material sensor 134, the positioning sensor 136, the linear module 132, and the first motor are electrically connected to the controller, which enables control of each component and achieves linkage. The controller can be an MCU controller or a PLC controller.

[0042] The working principle of the alignment and conveying device provided in this application embodiment is as follows: When a circuit board is conveyed to the output side 104 by the conveyor roller 108, the stop sensor 126 detects that the circuit board has reached its position. The second lifting device 124 raises the first stop 123, the first motor of the conveying assembly 101 stops rotating so that the conveyor roller 108 stops rotating, and the first lifting device 113 raises the ball rod 114, so that the universal ball 105 contacts the circuit board, thereby realizing that the circuit board leaves the surface of the conveyor roller 108. When the material sensor 134 detects that the circuit board lifted by the universal ball 105 has risen to the set position, the linear module 132 causes the clapper 133 to move linearly. After the clapping plate 133 contacts the side of the circuit board, it pushes the circuit board towards the alignment reference 106. When the side of the circuit board contacts the alignment reference 106, the alignment sensor 136 detects that the circuit board is in position. Then, the second lifting device 124 causes the first stop 123 to descend, the conveying roller 108 of the conveying assembly 101 starts to rotate, and the first lifting device 113 causes the ball rod 114 to descend. After the universal ball 105 separates from the circuit board, the surface of the conveying roller 108 contacts the circuit board, and the circuit board is then conveyed to the next process by the conveying roller 108. When the next circuit board is conveyed to the output side 104 by the conveying roller 108, the stop sensor 126 detects that the circuit board is in position, and then the above process is repeated, thus realizing the alignment operation of multiple circuit boards.

[0043] This application provides an optical inspection device, including the alignment conveying device provided in any of the above embodiments. The optical inspection device has the same technical effects as the alignment conveying device provided in the foregoing embodiments, and will not be described again here. For example, the optical inspection device further includes a camera for taking pictures of the aligned circuit board conveyed by the alignment conveying device.

[0044] It should be understood that, in the embodiments of this application, unless otherwise expressly specified and limited, the terms "connection," "fixed connection," "contact," etc., should be interpreted broadly. Those skilled in the art can understand the specific meanings of the various terms in the embodiments of this application according to the specific circumstances.

[0045] For example, the "connection" can be a fixed connection, a rotating connection, a flexible connection, a sliding connection, a one-piece molding, an electrical connection, a contact connection, or other connection methods; it can be a direct connection, or an indirect connection through an intermediate medium, or a connection within two components or an interaction between two components.

[0046] For example, a "fixed connection" can be a component that can be directly or indirectly fixedly connected to another component; a fixed connection can include mechanical connection, welding, bonding or integral molding, etc., wherein mechanical connection can include riveting, bolting, threaded connection, keying, snap-fit ​​connection, locking connection, plugging, etc., and bonding can include adhesive bonding and solvent bonding, etc.

[0047] It should also be understood that the “parallel” or “perpendicular” described in the embodiments of this application can be understood as “approximately parallel” or “approximately perpendicular”.

[0048] It should also be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Features specified as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0049] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature. It should also be understood that the terms "length," "width," "above," "below," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationship (if any), are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0050] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. In conclusion, the above description is merely a preferred embodiment of the technical solution of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A lifting clapper device, characterized in that, include: A lifting mechanism, comprising a swivel ball and a first lifting device, wherein the first lifting device is used to drive the swivel ball to perform lifting and lowering movements; Alignment mechanism, the alignment mechanism including alignment reference elements and a clapper assembly distributed at intervals; The first lifting device drives the omnidirectional ball to rise and support the circuit board to be lifted between the alignment reference and the clapper assembly. The clapper assembly pushes the circuit board toward the alignment reference, so that one side of the circuit board comes into contact with the alignment reference.

2. The lifting and clapping device as described in claim 1, characterized in that, The clapper assembly includes a linear module, a clapper piece, and a material sensor, wherein the material sensor is mounted on the clapper piece; The moving part of the linear module is connected to the clapper. When the material sensor detects that the circuit board lifted by the omnidirectional ball has risen to a set position, the moving part of the linear module drives the clapper to move in a straight line.

3. The lifting and clapping device as described in claim 1, characterized in that, The lifting mechanism further includes a cue stick, a first guide assembly, a first buffer, and a lifting base; the first guide assembly and the first buffer are respectively disposed below the cue stick; The cue stick is equipped with a plurality of omnidirectional balls spaced apart along the length of the cue stick, and the first lifting device is connected to the cue stick to drive the cue stick to perform lifting and lowering movements; The first lifting device is installed on the lifting base, and the first guide assembly includes a first guide post and a first linear bearing, with the first linear bearing sleeved on the first guide post; One of the first guide column and the first linear bearing is fixedly connected to the lifting base, and the other is fixedly connected to the ball rod; At least one of the lifting base and the cue stick is fixedly connected to the first buffer.

4. The lifting and clapping device as described in claim 1, characterized in that, The alignment mechanism also includes a positioning sensor, which is mounted on the alignment reference component; the positioning sensor is used to detect whether one side of the circuit board is in contact with the alignment reference component.

5. A positioning and conveying device, characterized in that, It includes a conveying mechanism and a lifting plate device as described in any one of claims 1-4; the conveying mechanism is used to convey the circuit board to the lifting plate device.

6. The register transport apparatus of claim 5, wherein, The conveying mechanism includes a conveying component and a stopper assembly. The conveying component includes a plurality of conveying rollers arranged at intervals, and the stopper assembly is disposed on the output side of the conveying mechanism. The omnidirectional ball is located between two adjacent conveying rollers. The first lifting device drives the omnidirectional ball to rise and protrude from the top surface of the conveying roller, so that the circuit board is detached from the support of the conveying roller. The alignment reference and the clapper assembly are located at opposite ends of the conveying roller along its length.

7. The alignment conveying device as described in claim 6, characterized in that, The conveying mechanism further includes a first support plate, which is disposed between two adjacent conveying rollers; the first support plate has a guide slope on the side near the input side of the conveying mechanism.

8. The alignment conveying device as described in claim 7, characterized in that, The first support plate has a clearance through hole; when the first lifting device drives the omnidirectional ball to rise, the omnidirectional ball can pass through the clearance through hole and contact the circuit board.

9. The alignment conveying device as described in any one of claims 6-8, characterized in that, The stop assembly includes a plurality of first stop bars spaced apart along the length of the conveyor roller; The alignment mechanism also includes a positioning sensor, which is mounted on the alignment reference component; Specifically, when the first stop bar is in the raised state, the top of the first stop bar is higher than the top surface of the conveying roller to intercept the circuit board; when the positioning sensor detects that the circuit board is in place, the first stop bar moves downward; when the first stop bar is in the lowered state, the top of the first stop bar is lower than the top surface of the conveying roller to allow the circuit board to pass.

10. The alignment conveying device as described in claim 9, characterized in that, The stop rod assembly also includes a second lifting device, a stop rod base plate, and a stop rod sensor. The second lifting device is located below the conveying roller, the first stop rod is fixed on the stop rod base plate, and the output end of the second lifting device is connected to the stop rod base plate to drive the stop rod base plate to move up and down. When the stop sensor detects that the circuit board being transported by the conveying assembly is blocked by the first stop, it triggers the lifting mechanism to perform a lifting motion.

11. The register transport apparatus of claim 10, wherein, The stop assembly further includes a second guide assembly, a second buffer, and a stop base; the second guide assembly and the second buffer are respectively disposed below the stop base plate; The second guide assembly includes a second guide post and a second linear bearing, wherein the second linear bearing is sleeved on the second guide post; One of the second guide post and the second linear bearing is fixedly connected to the stop rod base, and the other is fixedly connected to the stop rod base plate; At least one of the stop bar base plate and the stop bar base is fixedly connected to the second buffer.

12. An optical detection device, characterized by include: The alignment conveying device as described in any one of claims 5-11.

Images