A device for removing impurities from a plating solution

Abstract

This utility model discloses a device for adsorbing and removing impurities from a plating solution, comprising an electroplating tank with a through-hole on its outer side. A drain pipe is fixedly connected to the inner surface of the through-hole, and a filter cylinder is fixedly connected to the top outer surface of the drain pipe. Multiple filter boxes are fixedly connected to the inner surface of the filter cylinder. Each filter box includes a protective net, a gravel layer, a box body A, a support net, a connecting through-hole, a water outlet pipe, and a box body B. The outer surface of box body A is fixedly connected to the inner surface of the filter cylinder, and a protective net is fixedly connected to the top of box body A. The bottom of the protective net and the inner surface of box body A are both fixedly connected to the gravel layer. By setting up water pump A, water pump B, pipes A and B, and filter cylinders, the impurities in the electroplating solution can be circulated and purified without stopping the electroplating device, ensuring the cleanliness of the electroplating solution at all times.

Description

Technical Field

[0001] This utility model relates to the field of plating solution impurity removal technology, specifically a plating solution impurity adsorption and removal device. Background Technology

[0002] Removing impurities from the plating bath is a crucial step in the electroplating process, directly affecting the quality of the plating layer. Impurities come from a wide range of sources, including impure raw materials, environmental contamination, and chemical reaction byproducts; therefore, specific methods must be selected based on the type of impurity.

[0003] For electroplating to proceed normally, it is necessary to remove impurities from the electroplating solution periodically. Current methods primarily involve shutting down the electroplating equipment and then allowing prolonged sedimentation and filtration to remove impurities. This method requires shutdown, thus impacting product processing efficiency. Utility Model Content

[0004] This invention provides a device for adsorbing and removing impurities from plating solutions, which can circulate and purify impurities in the plating solution without requiring the electroplating equipment to be shut down.

[0005] To achieve the above objectives, a plating solution impurity adsorption and removal device is provided, comprising an electroplating tank with a through circular hole on its outer side. A drain pipe is fixedly connected to the inner surface of the through circular hole. A filter cylinder is fixedly connected to the top outer surface of the drain pipe. Multiple filter boxes are fixedly connected to the inner surface of the filter cylinder. Each filter box includes a protective net, a gravel layer, a box body A, a support net, a connecting through hole, a water outlet pipe, and a box body B. The outer surface of box body A is fixedly connected to the inner surface of the filter cylinder. A protective net is fixedly connected to the top of box body A. The bottom of the protective net and the inner surface of box body A are both fixedly connected to the gravel layer. The filter cylinder is provided to facilitate the filtration of the electroplating solution and to create a suitable working environment. The protective net is provided to fix and shape the gravel layer while ensuring that the plating solution can enter the filter box. The gravel layer is provided to directly remove large particles from the plating solution.

[0006] According to the plating solution impurity adsorption and removal device, the outer bottom surface of box A is fixedly connected to the outer top surface of box B. Multiple through-holes are formed at the contact points between the outer bottom surface of box A and the outer top surface of box B. Connecting through holes are fixedly connected to the inner surfaces of the through-holes shared by boxes A and B. Multiple common holes are formed at the bottom of box B, and the inner surfaces of the through-holes in box B are fixedly connected to the outer surface of the outlet pipe. The connecting through holes facilitate the flow of water from box A to box B, and then out through the outlet pipe in box B to the filter tank. The filter tank is designed to prevent large particulate impurities in the plating solution from affecting the filtration of the activated carbon layer.

[0007] According to the aforementioned plating solution impurity adsorption and removal device, an activated carbon layer is fixedly connected to the inner surface of the filter cylinder. The activated carbon layer is used to remove fine particulate matter floating in the wastewater, ensuring that the wastewater is filtered cleanly and thoroughly.

[0008] According to the aforementioned plating solution impurity adsorption and removal device, a through-hole is formed on the outer bottom surface of the filter cylinder. The inner surface of the through-hole at the bottom of the filter cylinder is fixedly connected to the outer surface of the drain pipe. A water pump B is fixedly connected to the end of the drain pipe away from the filter cylinder, and a pipe B is fixedly connected to the end of the water pump B away from the filter cylinder. The water pump B is used to extract the filtered plating solution from the filter cylinder, and the drain pipe and pipe B are used to facilitate the return of the filtered plating solution to the electroplating tank.

[0009] According to the aforementioned plating solution impurity adsorption and removal device, a through-hole is formed on the top outer surface of the filter cylinder. A pipe A is fixedly connected to the inner surface of the through-hole at the top of the filter cylinder, and a water pump A is fixedly connected to the outer surface of the pipe A. The water pump A and pipe A are provided to facilitate the pumping of the plating solution from the plating bath into the filter cylinder for filtration.

[0010] According to the aforementioned plating solution impurity adsorption and removal device, a support is fixedly connected to the outer surface of the filter cylinder, and multiple legs are fixedly connected to the bottom of the support. The support and legs are provided to support the structure of the filter cylinder.

[0011] According to the plating solution impurity adsorption and removal device, the mesh size of the support mesh is smaller than that of the protective mesh.

[0012] The beneficial effects of this utility model are: by setting up water pump A, water pump B, pipe A, pipe B and filter cylinder, the impurities in the electroplating solution can be circulated and purified without stopping the electroplating device, thus ensuring the cleanliness of the electroplating solution at all times.

[0013] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0015] Figure 1 This is a perspective view of the external structure of a plating solution impurity adsorption and removal device according to the present invention;

[0016] Figure 2 This is a front view of the external structure of a plating solution impurity adsorption and removal device according to the present invention;

[0017] Figure 3 This is a front view of the internal structure of a plating solution impurity adsorption and removal device according to the present invention;

[0018] Figure 4 For this practical application Figure 3 A magnified view of A in the middle.

[0019] Legend:

[0020] 1. Electroplating tank; 2. Pipe A; 3. Water pump A; 4. Filter cylinder; 5. Support frame; 6. Support leg; 7. Water pump B; 8. Drain pipe; 9. Pipe B; 10. Filter box; 1001. Protective net; 1002. Crushed stone layer; 1003. Box body A; 1004. Support net; 1005. Connecting through hole; 1006. Water outlet pipe; 1007. Box body B; 11. Activated carbon layer. Detailed Implementation

[0021] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0022] Reference Figures 1 to 4This utility model discloses a plating solution impurity adsorption and removal device, which includes an electroplating tank 1. The electroplating tank 1 has a through circular hole on its outer side. A drain pipe 8 is fixedly connected to the inner side of the through circular hole of the electroplating tank 1. A filter cylinder 4 is fixedly connected to the top surface of the outer side of the drain pipe 8. Multiple filter boxes 10 are fixedly connected to the inner surface of the filter cylinder 4. The filter box 10 includes a protective net 1001, a gravel layer 1002, a box body A1003, a support net 1004, a connecting through hole 1005, a water outlet pipe 1006, and a box body B1007. The outer surface of the box body A1003 is fixedly connected to the inner surface of the filter cylinder 4. The top of the box body A1003 is fixedly connected to the protective net 1001. The bottom of the protective net 1001 and the inner surface of the box body A1003 are together fixedly connected to the gravel layer 1002.

[0023] Since plating solutions typically contain strong acids, strong alkalis, or metal salts, it is necessary to select crushed stone with inert components that can withstand these substances. Therefore, the crushed stone for the crushed stone layer 1002 is recommended to be quartz, whose main component is silicon dioxide, which is resistant to acid and alkali corrosion and has stable chemical properties. Quartz is widely used in chemical filtration and meets the requirements of this device for the crushed stone layer 1002.

[0024] The outer bottom surface of the box A1003 is fixedly connected to the outer top surface of the box B1007. Multiple through holes are opened at the contact points between the outer bottom surface of the box A1003 and the outer top surface of the box B1007. The inner surfaces of the through holes shared by the boxes A1003 and B1007 are fixedly connected to the connecting through holes 1005. Multiple common holes are opened at the bottom of the box B1007. The inner surfaces of the through holes of the boxes B1007 are fixedly connected to the outer surface of the water outlet pipe 1006.

[0025] An activated carbon layer 11 is fixedly connected to the inner surface of the water filter cylinder 4.

[0026] A through hole is opened on the bottom surface of the outer side of the filter cylinder 4. The inner surface of the through hole at the bottom of the filter cylinder 4 is fixedly connected to the outer surface of the drain pipe 8. A water pump B7 is fixedly connected to the end of the drain pipe 8 away from the filter cylinder 4. A pipe B9 is fixedly connected to the end of the water pump B7 away from the filter cylinder 4.

[0027] A through hole is opened on the top surface of the outer side of the filter cylinder 4. A pipe A2 is fixedly connected to the inner surface of the through hole at the top of the filter cylinder 4, and a water pump A3 is fixedly connected to the outer surface of the pipe A2.

[0028] A bracket 5 is fixedly connected to the outer surface of the water filter cylinder 4, and multiple support legs 6 are fixedly connected to the bottom of the bracket 5.

[0029] The mesh size of the support net 1004 is smaller than that of the protective net 1001.

[0030] Working principle: When in use, turn on water pump A3 and water pump B7. Water pump A3 will then draw the plating solution from the electroplating tank 1 into the filter cylinder 4 through pipe A2. After entering the filter cylinder 4, the plating solution will first pass through the filter tank 10, where the gravel layer 1002 will directly remove large particles of impurities from the wastewater. The filtered plating solution will then undergo a third filtration through the activated carbon layer 11 to remove fine floating particles, ensuring that the wastewater is filtered cleanly and thoroughly. After that, the filtered plating solution will leave the filter cylinder 4 under the suction of water pump B7 and then re-enter the electroplating tank 1 through pipe B9, and then undergo the next cycle.

[0031] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A device for adsorbing and removing impurities from a plating solution, characterized in that, The system includes an electroplating tank (1), with a through circular hole on the outer side of the electroplating tank (1). A drain pipe (8) is fixedly connected to the inner surface of the through circular hole of the electroplating tank (1). A filter cylinder (4) is fixedly connected to the top surface of the outer side of the drain pipe (8). Multiple filter boxes (10) are fixedly connected to the inner surface of the filter cylinder (4). Each filter box (10) includes a protective net (1001), a gravel layer (1002), and a box body A (100). 3) Support net (1004), connecting through hole (1005), water outlet pipe (1006) and box body B (1007). The outer surface of the box body A (1003) is fixedly connected to the inner surface of the filter cylinder (4). The top of the box body A (1003) is fixedly connected to a protective net (1001). The bottom of the protective net (1001) and the inner surface of the box body A (1003) are fixedly connected to the gravel layer (1002).

2. The plating solution impurity adsorption and removal device according to claim 1, characterized in that, The outer bottom surface of the box A (1003) is fixedly connected to the outer top surface of the box B (1007). Multiple through holes are opened at the contact points between the outer bottom surface of the box A (1003) and the outer top surface of the box B (1007). The inner surfaces of the through holes shared by the boxes A (1003) and B (1007) are fixedly connected to the connecting through holes (1005). Multiple common holes are opened at the bottom of the box B (1007). The inner surfaces of the through holes of the boxes B (1007) are fixedly connected to the outer surface of the water outlet pipe (1006).

3. The plating solution impurity adsorption and removal device according to claim 1, characterized in that, An activated carbon layer (11) is fixedly connected to the inner surface of the filter cylinder (4).

4. The plating solution impurity adsorption and removal device according to claim 1, characterized in that, The bottom outer surface of the filter cylinder (4) has a through hole. The inner surface of the through hole at the bottom of the filter cylinder (4) is fixedly connected to the outer surface of the drain pipe (8). A water pump B (7) is fixedly connected to the end of the drain pipe (8) away from the filter cylinder (4). A pipe B (9) is fixedly connected to the end of the water pump B (7) away from the filter cylinder (4).

5. The plating solution impurity adsorption and removal device according to claim 1, characterized in that, The top outer surface of the filter cylinder (4) has a through hole, and the inner surface of the through hole at the top of the filter cylinder (4) is fixedly connected to a pipe A (2), and the outer surface of the pipe A (2) is fixedly connected to a water pump A (3).

6. The plating solution impurity adsorption and removal device according to claim 1, characterized in that, A bracket (5) is fixedly connected to the outer surface of the filter cylinder (4), and multiple legs (6) are fixedly connected to the bottom of the bracket (5).

7. The plating solution impurity adsorption and removal device according to claim 1, characterized in that, The mesh size of the support net (1004) is smaller than that of the protective net (1001).

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