A plating solution tank cleaning device for wire plating

Abstract

The utility model is suitable for plating solution pool cleaning technical field provides a kind of silk line electroplating is used plating solution pool cleaning device, including plating solution pool, the filter assembly is arranged in the plating solution pool, the filter assembly includes filter plate, the shape of filter plate is set to sawtooth shape, a plurality of filter holes are arranged on the filter plate, the filter hole is all arranged on the inclined surface of filter plate, the filter hole is along vertical direction setting, the filter assembly further includes first connecting plate, the first connecting plate is connected with filter plate, first clamping interface is set up in the first connecting plate, the inside of first clamping interface is provided with first fixing piece, by setting filter assembly, prefiltering metal oxidation is reduced, the possibility of accumulation of metal oxide in plating solution pool interior, compared with the sediment of plating solution pool that staff directly cleans, by filter assembly, the cleaning work intensity of staff to plating solution pool can be reduced, and then the cleaning efficiency of plating solution pool is improved.

Description

Technical Field

[0001] This utility model relates to the field of plating bath cleaning technology, and more specifically, it relates to a plating bath cleaning device for wire electroplating. Background Technology

[0002] Wire electroplating is a surface treatment technology for various types of wires. Its core principle is to uniformly cover the surface of the wire substrate with one or more layers of metal or alloy plating by means of electrochemical methods or chemical deposition.

[0003] Currently, wire electroplating technology requires the wire to be pretreated to ensure that the substrate surface is clean and has good coating adhesion. Then, through a specific electroplating process, metal ions are deposited in an orderly manner on the wire surface under the action of an electric field or through a chemical reduction reaction, ultimately forming a coating with controllable thickness and stable performance. Wire electroplating is generally carried out in a plating bath. After electroplating, the plating bath needs to be cleaned. During the cleaning process, operators generally use cleaning tools to clean the inside of the plating bath.

[0004] However, the electroplating process generates some metal oxides, which deposit in the plating bath. Operators need to spend a lot of time cleaning them, making the process cumbersome. To address this problem, a plating bath cleaning device for wire electroplating is proposed. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a cleaning device for the plating bath of wire electroplating.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A cleaning device for a plating bath in wire electroplating includes a plating bath, wherein a filter assembly is provided inside the plating bath.

[0008] The filter assembly includes a filter plate, which is serrated in shape and has a plurality of filter holes.

[0009] The present invention is further configured such that the filter holes are all disposed on the inclined surface of the filter plate, and the filter holes are disposed in the vertical direction.

[0010] By adopting the above technical solution, the sawtooth structure forms multiple inclined surfaces of the filter plate, which significantly increases the contact area with the plating solution compared to traditional flat filter plates. This allows for more effective interception of metal oxide particles in the flowing plating solution, reducing the circulation and residue of oxides in the plating solution. The filter holes are arranged vertically and distributed only on the inclined surfaces of the filter plate. On the one hand, this allows the plating solution to pass through the filter holes more smoothly when flowing. On the other hand, the vertical channels reduce the risk of metal oxide particles clogging the channels due to gravity deposition. Even if a small number of particles are attached, they can easily be removed by their own gravity or by the scouring effect of the plating solution.

[0011] The present invention is further configured such that: the filter assembly further includes a first connecting plate, the first connecting plate is connected to the filter plate, and a first card interface is provided through the first connecting plate.

[0012] The present invention is further configured such that: a first fixing member is provided inside the first card interface, the first fixing member is U-shaped, and two sets of first card slots are symmetrically opened on the inner side of the first fixing member.

[0013] By adopting the above technical solution, the first connecting plate serves as an extension connecting component of the filter plate, providing stable support for the filter plate. The first connecting plate cooperates with the first fixing component to achieve convenient installation and fixation of the filter plate. The first connecting plate is compatible with the first slot, providing the possibility for connection.

[0014] The present invention is further configured such that: a second connecting plate is provided at the end of the filter plate away from the first connecting plate, and the second connecting plate is connected to the filter plate.

[0015] The present invention is further configured such that: a second card interface is provided through the second connecting plate, and a second fixing member is provided inside the second card interface.

[0016] The present invention is further configured such that: the shape of the second fixing member is U-shaped, and two sets of second slots are symmetrically opened inside the second fixing member.

[0017] By adopting the above technical solution, the second connecting plate and the first connecting plate form a symmetrical support structure, so that the filter plate is subjected to balanced forces at both ends; the connecting component at the other end of the second connecting plate cooperates with the second fixing component to realize installation; the second connecting plate is adapted to the second slot, providing the possibility of connection; by setting the extension of the first connecting plate and the second connecting plate, the placement and fixing of the filter plate is made possible. In specific applications, the filter plate is connected to other components through the first connecting plate and the second connecting plate, which facilitates the placement and disassembly of the filter plate. The first slot can be adapted to the edge of the first connecting plate, and the second slot can be adapted to the edge of the second connecting plate, that is, the first connecting plate can be snapped into the inside of the first slot, and the second connecting plate can be snapped into the inside of the second slot. The snap-fit ​​method facilitates the replacement and disassembly of the filter plate.

[0018] In summary, this application includes at least one of the following beneficial technical effects:

[0019] To reduce the workload for operators, a filter assembly is installed inside the plating bath to pre-filter metal oxides, reducing the possibility of metal oxides accumulating inside the plating bath. Compared to workers directly cleaning the sediment in the plating bath, the filter assembly reduces the workload of subsequent workers in cleaning the plating bath, thereby improving the cleaning efficiency of the plating bath. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a plating bath cleaning device for wire electroplating according to the present invention.

[0021] Figure 2 for Figure 1 Top view.

[0022] Figure 3 A schematic diagram of the filter assembly in this utility model.

[0023] Figure 4 for Figure 3 Isometric side view.

[0024] Figure 5 for Figure 3 The front view.

[0025] Explanation of reference numerals in the attached diagram: 1. Plating bath;

[0026] 2. Filter assembly; 21. Filter plate; 22. Filter hole; 23. First connecting plate; 24. First card interface; 25. First fixing piece; 26. Second connecting plate; 27. Second fixing piece; 28. Second card interface. Detailed Implementation

[0027] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0028] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0029] Please see Figures 1-5 The present invention provides the following technical solution:

[0030] Example 1, see Figure 1 A cleaning device for a plating bath for wire electroplating includes a plating bath 1, and a filter assembly 2 is installed inside the plating bath 1.

[0031] To reduce the workload of operators, a filter assembly 2 is installed inside the plating bath 1 to pre-filter metal oxides, reducing the possibility of metal oxides accumulating inside the plating bath 1. Compared with workers directly cleaning the sediment in the plating bath 1, the filter assembly 2 can reduce the workload of subsequent workers in cleaning the plating bath 1, thereby improving the cleaning efficiency of the plating bath 1.

[0032] See Figures 2-5 The filter assembly 2 includes a filter plate 21, which is serrated in shape and has a plurality of filter holes 22.

[0033] See Figures 2-5 The filter holes 22 are all located on the inclined surface of the filter plate 21 and are arranged in the vertical direction.

[0034] The serrated structure creates multiple inclined surfaces on the filter plate 21, which significantly increases the contact area with the plating solution compared to the traditional flat filter plate 21. This allows for more effective interception of metal oxide particles in the flowing plating solution and reduces the residual oxides in the plating solution.

[0035] The filter holes 22 are arranged vertically and distributed only on the inclined surface of the filter plate 21. On the one hand, this allows the plating solution to pass through the filter holes 22 more smoothly when it flows. On the other hand, the vertical channels can reduce the risk of metal oxide particles clogging the channels due to gravity deposition. Even if a small number of particles are attached, they can easily be removed by their own gravity or by the plating solution.

[0036] By combining the filter plate 21 and the filter holes 22, the interception efficiency of metal oxides in the plating solution can be significantly improved, reducing the amount of oxides deposited in the plating solution tank 1 from the source. Specifically, the serrated filter plate 21 expands the interception range by increasing the contact area, while the vertical filter holes 22 on the inclined surface capture suspended oxide particles while ensuring smooth flow of the plating solution, forming a highly efficient filtration mechanism. This active filtration mode ensures that most metal oxides are concentrated and intercepted on the surface of the filter plate 21 and its surrounding area, preventing them from adhering to the inner wall, bottom, or other corners of the plating solution tank 1 as the plating solution flows.

[0037] In the subsequent cleaning process, the cleaning intensity of the staff was reduced, and the focus was on cleaning the filter plate 21. Compared with the traditional method of directly cleaning the plating bath 1, this mode greatly simplifies the operation process: on the one hand, the filter plate 21 can be easily disassembled, and the staff can move it out of the plating bath 1 for centralized cleaning, avoiding the inconvenience of working in a small pool space; on the other hand, the concentrated accumulation of oxides reduces the scope and difficulty of cleaning, and reduces physical exertion and operational complexity.

[0038] See Figures 2-5 The filter assembly 2 also includes a first connecting plate 23, which is connected to the filter plate 21, and a first card interface 24 is provided through the first connecting plate 23.

[0039] See Figures 2-5 The first card interface 24 has a first fixing member 25 inside. The first fixing member 25 is U-shaped and has two sets of first card slots symmetrically opened on the inner side.

[0040] The first connecting plate 23 serves as an extension connecting component of the filter plate 21, providing stable support for the filter plate 21. The first connecting plate 23 cooperates with the first fixing member 25 to achieve convenient installation and fixation of the filter plate 21. The first connecting plate 23 is compatible with the first slot, providing the possibility for connection.

[0041] The U-shaped structure design of the first fastener 25 provides a stable installation foundation and makes it possible to fix the filter plate 21.

[0042] See Figures 2-5 A second connecting plate 26 is provided at the end of the filter plate 21 away from the first connecting plate 23, and the second connecting plate 26 is connected to the filter plate 21.

[0043] See Figures 2-5 A second card interface 28 is provided through the second connecting plate 26, and a second fixing member 27 is provided inside the second card interface 28.

[0044] See Figures 2-5The second fastener 27 is U-shaped, and two sets of second slots are symmetrically opened inside the second fastener 27.

[0045] The second connecting plate 26 and the first connecting plate 23 form a symmetrical support structure, so that the filter plate 21 is subjected to balanced forces at both ends; the second connecting plate 26 serves as a connecting component at the other end of the filter plate 21 and is used in conjunction with the second fixing component 27 to achieve installation; the second connecting plate 26 is adapted to the second slot, providing the possibility for connection.

[0046] By setting the first connecting plate 23 and the second connecting plate 26 as extensions of the filter plate 21, it is possible to place and fix the filter plate 21. In specific applications, the filter plate 21 is connected to other components through the first connecting plate 23 and the second connecting plate 26, which facilitates the placement and disassembly of the filter plate 21.

[0047] The first slot can be adapted to the edge of the first connecting plate 23, and the second slot can be adapted to the second connecting plate 26. That is, the first connecting plate 23 can be snapped into the inside of the first slot, and the second connecting plate 26 can be snapped into the inside of the second slot. The snap-fit ​​method facilitates the replacement and disassembly of the filter plate 21.

[0048] In practical applications, both the first fixing member 25 and the second fixing member 27 can be fixed to the inner wall of the plating bath 1 by bolts. The first connecting plate 23 is connected to the first fixing member 25 through the first locking interface 24, and the second connecting plate 26 is connected to the second fixing member 27 through the second locking interface 28. Through the combination of the first connecting plate 23, the first locking interface 24 and the first fixing member 25, and the second connecting plate 26, the second fixing member 27 and the second locking interface 28, the filter plate 21 can be placed inside the plating bath 1, which is convenient for subsequent replacement and cleaning of the filter plate 21.

[0049] In the specific placement of the filter plate 21, the filter plate 21 is first placed in the middle position between the first fixing member 25 and the second fixing member 27. At this time, the first connecting plate 23 is set in the middle position of the first fixing member 25, and the second connecting plate 26 is set in the middle position of the second fixing member 27. Then, the filter plate 21 is pushed from one side, and the first connecting plate 23 is engaged with the first slot of the first fixing member 25, and the second connecting plate 26 is engaged with the second slot of the second fixing member 27. The first slot and the second slot are in a relatively far position, that is, the first slot inside the first slot interface 24 is approached by the first connecting plate 23, and the second slot inside the second slot interface 28 is not engaged. When it is necessary to disassemble the filter plate 21, the filter plate 21 is pulled directly, and the first connecting plate 23 and the second connecting plate 26 can be disengaged from the first slot and the second slot respectively under the action of the filter plate 21.

[0050] The snap-fit ​​design makes the installation and removal of the filter plate 21 simple and convenient, reducing maintenance difficulty and facilitating regular cleaning and replacement of the filter plate 21. This reduces maintenance time and workload, and the removal and installation can be completed without complicated tools, further reducing the workload of operators.

[0051] In specific application scenarios, the connecting plate plays a crucial role, whether it's the initial installation of the filter plate 21 or subsequent disassembly, cleaning, replacement, and maintenance. During installation, workers only need to connect the filter plate 21 to the fixing component using the connecting plate to quickly complete positioning and fixation. During disassembly, no modifications to the internal structure of the plating bath 1 are required; simply disengaging the connecting plate from the slot allows the filter plate 21 to be removed as a whole. This design significantly reduces the time workers spend operating within the confined space of the plating bath 1, lowers the labor intensity of maintenance work, and also avoids damage to the inner wall of the plating bath 1 or the filter plate 21 itself caused by frequent disassembly, thus extending the service life of the entire filter assembly 2.

[0052] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

Claims

1. A cleaning device for a plating bath in wire electroplating, characterized in that: It includes a plating bath (1), and a filter assembly (2) is provided inside the plating bath (1); The filter assembly (2) includes a filter plate (21), which is serrated in shape and has a plurality of filter holes (22).

2. The plating solution tank cleaning device for wire electroplating according to claim 1, characterized in that: The filter holes (22) are all located on the inclined surface of the filter plate (21), and the filter holes (22) are arranged in the vertical direction.

3. The plating solution cell cleaning device for wire plating according to claim 1, characterized by: The filter assembly (2) further includes a first connecting plate (23), which is connected to the filter plate (21), and a first card interface (24) is provided through the first connecting plate (23).

4. The plating solution tank cleaning device for wire plating according to claim 3, characterized by: The first card interface (24) is provided with a first fixing member (25) inside. The first fixing member (25) is U-shaped and has two sets of first card slots symmetrically opened on the inner side.

5. The plating solution cell cleaning device for wire plating according to claim 4, characterized by: A second connecting plate (26) is provided at the end of the filter plate (21) away from the first connecting plate (23), and the second connecting plate (26) is connected to the filter plate (21).

6. The plating solution cell cleaning device for wire plating according to claim 5, characterized by: The second connecting plate (26) has a second card interface (28) through it, and the second card interface (28) has a second fixing member (27) inside it.

7. The plating solution cell cleaning device for wire plating according to claim 6, characterized by: The second fastener (27) is U-shaped, and two sets of second slots are symmetrically provided inside the second fastener (27).

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