An optical module

Abstract

The optical module disclosed herein includes: a circuit board; a lens assembly connected to the circuit board at its bottom; the bottom of the lens assembly and the circuit board forming a receiving cavity; a light emitting assembly located within the receiving cavity; the light emitting assembly electrically connected to the circuit board, the light emitting assembly including a high-frequency electrode for inputting high-frequency signals; and a matching resistor assembly located within the receiving cavity and on the side of the light emitting assembly. The matching resistor assembly includes: a first substrate connected to the circuit board at its bottom, and a first pad and a second pad formed on its top; the first pad being wire-connected to the high-frequency electrode, and the second pad being wire-connected to the circuit board; and a matching resistor disposed on the top of the first substrate; a first end of the matching resistor being electrically connected to the first pad, and a second end of the matching resistor being electrically connected to the second pad. The optical module disclosed herein facilitates the solution to the problem of insufficient bandwidth in VCSELs.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, video, and artificial intelligence, the advancement of optical communication technology has become increasingly important. In optical communication technology, the optical module is the tool for converting between photoelectric and electrical signals, and is one of the key components in optical communication equipment, occupying a core position in optical communication.

[0003] Vertical-cavity surface-emitting lasers (VCSELs) are a commonly used type of laser in optical modules. VCSELs are typically connected to circuit boards or drivers via wire bonding. This wire bonding often introduces parasitic inductance, which reduces link bandwidth. Since the spacing between the VCSEL and the device cannot be eliminated, shortening the wire bonding length is limited in the manufacturing process; simply reducing the wire bonding length on high-speed signal lines cannot improve link bandwidth. Furthermore, as module speeds increase, especially after reaching single-wavelength 100GBd and 200GBd, the insufficient bandwidth becomes increasingly apparent. Utility Model Content

[0004] Some embodiments provide an optical module that facilitates the solution to the problem of insufficient bandwidth in VCSELs.

[0005] Some embodiments provide an optical module, including:

[0006] Circuit board;

[0007] A lens assembly is connected to the circuit board at its bottom; the bottom of the lens assembly and the circuit board form a receiving cavity, and the lens assembly is used to change the transmission direction of the optical signal;

[0008] An optical emitting component, located within the receiving cavity, is used to generate optical signals; the optical emitting component is electrically connected to the circuit board, and the optical emitting component includes a substrate, a high-frequency electrode and a light-emitting area are disposed on the top of the substrate, the light-emitting area is located to the left of the high-frequency electrode, and the high-frequency electrode is used to input high-frequency signals;

[0009] A matching resistor assembly is located within the receiving cavity and to the left of the light emitting assembly; wherein: the matching resistor assembly includes:

[0010] A first substrate has a bottom connection to the circuit board and a top having a first pad and a second pad; the first pad is wire-connected to the high-frequency electrode, the axis of the first pad is offset from the axis of the high-frequency electrode, and the second pad is wire-connected to the circuit board.

[0011] A matching resistor is disposed on the top of the first substrate; the first end of the matching resistor is electrically connected to the first pad, and the second end of the matching resistor is electrically connected to the second pad.

[0012] One of the above technical solutions has the following advantages or beneficial effects: The bottom of the lens assembly is connected to a circuit board, forming a receiving cavity with the circuit board. A light-emitting assembly is located within the receiving cavity and is electrically connected to the circuit board. The light-emitting assembly includes a substrate, with a high-frequency electrode and a light-emitting region disposed on the top of the substrate. The light-emitting region is located to the left of the high-frequency electrode, which is used to input high-frequency signals. When a high-frequency signal is input through the high-frequency electrode, the light-emitting assembly generates a light signal, and the lens assembly can change the transmission direction of the light signal. A matching resistor assembly is also disposed within the receiving cavity, located to the left of the light-emitting assembly. The matching resistor assembly includes a first substrate and a matching resistor. The bottom of the first substrate is connected to the circuit board, and the top of the first substrate forms a first pad and a second pad. The first end of the matching resistor is electrically connected to the first pad, and the second end of the matching resistor is electrically connected to the second pad. The high-frequency signal input to the high-frequency electrode is input from a wire bonding device located to the right of the high-frequency electrode, preventing the wire bonding from extending into the light-emitting region and affecting light emission from the light-emitting region. The axis of the first pad is offset from the axis of the high-frequency electrode. The high-frequency electrode is wire-connected to the first pad, which makes it easier to offset the wire from the light emission area, thereby reducing the impact of the wire on the transmission of the light signal generated by the light emitting component.

[0013] The high-frequency electrode is wire-bonded to the first pad. This facilitates the use of the matching resistor in the matching resistor assembly to reduce impedance discontinuities and guides reflected signals to the circuit board's ground, thereby reducing the impact of signal reflection on the effective signal and improving the signal-to-noise ratio. Additionally, the wire bonding between the high-frequency electrode and the matching resistor assembly, as well as the wire bonding between the matching resistor assembly and the circuit board, generates parasitic inductance. Combining these wire bondings, the matching resistor assembly and the circuit board, and the matching resistor itself, high-frequency attenuation caused by distributed capacitance can be compensated for through peaking, thus increasing the high-frequency bandwidth of the link. Therefore, by incorporating the matching resistor assembly, the transmission characteristics of the high-frequency signal from the optical transmitter can be effectively improved, signal reflection and loss can be reduced, and the high-frequency performance and stability of the optical module can be enhanced. This, in turn, improves the overall operating efficiency and data transmission quality of the optical module, making it perform better in high-speed data transmission applications.

[0014] In some embodiments, an optical module is provided, which further includes a laser driver chip located on the right side of the optical emitting component, and the high-frequency electrode is wire-connected to the laser driver chip;

[0015] The axis of the first pad deviates to the left and rearward from the axis of the high-frequency electrode, or the axis of the first pad deviates to the left and frontward from the axis of the high-frequency electrode.

[0016] One of the above technical solutions has the following advantages or beneficial effects: the optical module also includes a laser driver chip, which is located on the right side of the optical emitting component. The laser driver chip can be disposed inside the cavity or outside the lens assembly. By positioning the laser driver chip on one side of the optical emitting component and the matching resistor assembly on the other side, it facilitates the electrical connection between the optical emitting component and the matching resistor assembly, as well as the electrical connection between the optical emitting component and the laser driver chip. When the optical emitting component is wire-connected to the matching resistor assembly, because the axis of the first pad deviates to the left and rearward of the axis of the high-frequency electrode, or the axis of the first pad deviates to the left and frontward of the axis of the high-frequency electrode, the axis of the first pad is not collinear with the axis of the high-frequency electrode. This facilitates the wire bonding of the optical emitting component and the matching resistor assembly to avoid the optical transmission area of ​​the optical emitting component.

[0017] In some embodiments, an optical module is provided, further comprising a matching capacitor assembly located within the receiving cavity;

[0018] The matching capacitor assembly includes a second substrate and a matching capacitor; a third pad is provided on the top of the second substrate, the third pad is electrically connected to the first end of the matching capacitor, and the third pad is wire-connected to the second pad.

[0019] One of the above technical solutions has the following advantages or beneficial effects: the optical module further includes a matching capacitor assembly located within the housing cavity. The matching capacitor assembly can be located on the side of the matching resistor assembly away from the optical emitting component. The matching capacitor assembly includes a second substrate and a matching capacitor. A third pad is disposed on the top of the second substrate, and the third pad is electrically connected to the first end of the matching capacitor. The third pad is also wire-connected to the second pad. This utilizes the matching capacitor assembly and the matching resistor assembly to form an RC matching circuit, thereby facilitating the improvement of the small-signal bandwidth of the optical emitting component and enhancing the high-speed signal integrity of the link.

[0020] In some embodiments, an optical module is provided, wherein the optical emitting component includes a plurality of high-frequency electrodes, and the matching resistor component includes a plurality of matching resistors; a plurality of first pads and a second pad are formed on the top of the first substrate; the first ends of the plurality of matching resistors are electrically connected to the corresponding first pads, and the second ends of the plurality of matching resistors are electrically connected to the second pads.

[0021] One of the above technical solutions has the following advantages or beneficial effects: the light emitting component includes multiple high-frequency electrodes, the matching resistor component includes multiple matching resistors, and multiple first pads and one second pad are formed on the top of the first substrate. The first ends of the multiple matching resistors are electrically connected to the corresponding first pads, and the second ends of the multiple matching resistors are electrically connected to the second pads, which facilitates the formation of a matching resistor array and thus facilitates adaptation to VCSEL laser arrays.

[0022] In some embodiments, an optical module is provided, wherein a first locator and a second locator are formed on the top of the first substrate, and the first locator and the second locator are close to the second pad.

[0023] One of the above technical solutions has the following advantages or beneficial effects: a first locator and a second locator are formed on the top of the first substrate to locate the matching resistor assembly, thereby facilitating the positioning and connection of the matching resistor assembly to the circuit board. The first and second locators are close to the second pad, which helps to reduce the size of the matching resistor assembly.

[0024] In some embodiments, an optical module is provided, the optical emitting component including a substrate, a positive electrode and a negative electrode formed on the top of the substrate, the positive electrode being located on one side of the high-frequency electrode and the negative electrode being located on the other side of the high-frequency electrode.

[0025] One of the above technical solutions has the following advantages or beneficial effects: the light emitting component includes a substrate, and a positive electrode and a negative electrode are formed on the top of the substrate. The positive electrode is located on one side of the high-frequency electrode, and the negative electrode is located on the other side of the high-frequency electrode. This reduces signal interference between adjacent high-frequency electrodes when the positive electrode and the negative electrode are wire-connected to a circuit board or laser driver chip.

[0026] Some embodiments provide an optical module, including:

[0027] Circuit board;

[0028] A lens assembly is connected to the circuit board at its bottom; the bottom of the lens assembly and the circuit board form a receiving cavity, and the lens assembly is used to change the transmission direction of the optical signal;

[0029] A matching resistor assembly is located within the receiving cavity; wherein: the matching resistor assembly includes:

[0030] A first substrate has a bottom connection to the circuit board and a top having a first pad and a second pad.

[0031] A matching resistor is disposed on the top of the first substrate; the first end of the matching resistor is electrically connected to the first pad, and the second end of the matching resistor is electrically connected to the second pad;

[0032] A light emitting component is located within the receiving cavity and on top of the first substrate; the light emitting component includes a substrate, on the top of which a high-frequency electrode and a light-emitting region are disposed, the light-emitting region being located to the left of the high-frequency electrode, and the axis of the high-frequency electrode being offset from the axis of the first pad; the high-frequency electrode is used to input high-frequency signals and is wire-connected to the first pad.

[0033] One of the above technical solutions has the following advantages or beneficial effects: The bottom of the lens assembly is connected to a circuit board, forming a receiving cavity with the circuit board. The light emitting assembly is located within the receiving cavity and is electrically connected to the circuit board. The light emitting assembly includes a substrate, with a high-frequency electrode and a light-emitting region disposed on the top of the substrate. The light-emitting region is located to the left of the high-frequency electrode, which is used to input high-frequency signals. When a high-frequency signal is input through the high-frequency electrode, the light emitting assembly generates a light signal, and the lens assembly can change the transmission direction of the light signal. A matching resistor assembly is also disposed within the receiving cavity, with the light emitting assembly located on the matching resistor assembly. The matching resistor assembly includes a first substrate and a matching resistor. The bottom of the first substrate is connected to the circuit board, and the top of the first substrate forms a first pad and a second pad. The first end of the matching resistor is electrically connected to the first pad, and the second end of the matching resistor is electrically connected to the second pad. The light emitting assembly is disposed on the first substrate, and the high-frequency electrode is wire-connected to the first pad. The high-frequency signal input to the high-frequency electrode is input from the wire located to the right of the high-frequency electrode, preventing the wire from extending into the light-emitting region and affecting the light emission from the light-emitting region. The axis of the first pad is offset from the axis of the high-frequency electrode. The high-frequency electrode is wire-bonded to the first pad, which facilitates the wire bonding away from the light-emitting area, thereby reducing the impact of the wire bonding on the optical signal transmission generated by the optical emitting component. The optical emitting component is mounted on the first substrate, saving area on the circuit board below the lens assembly. This facilitates the use of the matching resistor in the matching resistor assembly to reduce impedance discontinuities and also facilitates guiding the reflected signal to ground on the circuit board, thus reducing the impact of signal reflection on the effective signal and improving the signal-to-noise ratio. Furthermore, the wire bonding between the high-frequency electrode and the matching resistor assembly, as well as the wire bonding between the matching resistor assembly and the circuit board, generates parasitic inductance. Combining the wire bonding between the high-frequency electrode and the matching resistor assembly, the wire bonding between the matching resistor assembly and the circuit board, and the matching resistor, "peaking" can compensate for high-frequency attenuation caused by distributed capacitance, thereby improving the high-frequency bandwidth of the link.

[0034] In some embodiments, an optical module is provided, further comprising a laser driver chip; the laser driver chip is located within the receiving cavity and is located to the right of the optical emitting component;

[0035] The high-frequency electrode is wire-connected to the laser driver chip;

[0036] The axis of the first pad is deviated to the left and forward from the axis of the high-frequency electrode.

[0037] One of the above technical solutions has the following advantages or beneficial effects: the optical module also includes a laser driver chip, which is located on the right side of the optical emitting component. The laser driver chip can be disposed inside the receiving cavity or outside the lens assembly. The laser driver chip's location on the side of the optical emitting component facilitates electrical connection between the optical emitting component and the matching resistor assembly, as well as electrical connection between the optical emitting component and the laser driver chip. When the optical emitting component is wire-connected to the matching resistor assembly, the axis of the first pad is offset to the left and forward of the axis of the high-frequency electrode, facilitating the wire bonding between the optical emitting component and the matching resistor assembly to avoid obstructing the optical transmission area of ​​the optical emitting component.

[0038] In some embodiments, an optical module is provided, wherein the bottom of the optical emitting component is connected to the second pad; the bottom of the optical emitting component is connected to the second pad; a first locator and a second locator are also formed on the top of the first substrate, the first locator and the second locator being close to the edge of the first substrate.

[0039] One of the above technical solutions has the following advantages or beneficial effects: the light emitting component is disposed on the second pad, which helps to save area on the circuit board below the lens component. A first locator and a second locator are formed on the top of the first substrate to locate the matching resistor component, thereby facilitating the positioning and connection of the matching resistor component to the circuit board. The first and second locators are located at the edge of the first substrate, which helps to reduce the size of the matching resistor component.

[0040] Some embodiments provide an optical module, including:

[0041] Circuit board;

[0042] A light emitting component is disposed on the circuit board; the light emitting component is used to generate light signals.

[0043] A lens assembly is connected to the circuit board at its bottom; the lens assembly is located above the light emitting assembly, and the lens assembly is used to change the transmission direction of the light signal;

[0044] A matching resistor assembly is located below the lens assembly and to the left of the light emitting assembly; wherein the matching resistor assembly includes:

[0045] A first substrate has a bottom connection to the circuit board and a top forming a first pad and a second pad; the second pad is wire-connected to the circuit board.

[0046] A matching resistor is disposed on the top of the first substrate; the first end of the matching resistor is electrically connected to the first pad, and the second end of the matching resistor is electrically connected to the second pad;

[0047] A laser driver chip is located on the right side of the light emitting component;

[0048] The light emitting component includes a substrate, on the top of which a high-frequency electrode and a light-emitting region are disposed; the light-emitting region is located to the left of the high-frequency electrode, which is offset from the first pad; the high-frequency electrode is wire-connected to the first pad and wire-connected to the laser driver chip, and the laser driver chip inputs a high-frequency signal to the light emitting component through the high-frequency electrode.

[0049] One of the above technical solutions has the following advantages or beneficial effects: The light emitting component is disposed on a circuit board and generates a light signal; the bottom of the lens assembly is connected to the circuit board, placing the lens assembly above the light emitting component, allowing the lens assembly to change the transmission direction of the light signal. The light emitting component includes a substrate, with a high-frequency electrode and a light-emitting area disposed on the top of the substrate. The light-emitting area is located to the left of the high-frequency electrode, which is used to input high-frequency signals. A matching resistor assembly is disposed to the left of the light emitting component, below the lens assembly, and a laser driver chip is disposed to the right of the light emitting component. The matching resistor assembly includes a first substrate and a matching resistor. The bottom of the first substrate is connected to the circuit board, and a first pad and a second pad are formed on the top of the first substrate. The first end of the matching resistor is electrically connected to the first pad, and the second end of the matching resistor is electrically connected to the second pad. The matching resistor assembly is located to the left of the high-frequency electrode, causing the wire bonding of the high-frequency electrode to the matching resistor assembly to extend to the left of the high-frequency electrode. The laser driver chip is located to the right of the high-frequency electrode, causing the wire bonding of the high-frequency electrode to the laser driver chip to extend to the right of the high-frequency electrode. Because the high-frequency electrode is offset from the first pad, the bonding wires extending to the left of the high-frequency electrode can avoid the light-emitting area. The light-emitting area is located to the left of the high-frequency electrode, which allows the bonding wires extending to the right of the high-frequency electrode to avoid the light-emitting area.

[0050] The high-frequency electrode is wire-bonded to the first pad. This utilizes the matching resistor in the matching resistor assembly to reduce impedance discontinuities and facilitates guiding reflected signals to the circuit board's ground, thereby reducing the impact of signal reflection on the effective signal and improving the signal-to-noise ratio. Furthermore, the wire bonding between the high-frequency electrode and the matching resistor assembly, as well as the wire bonding between the matching resistor assembly and the circuit board, generates parasitic inductance. Combining these wire bondings, the matching resistor assembly and the circuit board, and the matching resistor itself, high-frequency attenuation caused by distributed capacitance can be compensated for through peaking, thus increasing the link's high-frequency bandwidth. Therefore, by incorporating the matching resistor assembly, the transmission characteristics of the high-frequency signal from the optical transmitter can be effectively improved, reducing signal reflection and loss, enhancing the high-frequency performance and stability of the optical module, and ultimately improving the overall operating efficiency and data transmission quality of the optical module, making it perform better in high-speed data transmission applications. Attached Figure Description

[0051] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly introduced below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0052] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments;

[0053] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0054] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0055] Figure 4 An exploded view of an optical module according to some embodiments;

[0056] Figure 5 This is an exploded view of the internal structure of an optical module according to some embodiments;

[0057] Figure 6 for Figure 5 A magnified view of a section at point A in the middle;

[0058] Figure 7 This is an assembly diagram of an optical emitting component and a laser driving chip according to some embodiments;

[0059] Figure 8This is a usage diagram of an optical emitting component according to some embodiments;

[0060] Figure 9 This is an exploded view of the internal structure of an optical module according to some embodiments;

[0061] Figure 10 for Figure 9 A magnified view of a section at point B in the middle;

[0062] Figure 11 This is a structural diagram of a matching resistor assembly according to some embodiments;

[0063] Figure 12 This is a structural diagram of another matching resistor assembly according to some embodiments;

[0064] Figure 13A This is a schematic diagram of the assembly of a light emitting component and a matching resistor component according to some embodiments. Figure 1 ;

[0065] Figure 13B for Figure 13A The equivalent circuit diagram;

[0066] Figure 14 This is a schematic diagram of the assembly of a light emitting component and a matching resistor component according to some embodiments. Figure 2 ;

[0067] Figure 15 This is a schematic diagram of the assembly of a light emitting component and a matching resistor component according to some embodiments. Figure 3 ;

[0068] Figure 16A This is a schematic diagram of the assembly of another optical emitting component and matching resistor component according to some embodiments;

[0069] Figure 16B for Figure 16A The equivalent circuit diagram;

[0070] Figure 17 This is a schematic diagram of the assembly of another light emitting component and a matching resistor component according to some embodiments. Figure 1 ;

[0071] Figure 18 This is a schematic diagram of the assembly of another light emitting component and a matching resistor component according to some embodiments. Figure 2 ;

[0072] Figure 19 This is an internal structural diagram of another optical module according to some embodiments;

[0073] Figure 20 This is an internal structural diagram of another optical module according to some embodiments. Detailed Implementation

[0074] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0075] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0076] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0077] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0078] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0079] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0080] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0081] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0082] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0083] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0084] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0085] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0086] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0087] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0088] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0089] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0090] Figure 2This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2 As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0091] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0092] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0093] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0094] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0095] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0096] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 203 and 204, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0097] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0098] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, lens assembly 400, etc. into the housing, and the upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0099] The direction of the line connecting the two openings 203 and 204 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 203 is located at the end of the optical module 200. Figure 3 The opening 204 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 203 is located at the end of optical module 200, while opening 204 is located on the side of optical module 200.

[0100] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0101] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0102] like Figure 3 and Figure 4As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0103] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0104] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0105] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0106] In some implementations, the gold fingers are located on one side of the surface of the circuit board 300. In other implementations, the gold fingers are located on the top and bottom surfaces of the circuit board 300 to provide a greater number of pins, thus accommodating applications with high pin count requirements.

[0107] In some implementations, the gold fingers of the circuit board extend from the electrical port and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0108] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0109] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0110] In some embodiments, the bottom of the lens assembly 400 is connected to the circuit board 300, and the lens assembly 400 and the circuit board 300 form a receiving cavity. An optical chip can be disposed within the receiving cavity of the lens assembly 400 and the circuit board 300. The optical chip may include a light emitting chip and / or a light receiving chip, etc., and the light emitting chip, light receiving chip, etc., are electrically connected to the circuit board 300. The lens assembly 400 has optical surfaces such as a transmission surface and a reflection surface, so that the transmission direction of the emitted light signal and / or received light signal can be adjusted by combining the transmission surface and the reflection surface, enabling the emitted light signal generated by the light emitting chip to be output from the optical module, and the light signal input to the optical module to be transmitted to the light receiving chip. In some embodiments, a laser driver plate and / or a TIA may also be disposed below the lens assembly 400.

[0111] In some embodiments, the lens assembly 400 is connected to the optical fiber strip 410, and the optical signal generated by the optical transmitting chip is transmitted to the optical fiber strip 410 through the lens assembly 400; or the optical signal input through the optical fiber strip 410 is transmitted to the lens assembly 400, and then transmitted to the optical receiving chip through the lens assembly 400. Of course, in some embodiments, the lens assembly 400 is disposed on the optical port side of the optical module 200, and the lens assembly 400 is directly connected to an external optical fiber.

[0112] In some embodiments, an optical fiber adapter may be provided at one end of the optical fiber ribbon 410 for optical connection of the optical fiber ribbon 410 to an external optical fiber. In some embodiments, the optical fiber adapter is placed horizontally inside the optical port, that is, the main plane of the optical fiber adapter is parallel or approximately parallel to the bearing plane of the optical port. Of course, in some embodiments, the optical fiber adapter is placed vertically inside the optical port, that is, the main plane of the optical fiber adapter is perpendicular or approximately perpendicular to the bearing plane of the optical port. Figure 4 The image shows a fiber optic connector positioned horizontally.

[0113] In some embodiments, an optical fiber connector may be provided at the other end of the optical fiber ribbon 410, and the optical fiber ribbon is connected to the lens assembly 400 through the optical fiber connector. Of course, in some embodiments, the optical fiber ribbon 410 can be directly connected to the lens assembly 400 by adhesive or the like.

[0114] Figure 5 This is an exploded view of the internal structure of an optical module according to some embodiments. Figure 6 for Figure 5 A magnified view of a portion of point A in the middle. (See image below.) Figure 5 and Figure 6 As shown, in some embodiments, a light emitting component 310 may be disposed below the lens assembly 400. Exemplarily, the bottom of the light emitting component 310 is connected to the surface of the circuit board 300, and the light emitting component 310 is electrically connected to the circuit board 300. The optical signal generated by the light emitting component 310 is transmitted to the lens assembly 400, then through the lens assembly 400 to the first optical fiber strip 410, and finally through the optical fiber strip 410 to the outside of the optical module. In some embodiments, the light emitting component 310 may generate multiple light signals.

[0115] In some embodiments, a laser driver chip 330 may be disposed below the lens assembly 400. The laser driver chip 330 is disposed on one side of the light emitting assembly 310, and is electrically connected to both the circuit board 300 and the light emitting assembly 310. The light emitting assembly 310 may be wired to the laser driver chip 330.

[0116] Typically, the laser driver chip 330 is larger than the light emitting component 310, and the laser driver chip 330 can be disposed at the lower edge of the lens assembly 400. Exemplarily, the laser driver chip 330 can be disposed within the receiving cavity, and the laser driver chip 330 is closer to the edge of the lens assembly 400 than the light emitting component 310. Of course, in some embodiments, the laser driver chip 330 can also be located outside the receiving cavity.

[0117] In some embodiments, a light receiving component 320 may be disposed below the lens assembly 400. Optical signals transmitted to the lens assembly 400 via the fiber optic strip 410 are then transmitted to the light receiving component 320 via the lens assembly 400. The light receiving component 320 can receive multiple optical signals. The light receiving component 320 may be disposed on the side of the light emitting component 310.

[0118] In some embodiments, a TIA 340 may be disposed below the lens assembly 400, with the TIA 340 positioned beside the light receiving assembly 320. The TIA 340 is electrically connected to both the circuit board 300 and the light receiving assembly 320. The TIA 340 may be mounted on the circuit board 300, with its top surface higher than the top surface of the circuit board 300. The light receiving assembly 320 may be wired to the TIA 340.

[0119] In some embodiments, the light receiving component 320 may be located on the side of the light emitting component 310 in the width direction of the circuit board 300. Exemplarily, the light receiving component 320 and the light emitting component 310 are arranged side by side along the width direction of the circuit board 300.

[0120] In some embodiments, the light emitting component 310 includes a plurality of VCSELs. The plurality of VCSELs can form a laser array. Exemplarily, the light emitting component 310 may include four VCSELs, but of course, the light emitting component 310 in this disclosure is not limited to including four VCSEL lasers.

[0121] In some embodiments, the optical emitting component 310 is wire-connected to the laser driver chip 330, and the laser driver chip 330 transmits a high-frequency signal to the VCSEL in the optical emitting component 310, so that the VCSEL in the optical emitting component 310 generates an optical signal. To ensure the performance of multiple VCSELs generating optical signals, such as... Figure 6 As shown, the laser driver chip 330 is located to the right of the light emitting assembly 310 to facilitate control of the wire bonding length between the laser driver chip 330 and the multiple VCSELs. In some embodiments, the light emitting assembly 310 may be wire-connected to the circuit board 300 to transmit high-frequency signals to the VCSELs in the light emitting assembly 310 via the circuit board 300.

[0122] In some embodiments, the transmission rate of the VCSEL laser is 50Gb / s, 100Gb / s, 200Gb / s, etc. The wire bonding between the optical emitting component 310 and the laser driver chip 330 introduces parasitic inductance, which reduces the link bandwidth. This insufficient link bandwidth becomes increasingly apparent, especially as the transmission rate of the VCSEL laser in the optical emitting component 310 increases.

[0123] In some embodiments, the optical receiver 320 encapsulates a plurality of photodetectors. The optical receiver 320 may encapsulate four photodetectors, but in this embodiment, the optical receiver 320 is not limited to encapsulating four photodetectors.

[0124] In some embodiments, a DSP chip 350 may be disposed on the circuit board 300. The DSP chip 350 may be located on the side of the end of the lens assembly 400.

[0125] Figure 7 This is an assembly diagram of an optical emitting component and a laser driver chip according to some embodiments. Figure 8 This is a usage diagram of a light emitting component according to some embodiments. Figure 7 The image shows a partial structure of the laser driver chip. Figure 8 The operating state of a light emitting component is shown. For example... Figure 7 and Figure 8 As shown, the light emitting component 310 may include a substrate 311. A positive electrode 312, a negative electrode 313, and a high-frequency electrode 314 are disposed on the top of the substrate 311, with the high-frequency electrode 314 located between the positive electrode 312 and the negative electrode 313. The positive electrode 312, negative electrode 313, and high-frequency electrode 314 can all be wire-connected to a circuit board 300 or a laser driver chip 330, etc. The high-frequency electrode 314 is used to input high-frequency signals so that the light emitting component 310 can generate light signals. To facilitate electrical connection of the light emitting component 310 to the circuit board 300 or the laser driver chip 330, the positive electrode 312, negative electrode 313, and high-frequency electrode 314 are located at the edge of the top of the substrate 311.

[0126] In some embodiments, the positive electrode 312 is located on one side of the high-frequency electrode 314, and the negative electrode 313 is located on the other side of the high-frequency electrode 314, so that the high-frequency electrode 314 is located between the positive electrode 312 and the negative electrode 313.

[0127] In some embodiments, the top of the substrate 311 is provided with a plurality of positive electrodes 312, a plurality of negative electrodes 313 and a plurality of high-frequency electrodes 314, enabling the light emitting component 310 to generate multiple light signals. For example, the top of the substrate 311 is provided with four positive electrodes 312, four negative electrodes 313 and four high-frequency electrodes 314.

[0128] When the top of the substrate 311 is provided with multiple positive electrodes 312, multiple negative electrodes 313, and multiple high-frequency electrodes 314, positive electrodes 312 and negative electrodes 313 are formed between adjacent high-frequency electrodes 314. When the positive electrodes 312 and negative electrodes 313 are wired to the circuit board 300 or the laser driver chip 330, the wire bonding between the positive electrode 312 and the circuit board 300 or the laser driver chip 330, and the wire bonding between the negative electrode 313 and the circuit board 300 or the laser driver chip 330, can reduce signal interference between adjacent high-frequency electrodes 314.

[0129] A light-emitting region 315 is formed on the top of the substrate 311, and the light-emitting region 315 is located on the side of the high-frequency electrode 314. The light generated by the light-emitting component 310 is output from the light-emitting region 315. The light generated by the light-emitting component 310 is divergent light. When the light-emitting region 315 outputs light, a light transmission region 316 is formed above the light-emitting region 315. The light transmission region 316 can be frustum-shaped.

[0130] One side of the substrate 311 is close to the laser driver chip 330, making the positive electrode 312, negative electrode 313, and high-frequency electrode 314 close to the laser driver chip 330. The light-emitting region 315 is close to the other side of the substrate 311, making the light-emitting region 315 away from the laser driver chip 330. For example, the light-emitting region 315 is located to the left of the high-frequency electrode 314 to reduce the risk of wire bonding of the high-frequency electrode 314 to the circuit board 300 or the laser driver chip 330 extending to the light-emitting region 315 or the light transmission region 316.

[0131] In some instances, multiple light-emitting regions 315 are formed on the top of the substrate 311, and the light-emitting component 310 can generate multiple beams of light when it is in operation. For example, four light-emitting regions 315 are formed on the top of the substrate 311, and the light-emitting component 310 can generate four beams of light when it is in operation.

[0132] Figure 9 This is an exploded view of the internal structure of an optical module according to some embodiments. Figure 10 for Figure 9 A magnified view of a section at point B. (See image below.) Figure 9 and Figure 10 As shown, in some embodiments, a matching resistor assembly 360 may be disposed below the lens assembly 400. The matching resistor assembly 360 includes a matching resistor whose wires are connected to the light emitting assembly 310. Exemplarily, the matching resistor is disposed on the circuit board 300, and the matching resistor is electrically connected to the light emitting assembly 310 and the circuit board 300.

[0133] In some embodiments, the matching resistor component 360 is located on the left side of the optical emitting component 310 to facilitate control of the electrical connection performance between the matching resistor component 360 and the optical emitting component 310, and to ensure impedance matching performance between the matching resistor component 360 and the optical emitting component 310. If the matching resistor component 360 is placed at other locations on the side of the optical emitting component 310, such as on the front side, it would be difficult to ensure the uniformity of the electrical connection between the matching resistor component 360 and the VCSEL laser on the optical emitting component 310, and it would also increase the difficulty of impedance matching between the matching resistor component 360 and the optical emitting component 310.

[0134] Figure 11 This is a structural diagram of a matching resistor assembly according to some embodiments. Figure 11As shown, in some embodiments, the matching resistor assembly 360 may include a first substrate 361, on the top of which a first pad 362 and a second pad 364 are formed. The matching resistor assembly 360 includes a matching resistor 363, with a first terminal electrically connected to the first pad 362 and a second terminal electrically connected to the second pad 364. The matching resistor 363 may be a thin-film resistor, and it may be grown on the first substrate 361.

[0135] In some embodiments, the matching resistor assembly 360 may include a plurality of matching resistors 363. The plurality of matching resistors 363 may form a resistor array. Exemplarily, the matching resistor assembly 360 may include four matching resistors 363, four first pads 362, and one second pad 364. The first terminals of the four matching resistors 363 are electrically connected to the corresponding first pads 362, and the second terminals of the four matching resistors 363 are electrically connected to the second pad 364.

[0136] Figure 12 This is a structural diagram of another matching resistor assembly according to some embodiments. Figure 12 As shown, in some embodiments, the matching resistor assembly 360 may include four matching resistors 363, four first pads 362, and four second pads 364. The first terminals of the four matching resistors 363 are electrically connected to the corresponding first pads 362, and the second terminals of the four matching resistors 363 are electrically connected to the corresponding second pads 364.

[0137] In some embodiments, the matching resistor assembly 360 may include a first locator 365 and a second locator 366. The first locator 365 and the second locator 366 are located at the top edge of the first substrate 361. Exemplarily, the first locator 365 and the second locator 366 are close to the second pad 364. The first locator 365 and the second locator 366 are used to assist in the positioning of the matching resistor assembly 360.

[0138] Figure 13A This is a schematic diagram of the assembly of a light emitting component and a matching resistor component according to some embodiments. Figure 1 , Figure 13B for Figure 13A The equivalent circuit diagram. For example... Figure 13A and Figure 13BAs shown, in some embodiments, the matching resistor assembly 360 is located on the left side of the substrate 311, close to the light-emitting region 315, and far from the high-frequency electrode 314. The high-frequency electrode 314 is wire-connected to the matching resistor assembly 360, and the matching resistor assembly 360 is electrically connected to the circuit board 300 to form a signal loop. The wire connection between the high-frequency electrode 314 and the matching resistor assembly 360 can be gold wire. Exemplarily, the high-frequency electrode 314 is wire-connected to a corresponding first pad 362 on the matching resistor assembly 360, and the second pad 364 is wire-connected to the circuit board 300. This facilitates the use of the matching resistor 363 in the matching resistor assembly 360 to reduce impedance discontinuities and also facilitates guiding the reflected signal to the ground of the circuit board 300, thereby reducing the impact of signal reflection on the effective signal and improving the signal-to-noise ratio. Additionally, the wire connection between the high-frequency electrode 314 and the matching resistor assembly 360, and the wire connection between the matching resistor assembly 360 and the circuit board 300, generate parasitic inductance. By combining the wire bonding between the high-frequency electrode 314 and the matching resistor assembly 360, the wire bonding between the matching resistor assembly 360 and the circuit board 300, and the matching resistor 363, the high-frequency attenuation caused by distributed capacitance and other factors can be "peaked" to compensate for the high-frequency attenuation, thereby improving the high-frequency bandwidth of the link.

[0139] Because the light emitting component 310 is located below the lens assembly 400, it restricts the placement of the matching resistor assembly 360 and the wire bonding between the light emitting component 310 and the matching resistor assembly 360. Furthermore, when the wire bonding connects the matching resistor assembly 360 and the high-frequency electrode 314, the wire bonding can easily extend into the light transmission region 316. When the wire bonding extends into the light transmission region 316, it will affect the light transmission generated by the substrate 311.

[0140] Figure 14 This is a schematic diagram of the assembly of a light emitting component and a matching resistor component according to some embodiments. Figure 2 , Figure 15 This is a schematic diagram of the assembly of a light emitting component and a matching resistor component according to some embodiments. Figure 3 , Figure 14 The dashed line represents the axis between the corresponding high-frequency electrode and the first pad. For example... Figure 14 and Figure 15As shown, in some embodiments, the light emitting component 310 includes high-frequency electrodes 314a, 314b, 314c, and 314d, and light-emitting regions 315a, 315b, 315c, and 315d. Light-emitting region 315a is located beside high-frequency electrode 314a, light-emitting region 315b is located beside high-frequency electrode 314b, light-emitting region 315c is located beside high-frequency electrode 314c, and light-emitting region 315d is located beside high-frequency electrode 314d. The matching resistor component 360 includes first pads 362a, 362b, 362c, and 362d. High-frequency electrode 314a is wire-connected to the first pad 362a, high-frequency electrode 314b is wire-connected to the first pad 362b, high-frequency electrode 314c is wire-connected to the first pad 362c, and high-frequency electrode 314d is wire-connected to the first pad 362d.

[0141] In some embodiments, the axis of the first pad 362a deviates from the axis of the high-frequency electrode 314a, causing the first pad 362a to deviate from the light-emitting region 315a, thereby facilitating wire bonding between the high-frequency electrode 314a and the first pad 362a to avoid the light transmission region 316a. The axis of the first pad 362b deviates from the axis of the high-frequency electrode 314b, causing the first pad 362b to deviate from the light-emitting region 315b, thereby facilitating wire bonding between the high-frequency electrode 314b and the first pad 362b to avoid the light transmission region 316b. The axis of the first pad 362c deviates from the axis of the high-frequency electrode 314c, causing the first pad 362c to deviate from the light-emitting region 315c, thereby facilitating wire bonding between the high-frequency electrode 314c and the first pad 362c to avoid the light transmission region 316c. The axis of the first pad 362d is offset from the axis of the high-frequency electrode 314d, causing the first pad 362d to be offset from the light-emitting region 315d. This facilitates wire bonding between the high-frequency electrode 314d and the first pad 362d to avoid the light transmission region 316d. Thus, the axis of the first pad 362d is offset from the axis of the corresponding high-frequency electrode 314, facilitating wire bonding between the corresponding first pad 362d and the high-frequency electrode 314 to avoid the corresponding light transmission region 316. Figure 14 In the indicated direction, the axis of the first pad 362 is offset backward from the axis of the high-frequency electrode 314, and the axis of the first pad 362 is located to the left and slightly backward from the axis of the corresponding high-frequency electrode 314, so that the axis of the first pad 362 is offset from the axis of the corresponding high-frequency electrode 314; of course, in some embodiments of this disclosure, the axis of the first pad 362 can also be offset forward from the axis of the high-frequency electrode 314, so that the axis of the first pad 362 is located to the left and slightly forward from the axis of the corresponding high-frequency electrode 314.

[0142] In some embodiments, the bonding wire between the high-frequency electrode 314 and the first pad 362 is offset from the axis of the high-frequency electrode 314 by 45°, which facilitates the bonding wire avoiding the light transmission area 316. The arc height of the bonding wire between the high-frequency electrode 314 and the first pad 362 can be 100μm.

[0143] Figure 16A This is a schematic diagram of the assembly of another light emitting component and a matching resistor component according to some embodiments. Figure 16B for Figure 16A The equivalent circuit diagram. For example... Figure 16A and Figure 16B As shown, in some embodiments, a matching capacitor assembly 370 may be disposed below the lens assembly 400. The light emitting assembly 310 is disposed on one side of the matching resistor assembly 360, and the matching capacitor assembly 370 is disposed on the other side of the matching resistor assembly 360, such that the matching capacitor assembly 370 is located away from the light emitting assembly 310. The matching resistor assembly 360 is electrically connected to the matching capacitor assembly 370, and the matching resistor assembly 360 and the matching capacitor assembly 370 form an RC matching circuit. This facilitates the use of the RC matching circuit to improve the small-signal bandwidth of the light emitting assembly, thereby enhancing the high-speed signal integrity of the link.

[0144] In some embodiments, the matching capacitor assembly 370 may include a second substrate 371, with a third pad 372 formed on the top of the second substrate 371. The matching capacitor assembly 370 may include a matching capacitor 373, with a first end of the matching capacitor 373 electrically connected to the third pad 372. A second pad 364 is wire-connected to the third pad 372. Exemplarily, the matching capacitor assembly 370 is arranged side-by-side on the other side of the matching resistor assembly 360, such that the third pad 372 is located on the side of the second pad 364 and the outer side of the third pad 372 is directly opposite the outer side of the second pad 364, in order to control the wire length between the third pad 372 and the second pad 364.

[0145] In some embodiments, the matching capacitor assembly 370 may include a plurality of matching capacitors 373. The plurality of matching capacitors 373 may form a capacitor array. Exemplarily, the matching capacitor assembly 370 may include four matching capacitors 373 and four third pads 372. The first terminals of the four matching capacitors 373 are electrically connected to the corresponding third pads 372.

[0146] In some embodiments, a metal layer may be disposed on the second substrate 371, and the metal layer is electrically connected to the circuit board 300. The second end of the matching capacitor 373 is electrically connected to the metal layer.

[0147] In some embodiments, a fourth pad may be formed on the top of the second substrate 371. The second end of the matching capacitor 373 is electrically connected to the fourth pad, and the fourth pad is wire-connected to the circuit board 300.

[0148] Figure 17 This is a schematic diagram of the assembly of another light emitting component and a matching resistor component according to some embodiments. Figure 1 .like Figure 17 As shown, in some embodiments, the bottom of the first substrate 361 is connected to the circuit board 300, and the light emitting component 310 is disposed on the top of the first substrate 361, with the light emitting component 310 wire-connected to the first pad 362. Connecting the light emitting component 310 and the circuit board 300 via the first substrate 361 facilitates electrical connection of the light emitting component 310 to the circuit board 300. The light emitting component 310 being disposed on the first substrate 361 helps save area on the circuit board 300 below the lens assembly 400.

[0149] Figure 18 This is a schematic diagram of the assembly of another light emitting component and a matching resistor component according to some embodiments. Figure 2 .like Figure 18 As shown, in some embodiments, the bottom of the first substrate 361 is connected to the circuit board 300, and the light emitting component 310 is disposed on the second pad 364. The light emitting component 310 is wire-connected to the first pad 362. The light emitting component 310 is disposed on the second pad 364, which helps to further save area on the circuit board 300 below the lens assembly 400.

[0150] Figure 19 This is an internal structural diagram of another optical module according to some embodiments. Figure 20 This is an internal structural diagram of another optical module according to some embodiments. Figure 19 and Figure 20 As shown, in some embodiments, the optical module 200 may include a first lens assembly 400a and a second lens assembly 400b. The bottom of the first lens assembly 400a and the second lens assembly 400b is connected to a circuit board 300. An optical chip, including a light emitting component and / or a light receiving component, is disposed below the first lens assembly 400a and the second lens assembly 400b. The first lens assembly 400a and the second lens assembly 400b have a transmission surface and a reflection surface, so that the transmission direction of the emitted light signal and / or the received light signal can be adjusted by the combination of the transmission surface and the reflection surface, enabling the emitted light signal generated by the light emitting component to be output from the optical module and the light signal input to the optical module to be transmitted to the light receiving component. A laser driver chip and / or a TIA, etc., may be disposed below the first lens assembly 400a and the second lens assembly 400b.

[0151] In some embodiments, the second lens assembly 400b is connected to the second optical fiber strip 420, and the optical signal generated by the second optical emitting chip is transmitted to the second optical fiber strip 420 through the second lens assembly 400b; or, the optical signal input through the second optical fiber strip 420 is transmitted to the second lens assembly 400b, and then transmitted to the second optical receiving chip through the second lens assembly 400b.

[0152] In some embodiments, the second fiber optic strip 420 and the first fiber optic strip 410 share a single fiber optic connector. However, in some embodiments, the ends of the second fiber optic strip 420 and the first fiber optic strip 410 may not share a single fiber optic connector; that is, the second fiber optic strip 420 and the first fiber optic strip 410 are each connected to a corresponding fiber optic connector, and the two fiber optic connectors are arranged side-by-side at the optical port of the optical module 200; for example, the two fiber optic connectors are arranged side-by-side vertically at the optical port of the optical module 200.

[0153] In some embodiments, a matching resistor assembly 360 is disposed below both the first lens assembly 400a and the second lens assembly 400b. The matching resistor assembly 360 is wire-connected to the light emitting assembly 310. The structure and arrangement of the matching resistor assembly 360 below the first lens assembly 400a and the second lens assembly 400b can be referred to the structure and arrangement of the matching resistor assembly 360 in the above embodiments.

[0154] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, characterized in that, include: Circuit board; A lens assembly is connected to the circuit board at its bottom; the bottom of the lens assembly and the circuit board form a receiving cavity, and the lens assembly is used to change the transmission direction of the optical signal; An optical emitting component, located within the receiving cavity, is used to generate optical signals; the optical emitting component is electrically connected to the circuit board, and the optical emitting component includes a substrate, a high-frequency electrode and a light-emitting area are disposed on the top of the substrate, the light-emitting area is located to the left of the high-frequency electrode, and the high-frequency electrode is used to input high-frequency signals; A matching resistor assembly is located within the receiving cavity and to the left of the light emitting assembly; wherein: the matching resistor assembly includes: A first substrate has a bottom connection to the circuit board and a top having a first pad and a second pad; the first pad is wire-connected to the high-frequency electrode, the axis of the first pad is offset from the axis of the high-frequency electrode, and the second pad is wire-connected to the circuit board. A matching resistor is disposed on the top of the first substrate; the first end of the matching resistor is electrically connected to the first pad, and the second end of the matching resistor is electrically connected to the second pad.

2. The optical module according to claim 1, characterized in that, It also includes a laser driver chip, which is located on the right side of the light emitting component, and the high-frequency electrode is wire-connected to the laser driver chip; The axis of the first pad deviates to the left and rearward from the axis of the high-frequency electrode, or the axis of the first pad deviates to the left and frontward from the axis of the high-frequency electrode.

3. The optical module according to claim 1, characterized in that, It also includes a matching capacitor assembly located within the receiving cavity; The matching capacitor assembly includes a second substrate and a matching capacitor; a third pad is provided on the top of the second substrate, the third pad is electrically connected to the first end of the matching capacitor, and the third pad is wire-connected to the second pad.

4. The optical module according to claim 1, characterized in that, The light emitting component includes multiple high-frequency electrodes, and the matching resistor component includes multiple matching resistors; The top of the first substrate has a plurality of first pads and a second pad; the first ends of the plurality of matching resistors are electrically connected to the corresponding first pads, and the second ends of the plurality of matching resistors are electrically connected to the second pads.

5. The optical module according to claim 1, characterized in that, The top of the first substrate also has a first locator and a second locator, which are close to the second pad.

6. The optical module according to claim 1, characterized in that, The light emitting component includes a substrate, on the top of which a positive electrode and a negative electrode are formed. The positive electrode is located on one side of the high-frequency electrode, and the negative electrode is located on the other side of the high-frequency electrode.

7. An optical module, characterized in that, include: Circuit board; A lens assembly is connected to the circuit board at its bottom; the bottom of the lens assembly and the circuit board form a receiving cavity, and the lens assembly is used to change the transmission direction of the optical signal; A matching resistor assembly is located within the receiving cavity; wherein: the matching resistor assembly includes: A first substrate has a bottom connection to the circuit board and a top having a first pad and a second pad. A matching resistor is disposed on the top of the first substrate; the first end of the matching resistor is electrically connected to the first pad, and the second end of the matching resistor is electrically connected to the second pad; A light emitting component is located within the receiving cavity and on top of the first substrate; the light emitting component includes a substrate, on the top of which a high-frequency electrode and a light-emitting region are disposed, the light-emitting region being located to the left of the high-frequency electrode, and the axis of the high-frequency electrode being offset from the axis of the first pad; the high-frequency electrode is used to input high-frequency signals and is wire-connected to the first pad.

8. The optical module according to claim 7, characterized in that, It also includes a laser driver chip; the laser driver chip is located within the receiving cavity and is located to the right of the light emitting component; The high-frequency electrode is wire-connected to the laser driver chip; The axis of the first pad is deviated to the left and forward from the axis of the high-frequency electrode.

9. The optical module according to claim 7, characterized in that, The bottom of the light emitting component is connected to the second pad; a first locator and a second locator are also formed on the top of the first substrate, and the first locator and the second locator are close to the edge of the first substrate.

10. An optical module, characterized in that, include: Circuit board; A light-emitting component is mounted on the circuit board; The optical emitting component is used to generate optical signals; The lens assembly is connected to the circuit board at the bottom; The lens assembly is located above the light emitting assembly, and the lens assembly is used to change the transmission direction of the light signal; A matching resistor assembly is located below the lens assembly and to the left of the light emitting assembly; wherein the matching resistor assembly includes: A first substrate has a bottom connection to the circuit board and a top forming a first pad and a second pad; the second pad is wire-connected to the circuit board. A matching resistor is disposed on the top of the first substrate; the first end of the matching resistor is electrically connected to the first pad, and the second end of the matching resistor is electrically connected to the second pad; A laser driver chip is located on the right side of the light emitting component; The light emitting component includes a substrate, on the top of which a high-frequency electrode and a light-emitting region are disposed; the light-emitting region is located to the left of the high-frequency electrode, which is offset from the first pad; the high-frequency electrode is wire-connected to the first pad and wire-connected to the laser driver chip, and the laser driver chip inputs a high-frequency signal to the light emitting component through the high-frequency electrode.

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