Flash module and electronic device

Abstract

The present disclosure is a flash module and an electronic device, and relates to the technical field of electronic devices. The flash module comprises a support, a circuit board, a light-emitting assembly and a heat dissipation assembly; the circuit board is connected with the support; the light-emitting assembly has a first light-emitting module, the first light-emitting module comprises a first light-emitting element and a first lens, the first light-emitting element is electrically connected with the circuit board, and the first lens is opposite to the light-emitting light path of the first light-emitting element; the heat dissipation assembly comprises a first heat dissipation element and a second heat dissipation element, the first heat dissipation element is located on the side of the support away from the circuit board and is connected with the support, the second heat dissipation element is located on the side of the first heat dissipation element away from the support and is connected with the first heat dissipation element, and at least one of the first heat dissipation element and the second heat dissipation element is a metal heat dissipation element. In the present disclosure, the heat dissipation capacity of the heat dissipation assembly is improved, so that the flash module can further improve the illumination intensity.

Description

Technical Field

[0001] This disclosure relates to the field of electronic device technology, and in particular to a flash module and electronic device. Background Technology

[0002] As electronic devices become increasingly feature-rich, users are spending more time using them and the scenarios in which they are used are becoming more diverse. To be suitable for various scenarios, users are also demanding higher light intensity from flash modules.

[0003] In related technologies, the flash module conducts heat to the mid-frame of the electronic device through graphite components. As the light intensity of the flash module increases, the heat generated by the flash module increases. The heat dissipation capacity of the graphite components in the thickness direction is limited, and it is impossible to effectively dissipate heat from the flash module in a timely manner, thus limiting the further improvement of the light intensity of the flash module. Utility Model Content

[0004] This disclosure provides a flash module and an electronic device that can solve the aforementioned technical problems existing in related technologies. The technical solution is as follows:

[0005] In a first aspect, a flash module is provided, the flash module including a support, a circuit board, a light-emitting component and a heat dissipation component;

[0006] The circuit board is connected to the support member;

[0007] The light-emitting component has a first light-emitting module, the first light-emitting module includes a first light-emitting element and a first lens, the first light-emitting element is electrically connected to the circuit board, and the first lens is opposite to the light-emitting light path of the first light-emitting element;

[0008] The heat dissipation assembly includes a first heat dissipation component and a second heat dissipation component. The first heat dissipation component is located on the side of the support component away from the circuit board and is connected to the support component. The second heat dissipation component is located on the side of the first heat dissipation component away from the support component and is connected to the first heat dissipation component. At least one of the first heat dissipation component and the second heat dissipation component is a metal heat dissipation component.

[0009] In some possible implementations, the circuit board has a first mounting position and a second mounting position, which are located on both sides of the first light-emitting element and are used for electrical connection of other electronic components to the circuit board.

[0010] In some possible implementations, the surface of the first lens has Fresnel patterns.

[0011] In some possible implementations, the flash module further includes an adhesive component located between the support and the first heat sink, and bonded to both the support and the first heat sink.

[0012] In some possible implementations, the illumination intensity of the first light-emitting module at the center of the target distance is 25 lx-35 lx, and the uniformity of the four corners of the first light-emitting module is 25%-30%.

[0013] In some possible implementations, the light-emitting component further includes a second light-emitting module, which includes a second light-emitting element and a second lens. The second light-emitting element is electrically connected to the circuit board, and the second lens is opposite to the light-emitting path of the second light-emitting element.

[0014] In some possible implementations, the parameters of the second lens are different from those of the first lens. The range of light emitted by the first light-emitting element radiated by the first lens is a first range, and the range of light emitted by the second light-emitting element radiated by the second lens is a second range, which is larger than the first range.

[0015] In some possible implementations, the illumination intensity of the second light-emitting module at the center of the target distance is 11lx-16lx, and the uniformity of the four corners of the second light-emitting module is 30%-40%.

[0016] In some possible implementations, the light-emitting component further includes a third light-emitting module, which includes a third light-emitting element and a third lens. The third light-emitting element is electrically connected to the circuit board, and the third lens is opposite to the light-emitting path of the third light-emitting element.

[0017] In some possible implementations, the parameters of the third lens are different from those of the first lens. The range of light emitted by the first light-emitting element radiated by the first lens is a first range, and the range of light emitted by the third light-emitting element radiated by the third lens is a third range, which is larger than the first range.

[0018] In some possible implementations, the light-emitting component further includes a third light-emitting module, which includes a third light-emitting element and a third lens. The third light-emitting element is electrically connected to the circuit board, and the third lens is opposite to the light-emitting path of the third light-emitting element.

[0019] The parameters of the third lens, the first lens, and the first lens are all different. The range of light emitted by the first light-emitting element radiated by the first lens is a first range. The range of light emitted by the second light-emitting element radiated by the second lens is a second range. The range of light emitted by the third light-emitting element radiated by the third lens is a third range. The third range is larger than the second range, and the second range is larger than the first range.

[0020] In some possible implementations, the illumination intensity of the third light-emitting module at the center of the target distance is 10lx-20lx, and the uniformity of the four corners of the third light-emitting module is 40%-50%.

[0021] In some possible implementations, the first heat sink is a graphite heat sink, and the second heat sink is a metal heat sink.

[0022] In a second aspect, an electronic device is provided, the electronic device comprising a mid-frame and a flash module as described in any one of the first aspects;

[0023] The middle frame is connected to the first heat sink and the second heat sink, respectively.

[0024] The beneficial effects of the technical solution provided in this disclosure include at least the following:

[0025] In this application, the heat dissipation component includes a first heat sink and a second heat sink. On the one hand, it increases the heat transfer path of the flash module, that is, the heat is transferred to the middle frame through the first heat sink and to the second heat sink and then to the middle frame. On the other hand, the metal heat sink in the heat dissipation component has excellent thermal conductivity in the thickness direction, which avoids heat accumulation at the stacked light-emitting components and heat dissipation components. In this way, the heat dissipation capacity of the heat dissipation component is improved, so that the flash module can further improve the light intensity.

[0026] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is an exploded view of a flash module provided in an embodiment of this disclosure;

[0029] Figure 2 This is a schematic diagram of the structure of a flash module provided in an embodiment of this disclosure;

[0030] Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this disclosure;

[0031] Figure 4 This is a temperature distribution simulation diagram of a flash module provided in an embodiment of this disclosure.

[0032] Figure label:

[0033] 1. Support components;

[0034] 2. Circuit board; 2a. First mounting position; 2b. Second mounting position;

[0035] 3. Light-emitting components;

[0036] 3a. First light-emitting module; 31. First light-emitting element; 32. First lens;

[0037] 3b. Second light-emitting module; 33. Second light-emitting element; 34. Second lens;

[0038] 3c, Third light-emitting module; 35, Third light-emitting element; 36, Third lens;

[0039] 4. Heat dissipation components; 41. First heat sink; 42. Second heat sink;

[0040] 5. Adhesive parts;

[0041] 100. Mid-frame; 100a. Heat dissipation layer; 101. Camera module; 102. Light sensor; 103. Infrared sensor.

[0042] The accompanying drawings have illustrated specific embodiments of this disclosure, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this disclosure to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0044] The following explains the terminology that may appear in the embodiments of this disclosure.

[0045] Printed Circuit Board (PCB): A substrate used for mechanical support and electrical connection of electronic components. Conductive lines are formed on an insulating substrate through processes such as printing and etching. It is made of rigid insulating materials (e.g., epoxy resin, aluminum substrate, ceramic substrate, etc.).

[0046] Flexible printed circuit (FPC): A bendable circuit board made of flexible insulating substrate. High-precision conductive paths are formed on the thin film substrate through special processes to achieve reliable connection of electronic components in dynamic environments.

[0047] Illuminance: The maximum illuminance (unit: lux, symbol: lx) in the central area of ​​the light spot at a certain test distance.

[0048] Flash corner uniformity: The ratio of illuminance at the four corners to illuminance at the center within the flash's illumination range, usually expressed as a percentage (%), is used to measure whether the light field distribution is uniform.

[0049] Camera corner uniformity: The degree of consistency in brightness, color, or sharpness between the central area and the four corner areas of an image is one of the important indicators for measuring the imaging quality of a lens and sensor.

[0050] As electronic devices become increasingly feature-rich, users are spending more time using them and the scenarios in which they are used are becoming more diverse. To be suitable for various scenarios, users are also demanding higher light intensity from flash modules. For example, when there is a power outage, users use a continuously lit flash module as a temporary light source, or when walking in a location without streetlights, users use a continuously lit flash module as a flashlight.

[0051] In related technologies, the flash module conducts heat to the mid-frame of the electronic device through graphite components. As the light intensity of the flash module increases, the heat generated by the flash module increases. The heat dissipation capacity of the graphite components in the thickness direction is limited, and it is impossible to effectively dissipate heat from the flash module in a timely manner, thus limiting the further improvement of the light intensity of the flash module.

[0052] To address the aforementioned problems, this disclosure provides a flash module, referring to... Figure 1 As shown, the flash module includes a support 1, a circuit board 2, a light-emitting component 3, and a heat dissipation component 4.

[0053] This disclosure does not limit the specific structure and material of the circuit board 2, and can be matched and set according to parameters such as the wiring design of the circuit board 2, the installation space, and the ease of assembly process. For example, the circuit board 2 can be a printed circuit board (PCB), a flexible printed circuit board (FPC), or a hybrid structure of a PCB and a FPC.

[0054] Circuit board 2 is connected to support member 1. The support member 1 enhances the structural strength of circuit board 2, preventing it from being stretched, deformed, or broken when the electronic device is subjected to drops, impacts, or shaking, thus improving the working stability of the flash module.

[0055] The light-emitting component 3 has a first light-emitting module 3a, which includes a first light-emitting element 31 and a first lens 32. The first light-emitting element 31 is electrically connected to the circuit board 2, and the first lens 32 is opposite to the light-emitting path of the first light-emitting element 31. The light emitted by the first light-emitting element 31 passes through the first lens 32 and illuminates the external environment of the electronic device at a certain illumination angle.

[0056] The heat dissipation assembly 4 includes a first heat dissipation component 41 and a second heat dissipation component 42. The first heat dissipation component 41 is located on the side of the support component 1 away from the circuit board 2 and is connected to the support component 1. The second heat dissipation component 42 is located on the side of the first heat dissipation component 41 away from the support component 1 and is connected to the first heat dissipation component 41. At least one of the first heat dissipation component 41 and the second heat dissipation component 42 is metal.

[0057] On the one hand, both the first heat sink 41 and the second heat sink 42 can be connected to or in contact with the middle frame 100 of the electronic device to increase the heat transfer path of the flash module. That is, heat can be transferred to the middle frame 100 through the first heat sink 41, and heat can also be transferred to the second heat sink 42 and then to the middle frame 100 through the first heat sink 41.

[0058] On the other hand, the metal heat sink in the heat dissipation component 4 has excellent thermal conductivity in the thickness direction, which can absorb the heat generated by the light-emitting component 3 in a timely manner and transfer the heat layer by layer to the middle frame 100, and then to the surrounding air of the electronic device, thus avoiding heat accumulation in the light-emitting component 3 and the heat dissipation component 4.

[0059] Thus, referring to Figure 4 As shown, the heat dissipation capacity of the heat dissipation component 4 is improved through the above two measures, and the temperature of each position of the flash module is effectively controlled. The temperature of the first light-emitting element 31 area is the highest, and the highest temperature does not exceed 130°C. This allows the light-emitting elements inside the flash module (e.g., the first light-emitting element 31) to further improve the light intensity, so as to meet the user's demand for improving the maximum light intensity of the flash module.

[0060] In some embodiments, the support 1 is a metal element. On the one hand, the metal element has high structural strength and can provide effective support for the circuit board 2. On the other hand, the metal element has strong heat dissipation capacity in the thickness direction and can transfer the heat from the light-emitting component 3 and the circuit board 2 to the heat dissipation component 4 in the thickness direction in a timely manner.

[0061] In some embodiments, the first heat sink 41 is a graphite heat sink, and the second heat sink 42 is a metal heat sink.

[0062] The graphite heat sink can receive heat from the support member 1 and distribute the heat evenly in the length and width directions. At the same time, since the first heat sink 41 is connected to or in contact with the middle frame 100, the heat can be further transferred to the middle frame 100.

[0063] In the stacking thickness direction of the flash module, the metal heat sink can receive heat from the graphite heat sink. At the same time, since the second heat sink 42 is connected to or in contact with the middle frame 100, the heat can be further transferred to the middle frame 100.

[0064] In some embodiments, the surface of the first lens 32 has a Fresnel pattern. On the one hand, by replacing the continuous curved surface with a serrated Fresnel pattern, the thickness of the first lens 32 can be effectively reduced, and the geometric size of the flash module can be reduced, which is conducive to the pursuit of lightweight and miniaturized design of electronic devices. On the other hand, the Fresnel pattern can also improve the edge illuminance of the first light-emitting module 3a and improve the light uniformity of the first light-emitting module 3a, which is conducive to users obtaining a more uniform lighting effect of the flash module brightness.

[0065] In some embodiments, the illumination intensity of the first light-emitting module 3a at the center of the target distance is 25lx-35lx, and the uniformity of the four corners of the first light-emitting module 3a is 25%-30%. The target distance can be matched and set according to the design requirements and expected effects of the first light-emitting module 3a, for example, 50cm, 1m or 2m.

[0066] Through the design of the above parameters, the first light-emitting module 3a can be used as a high-brightness module in the flash module. That is, the first light-emitting module 3a is suitable for use by users in dark scenes (e.g., rooms without power or sidewalks without streetlights at night) to achieve higher brightness lighting.

[0067] In some embodiments, refer to Figure 1 As shown, the circuit board 2 has a first mounting position 2a and a second mounting position 2b, which are located on both sides of the first light-emitting element 31 and are used for electrical connection between other electronic components and the circuit board 2.

[0068] In this way, other electronic components can share the circuit board 2 with the first light-emitting component 31. On the one hand, this reduces the number of circuit boards inside the electronic device and simplifies the assembly process of the electronic device. On the other hand, it reduces the physical space occupied by each component inside the electronic device, which is conducive to the pursuit of a thinner and lighter design for the electronic device.

[0069] This disclosure does not specifically limit the types of electronic components installed at the first mounting position 2a and the second mounting position 2b, but allows for matching and setting based on parameters such as the function and cost of the electronic equipment. (See reference...) Figure 1 As shown, for example, the electronic component can be a light sensor 102 that detects light intensity, which can help adjust the brightness parameters of the screen components of the electronic device by collecting the light intensity of the corresponding area; another example is that the electronic component can also be an infrared sensor 103 that emits infrared light, which can realize the remote control function of the electronic device; yet another example is that the electronic component can also be a ToF sensor (Time-of-Flight sensor), which can measure the distance between the object and the mobile phone by emitting infrared light and calculating the time it takes for the light to reflect back, so as to realize background blur (such as portrait mode) and fast focusing of the camera module 101.

[0070] This disclosure does not specifically limit the distance between the first mounting position 2a and the first light-emitting element 31, or the distance between the second mounting position 2b and the first light-emitting element 31. The distance can be matched and set according to parameters such as the electromagnetic interference requirements of the components and the assembly safety distance.

[0071] It is understandable that, in order to reduce the signal interference of the first light-emitting element 31 to the electronic components located at the first mounting position 2a and the second mounting position 2b, shielding measures such as shielding covers can be set around the electronic components.

[0072] In some embodiments, refer to Figure 2 As shown, the light-emitting component 3 also has a second light-emitting module 3b, which includes a second light-emitting element 33 and a second lens 34. The second light-emitting element 33 is electrically connected to the circuit board 2, and the second lens 34 is opposite to the light-emitting path of the second light-emitting element 33. The second light-emitting module 3b shares the circuit board 2, the support member 1, and the heat dissipation component 4 with the first light-emitting module 3a.

[0073] This disclosure does not limit the relative position and distance between the second light-emitting module 3b and the first light-emitting module 3a, and can be matched and set according to the size of the flash module and the usage scenario.

[0074] In some embodiments, the parameters of the second lens 34 are different from those of the first lens 32. The range of light emitted by the first light-emitting element 31 radiated by the first lens 32 is a first range, and the range of light emitted by the second light-emitting element 33 radiated by the second lens 34 is a second range, which is larger than the first range.

[0075] In this way, compared with the first light-emitting module 3a, the second light-emitting module 3b has a larger illumination range. By appropriately selecting the illumination range of the second light-emitting module 3b, the second light-emitting module 3b can be used in scenarios that require a certain illumination range, such as taking pictures and recording videos.

[0076] In some embodiments, the illumination intensity of the second light-emitting module 3b at the center of the target distance is 11lx-16lx, and the uniformity of the four corners of the second light-emitting module 3b is 30%-40%.

[0077] Through the design of the above parameters, the second light-emitting module 3b can balance the central illumination intensity and the uniformity of the four corners, and is adapted to the field of view and the uniformity of the four corners of the camera module 101. Therefore, the second light-emitting module 3b can be used as the shooting module in the flash module, that is, the second light-emitting module 3b is suitable for use by users in photography or video recording scenarios.

[0078] In some embodiments, the light-emitting component 3 further includes a third light-emitting module 3c, which includes a third light-emitting element 35 and a third lens 36. The third light-emitting element 35 is electrically connected to the circuit board 2, and the third lens 36 is opposite to the light-emitting path of the third light-emitting element 35. The third light-emitting module 3c shares the circuit board 2, the support member 1, and the heat dissipation component 4 with the first light-emitting module 3a.

[0079] This disclosure does not limit the relative position and distance between the third light-emitting module 3c and the first light-emitting module 3a, and can be matched and set according to the size of the flash module and the usage scenario.

[0080] In some embodiments, the parameters of the third lens 36 are different from those of the first lens 32. The range of light emitted by the first light-emitting element 31 radiated by the first lens 32 is a first range, and the range of light emitted by the third light-emitting element 35 radiated by the third lens 36 is a third range, which is larger than the first range.

[0081] Thus, compared to the first light-emitting module 3a, the third light-emitting module 3c has a larger illumination range. By appropriately selecting the illumination range of the third light-emitting module 3c, it can be made suitable for application scenarios that require a larger illumination range.

[0082] In some embodiments, the illumination intensity of the third light-emitting module 3c at the center of the target distance is 10lx-20lx, and the uniformity of the four corners of the third light-emitting module 3c is 40%-50%.

[0083] With the design of the above parameters, the third light-emitting module 3c has a large four-corner uniformity parameter. Therefore, the third light-emitting module 3c can be used as a wide-angle module in the flash module, which is suitable for scenarios where users need to illuminate a larger area.

[0084] In some embodiments, the light-emitting component 3 further includes a third light-emitting module 3c, which includes a third light-emitting element 35 and a third lens 36. The third light-emitting element 35 is electrically connected to the circuit board 2, and the third lens 36 is opposite to the light-emitting path of the third light-emitting element 35.

[0085] Among them, the parameters of the third lens 36, the parameters of the first lens 32 and the parameters of the first lens 32 are all different. The range of light emitted by the first light-emitting element 31 radiated by the first lens 32 is the first range. The range of light emitted by the second light-emitting element 33 radiated by the second lens 34 is the second range. The range of light emitted by the third light-emitting element 35 radiated by the third lens 36 is the third range. The third range is larger than the second range, and the second range is larger than the first range.

[0086] In this way, by appropriately setting the illumination range of the first light-emitting module 3a, the second light-emitting module 3b, and the third light-emitting module 3c, the flash module can illuminate different light-emitting modules for different usage scenarios, thereby improving the versatility of the flash module's usage scenarios.

[0087] Users can turn on different light-emitting modules according to the needs of different environments. This way, the performance of a single light-emitting module is not sacrificed, while also meeting the user's needs for flash modules of electronic devices in complex scenarios.

[0088] In some embodiments, the surfaces of the second lens 34 and the third lens 36 are provided with Fresnel patterns. On the one hand, by replacing the continuous curved surface with a serrated Fresnel pattern, the thickness of the second lens 34 and the third lens 36 can be effectively reduced, thereby reducing the geometric dimensions of the flash module and facilitating the pursuit of lightweight and miniaturized design in electronic devices. On the other hand, the Fresnel pattern can also improve the edge illumination of the second light-emitting module 3b and the third light-emitting module 3c, and enhance the light uniformity of the second light-emitting module 3b and the third light-emitting module 3c, which is beneficial for users to obtain a more uniform lighting effect when using the flash module.

[0089] In some embodiments, the first light-emitting module 3a, the second light-emitting module 3b, and the third light-emitting module 3c of the light-emitting component 3 are distributed in a straight line, with the first light-emitting module 3a located at the edge. Thus, since the first light-emitting module 3a has a larger current parameter and correspondingly larger heat generation, placing the first light-emitting module 3a at the edge effectively reduces the impact of the heat generated by the first light-emitting module 3a on the second light-emitting module 3b and the third light-emitting module 3c.

[0090] In some other embodiments, the first light-emitting module 3a, the second light-emitting module 3b, and the third light-emitting module 3c of the light-emitting component 3 are distributed along a triangular structure.

[0091] In some embodiments, the flash module further includes an adhesive component 5, which is located between the support component 1 and the first heat sink 41, and is bonded to both the support component 1 and the first heat sink 41. Firstly, avoiding the use of metal fasteners to connect the support component 1 and the first heat sink 41 helps reduce the weight of the flash module. Secondly, the adhesive component 5 can distribute the load across the entire bonding surface, preventing stress concentration at the connection holes or weld seams. Thirdly, the adhesive component 5 maintains the surface integrity of the support component 1 and the first heat sink 41, and its simple processing technology helps reduce the manufacturing cost of the flash module.

[0092] Based on the same concept, this disclosure also provides an electronic device, referring to... Figure 3 As shown, the electronic device may include a mid-frame 100 and a flash module as described in any of the above embodiments, wherein the mid-frame 100 is connected to the first heat sink 41 and the second heat sink 42 respectively.

[0093] Taking the first heat sink 41 as a graphite heat sink and the second heat sink 42 as a metal heat sink as an example, the following explanation is provided:

[0094] On the one hand, both the first heat sink 41 and the second heat sink 42 are connected to the middle frame 100 to increase the heat transfer path of the flash module, that is, the heat is transferred to the middle frame 100 through the first heat sink 41 and then to the middle frame 100 through the first heat sink 41 and the second heat sink 42.

[0095] On the other hand, the second heat sink 42 has excellent thermal conductivity in the thickness direction, which can absorb the heat from the first heat sink 41 in a timely manner and transfer the heat to the surrounding air of the electronic device through the middle frame 100, thus preventing heat from accumulating on the stacked light-emitting components 3 and circuit boards 2.

[0096] In this way, the heat dissipation capacity of the heat dissipation component 4 is improved through the above two measures, and the temperature of each part of the flash module is effectively controlled, so that the light-emitting elements inside the flash module (e.g., the first light-emitting element 31) can further improve the light intensity to meet the user's demand for increasing the maximum light intensity of the flash module.

[0097] The light-emitting component 3 includes a first light-emitting module 3a, a second light-emitting module 3b, and a third light-emitting module 3c. Users can turn on different light-emitting modules according to the needs of different environments. In this way, the performance of a single light-emitting module is not sacrificed, and the needs of users to use the flash module of electronic devices in complex scenarios are also met.

[0098] In some embodiments, refer to Figure 4As shown, the middle frame 100 has a heat dissipation layer 100a, with a first heat sink 41 connected to the heat dissipation layer 100a, and / or a second heat sink 42 connected to the heat dissipation layer 100a. Since the heat dissipation layer 100a serves to dissipate heat for the entire electronic device, its area is relatively large. Through the first heat sink 41 and / or the second heat sink 42 and the heat dissipation layer 100a, a heat transfer path is achieved between the heat dissipation component 4 in the flash module and the heat dissipation layer 100a. Thus, the heat dissipation component 4 in the flash module is not an isolated heat dissipation element; the heat generated by the light-emitting component 3 can be transferred to the heat dissipation layer 100a through the heat dissipation component 4, and the heat generated by other components of the electronic device can also be transferred to the heat dissipation component 4 through the heat dissipation layer 100a, improving the overall heat dissipation area and heat dissipation capacity of the electronic device.

[0099] The electronic devices involved in this disclosure may also be referred to as terminals, mobile terminals, terminal devices, user equipment (UE), etc. For example, a terminal device may be a smartphone, tablet computer, laptop computer, wearable device (e.g., smartwatch), or it may be a digital camera, SLR camera / mirrorless camera, gimbal camera, action camera, drone, or other professional shooting equipment. It should be understood that this disclosure does not specifically limit the specific technology or device form used in the terminal device. In the description of the above embodiments, a mobile phone is used as an example, but this disclosure is not limited thereto.

[0100] In the description of this specification, the references to "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" refer to specific features, structures, materials, or characteristics described in connection with the described embodiment or example, which are included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0101] It is understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. The singular forms "a," "the," and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0102] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.

[0103] It is further understood that the terms “center,” “longitudinal,” “lateral,” “front,” “rear,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation.

[0104] It is further understood that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral molding; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the two components; they can refer to a direct connection between two components without the presence of other components, or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0105] It is further understood that although operations are described in a specific order in the accompanying drawings in the embodiments of this disclosure, this should not be construed as requiring these operations to be performed in the specific order or serial order shown, or requiring all of the shown operations to be performed to obtain the desired result. In certain environments, multitasking and parallel processing may be advantageous.

[0106] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the solutions disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the scope of the claims.

[0107] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A flash module, characterized by The flash module includes a support (1), a circuit board (2), a light-emitting component (3), and a heat dissipation component (4); The circuit board (2) is connected to the support member (1); The light-emitting component (3) has a first light-emitting module (3a), the first light-emitting module (3a) includes a first light-emitting element (31) and a first lens (32), the first light-emitting element (31) is electrically connected to the circuit board (2), and the first lens (32) is opposite to the light-emitting light path of the first light-emitting element (31); The heat dissipation assembly (4) includes a first heat dissipation component (41) and a second heat dissipation component (42). The first heat dissipation component (41) is located on the side of the support component (1) away from the circuit board (2) and is connected to the support component (1). The second heat dissipation component (42) is located on the side of the first heat dissipation component (41) away from the support component (1) and is connected to the first heat dissipation component (41). At least one of the first heat dissipation component (41) and the second heat dissipation component (42) is a metal heat dissipation component.

2. The flash module according to claim 1, characterized in that, The circuit board (2) has a first mounting position (2a) and a second mounting position (2b), which are located on both sides of the first light-emitting element (31) and are used for other electronic components to be electrically connected to the circuit board (2).

3. The flash module according to claim 1, characterized in that, The surface of the first lens (32) has Fresnel patterns.

4. The flash module according to claim 1, characterized in that, The flash module also includes an adhesive component (5), which is located between the support component (1) and the first heat sink component (41) and is bonded to the support component (1) and the first heat sink component (41) respectively.

5. The flash module according to claim 1, characterized in that, The illumination intensity of the first light-emitting module (3a) at the center of the target distance is 25lx-35lx, and the uniformity of the four corners of the first light-emitting module (3a) is 25%-30%.

6. The flash module according to claim 1, characterized in that, The light-emitting component (3) also has a second light-emitting module (3b), which includes a second light-emitting element (33) and a second lens (34). The second light-emitting element (33) is electrically connected to the circuit board (2), and the second lens (34) is opposite to the light-emitting path of the second light-emitting element (33).

7. The flash module according to claim 6, characterized in that, The parameters of the second lens (34) are different from those of the first lens (32). The range of light emitted by the first light-emitting element (31) radiated by the first lens (32) is a first range, and the range of light emitted by the second light-emitting element (33) radiated by the second lens (34) is a second range. The second range is larger than the first range.

8. The flash module according to claim 6, characterized in that, The illumination intensity of the second light-emitting module (3b) at the center of the target distance is 11lx-16lx, and the uniformity of the four corners of the second light-emitting module (3b) is 30%-40%.

9. The flash module according to claim 1, characterized in that, The light-emitting component (3) also has a third light-emitting module (3c), which includes a third light-emitting element (35) and a third lens (36). The third light-emitting element (35) is electrically connected to the circuit board (2), and the third lens (36) is opposite to the light-emitting path of the third light-emitting element (35).

10. The flash module according to claim 9, characterized in that, The parameters of the third lens (36) are different from those of the first lens (32). The range of light emitted by the first light-emitting element (31) radiated by the first lens (32) is a first range, and the range of light emitted by the third light-emitting element (35) radiated by the third lens (36) is a third range. The third range is larger than the first range.

11. The flash module according to claim 6, characterized in that, The light-emitting component (3) also has a third light-emitting module (3c), which includes a third light-emitting element (35) and a third lens (36). The third light-emitting element (35) is electrically connected to the circuit board (2), and the third lens (36) is opposite to the light-emitting path of the third light-emitting element (35). Among them, the parameters of the third lens (36), the parameters of the first lens (32) and the parameters of the first lens (32) are all different. The range of light emitted by the first light-emitting element (31) radiated by the first lens (32) is the first range. The range of light emitted by the second light-emitting element (33) radiated by the second lens (34) is the second range. The range of light emitted by the third light-emitting element (35) radiated by the third lens (36) is the third range. The third range is larger than the second range. The second range is larger than the first range.

12. The flash module according to any one of claims 9-11, characterized in that, The illumination intensity of the third light-emitting module (3c) at the center of the target distance is 10lx-20lx, and the uniformity of the four corners of the third light-emitting module (3c) is 40%-50%.

13. The flash module according to claim 1, characterized in that, The first heat sink (41) is a graphite heat sink, and the second heat sink (42) is a metal heat sink.

14. An electronic device, comprising: The electronic device includes a mid-frame (100) and a flash module as described in any one of claims 1-13; The middle frame (100) is connected to the first heat sink (41) and the second heat sink (42) respectively.

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