Electronic device
Patent Information
- Application Number
- CN202522017177.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-18
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2035-09-18
AI Technical Summary
在通电的情况下，电拆解胶带组件与壳体分离，但是，仍然与电池连接在一起，因此，如何使得电拆解胶带组件与电池容易分离是需要解决的技术问题
[0015]对于所述电子设备，由于所述粘接层与被粘对象(第一被粘对象或者第二被粘对象)的剥离力越小，粘接面积越大，这样，剥离力越小，被粘对象与导电基材更容易分离，此外，剥离力较小，也使得粘接层更容易从被粘对象脱落，不容易损坏被粘对象，特别是被粘对象(第一被粘对象)为电池时，不容易损坏电池，有利于实现复用电池。粘接面积越大，确保被粘对象与导电基材固定可靠，比如，优化电池固定的可靠性。
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Figure CN224745826U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electrolytic adhesive technology, and more particularly to electronic devices. Background Technology
[0002] The electronic device includes a battery, an electrolytic disassembly tape assembly, and a housing. The electrolytic disassembly tape assembly is connected to the housing via electrolytic adhesive and to the battery via glue. When powered on, the electrolytic disassembly tape assembly separates from the housing but remains connected to the battery. Therefore, how to easily separate the electrolytic disassembly tape assembly from the battery is a technical problem that needs to be solved. Utility Model Content
[0003] The purpose of this application is to disclose an electronic device.
[0004] In a first aspect, this application discloses an electronic device. The electronic device includes an object to be bonded, an electrolytic adhesive, a conductive substrate, and an adhesive layer; the electrolytic adhesive is disposed on the conductive substrate opposite to the adhesive layer; the peel force F between the adhesive layer and the object to be bonded is given by the adhesive layer and the bonding area s between the adhesive layer and the object to be bonded, wherein the smaller F is, the larger s is.
[0005] In some implementations, 1 ≤ F ≤ 20, in Newtons per 25 mm width; the surface of the object to be bonded includes a first surface bonded to the adhesive layer; the area of the first surface is S, and s / S ≥ 60%.
[0006] In some embodiments, the surface of the object to be bonded includes a first surface and a second surface both bonded to the adhesive layer, the second surface being connected to the first surface and inclined relative to the first surface.
[0007] In some embodiments, the surface of the object to be bonded further includes a third surface bonded to the adhesive layer, the third surface being connected to the second surface and opposite to the first surface; the conductive substrate is wrapped around the third surface.
[0008] In some embodiments, the adhesive layer includes an adhesive-free zone disposed on the conductive substrate.
[0009] In some embodiments, the peel force F between the adhesive layer and the bonded object is 2 ≤ F ≤ 3, in Newtons per 25 mm width.
[0010] In some embodiments, the adhesive layer includes an adhesive layer body with adhesive properties and a cover layer, the cover layer covering the adhesive layer body at intervals.
[0011] In some embodiments, the adhesive layer is an adhesive layer that is removed from the bonded object in response to external forces.
[0012] In some implementations, the external action includes alcohol action, UV action, thermal stripping action, or wire stripping action.
[0013] In some embodiments, the stripping lines for line stripping are disposed on the adhesive layer and are wavy.
[0014] In some embodiments, the conductive substrate includes aluminum foil, copper foil, a conductive layer coated on the surface of PET, or an electroplated conductive layer; and / or, the object to be adhered is a battery.
[0015] For the aforementioned electronic device, the smaller the peel force between the adhesive layer and the adhered object (first or second adhered object), the larger the adhesive area. This results in lower peel force, making it easier for the adhered object to separate from the conductive substrate. Furthermore, lower peel force also makes it easier for the adhesive layer to detach from the adhered object, reducing the risk of damage. This is particularly beneficial when the adhered object (first adhered object) is a battery, as it is less likely to damage the battery and facilitates battery reuse. A larger adhesive area ensures reliable fixation between the adhered object and the conductive substrate, for example, optimizing the reliability of battery fixation. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of an electronic device in related technologies, showing the bonding of a first object to be bonded, a second object to be bonded, a conductive substrate, an electrolytic adhesive, and a conventional adhesive into a whole.
[0017] Figure 2 This is a schematic diagram of an electronic device, including a first object to be bonded, a conductive substrate, and an electrolytic adhesive, as a whole, in a separated state from a second object to be bonded.
[0018] Figure 3 This is a first schematic diagram of an electronic device of the present application, in which a conductive substrate, an adhesive layer, an electrolytic adhesive and a first object to be bonded together are bonded as a whole, with the conductive substrate in an unfolded state.
[0019] Figure 4 It is along Figure 3 A cross-sectional view along line AA;
[0020] Figure 5 This is a second schematic diagram showing the conductive substrate, adhesive layer, electrolytic adhesive and first bonded object of the electronic device of this application bonded as a whole;
[0021] Figure 6 This is a third schematic diagram showing the conductive substrate, adhesive layer, electrolytic adhesive and first bonded object of the electronic device of this application bonded as a whole;
[0022] Figure 7 This is a fourth schematic diagram showing the conductive substrate, adhesive layer, electrolytic adhesive and first bonded object of the electronic device of this application bonded as a whole;
[0023] Figure 8 This is a schematic diagram of the first type of adhesive, conductive substrate and electrolytic adhesive combined into one piece;
[0024] Figure 9 This is a schematic diagram of the second type of adhesive, conductive substrate and electrolytic adhesive combined into one piece;
[0025] Figure 10 This is a schematic diagram of the third type of adhesive, conductive substrate and electrolytic adhesive combined into one piece in this application;
[0026] Figure 11 This is a schematic diagram of the fourth type of adhesive, conductive substrate and electrolytic adhesive combined into one piece in this application;
[0027] Figure 12 yes Figure 11 The diagram shown illustrates the connection point in the adhesive.
[0028] Figure 13 This is a schematic diagram of an adhesive layer according to this application. Detailed Implementation
[0029] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.
[0030] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.
[0031] See Figure 1 and Figure 2 In related technologies, an electronic device includes adhered objects (a first adhered object 1 and a second adhered object 8), electrolytic adhesive 2, a conductive substrate 3, and conventional adhesive 9. The electrolytic adhesive 2, conductive substrate 3, and conventional adhesive 9 can constitute an electrodisassembly tape assembly. The first adhered object 1 is, for example, a battery, including a surface 11 and a cell 12 wrapped by the surface 11. The surface 11 is, for example, an aluminum-plastic film. Figure 1 The diagram illustrates that the conductive substrate 3 is connected to the first object to be bonded 1 via conventional adhesive 9, while the electrolytic adhesive 2 is directly bonded to the second object to be bonded 8. (See also...) Figure 2A voltage is applied to the electrolytic adhesive 2, and the first bonded object 1, the electrolytic adhesive 2, and the conductive substrate 3 are separated from the second bonded object 8 as a whole. Subsequently, it is also necessary to separate the conductive substrate 3 from the first bonded object 1, but separating the conductive substrate 3 from the first bonded object 1 is not easy.
[0032] To solve the above problem, see Figures 3 to 7 The electronic device disclosed in this application differs from related technologies in that: the conventional adhesive 9 is replaced with a lower-tack adhesive layer 4. The methods for reducing adhesion include: a) changing the formulation of the conventional adhesive 9; b) using less conventional adhesive between the conductive substrate 3 and the bonded object. While replacing the conventional adhesive 9 with the lower-tack adhesive layer 4, the adhesive layer 4 is also enlarged (increasing the bonding area inevitably increases the size of the conductive substrate 3). The conductive substrate 3 is intentionally expanded, and the area between the dotted and solid lines is designated as the bonding area 20. Because the reduced adhesion may make it difficult to fix the bonded object, this is compensated for by increasing the bonding area. More specifically, the electrolytic adhesive 2 is disposed on the conductive substrate 3 opposite to the adhesive layer 4. The peel force F between the adhesive layer 4 and the bonded object is denoted by s; the smaller F is, the larger s is. Although Figures 3 to 7 The illustration shows adhesive layer 4 bonded to the first adhered object 1. However, in other embodiments, electrolytic adhesive 2 can also be bonded to the second adhered object 8 via a conductive substrate and adhesive layer 4. In some embodiments, 1 ≤ F ≤ 20, where the unit is Newtons / 25 mm width; the surface 11 of the adhered object 1 includes a first surface 111 bonded to the adhesive layer 4; the area of the first surface 111 is S, and s / S ≥ 60%, thereby achieving a smaller peel force F and a larger bonding area s. The unit F in Newtons / 25 mm width represents the average force required per unit width when peeling a 25 mm wide tape or adhesive sample from a test plate. Those skilled in the art will understand that different widths of tape or adhesive samples will yield different values, which are equivalent to 1 ≤ F ≤ 20. For the conductive substrate described in the embodiments of this application, the conductive substrate 3 includes aluminum foil, copper foil, PET with a conductive layer coated on its surface, or an electroplated conductive layer. In some related technologies, when electronic devices use conventional adhesives, the bonding area s between the conductive substrate 3 and the bonded object (such as the first bonded object) and the area S of the first surface 111 satisfy, for example, s / S = 40%.
[0033] As described above, the smaller the peel force F between the adhesive layer 4 and the adhered object (first adhered object 1 or second adhered object 8), the larger the adhesive area s. Thus, a smaller peel force makes it easier for the adhered object to separate from the conductive substrate 3. Furthermore, a smaller peel force also makes it easier for the adhesive layer 4 to detach from the adhered object, reducing the risk of damage. This is especially beneficial when the adhered object (first adhered object 1) is a battery, as it is less likely to damage the battery, facilitating battery reuse. A larger adhesive area s ensures reliable fixation between the adhered object and the conductive substrate 3, for example, optimizing the reliability of battery fixation.
[0034] See Figure 4 and Figure 5 and Figure 6 Compare, Figure 6 In this process, adhesive layer 4 is bonded only to the first surface 111 of the object being bonded 1. At this point, 100% > s / S ≥ 60%. Figure 4 and Figure 5 In this process, the surface of the object to be bonded includes a first surface 111 and a second surface 112, both of which are bonded to the adhesive layer 4, meaning that s / S > 100%. The second surface 112 is connected to the first surface 111 and is inclined relative to the first surface 111. The angle of inclination is not limited; for example, as shown... Figure 4 and Figure 5 As shown, the second surface 112 is tilted at 90 degrees. The tilting structure relative to the first surface 111 is not limited. For example, it can be tilted by rounding corners or by tilting directly.
[0035] As described above, the adhesive layer 4 is bonded not only to the first surface 111 but also to the second surface 112. This results in a smaller peel force F between the adhesive layer 4 and the adhered object, a larger bonding area s, and easier separation of the conductive substrate 3 from the adhered object. Furthermore, because the adhesive layer 4 is also bonded to the second surface 112, the conductive substrate 3 inevitably has a larger area. Firstly, the conductive substrate 3 covers more of the adhered object, enhancing its fixation. Secondly, when separating the conductive substrate 3 from the adhered object, the portions of the adhesive layer 4 and the conductive substrate 3 extending beyond the first surface 111 act as handles, allowing the conductive substrate 3 and the adhesive layer 4 as a whole to be directly separated from the adhered object (e.g., a battery), eliminating the need for the additional operation of using suction cups to pull the adhered object out, as is currently required in the industry. Thirdly, the larger area covered by the conductive substrate 3 and the adhesive layer 4 can disperse stress during drops, preventing localized tearing of the adhered object's surface (e.g., aluminum-plastic film).
[0036] See Figure 4The surface 11 of the object to be bonded also includes a third surface 113 bonded to the adhesive layer 4. The third surface 113 is connected to the second surface 112 and is opposite to the first surface 111. The conductive substrate 3 is wrapped around the third surface 113.
[0037] As described above, the conductive substrate 3 and adhesive layer 4 have a larger bonding area with the object being bonded. Firstly, this provides a stronger fixation effect on the object being bonded. Secondly, the portions of adhesive layer 4 and conductive substrate 3 that extend beyond the first surface 111 and the second surface 112 act as handles, making it easier to separate the conductive substrate 3 and adhesive layer 4 as a whole directly from the object being bonded (such as a battery). Thirdly, the conductive substrate 3 and adhesive layer 4 cover a larger portion of the object being bonded, which can better disperse the stress during a drop and prevent localized pulling on the surface of the object being bonded (such as aluminum-plastic film).
[0038] See Figure 7 The adhesive layer 4 includes a glue-removing area disposed on the conductive substrate 3. The glue-removing area can be formed by a glue-removing process, which involves printing ink on the adhesive surface (here, the conductive substrate 3) and leaving adhesive dots. The structure of the adhesive dots is not limited and can be circular, rectangular, or regular polygonal, etc. Glue removal reduces adhesion. One embodiment is as follows: a conductive layer 62 is disposed on one side of the substrate body 61, so that the conductive substrate 3 includes at least the substrate body 61 and the conductive layer 62. The conductive layer 62 is provided with the electrolytic adhesive, and the glue-removing area is formed on the opposite side of the substrate body 61 opposite to the electrolytic adhesive. Thus, by including the glue-removing area in the adhesive layer 4, an easy-tear adhesive is formed, facilitating the separation of the adhered object (e.g., a battery) from the conductive substrate 3.
[0039] In some embodiments, the peel force F between the adhesive layer and the bonded object is 2 ≤ F ≤ 3, in Newtons per 25 mm width. This embodiment is not limited to the peel force when the conductive substrate 3 includes the adhesive-free zone.
[0040] Since 2≤F≤3, the conductive substrate 3 is further separated from the object being bonded.
[0041] See Figure 13 The adhesive layer 4 includes an adhesive layer body 41 and a cover layer 42, the cover layer 42 covering the adhesive layer body 41 at intervals. The adhesive layer body 41 can be considered as a layer composed of conventional glue. The cover layer 42 can be constructed in any form, for example, by coating with ink, in which case the cover layer 42 covers part of the glue. Figure 13 This is merely to illustrate that the cover layer 42 can reduce adhesion; however, how the cover layer 42 specifically covers the adhesive layer body 41 is not limited, for example, except... Figure 13In addition to the state shown, the cover layer 42 can also be in the form of a grid. In short, the cover layer 42 can reduce the area of the adhesive on the adhesive layer body 41.
[0042] As described above, a cover layer 42 is provided on the adhesive layer body 41, which has adhesive properties. The adhesiveness of the adhesive layer 4 is adjusted by the coverage area of the cover layer 42, thereby facilitating the adjustment of the adhesiveness of the adhesive layer 4.
[0043] See Figures 8 to 12 The adhesive layer 4 is an adhesive layer that is removed from the bonded object in response to external forces. In other words, under external forces, the adhesive layer 4 can be easily separated from the bonded object. Therefore, not only is it easy to separate the conductive substrate 3, the electrolytic adhesive 2 and the adhesive layer 4 from the bonded object, but also, under external forces, the bonded object is less likely to have adhesive layer 4 residue (such as residual adhesive).
[0044] See Figures 8 to 11 The external action includes the action of alcohol. Thus, after the conductive adhesive 2, conductive substrate 3 and adhesive layer 4 are separated from one of the adhered objects (such as the second adhered object 8), the conductive adhesive 2, conductive substrate 3 and adhesive layer 4 are soaked in alcohol. Under the action of alcohol, the adhesive layer 4 can be easily separated from the other adhered object (the first adhered object 1 in the figure). That is, the entire conductive adhesive 2, conductive substrate 3 and adhesive layer 4 can be easily separated from the other adhered object.
[0045] See Figure 9 The external effects include UV radiation. After the conductive adhesive 2, conductive substrate 3, and adhesive layer 4 separate from one of the adhered objects (e.g., the second adhered object 8), the entire assembly of the conductive adhesive 2, conductive substrate 3, and adhesive layer 4 is irradiated with UV light. Under UV irradiation, the adhesive layer 4 easily separates from the other adhered object (the first adhered object 1 in the figure), meaning the entire assembly of the conductive adhesive 2, conductive substrate 3, and adhesive layer 4 is easily separated from the other adhered object.
[0046] See Figure 10 The external action includes thermal peeling. After the conductive adhesive 2, conductive substrate 3, and adhesive layer 4 separate from one of the adhered objects (e.g., the second adhered object 8), the entire assembly of the conductive adhesive 2, conductive substrate 3, and adhesive layer 4 is heated (e.g., at a low temperature). Under heating, the adhesive layer 4 easily separates from the other adhered object (the first adhered object 1 in the figure), meaning the entire assembly of the conductive adhesive 2, conductive substrate 3, and adhesive layer 4 is easily separated from the other adhered object.
[0047] See Figure 11The external action includes a peeling action. In this way, after the conductive adhesive 2, conductive substrate 3 and adhesive layer 4 are separated from one of the adhered objects (such as the second adhered object 8), the peeling line 43 is pulled, and the adhesive layer 4 can be easily separated from the other adhered object (the first adhered object 1 in the figure). That is, the entire conductive adhesive 2, conductive substrate 3 and adhesive layer 4 can be easily separated from the other adhered object.
[0048] See Figure 12 The peel line 43 is provided on the adhesive layer and is wavy.
[0049] As described above, since the peel line 43 is wavy, the wavy area is large, making it easier to separate the adhesive layer 4 from the bonded object (such as a battery).
[0050] It should be noted that the technical solutions or features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.
Claims
1. An electronic device, comprising: The electronic device includes an object to be bonded, an electrolytic adhesive, a conductive substrate, and an adhesive layer; the electrolytic adhesive is disposed on the conductive substrate opposite to the adhesive layer; the peel force F between the adhesive layer and the object to be bonded is denoted as F, and the bonding area between the adhesive layer and the object to be bonded is s, where the smaller F is, the larger s is.
2. The electronic device of claim 1, wherein, 1≤F≤20, in Newtons / 25 mm width; the surface of the object to be bonded includes a first surface bonded to the adhesive layer; the area of the first surface is S, s / S≥60%.
3. The electronic device according to claim 1, characterized in that, The surface of the object to be bonded includes a first surface and a second surface, both of which are bonded to the adhesive layer. The second surface is connected to the first surface and is inclined relative to the first surface.
4. The electronic device of claim 3, wherein, The surface of the object to be bonded also includes a third surface bonded to the adhesive layer, the third surface being connected to the second surface and opposite to the first surface; the conductive substrate is wrapped around the third surface.
5. The electronic device according to claim 1, characterized in that, The adhesive layer includes an adhesive-free zone disposed on the conductive substrate; And / or, the peel force F between the adhesive layer and the bonded object, 2≤F≤3, in Newtons / 25 mm width.
6. The electronic device of claim 1, wherein, The adhesive layer includes an adhesive layer body with adhesive properties and a cover layer, wherein the cover layer covers the adhesive layer body at intervals.
7. The electronic device of claim 1, wherein, The adhesive layer is an adhesive layer that is removed from the bonded object in response to external forces.
8. The electronic device according to claim 7, characterized in that, The external effects include alcohol exposure, UV exposure, thermal stripping, or wire stripping.
9. The electronic device according to claim 8, characterized in that, The stripping lines for line stripping are provided on the adhesive layer and are wavy.
10. The electronic device of claim 1, wherein, The conductive substrate includes aluminum foil, copper foil, PET with a conductive layer coated on the surface or an electroplated conductive layer; and / or, the object to be adhered is a battery.