Charging device

Abstract

This utility model discloses a charging device, relating to the field of charging equipment technology. The charging device includes a housing, a charging module, a plug assembly, and a cooling fan. The housing has a cavity and an air inlet and an air outlet communicating with the cavity. The charging module is disposed in the cavity, and the plug assembly is disposed on the housing and electrically connected to the charging module. The charging module includes a first circuit board and a circuit module disposed on the first circuit board. The first circuit board has a first side and a second side opposite to each other along its thickness direction. A first air duct is defined between the first side and the inner wall of the housing, and a second air duct is defined between the second side and the inner wall of the housing. At least a portion of the circuit module is disposed within the second air duct. The air inlet, the first air duct, the second air duct, and the air outlet are sequentially connected to form a cooling air duct. The cooling fan is disposed within the cooling air duct to guide airflow along the cooling air duct. The charging device provided by this utility model has the advantage of good heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of charging equipment technology, and in particular to a charging device. Background Technology

[0002] With the development of smart devices such as mobile phones and laptops, the power requirements of charging devices for various smart devices are constantly increasing. Charging devices generate a lot of heat when operating at high power. If the heat cannot be dissipated in time, it will not only reduce charging efficiency, but also accelerate the aging of components, shorten the service life of the charging device, and even pose safety hazards. Utility Model Content

[0003] The main purpose of this invention is to propose a charging device that aims to solve the problem of limited heat dissipation efficiency of existing charging devices.

[0004] To achieve the above objectives, the charging device proposed in this utility model includes: The housing has a receiving cavity and an air inlet and an air outlet communicating with the receiving cavity; A charging module is disposed in the accommodating cavity. The charging module includes a first circuit board and a circuit module disposed on the first circuit board. The first circuit board has a first side and a second side opposite to each other along its thickness direction. A first air duct is defined between the first side and the inner wall of the housing, and a second air duct is defined between the second side and the inner wall of the housing. At least a portion of the circuit module is disposed in the second air duct. The air inlet, the first air duct, the second air duct, and the air outlet are sequentially connected to form a heat dissipation air duct. A pin assembly is disposed on the housing and electrically connected to the charging module; A cooling fan is installed inside the cooling duct to guide airflow along the cooling duct.

[0005] In one embodiment, at least a portion of the circuit module and the inner wall of the housing define a guide air duct, the guide air duct connecting the first air duct and the second air duct.

[0006] In one embodiment, the circuit module includes a second circuit board electrically connected to the first circuit board, the thickness direction of the second circuit board intersecting the thickness direction of the first circuit board, the second circuit board and the inner wall of the housing enclose the airflow duct, and electronic components are provided on the second circuit board.

[0007] In one embodiment, the circuit module further includes a third circuit board electrically connected to the first circuit board. The thickness direction of the third circuit board intersects the thickness direction of the first circuit board. The third circuit board and the second circuit board are spaced apart. A connector is provided on the third circuit board. A power component electrically connected to the first circuit board is provided between the third circuit board and the second circuit board.

[0008] In one embodiment, the circuit module includes a fourth circuit board, the thickness direction of which intersects the thickness direction of the first circuit board, and the second circuit board, the fourth circuit board, and the third circuit board are arranged at intervals in sequence, with at least a portion of the power components disposed on the fourth circuit board.

[0009] In one embodiment, the thickness directions of the second circuit board, the fourth circuit board, and the third circuit board are all perpendicular to the thickness direction of the first circuit board. And / or, the second circuit board, the fourth circuit board, and the third circuit board are arranged sequentially at intervals along the extension direction of the second air duct.

[0010] In one embodiment, the power component includes a capacitor, an inductor, and a transformer, with the capacitor and the inductor disposed on the first circuit board and the transformer disposed on the fourth circuit board.

[0011] In one embodiment, the second circuit board, the fourth circuit board, and the third circuit board are arranged parallel to each other and spaced apart in sequence along the extension direction of the second air duct. The capacitor and the inductor are located between the second circuit board and the fourth circuit board, and the transformer is located on the side of the fourth circuit board facing the third circuit board.

[0012] In one embodiment, the distance between the second circuit board and the fourth circuit board is D1, wherein D1 satisfies: 55mm≤D1≤65mm; And / or, the distance between the fourth circuit board and the third circuit board is D2, wherein D2 satisfies: 20mm≤D2≤30mm; And / or, the distance between the side of the second circuit board away from the first circuit board and the inner wall of the housing is D3, wherein D3 satisfies: 3.5mm≤D3≤4mm; And / or, the distance between the side of the fourth circuit board away from the first circuit board and the inner wall of the housing is D4, wherein D4 satisfies: 2.5mm≤D4≤3mm; And / or, within the airflow duct, the distance between the sidewall of the second circuit board and the inner wall of the housing is D5, wherein D5 satisfies: 5.5mm≤D5≤6.5mm.

[0013] In one embodiment, the first circuit board and the housing together define at least one air passage, the air passage connecting the first air duct and the second air duct; Alternatively, the first circuit board may have at least one ventilation hole extending through it along its thickness direction, the ventilation hole connecting the first air duct and the second air duct.

[0014] In one embodiment, the air passage is an elongated hole that extends along the height direction of the first circuit board; And / or, the width of the air passage is w, where w satisfies: 3.4mm ≤ w ≤ 3.6mm; And / or, the height of the air passage is h, where h satisfies: 28mm ≤ h ≤ 30mm.

[0015] In one embodiment, along the thickness direction of the first circuit board, the housing has opposing first and second sidewalls; The first sidewall is provided with the air inlet, the second sidewall is provided with the air outlet, the circuit module includes a transformer disposed between the air outlet and the first circuit board, a cover is connected between the first sidewall and the second sidewall, and the pin assembly is disposed on the cover; And / or, the distance between the first side of the first circuit board and the first sidewall is D6, wherein D6 satisfies: 6mm≤D6≤8mm; And / or, the distance between the second side of the first circuit board and the second sidewall is D7, wherein D7 satisfies: 32mm≤D7≤34mm.

[0016] In one embodiment, the length of the cooling fan is 'a', where 'a' satisfies: 29.7mm ≤ a ≤ 30.3mm; And / or, the width value of the cooling fan is b, wherein b satisfies: 29.7mm≤b≤30.3mm; And / or, the thickness of the cooling fan is c, where c satisfies: 2.9mm ≤ c ≤ 3.5mm.

[0017] In one embodiment, the air inlet and the air outlet are located on opposite sides of the first circuit board along its thickness direction; And / or, the air inlet and the air outlet are arranged opposite each other along the thickness direction of the first circuit board.

[0018] In one embodiment, the first circuit board extends along the length of the housing, which has opposing third and fourth sidewalls along its length, the third sidewalls defining the airflow duct with at least a portion of the circuit module.

[0019] In one embodiment, along the length of the housing, the distances between the air inlet and the air outlet and the third sidewall are both greater than the distances between them and the fourth sidewall.

[0020] In one embodiment, a sealing ring is also included. The cooling fan is disposed in the first air duct and located at the air inlet. The sealing ring is disposed between the cooling fan and the inner wall of the accommodating cavity and surrounds the air inlet. And / or, the cooling fan has an inlet channel and an outlet channel that are interconnected. The inlet channel is arranged along the thickness direction of the first circuit board and communicates with the air inlet to guide airflow to a first side of the first circuit board. The outlet channel extends along the first air duct.

[0021] In one embodiment, the cooling fan is disposed within the first air duct, and the circuit module includes a transformer disposed within the second air duct; The air inlet and the first side are arranged opposite each other, and the air outlet and the second side are arranged opposite each other. The air inlet, the cooling fan, the transformer, and the air outlet are arranged sequentially along the thickness direction of the first circuit board. And / or, the transformer is further provided with heat sinks, at least a portion of which are located within the second air duct; And / or, at least one of an insulating plate and a metal heat-conducting plate is provided between the first side of the first circuit board and the cooling fan.

[0022] The charging device proposed in this utility model includes a housing, a charging module, a plug assembly, and a cooling fan. The housing has a receiving cavity and an air inlet and an air outlet communicating with the receiving cavity. The charging module is disposed in the receiving cavity. The plug assembly is disposed on the housing and electrically connected to the charging module. The charging module includes a first circuit board and a circuit module disposed on the first circuit board. The first circuit board has a first side and a second side opposite to each other along its thickness direction. A first air channel is defined between the first side and the inner wall of the housing, and a second air channel is defined between the second side and the inner wall of the housing. At least a portion of the circuit module is disposed in the second air channel. The air inlet, the first air channel, the second air channel, and the air outlet are sequentially connected to form a cooling air channel. The cooling fan is disposed in the cooling air channel to guide airflow along the cooling air channel. After entering the heat dissipation duct through the air inlet, external air flows through the first and second air ducts in sequence. The airflow can cover both sides of the first circuit board and the circuit module respectively, effectively increasing the heat dissipation area and improving the heat exchange efficiency. This solves the problem of unreasonable heat dissipation space arrangement and insufficient airflow to each heat-generating component in existing high-power charging devices, improves the overall heat dissipation effect of the charging device, ensures that the charging device can stably maintain high power output, extends the service life of components, and reduces safety hazards. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the structure of an embodiment of the charging device provided by this utility model; Figure 2 A schematic diagram showing the disassembled structure of an embodiment of the charging device provided by this utility model; Figure 3 A schematic diagram of the internal structure of an embodiment of the charging device provided by this utility model; Figure 4 A schematic diagram showing the internal structural dimensions of an embodiment of the charging device provided by this utility model; Figure 5 An exploded view of an embodiment of the charging device provided by this utility model; Figure 6 A schematic diagram of the structure of a charging module in one embodiment of the charging device provided by this utility model; Figure 7 A schematic diagram of the cooling fan in one embodiment of the charging device provided by this utility model.

[0025] Explanation of icon numbers: 100. Charging device; 1. Shell; 1a. Receiving cavity; 1b. Air inlet; 1c. Air outlet; 1d. Insertion hole; 11. Shell body; 111. First side wall; 112. Second side wall; 113. Third side wall; 114. Fourth side wall; 12. Cover; 13. Support; 2. Charging module; 21. First circuit board; 211. First side panel; 211a. First air duct; 211b. Air vent; 212. Second side panel; 212a. Second air duct; 22. Circuit module; 22a. Airflow duct; 221. Second circuit board; 222. Third circuit board; 2221. Connector; 223. Power component; 2231. Capacitor; 2232. Inductor; 2233. Transformer; 2234. Heat sink; 224. Fourth circuit board; 3. Pin assembly; 4. Cooling fan; 41. Intake channel; 42. Exhaust channel; 43. Sealing ring; 5. Insulating board; 6. Metal heat-conducting plate.

[0026] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0028] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0029] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0030] This utility model proposes a charging device 100.

[0031] Please see Figures 1 to 3In one embodiment of this utility model, the charging device 100 includes a housing 1, a charging module 2, a plug assembly 3, and a cooling fan 4. The housing 1 has a receiving cavity 1a and an air inlet 1b and an air outlet 1c communicating with the receiving cavity 1a. The charging module 2 is disposed in the receiving cavity 1a. The plug assembly 3 is disposed on the housing 1 and electrically connected to the charging module 2. The charging module 2 includes a first circuit board 21 and a circuit module 22 disposed on the first circuit board 21. The first circuit board 21 has a first side surface 211 and a second side surface 212 opposite to each other along its thickness direction. The first side surface 211 and the inner wall of the housing 1 define a first air duct 211a. The second side surface 212 and the inner wall of the housing 1 define a second air duct 212a. At least a portion of the circuit module 22 is disposed in the second air duct 212a. The air inlet 1b, the first air duct 211a, the second air duct 212a, and the air outlet 1c are sequentially connected to form a cooling air duct. The cooling fan 4 is disposed in the cooling air duct and is used to guide air to flow along the cooling air duct.

[0032] It should be noted that, in this embodiment, the housing 1 has various shapes and structures, for example, such as Figure 1 As shown, the overall shape of the housing 1 is a cuboid. The air inlet 1b and the air outlet 1c can be located on two opposite side walls of the housing 1, two adjacent side walls of the housing 1, or the same side wall of the housing 1, as long as they can connect to the heat dissipation channel for heat dissipation. No further restrictions are imposed here. In some other possible embodiments, the shape of the housing 1 can be set as a triangular prism, pentagonal prism, sphere, ellipsoid, or other irregular shape, and the air inlet 1b and the air outlet 1c can be correspondingly located on the outer wall of the housing 1. No specific limitations are imposed here.

[0033] Furthermore, in this embodiment, the housing 1 is formed by connecting a main body 11 and a cover 12. The main body 11 has multiple walls that collectively define a groove with an opening. The charging module is disposed within this groove. The cover 12 is placed over the opening of the groove and connected to the main body 11 to form a receiving cavity 1a. The plug assembly 3 can be disposed on either the cover 12 or the main body 11. The cover 12 and the main body 11 can be connected by snap-fit, screw connection, ultrasonic welding, etc., without specific limitations. This design simplifies the structure of the housing 1, facilitates the assembly of components such as the charging module 2 and the cooling fan 4 inside the charging device 100, and improves production efficiency. In some other embodiments, the housing 1 can also be formed by a hollow cylinder and two cover plates to enclose the receiving cavity 1a. Its structural forms are diverse and will not be described in detail here.

[0034] Please refer to Figure 3 The thickness direction of the first circuit board 21 is... Figure 3In the X direction marked in the figure, the first side 211 of the first circuit board 21 and the inner wall of the housing 1 are spaced apart and form a first air duct 211a. The second side 212 of the first circuit board 21 and the inner wall of the housing 1 are spaced apart and form a second air duct 212a. The first air duct 211a and the second air duct 212a are located on both sides of the first circuit board 21 in the X direction. There are various conduction structures between the first air duct 211a and the second air duct 212a. For example, holes can be opened on the first circuit board 21 to connect the first air duct 211a and the second air duct 212a, or holes can be formed between the side of the first circuit board 21 and the inner wall of the housing 1 to connect the first air duct 211a and the second air duct 212a, or a separate air guide channel connecting the first air duct 211a and the second air duct 212a can be provided on the housing 1. The specific structure and position of the air guide channel are not specifically limited here, as long as the first air duct 211a and the second air duct 212a can be connected.

[0035] Furthermore, the cooling fan 4 can be located in different positions within the housing 1. For example, the cooling fan 4 can be located in the first air duct 211a, or in the second air duct 212a, or partially located in the first air duct 211a and partially located in the second air duct 212a. As long as the cooling fan 4 can guide the airflow from the air inlet 1b into the first air duct 211a and then through the second air duct 212a before being discharged from the air outlet 1c, the type, specific structure, and air outlet orientation of the cooling fan 4 can be adapted and set according to actual needs.

[0036] It should be noted that the plug assembly 3 of the charging device 100 includes metal plugs disposed on the outer wall of the housing 1. These metal plugs are used to connect to the socket. The circuit module 22 typically includes necessary electronic components such as capacitors, inductors, transformers, and power chips to realize the charging function. Most of these electronic components generate heat during operation. By placing at least a portion of the circuit module 22 within the second air duct 212a, airflow can directly pass over the surface of these heat-generating components, effectively removing heat. Simultaneously, the first air duct 211a, located on the other side of the first circuit board 21, can also dissipate heat from the first circuit board 21 itself and the components disposed on the first side 211, improving overall heat dissipation uniformity. The circuit module 22 can be completely or partially disposed within the second air duct 212a; its specific structure is not limited here.

[0037] Furthermore, in order to realize the charging function, the charging device 100 can also be equipped with a charging cable that is electrically connected to the charging module 2, or a charging interface for the charging cable to be plugged in, such as a USB-A interface, a USB-C interface, a TYPE-C interface or a combination of multiple interfaces, to adapt to the charging needs of different electronic devices, thereby realizing the output of power to meet the charging needs of different devices. The output form of the charging device 100 is not specifically limited here.

[0038] Understandably, when the charging device 100 is in operation, driven by the cooling fan 4, external air enters the accommodating cavity 1a from the air inlet 1b, flows through the first air duct 211a and the second air duct 212a in sequence, and finally exits the accommodating cavity 1a from the air outlet 1c, so as to dissipate the heat in the accommodating cavity 1a to the outside. During this process, the airflow can cover both sides of the first circuit board 21 and the heat-generating power devices included in the circuit module 22, effectively increasing the heat dissipation area and improving the heat exchange efficiency. This solves the problem of unreasonable heat dissipation space arrangement and insufficient airflow to the heat-generating components in the existing high-power charging device 100, improves the overall heat dissipation effect of the charging device 100, ensures that the charging device 100 can stably maintain high power output, extends the service life of components, and reduces safety hazards.

[0039] In one implementation, such as Figure 3 As shown, at least a portion of the circuit module 22 and the inner wall of the housing 1 define a guiding air duct 22a, which connects the first air duct 211a and the second air duct 212a. It should be noted that in this embodiment, the specific form of the circuit module 22 is not limited. The circuit module 22 can be an independent electronic component disposed on the second side 212 of the first circuit board 21, or it can be a circuit board disposed on the second side 212, or it can be a combination of a circuit board and an electronic component, etc. Therefore, the guiding air duct 22a can be defined between the electronic component and the inner wall of the housing 1, between the circuit board and the inner wall of the housing 1, or between a combination of the circuit board and the electronic component and the inner wall of the housing 1. Various methods are possible, and no specific limitation is made here.

[0040] Furthermore, the airflow duct 22a can extend perpendicular to the thickness direction of the first circuit board 21, or it can be inclined to the thickness direction of the first circuit board 21, or it can be bent and extended; no specific limitation is made here. Since the airflow duct 22a is jointly formed by the circuit module 22 and the inner wall of the housing 1, the airflow enters the airflow duct 22a after passing through the first airflow duct 211a, and can directly dissipate heat from the circuit module 22 located at the airflow duct 22a, and finally enters the second airflow duct 212a. This arrangement can extend the length of the entire heat dissipation airflow duct, increase the contact time between the airflow and the circuit module 22, improve the fullness of heat exchange, and further enhance the heat dissipation effect. Moreover, by using the structure of the circuit module 22 itself to form the airflow path, there is no need to set up an additional independent airflow structure in the housing 1, which can simplify the internal structural design of the housing 1, make full use of the limited space in the accommodating cavity 1a, and ensure the heat dissipation effect without increasing the overall volume of the charging device 100, thus meeting the miniaturization design requirements of the charging device 100.

[0041] In one implementation, such as Figure 3 and Figure 6 As shown, the circuit module 22 includes a second circuit board 221 electrically connected to the first circuit board 21. The thickness direction of the second circuit board 221 intersects the thickness direction of the first circuit board 21. The second circuit board 221 and the inner wall of the housing 1 form a guide air duct 22a. Electronic components are disposed on the second circuit board 221. It should be noted that in this embodiment, the second circuit board 221 is soldered to the first circuit board 21, and the thickness direction of the first circuit board 21 is... Figure 3 The X direction is in the middle, while the thickness direction of the second circuit board 221 is in the middle. Figure 3 The Y direction, X direction and Y direction can be set to be perpendicular or intersecting at other angles. There is no limitation here, as long as the second circuit board 221 can be electrically connected to the first circuit board 21 and form a guide air duct 22a.

[0042] The second circuit board 221 can accommodate electronic components on both opposite sides in the Y direction. For example, a chip can be placed on the side of the second circuit board 221 facing the airflow duct 22a. When airflow passes through the airflow duct 22a, it can carry away the heat generated by the chip. Other electronic components can also be placed on the side of the second circuit board 221 away from the airflow duct, which will not be elaborated further here. This arrangement makes full use of the internal space within the accommodating cavity 1a. Placing the second circuit board 221 on the first circuit board 21 for electronic component mounting reduces the layout pressure on the first circuit board 21, thereby reducing its size and further miniaturizing the overall volume of the charging device 100, which is more conducive to the miniaturization design of the charging device 100. Furthermore, by using the second circuit board 221 in conjunction with the inner wall of the housing 1 to enclose the airflow duct 22a, no additional airflow structure is needed, thus avoiding the occupation of unnecessary internal space and balancing integrated layout and heat dissipation requirements.

[0043] In one implementation, such as Figure 2 , Figure 3 and Figure 5 As shown, the circuit module 22 also includes a third circuit board 222 electrically connected to the first circuit board 21. The thickness direction of the third circuit board 222 intersects the thickness direction of the first circuit board 21. The third circuit board 222 and the second circuit board 221 are spaced apart. A connector 2221 is provided on the third circuit board 222. A power component 223 electrically connected to the first circuit board 21 is provided between the third circuit board 222 and the second circuit board 221. In this embodiment, the third circuit board 222 is soldered to the first circuit board 21. The thickness directions of both the second circuit board 221 and the third circuit board 222 are... Figure 3 In the Y direction, the thickness direction of the first circuit board 21 is... Figure 3 The third circuit board 222 and the second circuit board 221 are spaced apart along the Y direction. The third circuit board 222 is provided with a connector 2221 on the side away from the second circuit board 221. The housing 1 is provided with a socket 1d that communicates with the accommodating cavity 1a. The connector 2221 is located at the socket 1d. The plug of the external charging cable can be inserted and connected to the connector 2221 through the socket 1d.

[0044] Furthermore, a bracket 13 is provided between the third circuit board 222 and the inner wall of the housing 1. The connector 2221 passes through the bracket 13 and is positioned towards the socket 1d. The bracket 13 can support the connector 2221, improving the stability of the connection with the external charging cable. The connector 2221 can be a TYPE-C socket, a USB socket, etc., and its quantity can be one, two, three, or more, without specific limitations. In some possible embodiments, the thickness directions of the second circuit board 221 and the third circuit board 222 can be parallel or intersecting. The thickness direction of the third circuit board 222 is perpendicular to the thickness direction of the first circuit board 21 or forms an angle with it, without specific limitations. The connector 2221 can also be located on the side of the third circuit board 222 closer to the second circuit board 221, as long as the connector 2221 can extend towards the inner wall of the housing 1 and a corresponding socket is provided on the housing 1. The installation position of the connector 2221 can be adapted according to requirements.

[0045] In one implementation, such as Figures 3 to 6 As shown, the circuit module 22 includes a fourth circuit board 224, the thickness direction of which intersects the thickness direction of the first circuit board 21. The second circuit board 221, the fourth circuit board 224, and the third circuit board 222 are arranged sequentially at intervals. At least some power components 223 are disposed on the fourth circuit board 224. In this embodiment, please refer to... Figure 3 The fourth circuit board 224 is soldered to the first circuit board 21. The thickness direction of the second circuit board 221, the third circuit board 222, and the fourth circuit board 224 are all... Figure 3 In the Y direction, the thickness direction of the first circuit board 21 is... Figure 3 The second circuit board 221, the fourth circuit board 224, and the third circuit board 222 are arranged sequentially and spaced apart along the Y direction. This allows for the full utilization of the spaced-out area to arrange different types of electronic components. At least a portion of the power component 223 is placed on the fourth circuit board 224, which disperses the electronic components. This reduces the area occupied by a single circuit board and disperses the heat-generating power component 223, preventing heat concentration and further improving the uniformity and efficiency of heat dissipation. This achieves high power configuration while meeting the design requirements of miniaturization.

[0046] Furthermore, in the fourth circuit board 224, the second circuit board 221, and the third circuit board 222, the thickness directions of any two circuit boards can be arranged parallel or intersecting, without specific limitations. The power components 223 include, but are not limited to, inductors, capacitors, transformers, etc. These components can all be disposed on the fourth circuit board 224 and can be selectively distributed on both sides of the thickness direction of the fourth circuit board 224; or they can be partially disposed on the first circuit board 21 and located between the fourth circuit board 224 and the second circuit board 221, or between the fourth circuit board 224 and the third circuit board 222. Their distribution position can be adapted according to requirements, without limitations.

[0047] In one implementation, such as Figure 3 and Figure 6 As shown, the thickness directions of the second circuit board 221, the fourth circuit board 224, and the third circuit board 222 are perpendicular to the thickness direction of the first circuit board 21. It can be understood that the thickness directions of the second circuit board 221, the fourth circuit board 224, and the third circuit board 222 are all along the Y direction, while the thickness direction of the first circuit board 21 is the X direction, which is perpendicular to the Y direction. This arrangement, in conjunction with the first circuit board 21, divides the internal space of the accommodating cavity 1a into different areas, maximizing the utilization of the cavity 1a's space. This allows for layered arrangement of electronic components without increasing the area occupied by the first circuit board 21, and ensures that components on each circuit board are exposed to airflow, preventing component stacking from obstructing the airflow. This further improves space utilization and ensures effective heat dissipation.

[0048] In one implementation, such as Figure 3 and Figure 6 As shown, the second circuit board 221, the fourth circuit board 224, and the third circuit board 222 are arranged alternately along the extension direction of the second air duct 212a. It can be understood that because the second circuit board 221, the fourth circuit board 224, and the third circuit board 222 are arranged alternately along the extension direction of the second air duct 212a, when the airflow flows within the second air duct 212a, it can sequentially flow over the components on the surfaces of the second circuit board 221, the fourth circuit board 224, and the third circuit board 222, ensuring that heat-generating components on each circuit board are covered by the airflow. This further improves the heat dissipation efficiency of the entire heat dissipation air duct, allowing all heat-generating components to be maintained within a reasonable operating temperature range.

[0049] In one embodiment, in conjunction with reference Figure 3The thickness direction of the second circuit board 221, the fourth circuit board 224, and the third circuit board 222 is all along the Y direction, while the thickness direction of the first circuit board 21 is the X direction, which is perpendicular to the Y direction. The second air duct 212a also extends along the Y direction. The second circuit board 221, the fourth circuit board 224, and the third circuit board 222 are arranged alternately along the Y direction. This arrangement can improve space utilization while ensuring heat dissipation. The specific effect is as described in the above embodiment, and will not be elaborated further here.

[0050] In one implementation, such as Figure 5 and Figure 6 As shown, the power component 223 includes a capacitor 2231, an inductor 2232, and a transformer 2233. The capacitor 2231 and inductor 2232 are disposed on the first circuit board 21, and the transformer 2233 is disposed on the fourth circuit board 224. It should be noted that, in this embodiment, the capacitor 2231 and inductor 2232 on the first circuit board 21 can be located between the second circuit board 221 and the fourth circuit board 224, or between the third circuit board 222 and the fourth circuit board 224, or they can be disposed on opposite sides of the fourth circuit board 224 in the Y direction. The transformer 2233 can also be disposed on either side of the fourth circuit board 224 in the Y direction, as long as it is ensured that there is no interference between the components. The specific positions of the components of the power component 223 are not limited.

[0051] In one implementation, such as Figure 6 As shown, the second circuit board 221, the fourth circuit board 224, and the third circuit board 222 are parallel to each other and are arranged in sequence at intervals along the extension direction of the second air duct 212a. The capacitor 2231 and the inductor 2232 are located between the second circuit board 221 and the fourth circuit board 224, and the transformer 2233 is located on the side of the fourth circuit board 224 facing the third circuit board 222. It is understandable that capacitor 2231 and inductor 2232 are located between the second circuit board 221 and the fourth circuit board 224, and are arranged along the Z direction. Transformer 2233 is located on the side of the fourth circuit board 224 facing the third circuit board 222. When airflow flows from the first air duct 211a into the second air duct 212a, it will pass through the second circuit board 221, the space between capacitor 2231 and inductor 2232, the fourth circuit board 224, the transformer 2233 and the third circuit board 222 in sequence. When the airflow passes through each heat-generating component, it will directly carry away the heat generated by the corresponding component, achieving full coverage heat dissipation for all core heat-generating components, avoiding local heat accumulation. At the same time, the arrangement of each component is compact and perfectly fits the internal space layout of the miniaturized charging device 100.

[0052] In one implementation, such as Figure 3 and Figure 4As shown, the distance between the second circuit board 221 and the fourth circuit board 224 is D1, where D1 satisfies: 55mm ≤ D1 ≤ 65mm. In this embodiment, the distance D1 between the second circuit board 221 and the fourth circuit board 224 can be 55mm, 57mm, 59mm, 60mm, 63mm, or 65mm, or any value within the aforementioned range, to accommodate the mounting space of the inductor 2232 and the capacitor 2231.

[0053] In one implementation, such as Figure 3 and Figure 4 As shown, the distance between the fourth circuit board 224 and the third circuit board 222 is D2, which satisfies: 20mm ≤ D2 ≤ 30mm. In this embodiment, the distance D2 between the fourth circuit board 224 and the third circuit board 222 can be 20mm, 22mm, 24.98mm, 25mm, 28mm or 30mm, or any value within the aforementioned range, to adapt to the installation space of the transformer 2233.

[0054] In one implementation, such as Figure 3 and Figure 4 As shown, the distance between the side of the second circuit board 221 away from the first circuit board 21 and the inner wall of the housing 1 is D3, where D3 satisfies: 3.5mm ≤ D3 ≤ 4mm. In this embodiment, D3 can be 3.5mm, 3.6mm, 3.7mm, 3.8mm, 3.9mm, or 4mm, or any value within the aforementioned range. This setting ensures that the airflow duct 22a has sufficient length, preventing the duct from being too short and affecting heat dissipation, while also preventing the distance between the second circuit board 221 and the inner wall of the housing 1 from being too small, resulting in insufficient air intake, thus further balancing heat dissipation and space utilization.

[0055] In one implementation, such as Figure 3 and Figure 4 As shown, the distance between the side of the fourth circuit board 224 away from the first circuit board 21 and the inner wall of the housing 1 is D4, where D4 satisfies: 2.5mm ≤ D4 ≤ 3mm. In this embodiment, D4 can be 2.5mm, 2.6mm, 2.7mm, 2.8mm, 2.9mm, or 3mm, or any value within the aforementioned range. This spacing design ensures that the length of the fourth circuit board 224 in the X direction is adapted to the installation of the transformer 2233, and allows the airflow in the second air duct 212a to pass through the gap between the fourth circuit board 224 and the inner wall of the housing 1 and blow towards the transformer 2233, thereby improving the heat dissipation effect while reducing the overall size of the charging device 100.

[0056] In one implementation, such as Figure 3 and Figure 4As shown, within the airflow duct 22a, the distance between the sidewall of the second circuit board 221 and the inner wall of the housing 1 is D5, where D5 satisfies: 5.5mm ≤ D5 ≤ 6.5mm. In this embodiment, D5 can be 5.5mm, 5.7mm, 5.85mm, 5.9mm, 6mm, 6.2mm, 6.4mm, or 6.5mm, or any value within the aforementioned range. This width design ensures that the airflow duct 22a has sufficient flow area to avoid excessive airflow resistance affecting heat dissipation efficiency, while also not occupying too much space in the Y direction.

[0057] It should be noted that, as Figure 3 As shown, the end of the first circuit board 21 away from the airflow duct 22a in the Y direction abuts against the inner wall of the housing 1, while the side of the third circuit board 222 away from the first circuit board 21 in the X direction abuts against the inner wall of the housing 1. Figure 6 The first circuit board 21 and the third circuit board 222 can abut against the cover 12 and the shell body 11 relative to the bottom wall of the cover 12 in the Z direction, so that the heat dissipation air duct is a continuous unidirectional channel, avoiding air leakage or turbulence in the first air duct 211a and the second air duct 212a, ensuring that the airflow can flow completely along the preset air duct 22a to each heat-generating component, avoiding the decrease in heat dissipation efficiency caused by airflow dispersion, thereby improving the utilization rate of airflow and ensuring the overall heat dissipation effect.

[0058] In one implementation, such as Figure 5 and Figure 6 As shown, the first circuit board 21 and the housing 1 together define at least one air passage 211b, which connects the first air duct 211a and the second air duct 212a. It should be noted that in this embodiment, the first circuit board 21 has a notch, which, together with the inner wall of the housing 1, forms the air passage 211b. This air passage 211b connects the first air duct 211a and the guide air duct 22a, allowing airflow to directly enter the guide air duct 22a from the first air duct 211a through the air passage 211b. No additional guide structure is needed to direct the airflow, resulting in a simple and smooth airflow path, lower wind resistance, increased air intake per unit time, and further enhanced heat dissipation. Multiple notches can be provided on the first circuit board 21, forming multiple air passages 211b with the inner wall of the housing 1; their number and specific structure are not limited here.

[0059] In one embodiment, the first circuit board 21 has at least one through-hole 211b extending along its thickness direction, and the through-hole 211b connects the first air duct 211a and the second air duct 212a. In this embodiment, the end of the first circuit board 21 near the guide air duct 22a in the Y direction can completely abut against the inner wall of the housing 1. The through-hole 211b extending along the thickness direction of the first circuit board 21 connects the first air duct 211a and the guide air duct 22a, which can also simplify the airflow path, reduce wind resistance, and eliminate the need for additional guide structures.

[0060] In one implementation, such as Figure 5 and Figure 6 As shown, the ventilation hole 211b is an elongated hole that extends along the height direction of the first circuit board 21. It should be noted that, in this embodiment, the height direction of the first circuit board 21 is... Figure 6 In the Z direction, the air passage 211b extends along the Z direction to form an elongated hole structure. This allows for the expansion of the opening area as much as possible without increasing the area of ​​the first circuit board 21, reducing the resistance of airflow through the air passage 211b and ensuring sufficient airflow into the second air duct 212a. At the same time, the Z-direction extension structure of the air passage 211b can adapt to the depth of the second air duct 212a along the Z direction, allowing airflow to enter the entire height area of ​​the second air duct 212a evenly, avoiding airflow deviation that could lead to insufficient heat dissipation in some areas.

[0061] In one implementation, such as Figure 5 and Figure 6 As shown, the width of the air passage 211b is w, which satisfies: 3.4mm ≤ w ≤ 3.6mm. In this embodiment, the width w of the air passage 211b can be 3.4mm, 3.45mm, 3.5mm, 3.55mm, or 3.6mm, or any value within the aforementioned range. This width design ensures that the air passage 211b has sufficient flow area to avoid excessive wind resistance reducing the air intake, while also avoiding excessive weakening of the structural strength of the first circuit board 21 and avoiding wasting the internal space of the housing 1, thus balancing air passage capacity, structural stability, and space utilization.

[0062] In one implementation, such as Figure 5 and Figure 6As shown, the height of the air passage 211b is h, which satisfies: 28mm ≤ h ≤ 30mm. In this embodiment, the height h of the air passage 211b can be 28mm, 28.5mm, 29mm, 29.5mm, or 30mm, or any value within the aforementioned range. The height of the air passage 211b can match the dimensions of the air guide duct 22a along the Z direction, allowing the airflow to evenly cover the entire cross-section of the second air duct 212a, avoiding uneven airflow distribution from affecting the heat dissipation effect. At the same time, it is compatible with the height dimensions of the housing 1 inside most small high-power charging devices 100, without the need for additional adjustments to the overall outline.

[0063] In one implementation, such as Figures 3 to 5 As shown, along the thickness direction of the first circuit board 21, the housing 1 has a first sidewall 111 and a second sidewall 112 facing each other. The first sidewall 111 is provided with an air inlet 1b, and the second sidewall 112 is provided with an air outlet 1c. The circuit module 22 includes a transformer 2233 disposed between the air outlet 1c and the first circuit board 21. A cover 12 is connected between the first sidewall 111 and the second sidewall 112, and a pin assembly 3 is disposed on the cover 12. It can be understood that in this embodiment, the first sidewall 111 and the second sidewall 112 are arranged opposite each other along the X direction. A first air duct 211a is defined between the first sidewall 111 and the first side surface 211 of the first circuit board 21, and a second air duct 212a is defined between the second sidewall 112 and the second side surface 212. The air outlet 1c and the air inlet 1b are respectively disposed on the first side surface 211 and the second side surface 212 to realize air intake and air exhaust.

[0064] Since the air outlet 1c is located on the second side wall 112, and the transformer 2233 is positioned opposite to the second side wall 112 in the X direction, the second side wall 112 generates a high amount of heat. The plug assembly 3 also generates a significant amount of heat when connected to the socket. If the plug assembly 3 is located on the second side wall 112, the heat generated by the plug assembly 3 and the heat dissipated by the power components inside the charging device 100 will overlap at the second side wall 112, easily leading to excessively high local temperatures, affecting the lifespan of the components, and even posing a safety hazard. To solve this problem, in this embodiment, the plug assembly 3 is located on the cover 12, spaced apart from the second side wall 112. This disperses the heat source and facilitates the rapid dissipation of heat generated by the plug assembly 3 through the surrounding airflow, preventing heat accumulation at the plug from affecting charging safety and lifespan. In some possible embodiments, the plug assembly 3 can also be located on other walls of the housing 1, as long as it is spaced apart from the second side wall 112; no specific limitation is made here.

[0065] In one embodiment, the distance between the first side surface 211 and the first sidewall 111 of the first circuit board 21 is D6, where D6 satisfies: 6mm ≤ D6 ≤ 8mm. In this embodiment, D6 can be 6mm, 6.5mm, 7mm, 7.05mm, 7.5mm, or 8mm, or any value within the aforementioned range. This spacing design ensures that the first air duct 211a has sufficient flow space, preventing the airflow velocity from being too fast and the wind resistance from being too high due to the width of the first air duct 211a being too small. At the same time, it avoids increasing the overall width of the charging device 100 due to the excessive spacing, thus balancing the air intake capacity and the miniaturization design requirements. This ensures that the airflow in the first air duct 211a can flow stably and smoothly to the air passage 211b, providing sufficient airflow for the second air duct 212a.

[0066] In one embodiment, the distance between the second side surface 212 and the second sidewall 112 of the first circuit board 21 is D7, where D7 satisfies: 32mm≤D7≤34mm. In this embodiment, D7 can be 32mm, 32.5mm, 32.9mm, 33mm, 33.4mm, 33.5mm, or 34mm, or any value within the aforementioned range. This distance can accommodate the installation space of each circuit board and other power components, while ensuring that the second air duct 212a has sufficient flow area, allowing the airflow that has carried away heat to be smoothly discharged from the air outlet 1c, preventing airflow from accumulating at the end of the second air duct 212a, ensuring smooth airflow circulation throughout the entire air duct, and adapting to the overall width design of the small high-power charging device 100 without additionally increasing the outline size of the charging device 100.

[0067] It should be noted that the values ​​of D1, D2, D3, D4, D5, D6, and D7 mentioned above can be adaptively adjusted according to the overall size of the charging device 100 and to avoid interference between the components, as long as the installation of each component is satisfied and the heat dissipation airflow is reasonably defined.

[0068] In one implementation, such as Figure 7 As shown, the length of the cooling fan 4 is 'a', where 'a' satisfies: 29.7mm ≤ a ≤ 30.3mm. In this embodiment, the length 'a' of the cooling fan 4 can be 29.7mm, 29.8mm, 29.9mm, 30mm, 30.1mm, 30.2mm, or 30.3mm, or any value within the aforementioned range. Figure 6 The length is adapted to the installation space inside the housing 1 of the charging device 100 along the Y direction, which can stably arrange the cooling fan 4 at the air inlet 1b of the first air duct 211a, ensuring that enough airflow can be pushed to the first air duct 211a per unit time, improving the overall air pressure and air volume of the air duct, enhancing the active heat dissipation capability, and at the same time not occupying extra space and affecting the overall size of the charging device 100.

[0069] In one implementation, such as Figure 7 As shown, the width of the cooling fan 4 is b, which satisfies: 29.7mm ≤ b ≤ 30.3mm. In this embodiment, the width b of the cooling fan 4 can be 29.7mm, 29.8mm, 29.9mm, 30mm, 30.1mm, 30.2mm, or 30.3mm, or any value within the aforementioned range. Figure 6 The width dimension b is adapted to the installation space inside the housing 1 along the Z direction, which allows the cooling fan 4 to be fully embedded in the air intake area of ​​the first air duct 211a, avoiding the formation of excess gaps between the fan and the inner wall of the housing 1 that would cause air pressure leakage, ensuring that all airflow enters the preset air duct, improving the fan's air delivery efficiency, and further enhancing the active cooling effect.

[0070] In one implementation, such as Figure 7 As shown, the thickness of the cooling fan 4 is c, which satisfies: 2.9mm ≤ c ≤ 3.5mm. In this embodiment, the thickness c of the cooling fan 4 can be 2.9mm, 3.0mm, 3.1mm, 3.2mm, 3.3mm, 3.4mm, or 3.5mm, or any value within the aforementioned range. Figure 3 The thickness value c can be adapted to the width of the first air duct 211a along the X direction, so that the cooling fan 4 is placed in the air intake section of the first air duct 211a. It will not occupy too much space between the first circuit board 21 and the air inlet 1b, which would cause the length of the first air duct 211a to be compressed. At the same time, it will not cause insufficient fan air pressure and air volume due to excessive thickness. It can match the heat dissipation requirements of the high-power charging device 100, and takes into account both heat dissipation capacity and internal space utilization.

[0071] In one implementation, such as Figures 1 to 3 As shown, the air inlet 1b and air outlet 1c are located on opposite sides of the first circuit board 21 along its thickness direction. In this embodiment, the air inlet 1b is located on the first sidewall 111, and the air outlet 1c is located on the second sidewall 112, with the airflow along... Figure 3 The airflow, as indicated by the middle arrow, enters through the air inlet 1b and flows sequentially through the first air duct 211a, the air passage 211b, the guide air duct 22a, and the second air duct 212a, finally exiting through the air outlet 1c. This layout separates the air inlet and outlet areas on opposite sides of the charging device 100, preventing the exhausted hot air from being re-inhaled into the air inlet 1b, thus preventing hot air circulation from reducing heat dissipation efficiency and ensuring stable heat dissipation.

[0072] In one implementation, such as Figures 1 to 3As shown, the air inlet 1b and the air outlet 1c are arranged opposite each other along the thickness direction of the first circuit board 21. It is understood that in this embodiment, the first circuit board 21 has different mounting methods; its thickness direction can be along the X, Y, or Z direction. The arrangement of the air inlet 1b and the air outlet 1c opposite each other along their thickness direction is beneficial for the design of the air duct and the arrangement of components. If the air inlet 1b and the air outlet 1c are misaligned along the thickness direction of the first circuit board 21, the housing 1 will be aesthetically unpleasing, and the length of the internal air duct will be affected, requiring adjustments to the mounting structure of internal components. This would compromise the overall size and heat dissipation effect of the charging device 100.

[0073] In one embodiment, the housing 1 has a first sidewall 111 and a second sidewall 112 along the thickness direction of the first circuit board 21. An air inlet 1b is disposed on the first sidewall 111 and an air outlet 1c is disposed on the second sidewall 112. The air inlet 1b and the air outlet 1c are arranged opposite to each other along the thickness direction of the first circuit board 21. This arrangement of opposite sides facilitates the sequential arrangement of internal circuit components along the airflow direction, allowing the heat-generating components to be fully cooled by the airflow and avoiding heat dissipation blind spots.

[0074] In one implementation, such as Figures 3 to 5 As shown, the first circuit board 21 extends along the length of the housing 1. The housing 1 has opposing third sidewalls 113 and fourth sidewalls 114 along its length. The third sidewall 113 and at least a portion of the circuit module 22 define a guiding airflow duct 22a. It is understood that in this embodiment, the length direction of the housing 1 is the Y direction, and the first circuit board 21 extends and is arranged along this direction so that the length directions of the first airflow duct 211a and the second airflow duct 212a are also along the Y direction. The housing 1 has opposing third sidewalls 113 and fourth sidewalls 114 in the Y direction. The third sidewall 113 and the second circuit board 221 in the circuit module 22 define the guiding airflow duct 22a, so that the first airflow duct 211a, the guiding airflow duct 22a, and the second airflow duct 212a are arranged around the periphery of the charging module 2. During airflow, the air can fully contact each heat-generating component, improving heat dissipation efficiency.

[0075] In one implementation, such as Figure 3As shown, along the length of the housing 1, the distances between the air inlet 1b and the air outlet 1c and the third side wall 113 are both greater than the distances to the fourth side wall 114. It should be noted that in this embodiment, in the Y direction of the housing 1, the distance between the air inlet 1b and the third side wall 113 is greater than the distance to the fourth side wall 114, and the distance between the air outlet 1c and the third side wall 113 is also greater than the distance to the fourth side wall 114. That is, the air inlet 1b and the air outlet 1c are located closer to the fourth side wall 114 on the housing 1. This arrangement makes the entire heat dissipation duct longer, allowing the airflow to travel a longer distance through the circuit module 22, increasing the contact time between the airflow and each heat-generating component, carrying away more heat, and further improving the heat dissipation effect.

[0076] In one implementation, such as Figure 5 As shown, the charging device 100 also includes a sealing ring 43. The cooling fan 4 is disposed within the first air duct 211a and located at the air inlet 1b. The sealing ring 43 is disposed between the cooling fan 4 and the inner wall of the accommodating cavity 1a and surrounds the air inlet 1b. It should be noted that in this embodiment, the sealing ring 43 is made of EVA material, which is soft and elastic. The sealing ring 43 is disposed between the first side wall 111 and the cooling fan 4, which can seal the gap between the cooling fan 4 and the air inlet 1b, preventing airflow from directly leaking from the gap between the cooling fan 4 and the side wall of the housing 1, ensuring that all the airflow generated by the cooling fan 4 can be sent into the first air duct 211a, improving wind pressure and air delivery efficiency. Of course, the sealing ring 43 can also be made of other materials such as rubber and silicone, which are not specifically limited here.

[0077] In one implementation, such as Figure 7 As shown, the cooling fan 4 has an inlet channel 41 and an outlet channel 42 that are interconnected. The inlet channel 41 is arranged along the thickness direction of the first circuit board 21 and communicates with the air inlet 1b, and is used to guide airflow to the first side surface 211 of the first circuit board 21. The outlet channel 42 extends along the first air duct 211a. It can be understood that in this embodiment, the inlet channel 41 and the outlet channel 42 of the cooling fan 4 are arranged perpendicularly, and the cooling fan 4 has openings on both sides in the thickness direction, so that the airflow entering from the air inlet 1b can be directly blown to the first side surface 211 of the first circuit board 21 along the inlet channel 41. The airflow can carry away some heat in advance, further improving the overall heat dissipation effect.

[0078] In one implementation, such as Figures 3 to 6The cooling fan 4 is located within the first air duct 211a. The circuit module 22 includes a transformer 2233 located within the second air duct 212a. The air inlet 1b is positioned opposite to the first side 211, and the air outlet 1c is positioned opposite to the second side 212. The air inlet 1b, cooling fan 4, transformer 2233, and air outlet 1c are arranged sequentially along the thickness direction of the first circuit board 21. In this embodiment, the air inlet 1b and cooling fan 4 are located on one side of the first circuit board 21 located on the first side 211, and the transformer 2233 and air outlet 1c are located on one side of the first circuit board 21 located on the second side 212. Furthermore, the air inlet 1b, cooling fan 4, transformer 2233, and air outlet 1c are arranged sequentially in the X direction.

[0079] It should be noted that, since the transformer 2233 generates a large amount of heat, the cooling fan 4 can guide the airflow along the X direction to blow directly onto the first side 211 of the first circuit board 21 corresponding to the transformer 2233. At this time, some heat can be carried away in advance. After the airflow passes through the first air duct 211a, the guide air duct 22a, and the second air duct 212a, it blows onto the transformer 2233. Since the transformer 2233 is close to the air outlet 1c, the airflow can directly exhaust most of the heat outside the casing 1, avoiding the accumulation of heat around the transformer 2233. This effectively reduces the temperature rise of the transformer 2233 under high-power charging conditions, ensures that the transformer 2233 can work stably, and avoids the interruption of charging due to the protection mechanism triggered by excessive temperature. This improves the reliability and safety of the charging device 100.

[0080] In one implementation, such as Figure 6 As shown, the transformer 2233 is also equipped with heat sinks 2234, at least a portion of which is located within the second air duct 212a. It should be noted that the heat sink 2234 is a metal heat-conducting fin disposed on the surface of the transformer 2233. A portion of the heat sink 2234 extends into the second air duct 212a and is positioned opposite to the air outlet 1c. The heat sink 2234 conducts heat from the transformer 2233 to a position near the air outlet 1c, where airflow directly delivers the heat out of the air outlet 1c, further improving the heat dissipation efficiency of the transformer 2233. This effectively reduces the operating temperature of the transformer 2233, preventing overheating during high-power charging and ensuring a stable and reliable charging process.

[0081] In one implementation, such as Figure 4 and Figure 5As shown, at least one of an insulating plate 5 and a metal heat-conducting plate 6 is provided between the first side 211 of the first circuit board 21 and the cooling fan 4. It should be noted that in this embodiment, only the insulating plate 5, only the metal heat-conducting plate 6, or both can be provided between the first side 211 of the first circuit board 21 and the cooling fan 4. The insulating plate 5 isolates the cooling fan 4 from the first circuit board 21, preventing short circuits and leakage caused by contact between the cooling fan 4 and the circuit board during operation, thus improving the overall safety of the charging device 100. The metal heat-conducting plate 6 can quickly conduct the heat generated by the first circuit board 21 into the first air duct 211a, where it is carried away by the airflow, improving the heat dissipation efficiency of the first circuit board 21 side. When both the insulating plate 5 and the metal heat-conducting plate 6 are provided, the insulating plate 5 is located closer to the first circuit board 21, and the metal heat-conducting plate 6 is located closer to the cooling fan 4, balancing insulation safety and heat dissipation effect.

[0082] The charging device 100 proposed in this utility model can be any device with charging function, such as a charger, power bank, desktop charger, or power strip, or other power equipment with integrated charging function. No specific limitation is made here.

[0083] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A charging device, characterized in that, include: The housing has a receiving cavity and an air inlet and an air outlet communicating with the receiving cavity; A charging module is disposed in the accommodating cavity. The charging module includes a first circuit board and a circuit module disposed on the first circuit board. The first circuit board has a first side and a second side opposite to each other along its thickness direction. A first air duct is defined between the first side and the inner wall of the housing, and a second air duct is defined between the second side and the inner wall of the housing. At least a portion of the circuit module is disposed in the second air duct. The air inlet, the first air duct, the second air duct, and the air outlet are sequentially connected to form a heat dissipation air duct. A pin assembly is disposed on the housing and electrically connected to the charging module; A cooling fan is installed inside the cooling duct to guide airflow along the cooling duct.

2. The charging device as described in claim 1, characterized in that, At least a portion of the circuit module and the inner wall of the housing define a guide air duct, the guide air duct connecting the first air duct and the second air duct.

3. The charging device as described in claim 2, characterized in that, The circuit module includes a second circuit board electrically connected to the first circuit board. The thickness direction of the second circuit board intersects the thickness direction of the first circuit board. The second circuit board and the inner wall of the housing enclose the airflow duct. Electronic components are provided on the second circuit board.

4. The charging device as described in claim 3, characterized in that, The circuit module further includes a third circuit board electrically connected to the first circuit board. The thickness direction of the third circuit board intersects the thickness direction of the first circuit board. The third circuit board and the second circuit board are spaced apart. A connector is provided on the third circuit board. A power component electrically connected to the first circuit board is provided between the third circuit board and the second circuit board.

5. The charging device as described in claim 4, characterized in that, The circuit module includes a fourth circuit board, the thickness direction of which intersects the thickness direction of the first circuit board. The second circuit board, the fourth circuit board, and the third circuit board are arranged at intervals in sequence, and at least a portion of the power components are disposed on the fourth circuit board.

6. The charging device as described in claim 5, characterized in that, The thickness directions of the second, fourth, and third circuit boards are all perpendicular to the thickness direction of the first circuit board. And / or, the second circuit board, the fourth circuit board, and the third circuit board are arranged sequentially at intervals along the extension direction of the second air duct.

7. The charging device as described in claim 5, characterized in that, The power components include a capacitor, an inductor, and a transformer. The capacitor and the inductor are located on the first circuit board, and the transformer is located on the fourth circuit board.

8. The charging device as claimed in claim 7, characterized in that, The second circuit board, the fourth circuit board, and the third circuit board are arranged parallel to each other and spaced apart in sequence along the extension direction of the second air duct. The capacitor and the inductor are located between the second circuit board and the fourth circuit board, and the transformer is located on the side of the fourth circuit board facing the third circuit board.

9. The charging device as claimed in claim 8, characterized in that, The distance between the second circuit board and the fourth circuit board is D1, where D1 satisfies: 55mm≤D1≤65mm; And / or, the distance between the fourth circuit board and the third circuit board is D2, wherein D2 satisfies: 20mm≤D2≤30mm; And / or, the distance between the side of the second circuit board away from the first circuit board and the inner wall of the housing is D3, wherein D3 satisfies: 3.5mm≤D3≤4mm; And / or, the distance between the side of the fourth circuit board away from the first circuit board and the inner wall of the housing is D4, wherein D4 satisfies: 2.5mm≤D4≤3mm; And / or, within the airflow duct, the distance between the sidewall of the second circuit board and the inner wall of the housing is D5, wherein D5 satisfies: 5.5mm≤D5≤6.5mm.

10. The charging device as claimed in claim 1, characterized in that, The first circuit board and the housing together define at least one air passage, which connects the first air duct and the second air duct; Alternatively, the first circuit board may have at least one ventilation hole extending through it along its thickness direction, the ventilation hole connecting the first air duct and the second air duct.

11. The charging device as claimed in claim 10, characterized in that, The ventilation hole is an elongated hole, and the ventilation hole extends along the height direction of the first circuit board. And / or, the width of the air passage is w, where w satisfies: 3.4mm ≤ w ≤ 3.6mm; And / or, the height of the air passage is h, where h satisfies: 28mm ≤ h ≤ 30mm.

12. The charging device as claimed in claim 1, characterized in that, Along the thickness direction of the first circuit board, the housing has opposing first and second sidewalls; The first sidewall is provided with the air inlet, the second sidewall is provided with the air outlet, the circuit module includes a transformer disposed between the air outlet and the first circuit board, a cover is connected between the first sidewall and the second sidewall, and the pin assembly is disposed on the cover; And / or, the distance between the first side of the first circuit board and the first sidewall is D6, wherein D6 satisfies: 6mm≤D6≤8mm; And / or, the distance between the second side of the first circuit board and the second sidewall is D7, wherein D7 satisfies: 32mm≤D7≤34mm.

13. The charging device as claimed in claim 1, characterized in that, The length of the cooling fan is 'a', where 'a' satisfies: 29.7mm ≤ a ≤ 30.3mm; And / or, the width value of the cooling fan is b, wherein b satisfies: 29.7mm≤b≤30.3mm; And / or, the thickness of the cooling fan is c, where c satisfies: 2.9mm ≤ c ≤ 3.5mm.

14. The charging device according to any one of claims 2 to 9, characterized in that, The air inlet and the air outlet are located on both sides of the first circuit board along the thickness direction; And / or, the air inlet and the air outlet are arranged opposite each other along the thickness direction of the first circuit board.

15. The charging device as claimed in claim 14, characterized in that, The first circuit board extends along the length of the housing, which has opposing third and fourth sidewalls along its length, the third sidewalls defining the airflow duct with at least a portion of the circuit module.

16. The charging device as claimed in claim 15, characterized in that, Along the length of the housing, the distances between the air inlet and the air outlet and the third sidewall are both greater than the distances between them and the fourth sidewall.

17. The charging device as claimed in claim 14, characterized in that, It also includes a sealing ring. The cooling fan is located in the first air duct and at the air inlet. The sealing ring is located between the cooling fan and the inner wall of the accommodating cavity and surrounds the air inlet. And / or, the cooling fan has an inlet channel and an outlet channel that are interconnected. The inlet channel is arranged along the thickness direction of the first circuit board and communicates with the air inlet to guide airflow to a first side of the first circuit board. The outlet channel extends along the first air duct.

18. The charging device as claimed in claim 1, characterized in that, The cooling fan is located in the first air duct, and the circuit module includes a transformer located in the second air duct; The air inlet and the first side are arranged opposite each other, and the air outlet and the second side are arranged opposite each other. The air inlet, the cooling fan, the transformer, and the air outlet are arranged sequentially along the thickness direction of the first circuit board. And / or, the transformer is further provided with heat sinks, at least a portion of which are located within the second air duct; And / or, at least one of an insulating plate and a metal heat-conducting plate is provided between the first side of the first circuit board and the cooling fan.

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