Middle frame structure and electronic device

Abstract

This disclosure relates to a mid-frame structure and an electronic device. The mid-frame structure includes a support plate and a frame surrounding the support plate. The support plate and the frame together enclose an accommodating space. The frame includes a first surface and a second surface connected together. The first surface is parallel to the support plate, and the second surface faces the accommodating space and is perpendicular to the support plate. A grounding structure is disposed on the second surface along a first direction perpendicular to the first surface. The end of the grounding structure facing away from the support plate is spaced apart from the first surface. This design allows for cable grounding via the grounding structure without interfering with the first surface of the frame, thus avoiding occupying the usable area of ​​the first surface and facilitating the design of an extremely narrow bezel in the electronic device.

Description

Technical Field

[0001] This disclosure relates to the field of electronic devices, and more particularly to a mid-frame structure and an electronic device. Background Technology

[0002] For example, in electronic devices such as mobile phones, the motherboard and sub-board need to be connected via cables for radio frequency signals. To improve the antenna performance of electronic devices, the cables need to be grounded to avoid electromagnetic interference from the cables to the antennas on the electronic devices. However, the current method of grounding cables is not conducive to the design of ultra-narrow bezels in electronic devices. Utility Model Content

[0003] To overcome the problems existing in related technologies, this disclosure provides a mid-frame structure and an electronic device.

[0004] According to a first aspect of this disclosure, a mid-frame structure is provided, the mid-frame structure including a support plate and a frame surrounding the support plate, the support plate and the frame together enclosing an accommodating space, the frame including a first surface and a second surface connected together, the first surface being parallel to the support plate, the second surface facing the accommodating space and perpendicular to the support plate, a grounding structure being provided on the second surface along a first direction perpendicular to the first surface, the end of the grounding structure facing away from the support plate having a gap distance from the first surface.

[0005] In some embodiments of this disclosure, the frame includes a conductor segment, and the grounding structure includes at least one grounding slot disposed on a side surface of the conductor segment facing the accommodating space.

[0006] In some embodiments of this disclosure, a first groove is provided on at least one side of the grounding structure along a second direction parallel to the second surface and perpendicular to the first direction. The first groove is connected to each of the grounding slots, and the orthographic projection of each grounding slot on a plane perpendicular to the second surface is located within the first groove. The depth of the first groove is greater than the depth of each grounding slot.

[0007] In some embodiments of this disclosure, along a second direction parallel to the second surface and perpendicular to the first direction, a second groove is respectively provided on at least one side of each grounding slot on the second surface. The second groove is connected to the grounding slot corresponding to the second groove, and the depth of the second groove is greater than the depth of the grounding slot corresponding to the second groove. Along the first direction, the groove opening width of the second groove is greater than the groove opening width of the grounding slot corresponding to the second groove.

[0008] In some embodiments of this disclosure, along the direction from the bottom wall of the grounding slot to the opening of the grounding slot, the length of the grounding slot gradually decreases in a second direction that is parallel to the second surface and perpendicular to the first direction.

[0009] In some embodiments of this disclosure, the length of the opening of the grounding slot in the second direction is 0.2 mm to 0.8 mm; the length of the bottom wall of the grounding slot in the second direction is 1.2 mm to 1.8 mm.

[0010] In some embodiments of this disclosure, multiple grounding slots are provided, and the multiple grounding slots are spaced apart in the first direction.

[0011] In some embodiments of this disclosure, the extension direction of at least one of the grounding slots from the slot opening to the bottom wall of the grounding slot is parallel to a third direction perpendicular to the second surface.

[0012] In some embodiments of this disclosure, the second surface is provided with a receiving groove, the receiving groove extends along a second direction parallel to the second surface and perpendicular to the first direction, and the receiving groove is connected to at least one of the grounding slots, the receiving groove being used to receive the cable.

[0013] In some embodiments of this disclosure, a third groove is provided on the second surface corresponding to a portion of the receiving groove, and the depth of the third groove is greater than the depth of the receiving groove, and the opening width of the third groove is greater than the opening width of the receiving groove along the first direction.

[0014] According to a second aspect of this disclosure, an electronic device is provided, the electronic device comprising: at least one cable; a mid-frame structure as described in the first aspect, wherein at least one cable cooperates with a grounding structure of the mid-frame structure to ground at least one cable.

[0015] In some embodiments of this disclosure, each cable includes a cable body and a grounding ring sleeved on the cable body, the grounding ring being embedded in the grounding slot of the grounding structure.

[0016] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0017] The mid-frame structure disclosed herein includes a grounding structure disposed on a second surface of the frame facing the accommodating space and perpendicular to the support plate. Furthermore, along a first direction perpendicular to the first surface of the frame and parallel to the support plate, the end of the grounding structure facing away from the support plate is spaced apart from the first surface. This design allows for cable grounding via the grounding structure without interfering with the first surface of the frame, thus avoiding occupying the usable area of ​​the first surface and facilitating the design of ultra-narrow bezels in electronic devices.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0020] Figure 1 This is a partial structural schematic diagram of the middle frame structure according to an exemplary embodiment;

[0021] Figure 2 This is a partial structural schematic diagram of the middle frame structure according to another exemplary embodiment;

[0022] Figure 3 yes Figure 2 Sectional view along the middle AA direction;

[0023] Figure 4 yes Figure 2 Sectional view along the BB direction;

[0024] Figure 5 This is a schematic diagram of a partial structure of an electronic device according to an exemplary embodiment.

[0025] In the picture:

[0026] 10-Middle frame structure; 11-Support plate; 12-Border; 121-First surface; 122-Second surface; 13-Grounding structure; 131-Grounding slot; 14-First groove; 15-Accommodation groove; 16-Third groove; 20-Electronic device; 21-Cable; 211-Cable body; 212-Grounding ring. Detailed Implementation

[0027] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0028] For example, in electronic devices such as mobile phones, the motherboard and sub-board need to be connected via cables for radio frequency signals. To improve the antenna performance of the electronic device, the cable needs to be grounded to avoid electromagnetic interference from the cable to the antenna on the electronic device. For example, the mid-frame of an electronic device in the related art includes a support plate and a frame surrounding the support plate. The frame includes a first surface facing away from the support plate and a second surface connected to the first surface. The second surface is connected to the inner surface of the support plate. A grounding slot is provided on the first surface, and the grounding slot extends through the second surface. Since the frame usually has a metal structural component inside, when the cable is inserted into the grounding slot, the grounding ring of the cable contacts the metal structural component, thereby grounding the cable by inserting it into the grounding slot.

[0029] However, in the aforementioned configuration, the first surface of the bezel typically has a certain width of adhesive application area serving as a waterproof platform. This platform is used for adhesive application to achieve a waterproof seal for the electronic device. In this case, when a grounding slot is provided on the first surface to ground the cable as described above, the grounding slot interferes with the waterproof platform, thus affecting the waterproof seal performance of the electronic device. Furthermore, to simultaneously accommodate both the waterproof platform and the grounding slot, the bezel width needs to be increased, which is detrimental to the design of extremely narrow bezels for electronic devices.

[0030] To address the aforementioned technical issues, this disclosure provides a mid-frame structure. A grounding structure is disposed on a second surface of the frame facing the accommodating space and perpendicular to the support plate. Along a first direction perpendicular to the first surface of the frame and parallel to the support plate, the end of the grounding structure facing away from the support plate is spaced apart from the first surface of the frame. This design allows for cable grounding via the grounding structure without interfering with the first surface of the frame, thus avoiding occupying the usable area of ​​the first surface and facilitating the design of ultra-narrow bezels in electronic devices.

[0031] An exemplary embodiment of this disclosure provides a mid-frame structure, such as Figure 1 and Figure 5As shown, the mid-frame structure 10 includes a support plate 11 and a frame 12 surrounding the support plate 11. The support plate 11 and the frame 12 together enclose a receiving space for accommodating internal components of an electronic device. The frame 12 includes a first surface 121 and a second surface 122 connected together. The first surface 121 is parallel to the support plate 11, and the second surface 122 faces the receiving space and is perpendicular to the support plate 11.

[0032] A grounding structure 13 is provided on the second surface 122. The grounding structure 13 is used to cooperate with at least one cable 21 to ground at least one cable 21.

[0033] For example, the grounding structure 13 can be used with only one cable 21 to ground that cable 21. The grounding structure 13 can also be used with multiple cables 21 at the same time, such as two or three, to ground multiple cables 21 simultaneously.

[0034] For example, the grounding structure 13 can be connected to each cable 21 by means of snap-fitting, adhesive bonding, etc., and there is no specific limitation. As long as the grounding structure 13 can be used to fix the cable 21 while grounding the cable 21, it is acceptable.

[0035] The mid-frame structure 10 typically consists of a metal structural component and a plastic structural component covering the metal structural component, forming a support plate 11 and a frame 12 surrounding the support plate 11. Exemplarily, the grounding structure 13 can be formed directly from the frame 12, i.e., integrally molded with the frame 12. For example, it could be a groove structure formed on the second surface 122 of the frame 12 or a protrusion structure protruding from the second surface 122 of the frame 12. This allows the metal structural component inside the frame 12 to contact the grounding ring on the cable 21, thereby grounding the cable 21. The grounding structure 13 can also be a structure fixed to the second surface 122 of the frame 12, for example, by bonding, welding, or snap-fitting. In this case, the grounding structure 13 can connect to the metal structural component inside the frame 12 to ground the cable 21, or it can connect the grounding ring or grounding structure 13 on the cable 21 to the circuit board inside the electronic device via a conductor such as a wire or circuit board to achieve grounding of the cable 21.

[0036] Furthermore, along a first direction perpendicular to the first surface 121 (e.g.) Figure 1As shown in the direction z), the end of the grounding structure 13 facing away from the support plate 11 has a gap between it and the first surface 121. Thus, while grounding the cable 21, the grounding structure 13 does not interfere with the first surface 121 of the frame 12, and therefore does not occupy the usable area of ​​the first surface 121 of the frame 12. That is, the first surface 121 in a third direction perpendicular to the second surface 122 (e.g., z) Figure 1 The width in the direction x) shown only needs to consider the adhesive area (i.e., the width of the waterproof platform), without needing to consider the design of the grounding structure 13, which is beneficial for the design of ultra-narrow bezels of electronic devices.

[0037] Continue to refer to Figure 1 and Figure 5 In one embodiment, the frame 12 includes a conductor segment. Understandably, the middle frame structure 10 forms a support plate 11 and a frame 12 surrounding the support plate 11 through a metallic structural member and a plastic structural member covering the metallic structural member. The frame 12 includes an outer portion of the metallic structural member and an inner portion of the metallic structural member spaced apart by the plastic structural member. The outer portion of the metallic structural member can constitute an antenna radiator, while the inner portion of the metallic structural member constitutes the conductor segment in this embodiment.

[0038] The grounding structure 13 includes at least one grounding slot 131 disposed on the side surface of the conductor segment facing the accommodating space. The at least one grounding slot 131 is used to engage with at least one cable 21 to ground each cable 21. Understandably, the number of grounding slots 131 corresponds to the number of cables 21. For example, when there is only one cable 21, one grounding slot 131 is provided, and when there are multiple cables 21, such as two, two grounding slots 131 are provided, so that each cable 21 is respectively inserted into one grounding slot 131, ensuring the grounding effect for each cable 21, thereby improving the antenna performance of the electronic device.

[0039] When cable 21 is inserted into the grounding slot 131, cable 21 comes into contact with the conductor section, thereby achieving grounding of the cable. This design makes the grounding structure 13 simple in structure and easy to manufacture and process.

[0040] It should be noted that when only one grounding slot 131 is provided on the second surface 122, the slot sidewall of the grounding slot 131 facing away from the support plate 11 is spaced apart from the first surface 121, meaning the grounding slot 131 does not penetrate the first surface 121. When multiple grounding slots 131 are provided on the second surface 122, the slot sidewall of each grounding slot 131 facing away from the support plate 11 is spaced apart from the first surface 121, and the spaced distance between the slot sidewall of each grounding slot 131 and the first surface 121 can be the same or different. This ensures that each grounding slot 131 does not penetrate the first surface 121, enabling the electronic device to achieve an extremely narrow bezel design, thereby improving the user experience.

[0041] Combination Figure 1 and Figure 2 In one embodiment, when multiple grounding slots 131 are provided, the multiple grounding slots 131 are in a first direction (e.g., Figure 1 The cables 21 are spaced apart in the direction z) shown in the diagram. This design, on the one hand, makes the layout of the cables 21 more standardized and organized, which is conducive to a more compact structure of the electronic device 20, thus facilitating the miniaturization of the electronic device 20. On the other hand, it avoids interference between multiple grounding slots 131 or multiple cables 21, thereby further ensuring the grounding effect of the cables 21.

[0042] In this embodiment, in the first direction (e.g.) Figure 1 Multiple grounding slots 131 are spaced apart along the direction z shown in the figure, parallel to the second surface 122 and along the first direction (e.g., Figure 1 The second direction perpendicular to the direction z shown in the figure (e.g.) Figure 1 In the direction y shown, at least two of the multiple grounding slots 131 can be arranged side by side or staggered. By increasing the flexibility of the setting position of each grounding slot 131, the structural strength of the frame 11 is guaranteed, which helps to improve the reliability of the middle frame structure 10.

[0043] Combination Figure 1 and Figure 3 In one embodiment, along a direction parallel to the second surface 122 and parallel to the first direction (e.g. Figure 1 The second direction perpendicular to the direction z shown in the figure (e.g.) Figure 1As shown in the direction y), the second surface 122 has a first groove 14 at at least one side of the grounding structure 13. That is, at least one grounding slot 131 can be treated as a whole. The first groove 14 can be provided only on one side of this whole, in which case the first groove 14 is located on the same side of each grounding slot 131. Alternatively, the first groove 14 can be provided on both sides of the whole, in which case each grounding slot 131 has a first groove 14 on both sides.

[0044] The first groove 14 is connected to each grounding slot 131, and the orthographic projection of each grounding slot 131 on the plane perpendicular to the second surface 122 is located within the first groove 14. The depth of the first groove 14 is greater than the depth of each grounding slot 131. This arrangement provides, on the one hand, operable space for inserting or removing the cable 21 from the grounding slot 131, thereby improving the assembly efficiency of the electronic device 20. On the other hand, by providing the first groove 14, some structures of the middle frame structure 10 are reduced, thereby reducing the weight of the middle frame structure 10 and facilitating the lightweight design of the electronic device 20. Furthermore, by providing a first groove 14 on the same side of each grounding slot 131, the cable 21 can be removed from each grounding slot 131 through a single first groove 14, facilitating the production and processing of the frame 12.

[0045] For example, the orthographic projection of the first groove 14 onto the support plate 11 can be a rectangular or arc-shaped shape, etc., without any specific limitation.

[0046] In another embodiment, along a direction parallel to the second surface 122 and in line with the first direction (e.g.) Figure 1 The second direction perpendicular to the direction z shown in the figure (e.g.) Figure 1 As shown in the direction y), the second surface 122 is provided with a second groove at at least one side of each grounding slot 131, and each second groove is connected to the corresponding grounding slot 131. For example, along a direction parallel to the second surface 122 and perpendicular to the first direction (e.g., y), a second groove is provided at a position corresponding to at least one side of each grounding slot 131, and each second groove is connected to the corresponding grounding slot 131. Figure 1 The second direction perpendicular to the direction z shown in the figure (e.g.) Figure 1 The direction (y) shown in the figure can be such that the second groove is provided only on one side of the grounding slot 131, or the second groove is provided on both sides of each grounding slot 131. Furthermore, the depth of each second groove is greater than the depth of its corresponding grounding slot 131, along the first direction (e.g., y). Figure 1As shown in the direction z), the width of the second groove is greater than the width of the corresponding grounding slot 131. In this way, on the one hand, it also provides operable space for each cable 21 to be inserted into or removed from the grounding slot 131, thereby improving the assembly efficiency of the electronic device 20.

[0047] Combination Figure 1 In one embodiment, along a direction parallel to the second surface 122 and parallel to the first direction (e.g. Figure 1 The second direction (e.g., the direction z shown in the figure) Figure 1 As shown in the direction y), the second surface 122 is provided with a plurality of grounding structures 13 at intervals. This design can further improve the stability of the cable 21 fixation and the grounding effect, thereby improving the reliability of the electronic device 20 and the antenna performance. At least one side of each grounding structure 13 is provided with a first groove 14. For example, two adjacent grounding structures 13 are connected by a first groove 14 to realize the connection between the grounding slots 131 of the two grounding structures 13, thereby ensuring the structural strength of the frame 12 and improving the reliability of the middle frame structure 10.

[0048] Combination Figure 1 In one embodiment, along the direction from the bottom wall of the grounding slot 131 to the opening of the grounding slot 131, the grounding slot 131 is in a second direction (e.g., Figure 1 The length gradually decreases in the direction y) shown in the diagram. This arrangement, by reducing the length of the grounding slot 131 opening, facilitates the insertion of the cable 21 into the grounding slot 131, thereby effectively improving assembly convenience and efficiency. Furthermore, the longer bottom wall of the grounding slot 131 effectively ensures the contact area between the cable 21 and the grounding slot 131, thus improving the grounding effect and stability of the cable 21.

[0049] In one embodiment, the slot of the grounding slot 131 is in the second direction (e.g., Figure 1 The length in the direction y) shown is 0.2 mm to 0.8 mm, for example, 0.5 mm. The bottom wall of the grounding slot 131 in the second direction (e.g., Figure 1 The length in the direction y) shown is 1.2mm to 1.8mm, for example, 1.5mm. This design facilitates the insertion of the cable 21 into the grounding slot 131, thereby effectively improving assembly convenience and efficiency, while also ensuring the contact area between the cable 21 and the grounding slot 131, thus improving the grounding effect and stability of the cable 21. Furthermore, it ensures the structural strength of the frame 12, thereby further improving the reliability of the middle frame structure 10.

[0050] In one embodiment, the extending direction of at least one grounding slot 131 from the slot opening to the bottom wall of the grounding slot 131 is perpendicular to a third direction (e.g., perpendicular to the second surface 122). Figure 1 The direction x) shown in the figure is parallel. In this way, it is convenient to insert and remove the cable 21, and it is also convenient to process the grounding slot 131, thereby improving the production efficiency of the middle frame structure 10.

[0051] Combination Figure 1 and Figure 5 In one embodiment, the second surface 122 of the frame 12 is provided with a receiving groove 15, the receiving groove 15 being along a second direction (e.g., Figure 1 The accommodating slot 15 extends in the direction y shown in the figure, and is connected to at least one grounding slot 131. The accommodating slot 15 is used to accommodate the cable 21.

[0052] For example, when only one grounding slot 131 is provided, the receiving slot 15 is connected to the grounding slot 131. When multiple grounding slots 131 are provided, all multiple grounding slots 131 are connected to the receiving slot 15.

[0053] For example, when only one cable 21 is provided, the cable 21 is fixed by inserting it into the receiving slot 15. When multiple cables 21 are provided, the receiving slot 15 can accommodate multiple cables 21 simultaneously, thereby fixing multiple cables 21 through the receiving slot 15. Alternatively, multiple receiving slots 15 can be provided, and multiple receiving slots 15 can be used to fix multiple cables 21 separately; there is no specific limitation on this.

[0054] By providing a receiving groove 15 on the second surface 122 of the frame 12 to accommodate the cable 21, the cable 21 is fixed inside the frame 12. This arrangement not only reduces the space occupied inside the electronic device 20, making the structure of the electronic device 20 more compact and facilitating the miniaturization design of the electronic device 20, but also improves the stability of the electrical connection between the cable 21 and other components by fixing the cable 21, thereby further improving the reliability of the electronic device 20.

[0055] Combination Figure 1 and Figure 4 In one embodiment, a third groove 16 is provided on a portion of the second surface 122 of the frame 12 corresponding to a portion of the receiving groove 15, and the depth of the third groove 16 is greater than the depth of the receiving groove 15, along the first direction (e.g. Figure 1As shown in the direction z), the width of the third groove 16 is greater than the width of the receiving groove 15. This design, on the one hand, provides operable space for inserting or removing the cable 21 from the receiving groove 15, thereby improving the assembly efficiency of the electronic device 20. On the other hand, by providing the third groove 16, a portion of the middle frame structure 10 is reduced, thus lightening its weight and contributing to the lightweight design of the electronic device 20. Furthermore, it ensures the stability of the cable 21's fixation, thereby improving the reliability of the electronic device 20.

[0056] For example, the orthographic projection of the third groove 16 onto the inner surface of the support plate 11 can be, for example, a rectangle, an arc, or the like, without any specific limitation.

[0057] In one embodiment, the grounding slot 131, the first groove 14, the receiving groove 15, and the third groove 16 are all manufactured using Computer Numerical Control (CNC). This effectively improves the accuracy of the machining dimensions of the grounding slot 131, the first groove 14, the receiving groove 15, and the third groove 16, thereby contributing to the stability of the grounding effect of the cable 21.

[0058] An exemplary embodiment of this disclosure provides an electronic device. Exemplarily, the electronic device can be a mobile device such as a mobile phone, tablet computer, laptop computer, handheld computer, in-vehicle electronic device, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), or a non-mobile device such as a personal computer (PC) or television (TV).

[0059] Combination Figure 1 and Figure 5 The electronic device 20 includes the mid-frame structure 10 as described above and at least one cable 21. The mid-frame structure 10 includes a support plate 11 and a frame 12 surrounding the support plate 11. The frame 12 includes a first surface 121 facing away from the support plate 11 and a second surface 122 connected to the first surface 121 and connected to the inner surface of the support plate 11. A grounding structure 13 is provided on the second surface 122 along a first direction perpendicular to the first surface 121 (e.g., ...). Figure 1As shown in the direction z), the end of the grounding structure 13 facing away from the support plate 11 has a gap between it and the first surface 121. At least one cable 21 mates with the grounding structure 13 of the middle frame structure 10 to ground at least one cable 21.

[0060] With this configuration, while grounding the cable 21, the grounding structure 13 will not interfere with the first surface 121 of the frame 12, thus not occupying the usable area of ​​the first surface 121 of the frame 12. That is, the first surface 121 in a third direction perpendicular to the second surface 122 (e.g.) Figure 1 The width in the direction x) shown in the figure only needs to consider the adhesive area (i.e. the width of the waterproof platform), without needing to consider the design of the grounding structure 13, which is beneficial to the design of the ultra-narrow bezel of the electronic device.

[0061] Combination Figure 5 In one embodiment, each cable 21 includes a cable body 211 and a grounding ring 212 sleeved on the cable body 211. The grounding ring 212 is embedded in the grounding slot 131 of the grounding structure 13. Exemplarily, the grounding ring 212 is a metallic structural component. The grounding ring 212 is sleeved on the cable body 211, with one end of the cable 21 conductor exposed. After the grounding ring 212 is embedded in the grounding slot 131 of the grounding structure 13, the grounding ring 212 contacts the grounding slot 131, that is, it contacts the metallic structural component within the frame 12, thereby achieving grounding of the cable 21. During the process of the grounding ring 212 being inserted into the grounding slot 131, the conductor of the cable body 211 undergoes a certain degree of compression deformation, thereby ensuring the squeezing force of the grounding slot 131 on the cable 21. This further improves the stability of the cable 21 when inserted into the grounding slot 131, thus improving the grounding effect of the cable 21.

[0062] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0063] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A middle frame structure, characterized in that, The middle frame structure includes a support plate and a frame surrounding the support plate. The support plate and the frame together enclose an accommodating space. The frame includes a first surface and a second surface connected together. The first surface is parallel to the support plate, and the second surface faces the accommodating space and is perpendicular to the support plate. A grounding structure is provided on the second surface along a first direction perpendicular to the first surface. The end of the grounding structure facing away from the support plate has a gap distance from the first surface.

2. The middle frame structure of claim 1, wherein, The frame includes a conductor segment, and the grounding structure includes at least one grounding slot disposed on a side surface of the conductor segment facing the accommodating space.

3. The middle frame structure according to claim 2, characterized in that, Along a second direction parallel to the second surface and perpendicular to the first direction, a first groove is provided on at least one side of the grounding structure on the second surface. The first groove is connected to each of the grounding slots, and the orthographic projection of each of the grounding slots on a plane perpendicular to the second surface is located in the first groove. The depth of the first groove is greater than the depth of each of the grounding slots.

4. The middle frame structure according to claim 2, characterized in that, Along a second direction parallel to the second surface and perpendicular to the first direction, a second groove is provided on at least one side of each grounding slot on the second surface. The second groove is connected to the grounding slot corresponding to the second groove, and the depth of the second groove is greater than the depth of the grounding slot corresponding to the second groove. Along the first direction, the groove opening width of the second groove is greater than the groove opening width of the grounding slot corresponding to the second groove.

5. The middle frame structure according to claim 2, characterized in that, Along the direction from the bottom wall of the grounding slot to the opening of the grounding slot, the length of the grounding slot gradually decreases in a second direction that is parallel to the second surface and perpendicular to the first direction.

6. The middle frame structure according to claim 5, characterized in that, The length of the grounding slot opening in the second direction is 0.2mm to 0.8mm; The length of the bottom wall of the grounding slot in the second direction is 1.2 mm to 1.8 mm.

7. The middle frame structure according to claim 2, characterized in that, Multiple grounding slots are provided, and the multiple grounding slots are spaced apart in the first direction.

8. The middle frame structure according to any one of claims 2 to 7, characterized in that, At least one of the grounding slots extends from the slot opening to the bottom wall of the grounding slot in a direction parallel to a third direction perpendicular to the second surface.

9. The middle frame structure according to any one of claims 2 to 7, characterized in that, The second surface is provided with a receiving groove, which extends along a second direction parallel to the second surface and perpendicular to the first direction, and the receiving groove is connected to at least one of the grounding slots.

10. The middle frame structure according to claim 9, characterized in that, The second surface has a third groove at a location corresponding to a portion of the receiving groove, and the depth of the third groove is greater than the depth of the receiving groove. Along the first direction, the width of the opening of the third groove is greater than the width of the opening of the receiving groove.

11. An electronic device, characterized in that, The electronic device includes: At least one cable; In the mid-frame structure as described in any one of claims 1 to 10, at least one of the cables is coupled to the grounding structure of the mid-frame structure to ground at least one of the cables.

12. The electronic device according to claim 11, characterized in that, Each of the cables includes a cable body and a grounding ring sleeved on the cable body, wherein the grounding ring is embedded in the grounding slot of the grounding structure.

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