Quadri-segment transition blanking device and battery piece testing machine

Abstract

The utility model belongs to the conveying technical field especially relates to four quarter section transition blanking device and battery piece testing machine, wherein one kind four quarter section transition blanking device, include: movable Bernoulli sucking disc structure, it sets up in equipment blanking end, is used for non -contact adsorption silicon wafer and carries out the pitch adjustment, prong transplanting mechanism, it sets up movable Bernoulli sucking disc structure downstream, is used for transmission silicon wafer to blanking position, wherein, movable Bernoulli sucking disc structure is suitable for adsorption at least four silicon wafers once, and is adapted to the silicon wafer pitch of different working procedure through the pitch adjustment, through the setting of movable Bernoulli sucking disc structure, can adsorb and transport at least 4 silicon wafers once, compares traditional double piece transmission mechanism, has improved work efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of conveying technology, and in particular relates to a four-piece transition feeding device and a battery cell testing machine. Background Technology

[0002] In the photovoltaic cell manufacturing process, the material handling and transfer during the testing phase is a crucial step in ensuring production efficiency and product quality. Currently, cell testing machines typically employ a dual-wafer transfer mechanism, meaning they can process only two wafers at a time. This transfer method is inefficient and cannot meet the demands of modern high-efficiency production, becoming a bottleneck, especially in scenarios with high capacity requirements.

[0003] Existing transfer equipment has significant drawbacks in adsorbing and transferring silicon wafers: the fixed suction cup structure cannot be adapted to silicon wafers of different sizes, resulting in poor compatibility; and the transfer speed is slow, affecting the overall production rhythm.

[0004] Therefore, how to solve the problems of low transmission efficiency and poor compatibility of dual chips is a technical problem that urgently needs to be solved in this field.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of this application concept, and therefore, the above description is not considered to constitute information related to the technology. Utility Model Content

[0006] This disclosure provides at least one four-cell transition feeding device and a cell testing machine.

[0007] In a first aspect, embodiments of this disclosure provide a four-piece transition feeding device, comprising: A movable Bernoulli suction cup structure is set at the unloading end of the equipment for non-contact adsorption of silicon wafers and for variable distance adjustment. A fork-tooth transfer mechanism, located downstream of the movable Bernoulli chuck structure, is used to transfer silicon wafers to the unloading position; The movable Bernoulli suction cup structure includes a Bernoulli suction cup fixed to the side wall of the frame, which uses negative pressure airflow to non-contactly adsorb the silicon wafer; and The movable Bernoulli chuck structure also includes a variable pitch drive mechanism, with at least one Bernoulli chuck disposed at the movable end of the variable pitch drive mechanism. The variable pitch drive mechanism is adapted to adjust the distance between two adjacent Bernoulli chucks to accommodate silicon wafers of different sizes.

[0008] In one optional embodiment, the drive mechanism includes: an adjusting motor, vertically mounted on the side wall of the frame; The driven shaft is rotatably located at the end of the frame away from the regulating motor; An adjusting belt is fitted onto the outer wall of the driven shaft and the rotating shaft of the adjusting motor; A fixing block is fixed to the adjusting belt, and one of the Bernoulli suction cups is fixed to the fixing block.

[0009] In one optional embodiment, the fork-tooth transplanting mechanism includes a horizontally arranged translation guide rail, with a drive motor at one end. A sliding block is slidably arranged on the translation guide rail, and the sliding block is connected to the drive motor in a transmission manner. The movable Bernoulli suction cup structure is fixed to the sliding block.

[0010] In one alternative embodiment, a control unit is further included, which is electrically connected to the drive unit of the movable Bernoulli chuck structure and the fork-tooth transfer mechanism, and is configured to control the movable Bernoulli chuck structure to adsorb silicon wafers and control the fork-tooth transfer mechanism to transfer silicon wafers.

[0011] In one alternative embodiment, a movable Bernoulli suction cup structure, disposed at the unloading end of the device, includes: Variable pitch drive mechanism and two Bernoulli suction cups; One Bernoulli suction cup is fixed to the side wall of the frame, and the other Bernoulli suction cup is fixed to the movable end of the variable pitch drive mechanism; The variable pitch drive mechanism is adapted to adjust the distance between two adjacent Bernoulli chucks to accommodate silicon wafers of different sizes.

[0012] In one optional embodiment, the drive mechanism includes: an adjusting motor, vertically mounted on the side wall of the frame; The driven shaft is rotatably located at the end of the frame away from the regulating motor; An adjusting belt is fitted onto the outer wall of the driven shaft and the rotating shaft of the adjusting motor; A fixing block is fixed to the adjusting belt, and one of the Bernoulli suction cups is fixed to the fixing block.

[0013] Secondly, embodiments of this disclosure also provide a cell testing machine.

[0014] The beneficial effects of this utility model are that it provides a four-piece transition feeding device and a cell testing machine. Through the setting of the movable Bernoulli suction cup structure, silicon wafers can be quickly adsorbed in the air. At least four silicon wafers can be adsorbed and transferred at one time. Compared with the traditional dual-wafer transfer mechanism, the working efficiency is improved. The setting of the variable distance module can adjust the distance between two adjacent Bernoulli suction cups, which can adapt to the processing of silicon wafers of different sizes, improving the compatibility and adaptability of the equipment.

[0015] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0016] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of this utility model, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 A perspective view of the four-piece transition feeding device provided in the embodiments of this disclosure; Figure 2 This is a top view of the four-piece transition feeding device provided in an embodiment of this disclosure.

[0019] In the picture: 1. Movable Bernoulli suction cup structure; 10. Bernoulli suction cup; 12. Variable pitch drive mechanism; 13. Adjustable motor; 14. Driven shaft; 15. Adjustable belt; 16. Fixing block; 2. Fork-tooth transplanting mechanism; 21. Translation guide rail; 22. Drive motor; 23. Sliding block. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0021] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0022] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0023] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise expressly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0024] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0025] Research has revealed that in the photovoltaic cell manufacturing process, the material handling and transfer during the testing phase is a crucial step in ensuring production efficiency and product quality. Currently, cell testing machines typically employ a dual-wafer transfer mechanism, processing only two wafers at a time. This transfer method is inefficient and cannot meet the demands of modern high-efficiency production, becoming a bottleneck, especially in scenarios with high capacity requirements.

[0026] Existing transfer equipment has significant drawbacks in adsorbing and transferring silicon wafers: the fixed suction cup structure cannot be adapted to silicon wafers of different sizes, resulting in poor compatibility; and the transfer speed is slow, affecting the overall production rhythm.

[0027] Therefore, how to solve the problems of low transmission efficiency and poor compatibility of dual chips is a technical problem that urgently needs to be solved in this field.

[0028] The defects in the above solutions and the reasons for their occurrence are the results of the inventors' practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventors' contributions to this disclosure.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0030] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0031] like Figure 1 As shown, at least one embodiment provides a four-wafer transition unloading device, including: a movable Bernoulli suction cup structure 1, a fork-tooth transfer mechanism 2, and a control unit. The four-wafer transition unloading device is entirely encapsulated within a dust cover, which has a built-in HEPA filter to maintain internal cleanliness at ISO 14644-1 level 5, preventing dust contamination of the silicon wafers. The control unit is integrated into the equipment cabinet and communicates with each component via a CAN bus to coordinate the working sequence. The four-wafer transition unloading device is designed for the unloading stage of a solar cell testing machine, processing at least four silicon wafers at a time, solving the problems of low efficiency and poor compatibility of traditional dual-wafer transfer methods.

[0032] Reference Appendix Figure 1 A movable Bernoulli suction cup structure 1 is disposed at the unloading end of the equipment for non-contact adsorption of silicon wafers and for variable pitch adjustment; it includes a Bernoulli suction cup 10 and a variable pitch driving mechanism 12. Further, there are at least four Bernoulli suction cups 10, and at least one Bernoulli suction cup 10 is disposed at the movable end of the variable pitch driving mechanism 12. The variable pitch driving mechanism 12 is adapted to adjust the spacing between two adjacent Bernoulli suction cups 10 to accommodate silicon wafers of different sizes.

[0033] Continue to refer to the appendix Figure 1The movable Bernoulli suction cup structure 1 includes a Bernoulli suction cup 10 fixed to the side wall of the frame. The Bernoulli suction cup 10 uses negative pressure airflow to non-contactly adsorb silicon wafers, with an adsorption height of 0.5-2 mm and an adsorption time of ≤0.5 s. Multiple Bernoulli suction cups 10 (made of aluminum alloy with anodized surface) adsorb silicon wafers non-contactly using negative pressure airflow. Each suction cup is connected to a vacuum generator, with an adsorption height set to 1.5 mm (adjustable range 0.5-2 mm) and an adsorption time of 0.3 s (≤0.5 s). During operation, the vacuum generator is activated, and the airflow suspends the silicon wafers for adsorption, avoiding physical contact and scratches. The Bernoulli suction cup 10 is fixed to the side wall of the frame or the movable end of the variable pitch drive mechanism 12, and can adsorb up to 4 silicon wafers at a time.

[0034] Reference Appendix Figure 1 The variable-pitch drive mechanism 12 is used to adjust the distance between two adjacent Bernoulli chucks 10 to accommodate silicon wafers of different sizes. The variable-pitch drive mechanism includes: an adjusting motor 13, vertically mounted on the side wall of the frame, using a servo motor (accuracy ±0.05mm) to provide power; a driven shaft 14, rotatably mounted at the end of the frame away from the adjusting motor 13, used to support the transmission of the adjusting belt 15; the adjusting belt 15 is sleeved on the outer wall of the shaft connecting the driven shaft 14 and the adjusting motor 13; the adjusting belt 15 drives the fixed block 16 to move linearly. The fixed block 16 is fixed to the adjusting belt 15, and one of the Bernoulli chucks 10 is fixed to the fixed block 16. When the adjusting motor 13 is running, the adjusting belt 15 drives the fixed block 16 to move, thereby adjusting the distance between two adjacent Bernoulli chucks 10 (adjustable range 30mm ± 15mm). For example, for a 156mm silicon wafer, the distance is set to 30mm; for a 210mm silicon wafer, the distance is adjusted to 45mm.

[0035] Please refer to the attached document again. Figure 1 The fork-tooth transfer mechanism 2, located downstream of the movable Bernoulli suction cup structure 1, is used to transfer silicon wafers to the unloading position. The fork-tooth transfer mechanism 2 includes a horizontally positioned translation guide rail 21, with a drive motor 22 at one end. A sliding block 23 is slidably mounted on the translation guide rail 21, and the sliding block 23 is connected to the drive motor 22. The movable Bernoulli suction cup structure 1 is fixed to the sliding block 23. When the drive motor 22 is running, the slider moves along the translation guide rail 21, transferring the silicon wafer to the designated unloading position. The transfer process is smooth, preventing the silicon wafer from shaking or falling.

[0036] The control unit, electrically connected to the drive unit of the movable Bernoulli suction cup structure 1 and the fork-tooth transfer mechanism 2, is configured to control the movable Bernoulli suction cup structure 1 to adsorb silicon wafers and control the fork-tooth transfer mechanism 2 to transfer silicon wafers. The control unit uses an STM32 microprocessor as its core and connects to each component via a CAN bus. Its functions include: Timing coordination: controlling the sequence of adsorption, pitch adjustment, and fork-tooth transfer of the Bernoulli suction cup 10 to ensure synchronization of each action. For example, adsorption command → pitch adjustment → transfer start. Real-time monitoring: monitoring the silicon wafer position, adsorption status, and transfer speed through sensors (such as photoelectric sensors and encoders), with data displayed in real-time on the human-machine interface. For example, displaying a transfer speed of 0.5 m / s, a calibration accuracy of ±0.1 mm, and equipment status (vacuum level, motor status). Parameter setting and alarms: the human-machine interface supports setting parameters such as adsorption height, transfer speed, and spacing; in case of abnormalities (such as silicon wafer misalignment exceeding tolerance or adsorption failure), it outputs audible and visual alarms and records data for traceability. Compatibility management: Stores multiple preset silicon wafer sizes (such as 156mm, 166mm, 210mm), automatically adjusts pitch parameters, and reduces manual intervention.

[0037] At least one embodiment provides a four-wafer transition unloading device, comprising: a movable Bernoulli chuck structure 1 disposed at the unloading end of the device, including: a pitch-adjustable drive mechanism 12 and at least two Bernoulli chucks 10, one Bernoulli chuck 10 fixed to the side wall of the frame, and the other Bernoulli chuck 10 fixed to the movable end of the pitch-adjustable drive mechanism 12. The pitch-adjustable drive mechanism 12 is adapted to adjust the spacing between adjacent Bernoulli chucks 10 to accommodate silicon wafers of different sizes. The pitch-adjustable drive mechanism 12 includes: an adjusting motor 13 vertically disposed on the side wall of the frame; a driven shaft 14 rotatably disposed at the end of the frame away from the adjusting motor 13; an adjusting belt 15 sleeved on the outer wall of the shaft of the driven shaft 14 and the adjusting motor 13; and a fixing block 16 fixed to the adjusting belt 15, with one of the Bernoulli chucks 10 fixed to the fixing block 16.

[0038] At least one embodiment provides a cell testing machine that employs the cell transition feeding device provided in the above embodiments.

[0039] The working process and principle of a four-segment transition feeding device are as follows: The equipment is initialized and started, the control unit performs a self-test, and all components are reset (Bernoulli chuck 10 returns to its original position, and the fork-tooth transfer mechanism 2 returns to zero). The human-machine interface displays the ready status, and the operator sets the silicon wafer size (e.g., 156mm) and transfer speed (0.5m / s). The control unit loads preset parameters. The silicon wafer is adsorbed, entering the unloading end from the upstream testing station. The movable Bernoulli chuck structure 1 moves above the silicon wafer, the vacuum generator starts, and negative pressure airflow adsorbs the silicon wafer. The silicon wafer is suspended stably without contact. Four silicon wafers are adsorbed at a time.

[0040] like Figure 2 As shown, the suction cups are arranged to cover the silicon wafer area. The spacing is adjusted by the control unit, which calculates the required spacing based on the silicon wafer size: for example, a 156mm silicon wafer requires a suction cup spacing of 30mm. The regulating motor 13 operates, moving the fixed block 16 via the regulating belt 15 to adjust the spacing of the Bernoulli suction cups 10. Spacing changes are fed back to the control unit in real time, ensuring an accuracy of ±0.1mm. After adsorption, the fork-tooth transfer mechanism 2 is activated: the drive motor 22 pushes the sliding block 23 along the translation guide rail 21, transferring the silicon wafer to the unloading position. During transfer, the control unit monitors the position to ensure the silicon wafer moves smoothly without slippage. Once the silicon wafer reaches the unloading position, the Bernoulli suction cup 10 releases the vacuum, and the silicon wafer falls. The fork-tooth transfer mechanism 22 returns to its initial position, ready for the next cycle. Abnormal handling: If the sensor detects silicon wafer damage, positional deviation (offset > 0.5mm), or adsorption failure, the control unit pauses operation, triggers an alarm (displaying "Adsorption Abnormality" on the human-machine interface), and records the event timestamp. Manual intervention is required for inspection and reset to ensure production safety.

[0041] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0042] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as the second element, component, region, layer, or segment.

[0043] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A quad transition blanking device, characterized by, include: A movable Bernoulli suction cup structure (1) is set at the unloading end of the equipment for non-contact adsorption of silicon wafers and for variable distance adjustment; The fork-tooth transfer mechanism (2) is located downstream of the movable Bernoulli chuck structure (1) and is used to transfer the silicon wafer to the unloading position; The movable Bernoulli suction cup structure (1) includes a Bernoulli suction cup (10) fixed to the side wall of the frame, wherein the Bernoulli suction cup (10) non-contactly adsorbs the silicon wafer through negative pressure airflow; and The movable Bernoulli chuck structure (1) further includes a variable pitch drive mechanism (12), at least one Bernoulli chuck (10) is disposed at the movable end of the variable pitch drive mechanism (12), and the variable pitch drive mechanism (12) is adapted to adjust the distance between two adjacent Bernoulli chucks (10) to accommodate silicon wafers of different sizes.

2. The four-piece transition feeding device as described in claim 1, characterized in that, The variable pitch drive mechanism includes: an adjustment motor (13), which is vertically mounted on the side wall of the frame; Driven shaft (14) is rotatably mounted at the end of the frame away from the regulating motor (13); Adjusting belt (15) is sleeved on the outer wall of the shaft of driven shaft (14) and adjusting motor (13); A fixing block (16) is fixed to an adjusting belt (15), and a Bernoulli suction cup (10) is fixed to the fixing block (16).

3. The four-piece transition feeding device as described in claim 1, characterized in that, The fork-tooth transplanting mechanism (2) includes a translation guide rail (21), which is horizontally arranged, and a drive motor (22) is provided at one end. A sliding block (23) is slidably arranged on the translation guide rail (21), and the sliding block (23) is connected to the drive motor (22) in a transmission connection. The movable Bernoulli suction cup structure (1) is fixed to the sliding block (23).

4. The four-piece transition feeding device as described in claim 1, characterized in that, It also includes a control unit electrically connected to the drive unit of the movable Bernoulli suction cup structure (1) and the fork tooth transfer mechanism (2), and is configured to control the movable Bernoulli suction cup structure (1) to adsorb silicon wafers and control the fork tooth transfer mechanism (2) to transfer silicon wafers.

5. A quad transition blanking device characterized by, include: A movable Bernoulli suction cup structure (1), which is located at the unloading end of the equipment, includes: Variable pitch drive mechanism (12) and two Bernoulli suction cups (10); One Bernoulli suction cup (10) is fixed to the side wall of the frame, and the other Bernoulli suction cup (10) is fixed to the movable end of the variable pitch drive mechanism (12); The variable pitch drive mechanism (12) is adapted to adjust the distance between two adjacent Bernoulli chucks (10) to accommodate silicon wafers of different sizes.

6. The four-piece transition feeding device as described in claim 5, characterized in that, The variable pitch drive mechanism includes: an adjustment motor (13), which is vertically mounted on the side wall of the frame; Driven shaft (14) is rotatably mounted at the end of the frame away from the regulating motor (13); Adjusting belt (15) is sleeved on the outer wall of the shaft of driven shaft (14) and adjusting motor (13); A fixing block (16) is fixed to an adjusting belt (15), and a Bernoulli suction cup (10) is fixed to the fixing block (16).

7. A battery cell testing machine characterized by, A quaterion transition blanking device as claimed in any one of claims 1 to 6.

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