Heat dissipation structure of electrical connector based on phonon engineering and biomimetic technology

Abstract

The utility model discloses belong to the technical field of electric connector, concretely for the electric connector heat radiation structure based on phonon engineering and bionic technology, including the connector casing and the conductive terminal of setting in the inside of connector casing, still including the phonon optimization layer of close adhesion with conductive terminal, the phonon optimization layer outer periphery is provided with phase change heat storage device, phase change heat storage device and bionic honeycomb structure close contact, be equipped with the ventilation grid on the connector casing, and its surface covers bionic radiation heat dissipation layer. The utility model solves the interface thermal resistance bottleneck problem of the phonon spectrum mismatch of material through the introduction phonon optimization layer, and through the synergistic work with bionic heat dissipation structure, greatly improves the heat dissipation efficiency, forms a complete, efficient, passive heat dissipation solution scheme from heat source to environment.

Description

Technical Field

[0001] This utility model relates to the field of electrical connector technology, specifically to a heat dissipation structure for electrical connectors based on phonon engineering and biomimetic technology. Background Technology

[0002] As a core component in electrical and electronic systems for energy transmission and signal exchange, the thermal stability and power handling capacity of electrical connectors directly determine the reliability of the entire system. Currently, electronic devices are evolving towards high power density and extreme miniaturization, leading to a sharp increase in the heat accumulated by electrical connectors under rated operating conditions due to the Joule effect, as well as the peak heat flux density generated during instantaneous overload.

[0003] Traditional thermal management solutions, such as increasing the connector housing surface area to enhance natural convection or adding external metal heat sinks, have reached near-physical limits in terms of heat dissipation efficiency. These solutions inherently rely on slow heat conduction and convection, resulting in significant thermal delay. When a system experiences a transient high-current surge, heat is instantly generated at the conductive terminals. Traditional heat dissipation structures, unable to achieve rapid heat response and on-site heat management, cause heat accumulation, leading to a spike in terminal temperature. This periodic or sudden high-temperature shock drastically accelerates electrochemical corrosion and oxidation of the conductive terminal contact surfaces and promotes thermal aging and deformation of the insulating polymer material, ultimately leading to a severe increase in contact resistance, deterioration of connector electrical performance, and even permanent connector failure due to localized overheating, posing a serious safety hazard to system operation. Therefore, overcoming the response speed and capacity bottlenecks of traditional heat dissipation methods to achieve efficient absorption and intelligent management of instantaneous peak heat has become a core technical challenge that urgently needs to be addressed by those skilled in the art. Therefore, this invention proposes a heat dissipation structure for electrical connectors based on phonon engineering and biomimetic technology. Utility Model Content

[0004] To solve the above-mentioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution:

[0005] The heat dissipation structure of the electrical connector based on phonon engineering and biomimetic technology includes a connector housing and conductive terminals disposed inside the connector housing, and a phonon optimization layer that is tightly attached to the conductive terminals. The side of the connector housing is provided with a biomimetic honeycomb structure, and a phase change heat storage device is provided on the outer periphery of the phonon optimization layer. The phase change heat storage device is in close contact with the biomimetic honeycomb structure, and the phase change heat storage device is filled with phase change material. The connector housing is provided with a ventilation grille, and its surface is covered with a biomimetic radiative heat dissipation layer.

[0006] As a preferred embodiment of the heat dissipation structure of the electrical connector based on phonon engineering and biomimetic technology described in this utility model, the phonon optimization layer is made of nano-silver paste.

[0007] As a preferred embodiment of the heat dissipation structure of the electrical connector based on phonon engineering and biomimetic technology described in this utility model, the phase change material is a paraffin-based composite phase change material.

[0008] As a preferred embodiment of the heat dissipation structure of the electrical connector based on phonon engineering and biomimetic technology described in this utility model, the biomimetic honeycomb structure is a periodically arranged metal hexagonal hole unit.

[0009] As a preferred embodiment of the heat dissipation structure of the electrical connector based on phonon engineering and biomimetic technology described in this utility model, the biomimetic radiation heat dissipation layer is a micro-nano structure layer processed by femtosecond laser.

[0010] Compared with existing technologies:

[0011] 1. Extreme heat dissipation efficiency across scales: The phonon optimization layer solves the interface thermal resistance bottleneck at the microscopic level, ensuring efficient heat removal from the heat source; at the same time, the macroscopic biomimetic honeycomb structure and the biomimetic radiative heat dissipation layer work together to achieve rapid heat diffusion and ultimate dissipation, forming a complete and efficient heat dissipation chain from the nanometer to the millimeter scale.

[0012] 2. Intelligent peak thermal management capability: The integrated phase change thermal storage device absorbs and stores a large amount of thermal energy during solid-liquid conversion by utilizing the latent heat of phase change. Its isothermal phase change characteristics can instantly "smooth out" temperature peaks, providing excellent thermal shock buffer for the system and significantly improving the stability of the connector under dynamic loads.

[0013] 3. Completely passive high-reliability operation: The entire heat dissipation system requires no external energy input and has no moving parts. It works spontaneously entirely by relying on physical effects such as phonon transport, latent heat of phase change, convection and radiation. The system is robust and durable, achieving high reliability and maintenance-free long-term operation.

[0014] 4. Future-proof power density potential: This structure greatly improves heat dissipation per unit volume by synergistically combining multiple physical effects, enabling electrical connectors to adapt to higher power density design requirements and providing a key thermal management solution for next-generation high-power electronic devices. Attached Figure Description

[0015] Figure 1 This is a frontal sectional view of the present invention.

[0016] In the diagram: 1. Conductive terminal; 2. Connector housing; 3. Phonon optimization layer; 4. Phase change material; 5. Phase change thermal storage device; 6. Bionic honeycomb structure; 7. Bionic radiative heat dissipation layer. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0018] This utility model provides a heat dissipation structure for electrical connectors based on phonon engineering and biomimetic technology. Please refer to [link / reference]. Figure 1 The connector includes a connector housing 2 and conductive terminals 1 disposed inside the connector housing 2. It also includes a phonon optimization layer 3 tightly fitted to the conductive terminals 1. The connector housing 2 has a biomimetic honeycomb structure 6 on its side. A phase change heat storage device 5 is disposed around the outer periphery of the phonon optimization layer 3, and the phase change heat storage device 5 is in close contact with the biomimetic honeycomb structure 6. The connector housing 2 has ventilation grilles, and its surface is covered with a biomimetic radiative heat dissipation layer 7. The conductive terminals 1 are made of T2 copper, cold-extruded and then silver-plated to effectively reduce contact resistance and oxidation risk. Their length is designed according to the connector mating depth. The connector housing 2 is made of modified PA66 engineering plastic, possessing excellent insulation properties. Ventilation grilles are symmetrically opened on both sides of the connector housing 2 to form convection channels. The phonon optimization layer 3 enables efficient heat conduction from the conductive terminal 1 to the phase change heat storage device 5. The phase change heat storage device 5 uses the phase change material 4 to absorb and store instantaneous heat. The biomimetic honeycomb structure 6 then efficiently diffuses the stored heat to the ventilation grille. Finally, the biomimetic radiative heat dissipation layer 7 covering the ventilation grille dissipates the heat to the external environment, forming a complete, efficient, and passive heat dissipation path from the heat source to the environment.

[0019] The phonon optimization layer 3 uses nano-silver paste with a particle size of 50-100 nm. Its shape is a thin layer tightly wrapping the outer surface of the conductive terminal 1 to achieve optimal phonon transmission efficiency. Specifically, it is coated onto the outer surface of the conductive terminal 1 using a screen printing process, covering all heat-generating areas of the conductive terminal 1 except for the mating end. When the connector is working, the conductive terminal 1 generates a large amount of heat due to carrying a large current. This heat is transferred to the phonon optimization layer 3 in the form of phonons through the contact interface. Because the nano-silver paste has extremely high thermal conductivity and excellent phonon transmission characteristics, it can effectively reduce interfacial thermal resistance and rapidly conduct heat to the outer phase change thermal storage device 5.

[0020] The phase change heat storage device 5 is a rectangular cavity made of stainless steel, and the cavity size is adapted to the overall outline of the conductive terminals and the phonon optimization layer. The phase change heat storage device 5 is filled with phase change material 4, which is a paraffin-based composite phase change material. It has high latent heat of phase change and strong thermal conductivity, which can effectively absorb instantaneous heat, suppress temperature peaks, and maintain a relatively stable temperature during the phase change process, ensuring the normal operation of the connector.

[0021] The biomimetic honeycomb structure 6 is a periodically arranged metal hexagonal hole unit that maintains close contact with the outer surface of the phase change heat storage device 5. Through biomimetic design, it achieves the maximum heat dissipation surface area in a limited space, providing an efficient channel for heat diffusion. The biomimetic honeycomb structure 6 is made of 6061 aluminum alloy by die casting, and the surface of the structure is anodized to improve corrosion resistance and heat conduction efficiency.

[0022] The biomimetic radiation heat dissipation layer 7 is a micro-nano structure layer processed by femtosecond laser. Specifically, it is prepared on the outer surface of the connector housing 2 using femtosecond laser processing technology. A periodic micro-nano groove structure is formed on the ventilation grille and outer surface of the connector housing 2. Its infrared emissivity in the wavelength range of 8-13 micrometers is greater than 0.9, while its solar light absorption rate in the wavelength range of 0.3-2.5 micrometers is less than 0.2, so as to achieve a passive radiation cooling effect.

[0023] In practical applications, when the electrical connector carries a large current, the conductive terminal 1 generates significant heat due to the Joule effect. This heat is first efficiently conducted through the phonon optimization layer 3, which significantly improves heat flux density transfer efficiency by reducing interfacial phonon scattering. When the heat flux is transferred to the phase change thermal storage device 5, the paraffin-based composite phase change material 4 undergoes a solid-liquid phase change after reaching the phase change temperature. This process absorbs a large amount of latent heat of phase change, effectively suppressing the system's temperature peak while maintaining a near-isothermal state, thus achieving intelligent buffering against transient thermal shocks.

[0024] Subsequently, the stored heat is transferred to the biomimetic honeycomb structure 6. This structure utilizes its porous topology to create a maximum heat dissipation area within a limited space, promoting spatially uniform heat distribution by enhancing convective heat transfer efficiency. At the same time, the biomimetic radiative heat dissipation layer 7 covering the surface of the ventilation grille dissipates heat directly to the external environment in the form of infrared radiation through the 8-13μm atmospheric window band.

[0025] After the load condition is reduced, the phase change material 4 gradually releases the stored heat through the reverse phase change process. This process continues under the synergistic heat dissipation effect of the biomimetic honeycomb structure 6 and the biomimetic radiative heat dissipation layer 7, and finally enables the phase change heat storage device 5 to complete the thermal cycle reset, so as to prepare for energy storage in the event of subsequent thermal shock.

[0026] This structure establishes a complete, efficient, and passive thermal management path from heat source to environment through a multi-level collaborative mechanism of "phonon transport - phase change energy storage - biomimetic heat dissipation," ensuring the thermal reliability and long-term operational stability of the electrical connector under dynamic operating conditions.

[0027] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A heat dissipation structure for an electrical connector based on phonon engineering and biomimetic technology, comprising a connector housing (2) and conductive terminals (1) disposed inside the connector housing (2), characterized in that: It also includes a phonon optimization layer (3) that is closely attached to the conductive terminal (1), a biomimetic honeycomb structure (6) is provided on the side of the connector housing (2), a phase change heat storage device (5) is provided on the outer periphery of the phonon optimization layer (3), the phase change heat storage device (5) is in close contact with the biomimetic honeycomb structure (6), the phase change heat storage device (5) is filled with phase change material (4), and a ventilation grille is provided on the connector housing (2), the surface of which is covered with a biomimetic radiation heat dissipation layer (7).

2. The heat dissipation structure of the electrical connector based on phonon engineering and biomimetic technology according to claim 1, characterized in that, The phonon optimization layer (3) is made of nano-silver paste.

3. The heat dissipation structure of the electrical connector based on phonon engineering and biomimetic technology according to claim 1, characterized in that, The phase change material (4) is a paraffin-based composite phase change material.

4. The heat dissipation structure of the electrical connector based on phonon engineering and biomimetic technology according to claim 1, characterized in that, The biomimetic honeycomb structure (6) consists of periodically arranged metal hexagonal perforated units.

5. The heat dissipation structure of the electrical connector based on phonon engineering and biomimetic technology according to claim 1, characterized in that, The biomimetic radiation heat dissipation layer (7) is a micro-nano structure layer processed by femtosecond laser.

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