Laser processing system and laser processing apparatus

Abstract

The application discloses a laser processing system and a laser processing device. The laser processing system comprises a phase modulation device, a rotating driving device and a focusing objective arranged in sequence in an optical path. The phase modulation device is used for spatial phase modulation of the laser beam to form a multi-focal light field distribution. The rotating driving device is a hollow structure, the laser beam passes through the hollow region of the rotating driving device, and the rotating driving device drives the phase modulation device to rotate around the optical axis of the laser beam to perform rotational modulation on the phase of the spatially phase-modulated laser beam. The focusing objective is used for focusing the rotationally modulated laser beam to a workpiece. The hollow coaxial rotating driving device design is adopted, and the laser beam can directly pass through, so that the optical path layout is simplified.

Description

Technical Field

[0001] This application relates to the field of laser processing, and in particular to a laser processing system and laser processing equipment. Background Technology

[0002] In the field of laser processing, especially for the precision cutting and chamfering of hard and brittle materials such as glass and sapphire, phase modulation devices are often used to shape the beam into a non-rotationally symmetric optical field distribution in order to obtain specific processing morphologies. However, when the processing path is curved or has a complex contour, to ensure consistent processing results, the spatial distribution direction of the customized optical field must follow the tangent direction of the processing path in real time. In related technologies, the entire phase modulation device and its supporting structure are usually placed on a rotating mechanism outside the optical path, resulting in an excessively large overall system. Utility Model Content

[0003] This application provides a laser processing system and laser processing equipment, simplifying the layout of the laser processing system.

[0004] The laser processing system provided in this application includes, sequentially arranged along the optical path:

[0005] A phase modulation device for spatially phase modulating a laser beam to form a multi-focal optical field distribution;

[0006] A rotary driving device, wherein the rotary driving device has a hollow structure, the laser beam passes through the hollow region of the rotary driving device, and the rotary driving device drives the phase modulation device to rotate around the optical axis of the laser beam, so as to perform rotational modulation on the phase of the spatially phase-modulated laser beam; and

[0007] A focusing objective lens is used to focus a rotationally modulated laser beam onto a workpiece.

[0008] Optionally, the phase modulation device includes a diffractive optical element, which is used to spatially phase modulate the laser beam to form a multifocal optical field distribution.

[0009] The diffractive optical element is mounted on the rotation drive device, which drives the diffractive optical element to rotate around the optical axis, thereby causing the phase of the laser beam in the diffractive optical element to be rotated and modulated.

[0010] Optionally, the laser processing system includes a 4f optical system located between the rotation drive device and the focusing objective, the 4f optical system being used to transmit the spatially phase-modulated laser beam to the focusing objective.

[0011] Optionally, the phase modulation device includes a diffractive optical element, which is used to spatially phase modulate the laser beam to form a multifocal optical field distribution.

[0012] The phase modulation device further includes a rotating prism, which is installed in the hollow region. The rotation driving device drives the rotating prism to rotate around the optical axis, thereby causing the phase of the laser beam after spatial phase modulation to be rotated and modulated.

[0013] Optionally, the phase modulation device includes a prism and a spatial light modulator, wherein the prism reflects the laser beam onto the spatial light modulator, and the spatial light modulator is used to spatially phase modulate the laser beam;

[0014] The phase modulation device further includes a rotating prism, which is installed in the hollow region. The rotation driving device drives the rotating prism to rotate around the optical axis, thereby causing the phase of the laser beam after spatial phase modulation to be rotated and modulated.

[0015] Optionally, the rotating prism includes at least one of a Dowell prism, a Schmidt-Behan prism, a rotating K-mirror, or an Abbe cemented prism.

[0016] Optionally, the laser processing system includes a 4f optical system located between the phase modulation device and the rotation drive device, the 4f optical system being used to transmit the spatially phase-modulated laser beam to the focusing objective.

[0017] Optionally, the laser processing system further includes a controller electrically connected to the rotary drive device, the controller being configured to control the rotation angle of the rotary drive device according to a predetermined processing path, so that the angle between the phase distribution direction of the laser beam and the tangential direction of the processing path remains unchanged.

[0018] Optionally, the laser processing system includes a rangefinder located between the rotary drive device and the focusing objective lens, the rangefinder being used to measure the surface flatness of the workpiece.

[0019] The laser processing equipment provided in this application includes:

[0020] The laser processing system described in any of the above embodiments; and

[0021] A wet etching apparatus is used to perform wet etching on the workpiece processed by the laser processing system.

[0022] In the laser processing system and laser processing equipment of this application, the laser beam, after being formed into a multifocal light field by a phase modulation device, passes through a hollow rotating drive device. The rotating drive device drives the phase modulation device to rotate around the optical axis to dynamically rotate and modulate the phase of the light field. Then, it is focused onto the workpiece by a focusing objective lens, achieving real-time matching between the multifocal direction and the processing trajectory. Because a hollow coaxial rotating drive device is used, the laser beam can pass directly through, simplifying the optical path layout. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the laser processing system provided in the embodiments of this application.

[0025] Figure 2 This is another structural schematic diagram of the laser processing system provided in the embodiments of this application.

[0026] Figure 3 This is another structural schematic diagram of the laser processing system provided in an embodiment of this application.

[0027] Explanation of icon numbers:

[0028] Laser processing system 100, phase modulation device 10, diffractive optical element 11, prism 12, spatial light modulator 13, rotating prism 14, rotation drive device 20, hollow region 201, focusing objective lens 30, 4f optical system 40, first lens 41, second lens 42, rangefinder 50, aperture 61, reflecting mirror 62, dichroic mirror 63.

[0029] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0031] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0032] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0033] It should be understood that the term "and / or" as used in this application specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0035] Please see Figure 1 The laser processing system 100 provided in this application includes a phase modulation device 10, a rotation drive device 20, and a focusing objective lens 30 arranged sequentially along the optical path. The phase modulation device 10 is used to spatially phase modulate the laser beam to form a multi-focal optical field distribution. The rotation drive device 20 has a hollow structure, through which the laser beam passes. The rotation drive device 20 drives the phase modulation device 10 to rotate around the optical axis of the laser beam, thereby performing rotational modulation on the phase of the spatially phase-modulated laser beam. The focusing objective lens 30 is used to focus the rotationally modulated laser beam onto the workpiece 300.

[0036] After the incident laser beam reaches the phase modulation device 10, the phase modulation device 10 performs spatial phase modulation on the laser beam, changing the light field distribution to form multiple discrete focal points on the focal plane, i.e., a multi-focal light field distribution. The multi-focal distribution allows multiple positions within the material of the workpiece 300 to be processed simultaneously, thereby improving processing efficiency.

[0037] After spatial phase modulation, a multifocal laser beam with a specific spatial distribution is formed and then enters the rotation drive device 20. The rotation drive device 20 is used to drive the optical axis of the phase modulation device 10 to rotate, with the rotation axis coinciding with the optical axis of the laser beam to avoid introducing optical axis offset or aberrations during rotation. As the phase modulation device 10 rotates, the phase of the entire multifocal optical field is rotated synchronously, thereby causing a change in the orientation of the multifocal array in space. For example, the initial multifocal line is horizontal, and when the rotation drive device 20 drives the phase modulation device 10 to rotate 30 degrees, the focal line also rotates 30 degrees.

[0038] The rotary drive device 20 has a hollow structure, and the laser beam passes precisely through the hollow region 201 at the center of the rotary drive device 20. This ensures that the laser beam path is not blocked or deflected by the mechanical structure of the rotary drive device 20, guaranteeing the integrity of the beam path and the quality of the beam. The rotary drive device 20 can be a hollow torque motor, a hollow servo motor, or a stepper motor with a hollow shaft, etc. The rotor of the rotary drive device 20 has a through-hole hollow region 201 at its center. The diameter of the hollow region 201 is slightly larger than the spot diameter of the laser beam, ensuring that the laser beam can pass through without obstruction.

[0039] The rotation drive device 20 can be controlled in real time according to the processing trajectory direction to rotate and modulate the beam, ensuring that the corresponding multi-focal distribution direction matches the required edge chamfering orientation. That is, the angle between the chamfering direction and the processing direction remains unchanged. Thus, the edge processing of hard and brittle transparent materials can be carried out in one step under curved and complex processing trajectories, ensuring the uniformity and smoothness of the processed edge.

[0040] A laser beam, modulated by rotation, is incident on a focusing lens 30. The focusing lens 30 focuses the dynamically rotating multifocal light field onto the interior or surface of the workpiece 300, which can be made of hard and brittle materials such as glass or sapphire. Under the action of the ultrafast laser, the material of the workpiece 300 undergoes nonlinear absorption in the focal region, forming a modified region. Subsequently, the workpiece 300 is placed in an acid or alkaline solution for wet etching. Because the modified region is more susceptible to corrosion, its etching rate differs from that of the unmodified region in the solution by more than 100 times, thereby forming the desired chamfer shape in the modified region to achieve chamfering.

[0041] Optionally, the laser processing system 100 also includes a controller (not shown), electrically connected to the rotary drive device 20. The controller is configured to control the rotation angle of the rotary drive device 20 according to a predetermined processing path, so that the angle between the phase distribution direction of the laser beam and the tangential direction of the processing path remains unchanged. Through real-time control by the controller, regardless of whether the processing path is an arc or other complex curve, the angle between the multifocal direction of the laser beam and the processing direction remains constant, thereby ensuring processing quality.

[0042] During operation, the controller calculates the required optical field direction based on the preset processing trajectory and sends a pulse signal to the rotary drive device 20. The rotary drive device 20 rotates according to the signal, thereby causing the laser beam after spatial phase modulation to rotate by a corresponding angle, ensuring that the angle between the multi-focal distribution direction of the laser beam after spatial modulation and rotation modulation on the processing surface and the processing direction remains unchanged.

[0043] In the laser processing system 100 of this application, after the laser beam is formed into a multifocal light field by the phase modulation device 10, it passes through the hollow rotary drive device 20. The rotary drive device 20 drives the phase modulation device 10 to rotate around the optical axis to dynamically modulate the phase of the light field. Then, it is focused onto the workpiece 300 by the focusing objective lens 30, realizing real-time matching between the multifocal direction and the processing trajectory. Because a hollow coaxial rotary drive device 20 is used, the laser beam can pass directly through it, eliminating the need for additional optical path steering components and simplifying the optical path layout.

[0044] Please see Figure 1 Optionally, the phase modulation device 10 includes a diffractive optical element 11, which is used to spatially phase modulate the laser beam to form a multi-focal optical field distribution. The diffractive optical element 11 is mounted on a rotation drive device 20, which drives the diffractive optical element 11 to rotate around the optical axis, thereby causing rotational modulation of the phase of the laser beam within the diffractive optical element 11. By driving the diffractive optical element 11 to rotate, spatial phase modulation of the laser beam is achieved simultaneously with rotational phase modulation, resulting in a more compact optical path structure and a faster response speed.

[0045] Specifically, the diffractive optical element 11 (DOE) is an optical element that uses micro- and nano-structures to control the diffraction characteristics of light waves to achieve functions such as beam shaping or beam splitting. The surface of the diffractive optical element 11 is engraved with relief structures. When a laser beam passes through the diffractive optical element 11, its spatial phase is modulated, thereby changing the spatial distribution of the light field and forming a multifocal distribution.

[0046] The diffractive optical element 11 can be mounted above the rotary drive device 20, so that the laser beam passes through the diffractive optical element 11 first and then through the central region of the rotary drive device 20. The diffractive optical element 11 is connected to the output end of the rotary drive device 20, and the optical center of the diffractive optical element 11 coincides with the rotation axis of the rotary drive device 20. The output end of the rotary drive device 20 rotates around the optical axis, thereby driving the diffractive optical element 11 to rotate together around the optical axis of the laser beam.

[0047] The spatial distribution of the multifocal optical field is determined by the phase structure of the diffractive optical element 11. When the diffractive optical element 11 rotates as a whole, the optical field pattern it generates also rotates synchronously. Therefore, the rotating diffractive optical element 11 modulates the phase of the laser beam in both spatial and rotational ways.

[0048] Optionally, the laser processing system 100 includes a 4f optical system 40, which is located between the rotation drive device 20 and the focusing objective lens 30. The 4f optical system 40 is used to transmit the spatially phase-modulated laser beam to the focusing objective lens 30. The 4f optical system 40 can fix the optical path difference, improve system stability, and transmit the multifocal light field generated by the phase modulation device 10 to the focal plane of the focusing objective lens 30.

[0049] The 4f optical system 40 may include a first lens 41 and a second lens 42. The focal length of the first lens 41 is a first focal length f1, the focal length of the second lens 42 is a second focal length f2, and the focal length of the focusing objective lens 30 is a third focal length f3. The first lens 41 is positioned close to the rotation drive device 20. The distance between the first lens 41 and the diffractive optical element 11 is the first focal length f1. The distance between the second lens 42 and the first lens 41 is the sum of the first focal length f1 and the second focal length f2. The distance between the second lens 42 and the focusing objective lens 30 is the sum of the second focal length f2 and the third focal length f3.

[0050] By setting the lens spacing as described above, it is ensured that the multifocal light field generated by the diffractive optical element 11 can be relayed to the focal plane of the focusing objective lens 30 without distortion, thereby reproducing the predetermined modified pattern on the workpiece 300.

[0051] Please see Figure 2 Optionally, the phase modulation device 10 includes a diffractive optical element 11, which is used to spatially phase modulate the laser beam to form a multi-focal optical field distribution. The phase modulation device 10 also includes a rotating prism 14, which is installed in the hollow region 201. The rotation drive device 20 drives the rotating prism 14 to rotate around the optical axis, thereby causing the phase of the spatially phase-modulated laser beam to be rotated and modulated.

[0052] By controlling the angle of the rotary drive device 20, the direction of the multifocal optical field on the workpiece 300 can be controlled. During this process, the phase modulation device 10, that is, the diffractive optical element 11, remains stationary, thereby reducing the requirements for the mechanical stability of the diffractive optical element 11 during installation.

[0053] Specifically, the rotating prism 14 is installed and fixed within the hollow region 201. The rotating prism 14 can change or invert the image direction. When the rotating drive device 20 drives the rotating prism 14 to rotate around the optical axis, the phase modulation of the laser beam also rotates accordingly, thus realizing optical field rotation modulation. Similarly, the multi-focal orientation of the beam can be adjusted, so that the multi-focal orientation of the beam matches the processing path direction, ensuring that the angle between the multi-focal direction and the processing direction remains unchanged.

[0054] Please see Figure 3 Optionally, the phase modulation device 10 includes a prism 12 and a spatial light modulator 13. The prism 12 reflects the laser beam onto the spatial light modulator 13, which is used to spatially phase modulate the laser beam. The phase modulation device also includes a rotating prism 14, which is housed within the hollow region 201. The rotation drive device 20 drives the rotating prism 14 to rotate around the optical axis, thereby causing the phase of the spatially phase-modulated laser beam to undergo rotational modulation.

[0055] The spatial light modulator 13 makes the laser processing system 100 flexible. Without changing the hardware, the pattern or number of multi-focus points can be changed in real time through software programming so that the laser processing system 100 can meet different processing needs.

[0056] The spatial light modulator (SLM) 13 is a programmable active optical device where each pixel on its panel can be independently controlled. By loading a computer-generated hologram, the laser beam undergoes flexible and dynamic spatial phase modulation to generate the desired multifocal light field distribution. The incident laser beam is first reflected by prism 12 to change its propagation path before entering the working surface of the spatial light modulator 13 at a specific angle. After spatial phase modulation, the laser beam is reflected back to prism 12 along its original path and then reflected again by prism 12 before entering the downstream rotating prism 14. When the rotation drive device 20 drives the rotating prism 14 to rotate around the optical axis, the multifocal light field generated by the spatial light modulator 13 also rotates accordingly, thus achieving rotational phase modulation.

[0057] Optionally, the rotating prism 14 may include at least one of a Dowell prism, a Schmidt-Behan prism, a rotating K-mirror, or an Abbe cemented prism. When the rotating prism 14 rotates, it drives the light field distribution to rotate synchronously, thereby ensuring that the orientation of the multifocal pattern can be modulated in real time and accurately to meet the needs of complex trajectory processing.

[0058] In this system, the incident laser beam is inverted 180° after passing through the Dowell prism, and the change in image angle when the Dowell prism is rotated is twice the rotation angle of the Dowell prism. The Schmidt-Behan prism provides good light transmission performance and image rotation stability. The rotating K-mirror is a reflective image rotation prism composed of two mirrors at a specific angle. The Abbe cemented prism is formed by optically cementing two or more prisms, achieving image rotation while maintaining a certain level of imaging quality. Therefore, different rotating prisms can be selected according to different processing requirements.

[0059] Optionally, the laser processing system 100 includes a 4f optical system 40, which is located between the phase modulation device 10 and the rotation drive device 20. The 4f optical system 40 is used to transmit the spatially phase-modulated laser beam to the focusing objective lens 30. The 4f optical system 40 can fix the optical path difference, improve system stability, and transmit the multifocal light field generated by the phase modulation device 10 to the focal plane of the focusing objective lens 30.

[0060] The 4f optical system 40 may include a first lens 41 and a second lens 42. The focal length of the first lens 41 is a first focal length f1, the focal length of the second lens 42 is a second focal length f2, and the focal length of the focusing objective lens 30 is a third focal length f3. The first lens 41 is positioned close to the phase modulation device 10. The distance between the first lens 41 and the diffractive optical element 11 or the spatial light modulator 13 is the first focal length f1. The distance between the second lens 42 and the first lens 41 is the sum of the first focal length f1 and the second focal length f2. The distance between the second lens 42 and the focusing objective lens 30 is the sum of the second focal length f2 and the third focal length f3.

[0061] By setting the lens spacing as described above, it is ensured that the multifocal light field generated by the diffractive optical element 11 or the spatial light modulator 13 can be relayed to the focal plane of the focusing objective lens 30 without distortion, thereby reproducing the predetermined modified pattern on the workpiece 300.

[0062] Optionally, the laser processing system 100 includes a rangefinder 50 located between the rotary drive device 20 and the focusing objective lens 30. The rangefinder 50 is used to measure the surface flatness of the workpiece 300. By measuring the positional information of the workpiece 300 surface using the rangefinder 50, surface flatness or axial position data relative to the focusing objective lens 30 can be obtained, thereby improving the adaptability of the processing to surface undulations of the workpiece 300.

[0063] Specifically, the rangefinder 50 is positioned between the downstream of the rotation drive device 20 and the upstream of the focusing objective lens 30. The rangefinder 50 can be a non-contact, high-precision sensor such as a laser triangulation type, confocal dispersion type, or spectral interferometer type.

[0064] During actual processing, the rangefinder 50 continuously emits a probe beam towards the test point on the workpiece 300 and receives the return signal. An internal algorithm calculates the height of the workpiece 300 surface at that point. The collected flatness information is fed back to the controller in real time, which then performs dynamic focal spot compensation on this data.

[0065] When an undulation is detected on the surface of the workpiece 300, the controller can drive the focusing objective lens 30 to move up and down to fine-tune the effective focal length of the focusing objective lens 30, ensuring that the focus of the laser beam always falls precisely on the surface or a predetermined depth inside the workpiece 300, avoiding a decrease in processing quality due to defocusing.

[0066] The laser processing system 100 may also include a dichroic mirror 63. Through the beam combining and splitting design of the dichroic mirror 63, it is ensured that the processing laser and the measuring laser emitted by the rangefinder 50 are always focused on the same point on the surface of the workpiece 300, thereby improving the accuracy and reliability of the measurement.

[0067] Optionally, the laser processing system 100 may also include an aperture 61, which is used to limit the effective aperture of the laser beam or filter out higher-order diffraction stray light, thereby improving the quality and contrast of the final focused spot.

[0068] The number of aperture stops 61 can be multiple, and the aperture stops 61 can be set at appropriate positions in the optical path. For example, the aperture stops 61 can be set in the optical path before the laser beam is incident on the phase modulation device 10, or the aperture stops 61 can be set at the spectral plane of the 4f optical system 40, or the aperture stops 61 can be set downstream of the rotation drive device 20.

[0069] Furthermore, to reduce the space occupied by the laser processing system 100, one or more reflectors 62 can be introduced into the optical path of the laser processing system 100. The reflectors 62 are used to change the propagation direction of the laser beam, so that core modules such as the phase modulation device 10, the rotation drive device 20, the 4f optical system 40, and the focusing objective lens 30 can be installed in a more compact layout.

[0070] The laser processing equipment provided in this application includes a laser processing system 100 according to any of the above embodiments and a wet etching apparatus. The wet etching apparatus is used to perform wet etching on the workpiece 300 processed by the laser processing system 100. Since the laser processing equipment of this application adopts the laser processing system 100 described above, it has at least the beneficial effects of the laser processing system 100 described above, which will not be repeated here.

[0071] The laser light field is controlled in space by a phase modulation device 10, such as a spatial light modulator 13 or a diffractive optical element 11. After being focused by a focusing objective lens 30 within the workpiece 300, a controllable spatial chamfered distribution shape is formed. The extremely high peak power laser instantaneously excites the workpiece 300 to form a plasma state, resulting in micro-explosions within the workpiece 300 and irreversible material modification.

[0072] After the material of workpiece 300 is modified, the efficiency of wet etching in the modified area is more than 100 times faster than that in the unmodified area. For some materials, the etching rate difference can reach thousands of times. Therefore, a wet etching apparatus is used to perform wet etching on workpiece 300, thereby achieving the separation of workpiece 300 to form the required chamfer shape in the modified area. Through the wet etching process, a one-step chamfering process for hard and brittle materials can be achieved, effectively reducing processing steps and improving processing efficiency.

[0073] The above are merely preferred embodiments of this application and do not limit the scope of the patent application. Any equivalent structural transformations made based on the inventive concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the scope of patent protection of this application.

Claims

1. A laser processing system, characterized in that, Including those arranged sequentially along the optical path: A phase modulation device for spatially phase modulating a laser beam to form a multi-focal optical field distribution; A rotary driving device, wherein the rotary driving device has a hollow structure, the laser beam passes through the hollow area of ​​the rotary driving device, and the rotary driving device drives the phase modulation device to rotate around the optical axis of the laser beam, so as to perform rotational modulation on the phase of the laser beam after spatial phase modulation. as well as A focusing objective lens is used to focus a rotationally modulated laser beam onto a workpiece.

2. The laser processing system according to claim 1, characterized in that, The phase modulation device includes a diffractive optical element, which is used to spatially phase modulate the laser beam to form a multi-focal optical field distribution. The diffractive optical element is mounted on the rotation drive device, which drives the diffractive optical element to rotate around the optical axis, thereby causing the phase of the laser beam in the diffractive optical element to be rotated and modulated.

3. The laser processing system according to claim 2, characterized in that, The laser processing system includes a 4f optical system located between the rotation drive device and the focusing objective lens. The 4f optical system is used to transmit the spatially phase-modulated laser beam to the focusing objective lens.

4. The laser processing system according to claim 1, characterized in that, The phase modulation device includes a diffractive optical element, which is used to spatially phase modulate the laser beam to form a multi-focal optical field distribution. The phase modulation device further includes a rotating prism, which is installed in the hollow region. The rotation driving device drives the rotating prism to rotate around the optical axis, thereby causing the phase of the laser beam after spatial phase modulation to be rotated and modulated.

5. The laser processing system according to claim 1, characterized in that, The phase modulation device includes a prism and a spatial light modulator. The prism reflects the laser beam onto the spatial light modulator, and the spatial light modulator is used to perform spatial phase modulation on the laser beam. The phase modulation device further includes a rotating prism, which is installed in the hollow region. The rotation driving device drives the rotating prism to rotate around the optical axis, thereby causing the phase of the laser beam after spatial phase modulation to be rotated and modulated.

6. The laser processing system according to claim 4 or 5, characterized in that, The rotating prism includes at least one of the following: a Dove prism, a Schmidt-Behan prism, a rotating K-prism, or an Abbe cemented prism.

7. The laser processing system according to claim 4 or 5, characterized in that, The laser processing system includes a 4f optical system located between the phase modulation device and the rotation drive device. The 4f optical system is used to transmit the spatially phase-modulated laser beam to the focusing objective.

8. The laser processing system according to claim 1, characterized in that, The laser processing system further includes a controller electrically connected to the rotary drive device. The controller is configured to control the rotation angle of the rotary drive device according to a predetermined processing path, so that the angle between the phase distribution direction of the laser beam and the tangential direction of the processing path remains unchanged.

9. The laser processing system according to claim 1, characterized in that, The laser processing system includes a rangefinder located between the rotary drive device and the focusing objective lens, and the rangefinder is used to measure the surface flatness of the workpiece.

10. A laser processing device, characterized in that, include: The laser processing system according to any one of claims 1 to 9; and A wet etching apparatus is used to perform wet etching on the workpiece processed by the laser processing system.

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