Battery cover plate assembly and electronic device

Abstract

The application relates to the field of electronic device assembly, and provides a battery cover plate assembly and an electronic device. The battery cover plate assembly comprises: a back plate stack layer comprising a plurality of support layer units stacked in a thickness direction, part of the support layer units are provided with avoiding areas, and a plurality of the avoiding areas are combined to form a mounting cavity; a sensing and interaction module fixed in the mounting cavity; and a circuit connection assembly electrically connected with the sensing and interaction module at one end and extending out of the mounting cavity and forming an electrical output end of the sensing and interaction module. The battery cover plate assembly provided by the application can effectively solve the problems of the electronic device module in the prior art, such as unstable installation, large increase in the thickness size of the device after installation, and low assembly efficiency.

Description

Technical Field

[0001] This application relates to the field of electronic device assembly, and more particularly to a battery cover assembly and an electronic device. Background Technology

[0002] In handheld and other portable electronic devices, the application of electronic device modules such as fingerprint modules, NFC modules and wireless charging modules is becoming increasingly widespread. In the existing technology, the above-mentioned modules mostly adopt independent design and assembly methods: that is, each module is attached to the device housing (such as battery cover) with adhesive backing, and then electrically connected to the motherboard through POGOPIN connectors (spring pin connectors), BTB connectors (board to board connectors) or ZIF connectors (zero insertion and extraction force connectors) to achieve the corresponding functions.

[0003] However, this assembly method has obvious technical defects: First, the adhesive strength is easily affected by the environment and fails. Under high temperature (such as in a car in summer) or low temperature (such as in northern winter) conditions, or when the equipment is dropped or squeezed, the adhesive is prone to aging or failure, which can cause the module to shift or even fall off, thus affecting the stability of the module's function. Second, independent assembly requires the superposition of the thickness of each module itself, the thickness of the adhesive, and the thickness of the battery cover, which increases the thickness of the corresponding area of ​​the device and does not meet the requirements of portable devices to be thin and light. Utility Model Content

[0004] This application provides a battery cover assembly to solve the problems in the prior art such as unreliable installation of electronic device modules, significant increase in the thickness of the device after installation, and low assembly efficiency.

[0005] This application also provides an electronic device.

[0006] According to a first aspect embodiment of this application, a battery cover assembly includes: The back panel stack includes multiple support layer units stacked along the thickness direction, some of the support layer units are provided with avoidance areas, and the multiple avoidance areas are combined to form a mounting cavity; A sensing and interaction module is fixed in the mounting cavity; The circuit connection component has one end electrically connected to the sensing and interaction module, and the other end extends out of the mounting cavity to form the electrical output terminal of the sensing and interaction module.

[0007] According to one embodiment of this application, the sensing and interaction module includes one or more of a fingerprint module, an NFC module, and a wireless charging module.

[0008] According to one embodiment of this application, the sensing and interaction module is a fingerprint module, the fingerprint module having a fingerprint acquisition surface, an opening on one side of the mounting cavity, and the fingerprint acquisition surface being exposed to the backplate stack through the opening; and / or The sensing and interaction module is an NFC module or a wireless charging module, and the sensing and interaction module is enclosed in the mounting cavity.

[0009] The opening size is adapted to the fingerprint collection surface of the fingerprint module, so that the fingerprint collection surface is exposed on the back panel stack; the sensing and interaction module is an NFC module or a wireless charging module, and both the upper and lower surfaces of the sensing and interaction module are covered.

[0010] According to one embodiment of this application, a connection gap is provided between the mounting cavity and the sensing and interaction module; The connection gap is configured such that after the battery cover assembly is hot-pressed, the back plate is stacked to fill the connection gap and is bonded to the sensing and interaction module.

[0011] According to one embodiment of this application, the backplate stack is provided with a wire-through hole adapted to the circuit connection component, and the other end of the circuit connection component passes through the wire-through hole and extends out of the mounting cavity for electrical connection with the motherboard.

[0012] According to one embodiment of this application, the plane at the middle position of the backplate stack is taken as the plane of symmetry, and the support layer units at corresponding positions on both sides of the plane of symmetry have the same material and thickness.

[0013] According to one embodiment of this application, since the number of support layer units is odd, the central plane of the middle support layer unit is a symmetrical plane; Since the number of the support layer units is even, the plane between the two middle support layer units is a symmetrical plane.

[0014] According to one embodiment of this application, the support layer unit located on the outer surface of the backplate stack is a fiber resin layer or a cortical layer, and the remaining support layer units are fiber resin layers.

[0015] According to one embodiment of this application, the thickness of a single support layer unit is 0.05 mm to 0.1 mm.

[0016] An electronic device according to a second aspect of this application, the electronic device comprising: The aforementioned battery cover assembly; The front cover, together with the battery cover assembly, forms a receiving cavity; The motherboard is located in the receiving cavity and is electrically connected to the other end of the circuit connection assembly; The battery is located in the receiving cavity and is electrically connected to the motherboard.

[0017] The above-described one or more technical solutions in the embodiments of this application have at least one of the following technical effects: The battery cover assembly of this application integrates a sensing and interaction module, which is at least partially encapsulated within a backplane stack. This ensures that the thickness of at least a portion of the sensing and interaction module coincides with the thickness of the backplane stack, effectively compressing the overall thickness of the battery cover assembly and thus reducing the thickness of the final product. The encapsulation of the sensing and interaction module within the backplane stack provides reliable installation, preventing misalignment or detachment during use. It is also less affected by high or low temperatures, drops, etc., resulting in high operational reliability. Furthermore, the battery cover assembly with this structural form offers high assembly efficiency, simplifies processes, reduces testing costs, and improves production efficiency.

[0018] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is an exploded structural diagram of the battery cover assembly provided in this application.

[0021] Figure 2 This is a structural schematic diagram of the battery cover assembly provided in this application.

[0022] Figure 3 yes Figure 2 Enlarged view of the structure of the sensing and interaction module (the sensing and interaction module is the fingerprint module).

[0023] Figure 4 This is a partial structural diagram of the battery cover assembly provided in this application (partial structural diagram of the sensing and interaction module; the sensing and interaction module is an NFC module).

[0024] Figure 5 This is a schematic diagram of the structure of the electronic device provided in this application. Figure 1 (The sensing and interaction module is a fingerprint module).

[0025] Figure 6 This is a schematic diagram of the structure of the electronic device provided in this application. Figure 2 (The sensing and interaction module is an NFC module).

[0026] Figure label: 1. Back panel stack; 11. Support layer unit; 111. Clearance area; 112. Mounting cavity; 113. Connection gap; 12. Wiring hole; 2. Sensing and interaction module; 3. Circuit connection assembly; 4. Front shell; 5. Main board; 6. Battery. Detailed Implementation

[0027] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but should not be used to limit the scope of this application.

[0028] In the description of the embodiments of this application, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0030] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0031] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples. In the embodiments of this application, "a plurality of" means two or more.

[0032] The existing bonding methods for electronic device modules and battery covers have the following problems: First, each module needs to be bonded, pressed, and tested separately, which significantly increases production assembly time and labor costs, making it unsuitable for large-scale production; Second, if the battery cover needs to be disassembled (e.g., to replace the battery), each module needs to be removed simultaneously. When re-bonding, not only is it difficult to guarantee the bonding strength, but it is also easy to tear the FPC of the module or damage the module body.

[0033] A battery cover assembly according to an embodiment of the first aspect of this application, such as Figure 1 As shown, the battery cover assembly includes: a backplate stack 1, including multiple support layer units 11 stacked along the thickness direction, some of the support layer units 11 being provided with clearance areas 111, and the multiple clearance areas 111 being combined to form a mounting cavity 112; a sensing and interaction module 2, fixed in the mounting cavity 112; and a circuit connection component 3, one end of which is electrically connected to the sensing and interaction module 2, and the other end extending out of the mounting cavity 112 to form an electrical output terminal of the sensing and interaction module 2.

[0034] The sensing and interaction module 2 is at least partially located in the mounting cavity 112 and at least partially encapsulated in the backplane stack 1. At least one of the upper and lower surfaces of the sensing and interaction module 2 is covered, wherein the upper surface corresponds to the side of the battery cover assembly facing outward, and the lower surface corresponds to the side of the battery cover assembly facing inward (e.g., the side where the battery 6 is disposed). Through the encapsulated connection method, the sensing and interaction module 2 and the backplane stack 1 form an integral component.

[0035] The backplate stack 1 is formed by stacking multiple support layer units 11 along the thickness direction. The avoidance areas 111 set in some of the support layer units 11 are combined to form a mounting cavity 112. The sensing and interaction module 2 is fixed in the mounting cavity 112, so that the sensing and interaction module 2 is at least partially encapsulated in the backplate stack 1. The thickness of at least part of the sensing and interaction module 2 coincides with the thickness of the backplate stack 1, which effectively compresses the overall thickness of the battery cover assembly. This meets the development requirements of portable electronic devices for thinness and lightness. It is equivalent to eliminating the thickness of the adhesive and at least part of the thickness of the sensing and interaction module 2 itself. This solves the problem of local thickness of the device caused by the superposition of the thickness of the module itself, the thickness of the fixing structure and the thickness of the battery cover assembly under the traditional independent assembly method. At the same time, it also reduces additional assembly steps, reduces structural complexity, and achieves the effect of reducing assembly and labor costs.

[0036] The sensing and interaction module 2 is at least partially encapsulated within the mounting cavity 112 of the back panel stack 1. Compared with the traditional method of fixing by adhesive, the installation stability is significantly improved. When the device is subjected to external forces such as drops or squeezing, or is in extreme environments such as high or low temperatures, it is less likely to misalign or fall off. This reduces the impact of environmental and external force factors on the module's working state, improves the reliability of the sensing and interaction module 2, and avoids the problem of functional failure due to module displacement or detachment.

[0037] Integrating the sensing and interaction module 2 within the mounting cavity 112 of the backplane stack 1 eliminates the need for separate bonding, pressing, and testing processes for the sensing and interaction module 2. This simplifies the production process of the battery cover assembly, shortens assembly time, reduces manpower input for corresponding processes, lowers production and testing costs, and better meets the needs of large-scale production. One end of the circuit connection component 3 is electrically connected to the sensing and interaction module 2, while the other end extends out of the mounting cavity 112 to form an electrical output terminal. This ensures stable signal and power transmission between the sensing and interaction module 2 and the external motherboard 5, guaranteeing the normal functioning of the module. Furthermore, the wiring method is simple and highly compatible with the overall integrated structure.

[0038] According to one embodiment of this application, the sensing and interaction module 2 includes one or more of a fingerprint module, an NFC module, and a wireless charging module. The NFC module can be an NFC coil, and the wireless charging module can be a wireless charging coil. Figure 1 , Figure 2 , Figure 3 , Figure 5 The sensing and interaction module 2 is a fingerprint module. Figure 4 and Figure 6 The sensing and interaction module 2 is an NFC module, and the specific structure of the circuit connection components corresponding to the fingerprint module and the NFC module can be different (e.g., Figure 5 and Figure 6 (As shown).

[0039] The module combination can be flexibly selected according to the functional requirements of portable electronic devices to adapt to the positioning differences of different products. In other words, the assembly structure of the above-mentioned sensing and interaction module 2 can be applied to a variety of scenarios.

[0040] When multiple modules are integrated, each module can share the mounting cavity 112 of the backplane stack 1 (or form an independent mounting cavity 112 in the backplane stack 1 to accommodate multiple modules), so that the thickness of multiple modules partially overlaps with the thickness of the backplane stack 1. This avoids the problem of excessive local thickness of the device caused by the stacking thickness of multiple modules in traditional independent assembly, maintaining the thin and light characteristics of the battery cover assembly and conforming to the trend of thinner and lighter portable electronic devices. At the same time, the integration of multiple modules into the same battery cover assembly allows them to share some structures of the circuit connection component 3 (such as sharing wire harness interfaces or adapter units), reducing the number of independent circuits, simplifying overall wiring, reducing assembly complexity, further improving production efficiency and reducing costs. For example, the fingerprint module and the NFC module can be integrated on the backplane stack 1 at the same time, with the fingerprint module located in the middle empty area of ​​the NFC module; or, the fingerprint module and the wireless charging module can be integrated on the backplane stack 1 at the same time.

[0041] Whether it is a single module or multiple modules integrated, they are fixed through the mounting cavity 112 of the back plate stack 1. Compared with the traditional adhesive backing method, each module is less affected by the environment (high temperature, low temperature) and external forces (drop, squeeze), and is less likely to misalign or fall off, ensuring the stable operation of functions such as fingerprint recognition, NFC interaction, and wireless charging, and reducing device malfunctions caused by module failure.

[0042] According to one embodiment of this application, such as Figure 3 As shown, the sensing and interaction module 2 is a fingerprint module. The fingerprint module has a fingerprint acquisition surface, and one side of the mounting cavity 112 has an opening. The fingerprint acquisition surface is exposed to the backplate stack 1 through the opening; as shown... Figure 4 As shown, the sensing and interaction module 2 is an NFC module or a wireless charging module, and the sensing and interaction module 2 is enclosed in the mounting cavity 112. The mounting cavity 112 is a relatively closed cavity (e.g., a wire hole 12 may be provided) to fix and protect the sensing and interaction module 2.

[0043] The aforementioned "partially encapsulated in the mounting cavity 112 of the backplane stack 1" refers to the fingerprint module, meaning that the fingerprint module is not completely encapsulated in the backplane stack 1, and its fingerprint collection surface is exposed in the mounting cavity 112. In other words, the mounting cavity 112 can be closed, corresponding to an NFC module or a wireless charging module; the mounting cavity 112 can also have an opening at the top, corresponding to the fingerprint module. The fingerprint collection surface is the upper surface, and the fingerprint collection surface is exposed on the upper part of the backplane stack 1, meaning that the lower surface of the sensing and interaction module 2 is covered, and the upper surface is not covered; the fingerprint collection surface being exposed on the backplane stack 1 includes the fingerprint collection surface being higher than or protruding from the surface of the backplane stack 1, as well as the case where it is flush with or lower than the surface of the backplane stack 1.

[0044] The opening size is adapted to the fingerprint collection surface of the fingerprint module, so that the fingerprint collection surface is exposed on the back panel stack 1; the sensing and interaction module 2 is an NFC module or a wireless charging module, and both the upper and lower surfaces of the sensing and interaction module 2 are covered.

[0045] Different mounting cavity 112 structures are adopted for different types of sensing and interaction modules 2, which can accurately adapt to the functional requirements of each module and avoid the problem of mismatch between structural design and functional requirements. When the sensing and interaction module 2 is a fingerprint module, an opening is provided on one side of the mounting cavity 112, and the fingerprint collection surface is exposed to the back plate stack 1 through the opening. This ensures that the fingerprint collection surface can directly contact the user's finger, meeting the core requirements of fingerprint recognition function, while the back plate stack 1 encapsulates and fixes the rest of the fingerprint module, avoiding the vulnerability caused by the overall exposure of the fingerprint module. Compared with the traditional design of separately pasting the fingerprint module to the surface of the battery cover assembly, this structure makes the fingerprint module and the back plate stack 1 form a tighter integration relationship, reducing the risk of module loosening or falling off.

[0046] When the sensing and interaction module 2 is an NFC module or a wireless charging module, it is enclosed in the mounting cavity 112, and the backplate stack 1 provides all-round protection for the module. On the one hand, it can isolate dust, moisture and other impurities in the external environment from entering the module, preventing impurities from affecting the module's circuit connection or signal transmission; on the other hand, when the device is subjected to external forces such as drops or squeezing, the backplate stack 1 can buffer the impact of external forces on the module, reduce the probability of the module being damaged by collision, and at the same time reduce the impact of extreme environments such as high temperature and low temperature on the internal components of the module, ensuring the signal interaction stability of the NFC module and the energy transmission reliability of the wireless charging module.

[0047] From an overall structural integration perspective, this differentiated design, while realizing the functions of each module, maintains the thickness overlap between the sensing and interaction module 2 and the backplane stack 1. Whether the mounting cavity 112 is open or closed, the module does not significantly increase the overall thickness of the battery cover assembly, continuing the advantages of a thin and light design and meeting the structural requirements of portable electronic devices. Furthermore, the unified mounting cavity 112 of the backplane stack 1 secures different modules, eliminating the need for independent fixing structures for different modules. This simplifies the overall structural design of the battery cover assembly, reduces manufacturing complexity, and facilitates subsequent unified testing and maintenance of each module.

[0048] According to one embodiment of this application, such as Figure 3 As shown, a connection gap 113 is provided between the mounting cavity 112 and the sensing and interaction module 2; the connection gap 113 is configured such that after the battery cover assembly is hot-pressed, the backplate laminate 1 fills the connection gap 113 and bonds it to the sensing and interaction module 2. The backplate laminate 1 may include fiber and resin materials, wherein the resin material flows and fills the connection gap 113 after hot pressing.

[0049] A connection gap 113 is provided between the mounting cavity 112 and the sensing and interaction module 2. The backplate stack 1 fills the gap and bonds to the module through hot pressing, which can significantly improve the connection reliability between the module and the backplate stack 1. Compared with the traditional adhesive bonding method, the bonding structure formed between the backplate stack 1 material (such as resin) and the module surface after hot pressing is less affected by temperature changes (high temperature, low temperature) and external impacts (drop, squeeze). It is less likely to cause module displacement or detachment due to adhesive aging or failure, ensuring long-term stable operation of the module and solving the defects of insufficient reliability of traditional fixing methods.

[0050] The preset gap 113 can also accommodate the dimensional processing errors of the sensing and interaction module 2, eliminating the need to design the mounting cavity 112 and the module to have a zero-gap fit. This reduces the requirements for the processing accuracy of the mounting cavity 112 and the production accuracy of the module, reduces assembly difficulties caused by dimensional deviations, and improves the assembly error tolerance. At the same time, the material filling the gaps in the backplate stack 1 during the hot pressing process can eliminate the gaps between the mounting cavity 112 and the module, preventing external dust and moisture from entering the module through the gaps. This provides a certain degree of sealing protection for the module, reduces the corrosion of module circuits and components by impurities, and extends the module's service life.

[0051] Integrating "module fixing" and "backsheet stacking 1 molding" into the hot pressing process eliminates the need for additional independent processes such as adhesive bonding and pressing, simplifying the production process of the battery cover assembly, reducing transfer and waiting time between processes, helping to improve overall production efficiency, and avoiding the use of additional consumables such as adhesive, thus reducing production material costs to a certain extent.

[0052] According to one embodiment of this application, such as Figure 3 As shown, the backplate stack 1 is provided with a wire-through hole 12 adapted to the circuit connection component 3. The other end of the circuit connection component 3 passes through the wire-through hole 12 and extends out of the mounting cavity 112 for electrical connection with the motherboard 5. The wire-through hole 12 is small in size and will fit tightly with the circuit connection component 3 after hot pressing.

[0053] The backplate stack 1 is provided with a wire-passing hole 12 that is compatible with the circuit connection component 3, so that the other end of the circuit connection component 3 passes through the wire-passing hole 12 and extends out of the mounting cavity 112. This provides a stable wiring and fixing path for the circuit connection component 3, preventing the circuit connection component 3 from shifting or bending due to shaking or pulling during equipment use, reducing the risk of poor contact caused by messy wiring, ensuring the stability of the electrical connection between the sensing and interaction module 2 and the motherboard 5, and solving the problem that the circuit connection component 3 lacks a fixed structure and is easily affected by external forces in traditional independent assembly.

[0054] The "fitting" design of the wire hole 12 and the circuit connection component 3 means that the size of the wire hole 12 matches the shape and thickness of the circuit connection component 3. This prevents the component from wobbling due to an excessively large wire hole 12, and avoids difficulties in threading the component due to an excessively small wire hole 12, improving assembly smoothness, reducing rework caused by dimensional deviations, and lowering production difficulty. Simultaneously, the wire hole 12 is integrated into the back panel stack 1, eliminating the need for additional independent fixing brackets or wiring structures for the circuit connection component 3. This avoids additional structures occupying internal space, helping to reduce the size of the battery cover assembly and the overall device, meeting the development needs of thinner and lighter portable electronic devices.

[0055] The through hole 12 can provide a certain degree of protection for the circuit connection component 3 that passes through it, preventing dust and moisture in the external environment from directly contacting the core conductive area of ​​the circuit connection component 3, reducing the erosion of the component by impurities, slowing down the aging rate of the component, extending the service life of the circuit connection component 3, and indirectly ensuring the long-term stable operation of the sensing and interaction module 2.

[0056] In some cases, in addition to the aforementioned "through hole 12", the circuit connection component 3 may also extend from the interlayer gap between adjacent support layer units 11; or, a connecting hole may be provided on the back panel stack 1, and the circuit connection component 3 (e.g., POGOPIN connector) may be electrically connected to the sensing and interaction module 2 through the connecting hole.

[0057] According to one embodiment of this application, the plane at the middle position of the backplate stack 1 is taken as the plane of symmetry, and the support layer units 11 at corresponding positions on both sides of the plane of symmetry have the same material and thickness.

[0058] By taking the plane at the middle position of the back panel stack 1 as the plane of symmetry, the material and thickness of the support layer units 11 at the corresponding positions on both sides of the plane of symmetry are the same. This ensures that the stress, shrinkage or expansion changes on both sides of the back panel stack 1 are consistent during processing (such as hot pressing) and use. This effectively avoids stress imbalance caused by differences in materials and uneven thickness on both sides, greatly reduces deformation problems such as warping and bending of the back panel stack 1, and improves production yield.

[0059] The symmetrical material and thickness distribution result in more balanced overall mechanical properties of the backsheet stack 1, with more stable impact and compression resistance. This avoids structural weaknesses caused by excessively thin areas or insufficient material strength, extending the service life of the battery cover assembly. Simultaneously, the symmetrical structure simplifies the design and manufacturing process of the backsheet stack 1, eliminating the need to calculate processing parameters (such as hot-pressing temperature and pressure distribution) separately for the different structures on both sides. This reduces design complexity and manufacturing errors, improves production efficiency, and decreases the scrap rate caused by structural asymmetry.

[0060] A stable and flat backplate stack 1 ensures the proper functioning of the sensing and interaction module 2. For example, the fingerprint sensor surface of the fingerprint module can remain flat, preventing tilting of the sensor surface due to backplate deformation, which would affect fingerprint recognition accuracy; the fit between the wireless charging module and the battery 6 is more stable, reducing changes in the distance between the module and the battery 6 caused by stack deformation, and ensuring the stability of wireless charging efficiency.

[0061] According to one embodiment of this application, when the number of support layer units 11 is odd, the central plane of the middle support layer unit 11 is a plane of symmetry; when the number of support layer units 11 is even, the plane between the two middle support layer units 11 is a plane of symmetry.

[0062] Based on the odd or even number of support layer units 11, the position of the symmetry plane is determined, which provides a precise and unique benchmark for the symmetrical design of the back panel stack 1, avoiding the "pseudo-symmetry" problem of the support layer units 11 on both sides due to the ambiguity of the symmetry plane positioning. When the number of support layer units 11 is odd, the central plane of the middle support layer unit 11 is taken as the symmetry plane, which can ensure that the middle unit itself is subjected to balanced force and shrinkage in the thickness direction, while allowing the remaining units on both sides to be distributed in a mirror symmetry.

[0063] When the number of support layer units 11 is even, the plane between the two middle support layer units 11 is used as the plane of symmetry, so that the units on both sides are completely mirrored and there are no units in the "asymmetrical area". This avoids the situation where the number of units on one side is more than that on the other side due to the offset of the plane of symmetry, or the thickness and material of the units on both sides are misaligned.

[0064] Precise symmetry plane positioning also ensures the machining accuracy of the mounting cavity 112. The mounting cavity 112 of the backplate stack 1 needs to be centered or symmetrical in shape based on the symmetry plane. If the symmetry plane positioning is off, it will cause the mounting cavity 112 to shift and become asymmetrical in size, which will affect the assembly accuracy of the sensing and interaction module 2 (such as the module not being able to be fixed in the center or misaligned with the circuit connection component 3). A clear symmetry plane reference allows the machining position and shape of the mounting cavity 112 to be precisely matched with the symmetrical structure, providing a stable assembly space for the module.

[0065] According to one embodiment of this application, the support layer unit 11 located on the outer surface of the backplate stack 1 is a fiber resin layer or a cortical layer, and the remaining support layer units 11 are fiber resin layers.

[0066] According to one embodiment of this application, the backsheet stack 1 may include 6 to 9 support layer units 11. Figure 1 The number of middle support layer units 11 is 9, such as Figure 6 The number of middle support layer units 11 is 6.

[0067] According to one embodiment of this application, the middle support layer unit 11 and the outer surface support layer unit 11 are made of the same material, while the remaining support layer units 11 are made of a different material.

[0068] The fiber-resin layer comprises both fiber and resin materials; that is, it is a composite of fiber and resin. It is prepared by directly impregnating the fiber with resin melted at high temperature, or by first forming a resin film and then combining it with the fiber. The resin is at least one of epoxy resin, phenolic resin, cyanate ester resin, polyimide resin, etc., and the fiber-resin layer is woven or braided from fiber yarns.

[0069] The fibers in the fiber resin layer can be high-strength fibers such as glass fiber, UPE fiber (ultra-high molecular weight polyethylene fiber), aramid fiber, carbon fiber, or PBO (poly(p-phenylenebenzobisoxazole) fiber). The cortex in the cortex layer can be a PU layer (polyurethane layer) or a silicone layer.

[0070] The surface or outer surface of the backsheet stack 1 refers to the side of the backsheet stack 1 facing outwards, which is relative to the side of the backsheet stack 1 facing the battery 6 or the inside of the electronic device.

[0071] The support layer unit 11 located on the outer surface of the backsheet stack 1 is made of fiber resin or leather, while the remaining support layer units 11 are uniformly made of fiber resin. This achieves the differentiated design goal of "adapting the outer surface to function and appearance as needed, while ensuring structural stability internally." The outer surface can be coated, printed, transferred out of mold, hardened, or otherwise processed to create an appearance layer, giving the battery cover assembly specific colors, patterns, textures, and vibrant effects, thus resulting in a better appearance.

[0072] When a fiber resin layer is used for the outer surface, its wear-resistant and impact-resistant properties can improve the scratch and drop resistance of the battery cover assembly, avoiding scratches and damage to the outer surface during daily use and extending the service life of the assembly. When a leather layer is used for the outer surface, it can significantly improve the tactile comfort of the user and give the battery cover assembly a more textured appearance, meeting the needs of mid-to-high-end portable electronic devices for "feel and appearance", and solving the problems of the traditional single fiber resin layer outer surface having a stiff feel and monotonous appearance.

[0073] The remaining support layer units 11 all use fiber resin layers, which ensures the consistency of the internal materials of the back panel stack 1, reduces the stress imbalance inside the stack caused by differences in the shrinkage rate and mechanical properties of different materials, and thus reduces the risk of deformation such as warping and cracking of the back panel stack 1, ensuring the dimensional stability of the mounting cavity 112. At the same time, the uniformity of internal materials also simplifies the production process of the back panel stack 1, eliminating the need to switch material types and processing parameters for different internal units, reducing the complexity of the production process, improving processing efficiency, and reducing errors and costs caused by material switching.

[0074] For example, such as Figure 1 As shown, there are a total of 9 support layer units 11. The materials of the 9 support layer units 11 from top to bottom can be: fiberglass resin layer, UPE resin layer, UPE resin layer, fiberglass resin layer, fiberglass resin layer, fiberglass resin layer, UPE resin layer, UPE resin layer, and fiberglass resin layer, respectively.

[0075] According to one embodiment of this application, the thickness of a single support layer unit 11 is 0.05 mm to 0.1 mm.

[0076] The manufacturing process of the battery cover assembly may include: Preparation of high-strength fibers; The fiber and resin are mixed, and the resin is melted at high temperature and then directly impregnated into the fiber, or a resin film is first made and then combined with the fiber to prepare a semi-cured sheet. Manufacturers of fingerprint modules, NFC antennas, or wireless charging coils prepare specific modules and provide materials to board manufacturers; A layer of fiber resin semi-cured sheet is die-cut to obtain the desired shape; The multilayer fiber resin prepreg and the fingerprint module, NFC antenna or wireless charging coil are placed into the hot press mold in the stacking order and pressed together. Post-processing includes CNC (Computer Numerical Control) cutting, surface treatment, full inspection, and packaging.

[0077] An electronic device according to a second aspect embodiment of this application, such as Figure 5and Figure 6 As shown, the electronic device includes: the aforementioned battery cover assembly; a front shell 4, which surrounds the battery cover assembly to form a receiving cavity; a main board 5, located in the receiving cavity and electrically connected to the other end of the circuit connection assembly 3; and a battery 6, located in the receiving cavity and electrically connected to the main board 5.

[0078] When the sensing and interaction module 2 is an NFC module, the electronic device can be a mobile phone; when the sensing and interaction module 2 is a fingerprint module or a wireless charging module, the electronic device can also be a portable handheld electronic device such as a voice recorder, a learning machine, or a translator.

[0079] The motherboard 5 is electrically connected to the battery 6, and the sensing and interaction module 2 is electrically connected to the motherboard 5. The battery 6 supplies power to the motherboard 5 and the sensing and interaction module 2.

[0080] The circuit connection component 3 can be an "FPC (Flexible Printed Circuit) + BTB connector", an "FPC + POGOPIN connector", or an "FPC + ZIF connector". The male connector of each of these connectors connects to the end of the FPC, and the female connector connects to the main board 5. The FPC can be the shape shown in the figure, or it can be a partial structure integrated into the sensing and interaction module 2. There are no restrictions on the specific shape or size of the FPC. Of course, the circuit connection component 3 can also be other components for circuit conduction. Specific circuit connection methods can refer to existing circuit connection structures, which will not be elaborated here.

[0081] Battery cover assemblies used in electronic devices can be either 2D (i.e., flat) or 3D (i.e., partially curved).

[0082] Finally, it should be noted that the above embodiments are only used to illustrate this application and are not intended to limit this application. Although this application has been described in detail with reference to the embodiments, those skilled in the art should understand that various combinations, modifications, or equivalent substitutions of the technical solutions of this application do not depart from the spirit and scope of the technical solutions of this application and should be covered within the scope of the claims of this application.

Claims

1. A battery cover assembly, characterized in that, include: The back panel stack (1) includes a plurality of support layer units (11) stacked along the thickness direction, some of the support layer units (11) are provided with a clearance area (111), and the plurality of clearance areas (111) are combined to form a mounting cavity (112). The sensing and interaction module (2) is fixed in the mounting cavity (112). The circuit connection component (3) is electrically connected at one end to the sensing and interaction module (2), and the other end extends out of the mounting cavity (112) and forms the electrical output terminal of the sensing and interaction module (2).

2. The battery cover assembly according to claim 1, characterized in that, The sensing and interaction module (2) includes one or more of a fingerprint module, an NFC module, and a wireless charging module.

3. The battery cover assembly according to claim 2, characterized in that, The sensing and interaction module (2) is a fingerprint module, which has a fingerprint acquisition surface. The mounting cavity (112) has an opening on one side, through which the fingerprint acquisition surface is exposed to the backplate stack (1); and / or The sensing and interaction module (2) is an NFC module or a wireless charging module, and the sensing and interaction module (2) is enclosed in the mounting cavity (112).

4. The battery cover assembly according to claim 1, characterized in that, A connection gap (113) is provided between the mounting cavity (112) and the sensing and interaction module (2). The connection gap (113) is configured such that after the battery cover assembly is hot-pressed, the back plate stack (1) fills the connection gap (113) and is bonded to the sensing and interaction module (2).

5. The battery cover assembly according to claim 1, characterized in that, The backplate stack (1) is provided with a wire hole (12) adapted to the circuit connection component (3). The other end of the circuit connection component (3) passes through the wire hole (12) and extends out of the mounting cavity (112) for electrical connection with the motherboard (5).

6. The battery cover assembly according to claim 1, characterized in that, With the plane at the middle position of the back plate stack (1) as the plane of symmetry, the support layer units (11) at the corresponding positions on both sides of the plane of symmetry have the same material and thickness.

7. The battery cover assembly according to claim 6, characterized in that, Based on the fact that the number of the support layer units (11) is odd, the central plane of the support layer unit (11) located in the middle is a symmetrical plane; Since the number of the support layer units (11) is even, the plane between the two middle support layer units (11) is a symmetrical plane.

8. The battery cover assembly according to claim 1, characterized in that, The support layer unit (11) located on the outer surface of the back plate stack (1) is a fiber resin layer or a cortical layer, and the remaining support layer units (11) are fiber resin layers.

9. The battery cover assembly according to any one of claims 1 to 8, characterized in that, The thickness of a single support layer unit (11) is 0.05 mm to 0.1 mm.

10. An electronic device, characterized in that, include: The battery cover assembly as described in any one of claims 1 to 9; The front shell (4) and the battery cover assembly form a receiving cavity; The motherboard (5) is located in the receiving cavity and is electrically connected to the other end of the circuit connection assembly (3); The battery (6) is located in the receiving cavity and is electrically connected to the motherboard (5).

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