A non-magnetic structure

Abstract

The utility model relates to a kind of non-magnetic structures, comprising: titanium alloy shell;Molybdenum wire inner conductor;Glass insulation part is set between the titanium alloy shell and the molybdenum molybdenum wire inner conductor;The outer surface of the titanium alloy shell and the outer surface of the molybdenum molybdenum wire inner conductor are equipped with pre-plated copper layer, and the thickness of the pre-plated copper layer is 4-6 microns.The pre-plated copper layer of the titanium alloy shell and the pre-plated copper layer of the molybdenum wire inner conductor are isolated and electrically insulated in structure after sintering by glass insulation part.Compared with prior art, the utility model has the advantages of reducing production cost, improving product reliability, meeting the requirements of non-magnetic core, etc.

Description

Technical Field

[0001] This utility model relates to the field of non-magnetic technology, and in particular to a non-magnetic structure. Background Technology

[0002] In high-frequency, high-reliability electronic devices (such as aerospace, military technology, high-end medical equipment, and quantum computing), non-magnetic components are often required. These components require that their material structure and manufacturing process completely avoid introducing magnetic materials such as iron, nickel, and cobalt to prevent interference with the surrounding sensitive electromagnetic environment.

[0003] Currently, when manufacturing non-magnetic hermetically sealed products consisting of a titanium alloy shell, a molybdenum or molybdenum alloy inner conductor, and a glass insulator, the traditional manufacturing process typically involves the following steps: First, the titanium alloy shell and the molybdenum alloy inner conductor are cleaned and treated as necessary; then, the three are assembled using a mold and sintered at high temperature to melt the glass and achieve hermetically sealed packaging.

[0004] However, this existing technology has the following significant drawbacks: The sintering process is complex and costly: Titanium alloys readily react with oxygen and nitrogen in the air at high temperatures, forming brittle compounds such as titanium oxide and titanium nitride, severely impairing their mechanical properties and sealing reliability. Therefore, traditional processes require sintering in a high-purity inert gas (such as argon) protective atmosphere. The use and maintenance of such protective gases are very expensive, and the sealing requirements for the sintering equipment are extremely high, resulting in persistently high overall production costs.

[0005] Post-sintering surface treatment is difficult and affects electrical properties: After sintering, an oxide layer or other reactive layer forms on the surface of titanium and molybdenum alloys. This layer makes subsequent electroplating (such as gold plating) extremely difficult, severely affecting the solderability and long-term electrical contact reliability of the product. To obtain a good gold plating layer, complex surface activation treatments, such as pickling and activation, must be performed on the sintered product. These processes not only increase manufacturing costs and time but may also cause potential damage or contamination to the fragile glass sealing interface.

[0006] The contradiction of introducing magnetic risks to ensure plating applicability: To solve the problem of difficult plating on the surface after sintering, one possible improvement is to introduce a nickel plating layer as an underlayer, because nickel has good electrical conductivity and excellent properties as an underlayer for plating precious metals such as gold and silver. However, nickel itself is a ferromagnetic material, and its introduction directly violates the core requirement of the product being "non-magnetic," leading to product failure and making it unsuitable for sensitive fields with strict magnetic restrictions.

[0007] Reliability risks: Complex post-sintering surface treatment processes (such as strong acid cleaning) may erode the glass-metal sealing interface, introduce potential microcracks or reduce sealing strength, thereby affecting the long-term airtightness and mechanical reliability of the product.

[0008] CN202410912917.2 discloses a hermetically sealed process for a non-magnetic quartz observation window, including processing a quartz glass sheet, a solder preform, and titanium or titanium alloy parts according to the required dimensions of the quartz observation window; sequentially depositing a titanium metal layer, a copper or molybdenum metal layer, and a nickel metal layer on the surface of the quartz glass sheet to be sealed; stacking and assembling the quartz glass sheet, solder preform, and titanium or titanium alloy parts with metal layers deposited on the sealing surface, and then vacuum welding them to obtain the non-magnetic quartz observation window. However, the process is complex, costly, involves multiple deposition steps, and requires sophisticated pretreatment.

[0009] In summary, existing technologies for manufacturing high-performance non-magnetic products need to meet the requirements of "cost control," "non-magnetic requirements," and "process feasibility / reliability." There is an urgent need for a new product structure design scheme that can simplify the manufacturing process, reduce production costs, and simultaneously ensure excellent electrical performance and reliability of the product without introducing magnetic materials. Utility Model Content

[0010] The purpose of this utility model is to overcome the defects of the existing technology and provide a non-magnetic structure, reduce production costs, improve product reliability, and meet the core requirements of non-magnetic technology. The objective of this utility model can be achieved through the following technical solutions: This utility model provides a non-magnetic structure, including: Titanium alloy casing; Inner conductor of molybdenum wire; A glass insulating portion is disposed between the titanium alloy outer shell and the molybdenum wire inner conductor; Both the outer surface of the titanium alloy shell and the outer surface of the molybdenum wire inner conductor are provided with a pre-plated copper layer, the thickness of which is 4-6 micrometers.

[0011] The pre-plated copper layer of the titanium alloy shell and the pre-plated copper layer of the molybdenum wire inner conductor are structurally isolated and electrically insulated by a glass insulating part after sintering.

[0012] The sintering process of the non-magnetic structure was carried out under a nitrogen protective atmosphere.

[0013] Furthermore, the thickness of the pre-plated copper layer after sintering is 2-3 micrometers.

[0014] Furthermore, the titanium alloy shell, molybdenum wire inner conductor, and glass insulation are assembled by mold and then sintered to form an integral structure.

[0015] Furthermore, the outer surface of the non-magnetic structure also has a gold plating layer.

[0016] Furthermore, the gold plating layer directly covers the pre-plated copper layer.

[0017] Furthermore, the pre-plated copper layer serves as an intermediate bonding layer, bonding to the body of the titanium alloy shell or the molybdenum wire inner conductor on one side, and to the outermost gold plating layer on the other side.

[0018] Furthermore, the pre-plated copper layer of the titanium alloy shell completely covers the outer surface of the titanium alloy shell.

[0019] Furthermore, the pre-plated copper layer of the molybdenum wire inner conductor completely covers the outer surface of the molybdenum wire inner conductor.

[0020] Furthermore, a non-magnetic sealing structure is formed at the interface between the glass insulating part and the titanium alloy shell and the molybdenum wire inner conductor.

[0021] Furthermore, the titanium alloy shell, the pre-plated copper layer, the glass insulation part, and the molybdenum wire inner conductor and the pre-plated copper layer together constitute a coaxial structure sintered under a nitrogen protective atmosphere.

[0022] The non-magnetic product does not contain any nickel magnetic materials.

[0023] Compared with the prior art, the present invention has the following advantages: (1) Reduced production costs. The pre-plated copper layer forms an effective protective barrier on the surface of the titanium alloy, preventing it from oxidizing during high-temperature sintering. This allows the sintering process to be downgraded from requiring expensive high-purity inert gases (such as argon) for protection to using much cheaper nitrogen protection. Traditional processes make it very difficult to directly electroplate titanium alloys and molybdenum after sintering, requiring complex pre-activation treatments. In this invention, the surface of the sintered product has a residual copper layer, and copper is a metal that is very easy to electroplate. This makes the subsequent copper plating and gold plating processes very simple, fast, and yields high-quality products, further reducing processing costs.

[0024] (2) Improved product reliability. The pre-plating of copper is completed before sintering, and the bonding between the copper and the titanium alloy / molybdenum wire substrate is carried out in a controlled, clean environment. During sintering, thermal diffusion occurs between the copper layer and the substrate, forming a strong metallurgical bond, which is stronger than the bonding force obtained by electroplating on a rough, oxidized surface after sintering, thus ensuring the durability and stability of the gold plating layer. This invention avoids the harsh treatment processes such as strong acid washing required after sintering to activate the surface, eliminating the risk of corrosion or stress cracking at the glass-metal sealing interface caused by these chemical treatments, and ensuring the airtightness and long-term mechanical reliability of the product.

[0025] (3) Meets the core requirement of non-magnetic properties. By replacing nickel with copper, the contradiction between "plateability" and "non-magnetic properties" is resolved. Copper is an excellent non-magnetic conductor, which not only has the advantages of nickel as a base layer (promoting sintering and providing an excellent electroplating substrate), but also does not contain any magnetism, thus ensuring the non-magnetic properties of the product from the material source. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of a non-magnetic structure.

[0027] Reference numerals: 1-Titanium alloy outer shell; 2-Molybdenum wire inner conductor; 3-Glass insulation. Detailed Implementation

[0028] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. Component models, material names, connection structures, control methods, algorithms, and other features not explicitly described in this technical solution are considered common technical features disclosed in the prior art.

[0029] Example 1 This embodiment provides a non-magnetic structure, such as Figure 1 As shown, it includes: Titanium alloy casing 1; Molybdenum wire inner conductor 2; A glass insulating part 3 is disposed between the titanium alloy outer shell 1 and the molybdenum wire inner conductor 2; Both the outer surface of the titanium alloy shell 1 and the outer surface of the molybdenum wire inner conductor 2 are provided with a pre-plated copper layer, the thickness of which is 4-6 micrometers.

[0030] The pre-plated copper layer of the titanium alloy shell 1 and the pre-plated copper layer of the molybdenum wire inner conductor 2 are structurally isolated and electrically insulated by the glass insulating part 3 after sintering.

[0031] The sintering process of the non-magnetic structure was carried out under a nitrogen protective atmosphere.

[0032] Example 2 This embodiment provides a non-magnetic structure, such as Figure 1 As shown, it includes: Titanium alloy casing 1; Molybdenum wire inner conductor 2; A glass insulating part 3 is disposed between the titanium alloy outer shell 1 and the molybdenum wire inner conductor 2; Both the outer surface of the titanium alloy shell 1 and the outer surface of the molybdenum wire inner conductor 2 are provided with a pre-plated copper layer, the thickness of which is 4-6 micrometers.

[0033] The pre-plated copper layer of the titanium alloy shell 1 and the pre-plated copper layer of the molybdenum wire inner conductor 2 are structurally isolated and electrically insulated by the glass insulating part 3 after sintering.

[0034] The sintering process of the non-magnetic structure was carried out under a nitrogen protective atmosphere.

[0035] In a specific embodiment, the thickness of the pre-plated copper layer after sintering is 2-3 micrometers.

[0036] In a specific embodiment, the titanium alloy shell 1, the molybdenum wire inner conductor 2, and the glass insulation part 3 are assembled by mold and then sintered to form an integral structure.

[0037] In a specific implementation, the outer surface of the non-magnetic structure also has a gold plating layer.

[0038] In a specific embodiment, the gold plating layer 5 directly covers the pre-plated copper layer.

[0039] In a specific embodiment, the pre-plated copper layer serves as an intermediate bonding layer, bonding to the body of the titanium alloy shell 1 or the molybdenum wire inner conductor 2 on one side, and to the outermost gold plating layer on the other side.

[0040] In a specific embodiment, the pre-plated copper layer of the titanium alloy shell 1 completely covers the outer surface of the titanium alloy shell 1.

[0041] In a specific embodiment, the pre-plated copper layer of the molybdenum wire inner conductor 2 completely covers the outer surface of the molybdenum wire inner conductor 2.

[0042] In a specific embodiment, a non-magnetic sealing structure is formed at the interface between the glass insulating part 3 and the titanium alloy outer shell 1 and the molybdenum wire inner conductor 2.

[0043] In a specific embodiment, the titanium alloy shell 1, the pre-plated copper layer, the glass insulation part 3, and the molybdenum wire inner conductor 2 and the pre-plated copper layer together constitute a coaxial structure sintered under a nitrogen protective atmosphere.

[0044] Components not described in detail in this embodiment are all existing components that can be purchased through public channels.

[0045] The above description of the embodiments is provided to enable those skilled in the art to understand and use the utility model. It will be apparent to those skilled in the art that various modifications can be easily made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present utility model is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present utility model without departing from its scope should be within the protection scope of the present utility model.

Claims

1. A non-magnetic structure, characterized in that, include: Titanium alloy shell (1); molybdenum wire inner conductor (2); A glass insulating part (3) is disposed between the titanium alloy shell (1) and the molybdenum wire inner conductor (2); The outer surface of the titanium alloy shell (1) and the outer surface of the molybdenum wire inner conductor (2) are both provided with a pre-plated copper layer, the thickness of which is 4-6 micrometers.

2. The non-magnetic structure according to claim 1, characterized in that, The thickness of the pre-plated copper layer after sintering is 2-3 micrometers.

3. The non-magnetic structure according to claim 1, characterized in that, The titanium alloy shell (1), the molybdenum wire inner conductor (2), and the glass insulation part (3) are assembled by mold and then sintered to form an integral structure.

4. A non-magnetic structure according to claim 1, characterized in that, The outer surface of the non-magnetic structure also has a gold plating layer.

5. A non-magnetic structure according to claim 4, characterized in that, The gold plating layer (5) directly covers the pre-plated copper layer.

6. A non-magnetic structure according to claim 4, characterized in that, The pre-plated copper layer serves as an intermediate bonding layer, bonding to the body of the titanium alloy shell (1) or the molybdenum wire inner conductor (2) on one side, and to the outermost gold plating layer on the other side.

7. A non-magnetic structure according to claim 1, characterized in that, The pre-plated copper layer of the titanium alloy shell (1) completely covers the outer surface of the titanium alloy shell (1).

8. A non-magnetic structure according to claim 1, characterized in that, The pre-plated copper layer of the molybdenum wire inner conductor (2) completely covers the outer surface of the molybdenum wire inner conductor (2).

9. A non-magnetic structure according to claim 1, characterized in that, A non-magnetic sealing structure is formed at the interface between the glass insulating part (3), the titanium alloy shell (1), and the molybdenum wire inner conductor (2).

10. A non-magnetic structure according to claim 1, characterized in that, The titanium alloy shell (1), the pre-plated copper layer, the glass insulation part (3), and the molybdenum wire inner conductor (2) and the pre-plated copper layer together constitute a coaxial structure sintered under a nitrogen protective atmosphere.

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