A new notebook cooling stand

Abstract

The utility model relates to notebook computer heat dissipation technical field, concretely relates to a novel notebook computer heat dissipation support, including the casing that is composed of upper cover and lower cover, two first fans are symmetrically arranged in the lower cover, are used for air cooling, the cold row is arranged in the lower cover, and the cold row is used for the cooling of liquid cooling, and two flow passages are respectively communicated and arranged in the both ends of the cold row, and the one end of two flow passages is connected, and the connected place is provided with notebook computer interface, and the notebook computer interface is used for the cooling liquid to notebook computer heat dissipation module, and the water pump and storage cooling liquid water tank that drive cooling liquid flow are arranged on one flow passage, and the one end of the cold row is provided with a plurality of second fans for cooling, and the notebook computer is cooled through the double mode of air cooling and water cooling, can effectively reduce the burden of notebook computer heat dissipation module under the condition that notebook computer internal structure is not changed, guarantees that the chip will not be influenced by the heat accumulation in the working process.

Description

Technical Field

[0001] This utility model relates to the field of laptop heat dissipation technology, and in particular to a novel laptop heat dissipation bracket. Background Technology

[0002] As chip power consumption increases, the burden on laptop heat dissipation also increases. Due to the limitations of internal space and chip size, laptop heat sinks cannot be too large, and the amount of heat they can remove is greatly limited. As a result, heat accumulates in the chip during operation, leading to frame drops and stuttering, which is not conducive to user experience. Utility Model Content

[0003] The purpose of this utility model is to provide a new type of laptop cooling bracket, which aims to solve the problem that the laptop cooling structure cannot be too large due to the limitations of the internal space and chip size of the laptop itself, and the heat it can remove is greatly limited. This results in heat accumulation in the chip during operation, causing frame drops, lag, and other problems that are not conducive to user experience.

[0004] To achieve the above objectives, this utility model employs a novel laptop cooling bracket, comprising a housing consisting of an upper cover and a lower cover. Two first fans are symmetrically arranged inside the lower cover for air cooling. A radiator is also located inside the lower cover for cooling the coolant. Two flow channels are connected to each end of the radiator, with one end of each flow channel connected to a laptop connector at the connection point. The laptop connector is used to deliver coolant to the laptop's cooling module. One of the flow channels is equipped with a water pump to drive the coolant flow and a coolant storage tank. Multiple second fans for cooling are located at one end of the radiator.

[0005] The bottom of the lower cover has multiple ventilation holes corresponding to the positions of the two first fans, which are used to allow airflow. The upper cover has two through slots corresponding to the positions of the two first fans.

[0006] The diameter of the vent hole is 0.5 mm.

[0007] The top cover is provided with a mounting slot that is compatible with the laptop's interface.

[0008] A bracket is provided below the lower cover.

[0009] Beneficial effects:

[0010] The two first fans operate, forcing outside air into the laptop. By improving the air intake method, the airflow for heat exchange through the cooling module is increased, removing more heat per unit time. The coolant is pumped by the water pump and flows into the module through the laptop interface. As the coolant passes through the internal channels of the module, it undergoes heat exchange to remove heat. Through the dual cooling methods of air cooling and water cooling, the burden on the laptop's own cooling module is effectively reduced, ensuring that the chip is not affected by heat buildup during operation. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the structure of the novel laptop cooling bracket of this utility model.

[0013] 101-Lower cover, 102-Upper cover, 103-First fan, 104-Water tank, 105-Water pump, 106-Flow channel, 107-Laptop interface, 108-Radiator, 109-Second fan, 110-Ventilation hole, 111-Through slot, 112-Mounting slot, 113-Bracket. Detailed Implementation

[0014] Please see Figure 1 ,in, Figure 1 This is a schematic diagram of the structure of the novel laptop cooling bracket of this utility model.

[0015] This utility model provides a novel laptop cooling bracket, comprising a housing composed of an upper cover 102 and a lower cover 101. Two first fans 103 are symmetrically arranged inside the lower cover 101 for air cooling. A radiator 108 is disposed inside the lower cover 101 for cooling the coolant. Two flow channels 106 are respectively connected to both ends of the radiator 108, with one end of each flow channel 106 connected together. A laptop connector 107 is provided at the connection point, allowing the laptop to connect to the laptop. The heat dissipation module is used to deliver coolant to the laptop's heat dissipation module. One of the flow channels 106 is equipped with a water pump 105 that drives the flow of coolant and a coolant tank 104. One end of the radiator 108 is equipped with multiple second fans 109 for cooling. When the multiple second fans 109 are working, the coolant passes through the fins of the radiator 108, and the heat is carried away by the air. The cooled coolant flows back to the tank 104 through the pipes, thereby achieving the recycling of coolant.

[0016] Furthermore, the bottom of the lower cover 101 is provided with a plurality of ventilation holes 110 corresponding to the positions of the two first fans 103, and the plurality of ventilation holes 110 are used for airflow. The upper cover 102 is provided with two through slots 111 corresponding to the positions of the two first fans 103.

[0017] In this embodiment, the vent 110 and the through slot 111 form a connected channel. The first fan 103 delivers outside air into the laptop through this channel. The outside air is forced into the laptop. By improving the air intake method, the air volume that exchanges heat through the heat dissipation module is increased, and more heat is removed per unit time.

[0018] Furthermore, the diameter of the vent 110 is 0.5 mm.

[0019] In this embodiment, the diameter of the vent 110 is 0.5mm. This vent diameter can ensure a certain heat dissipation capacity and meet the heat dissipation requirements inside the laptop. On the other hand, it also meets the requirements of the printed circuit board manufacturing process.

[0020] Furthermore, the upper cover 102 is provided with a mounting groove 112 that is adapted to the laptop interface (107).

[0021] In this embodiment, the mounting slot 112 is adapted to the laptop interface (107) for connecting the laptop interface 107 to the heat dissipation module of the laptop.

[0022] Furthermore, a bracket 113 is provided below the lower cover 101.

[0023] In this embodiment, the bracket 113 raises the lower cover 101 to prevent the desktop on which the lower cover 101 is placed from blocking the multiple ventilation holes 110, thus ensuring that the multiple ventilation holes 110 can take in air normally.

[0024] Working principle:

[0025] When the laptop is working, the two first fans 103 operate, forcing outside air into the laptop. By improving the air intake method, the airflow for heat exchange through the cooling module is increased, removing more heat per unit time. The coolant is pumped by the water pump 105, entering the flow channel 106 from the water tank 104 and flowing into the module through the laptop interface 107. The coolant undergoes heat exchange as it passes through the internal channels of the module, removing heat. Afterward, the coolant flows out through the laptop interface 107 and enters the radiator 108 through the flow channel 106. Multiple second fans 109 operate, and as the coolant passes through the radiator 108, the heat is carried away by the airflow through the fins of the radiator 108. The cooled coolant then flows back to the water tank 104 through pipes, thus achieving coolant recycling. This cooling method innovatively integrates water cooling into traditional air cooling. The two work together, improving the air intake method and increasing the use of coolant, thereby reducing the burden on the laptop's cooling module and reducing heat buildup on the chips. Because of the use of this invention, the chip temperature of the laptop is lower when it is working, and the laptop can handle data image processing and AAA games with higher power consumption requirements.

[0026] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the utility model.

Claims

1. A novel laptop cooling stand, characterized in that, It includes a housing consisting of an upper cover (102) and a lower cover (101); Two first fans (103) are symmetrically arranged inside the lower cover (101) for air cooling; A radiator (108) is provided inside the lower cover (101). The radiator (108) is used to cool the coolant. Two flow channels (106) are respectively connected to both ends of the radiator (108). One end of the two flow channels (106) is connected, and a laptop interface (107) is provided at the connection point. The laptop interface (107) is used to deliver the coolant to the laptop heat dissipation module. A water pump (105) that drives the coolant flow and a coolant storage tank (104) are provided on one of the flow channels (106). Multiple second fans (109) for cooling are provided at one end of the radiator (108).

2. The novel laptop cooling stand as described in claim 1, characterized in that, The bottom cover (101) has multiple ventilation holes (110) at the position corresponding to the two first fans (103), and the multiple ventilation holes (110) are used to circulate airflow. The top cover (102) has two through slots (111) at the position corresponding to the two first fans (103).

3. The novel laptop cooling stand as described in claim 2, characterized in that, The diameter of the vent (110) is 0.5 mm.

4. The novel laptop cooling stand as described in claim 3, characterized in that, The top cover (102) is provided with a mounting slot (112) that is adapted to the laptop interface (107).

5. The novel laptop cooling stand as described in claim 4, characterized in that, A bracket (113) is provided below the lower cover (101).

Images